ByÂ Dr. Phil Garrou, Contributing Editor
Memorial Day in the US means the start of the IEEE ECTC meeting, which is run by the IEEE EPS society (Electronic Packaging Society). This years 68th meeting was in San Diego and broke all records with an attendance of > 1750. There were 369 presentations in 36 oral sessions (6 in parallel) with authors from 28 countries.
The exhibition has been at capacity for several years with 106 exhibitors and reportedly 40+ on a wait list. IFTLE concludes that eventually this meeting must move to convention centers because it is becoming too large for hotel spaces available.
In this first blog on 2018 ECTC we will look at the EPS 2018 award winners.
The IEEE EPS Field Award
As we have discussed in the past the major packaging award in the world is the EPS âField Awardâ meaning the top award in the âfield.â This yearâs winner is Bill Chen from ASE. The photo below shows IEEE President Jose Moura giving the award to Bill.
Bill received his engineering education at University of London (B.Sc), Brown University (M.Sc) and CornellÂ University (PhD).Â He joined IBM Corporation at Endicott New York in 1963. At Â IBM Â he Â worked Â in Â a Â broad Â range Â of Â IBM microelectronic packaging products. He received IBM Division President Award for his leadership and innovation in Predictive Modelling on IBM products. Â Â He was elected to the IBM Academy of Technology for hisÂ contributionsÂ toÂ IBM ProductsÂ and Packaging Technologies. He retiredÂ fromÂ IBM in 1997. Â HeÂ joinedÂ the Institute of Materials ResearchÂ and Engineering (IMRE) in Singapore, as Director of the Institute till 2001 when he joined ASE Group, where he holds the position of ASE Fellow and Senior Technical Advisor with responsibilities for guidance toÂ technology strategicÂ directionsÂ for ASE Group.
He is Senior Past President of the IEEE/CPMT Society. He is the Co-Chair of the ITRSÂ Assembly and Packaging Roadmap Technical Working Group.Â He is a Fellow of IEEE and Fellow of ASME. Â He has servedÂ as an Associate Editor Â of ASME Journal of Electronic Packaging, and IEEE/CPMT Transactions.
EPS Electronics Manufacturing Technology Award
The 2018 IEEE EPS Electronics Manufacturing Technology Award was given to Douglas Yu of TSMC for âcontributions to the development and high volume manufacturing of interposers and wafer level fan out packagingâ. Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and his Ph.D. in Materials Engineering from Georgia Institute of Technology. Dr. Yu was appointed TSMCâs Vice President in November 2016. Dr. Yu joined TSMC in 1994. He was previously Senior Director of the Integrated Interconnect & Packaging Division, where he led the development of interconnect technology for integrated circuits. Below we see Dr. Yu (L) accepting his award from EPS President Avi Bar Cohen.
The IEEE EPS Outstanding Sustained Technical Achievement Award went to Professor Pradeep Lall of Auburn for âoutstanding sustained contributions to the design reliability and prognostics for harsh environment electronic systemsâ.
The IEEE EPS Exception Technical Achievement Award went to three practitioners in the 2.5/3D technical space: Prof Mohannad Bakir of Georgia Tech; Prof Kuan-Neng Chen of National Chiao Tung Univ in Taiwan and Dr Katsuyuki Sukama of IBM.
All the awards were for âcontributions to 2.5 and 3D IC heterogeneous integration, with focus on interconnect technologies.â
The IEEE EPS David Feldman Outstanding Contribution award went to EPS past president Jean Trewhella for â20 years of leadership consistently driving change collaboration and engagement in EPS and ECTC, including driving our society name change, sponsoring the heterogenous Integration roadmap and establishing the ECTC student reception.â
Newly elected Fellows included:
Kuan-Neng Chen – National Chiao Tung Univ , Taiwan
Klaus-Dieter Lang â Fraunhoffer IZM, Germany
Jinmin Qu â Northwestern Univ
Guo-Quan Lu â VPI
Saibal Mukhopadhyay â Georgia Tech
Stefan Grivet-Talocia â Politecnico de Turino, Italy
âŠand while we are talking awards.
Corning Presents First Annual âCorning Leadership in Glass Awardâ at ECTC 2018
At the ECTC, Corning presented the first annual âCorning Leadership in Glass Awardâ to Proff Rao Tummala and his group at Ga Tech. The award recognized the technical paper âDesign and Demonstration of Highly Miniaturized, Low Cost Panel-Level Glass Package for MEMS Sensors,â submitted by Georgia Tech at ECTC 2017 that best demonstrated the viability of glass for semiconductor packaging applications.
âWeâre pleased to accept this very special award from Corning,â said Tummala. âWe have long believed that the properties and fabrication of ultra-thin glass make it the best next generation material of choice for semiconductor and system package integration manufacturing processes after metal-based packaging since 1970s, ceramics since 1980s, organic laminates since 1990s and silicon since 2010. Weâre proud that the research weâve done in glass panel packaging in both chip-first and chip-last architectures, is gaining more and more acceptance.â Because of this special and unique nature of glass packaging, we converted our whole Center to glass packaging for high-bandwidth computing, 5G communications, power, mems and sensors and others.â
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