New Products


Computerized Tomography

Dage’s computerized tomography (CT) option for digital X-ray inspection systems uses a digital geometric process to generate a 3-D image model from a series of individual 2-D X-ray image “slices” taken around a single axis of rotation. The captured images are fed in real-time to a dedicated reconstruction server that creates a 3-D image. Developed for analytical inspection of interconnections for stacked die, MEMS, package-in-package (PiP), package-on-package (PoP), and other dense applications, the CT option enables efficient conversions between 2- and 3-D modes for different inspection purposes. Dage Precision Industries, Freemont, CA, Booth 408

Measurement Systems

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Scan CT Suite 7.1 and AScan Automated Application Software Version 3.1 represent the next generation of CyberScan Vantage measurement systems. Scan CT 2- and 3-D profiling software includes roughness algorithms that meet ISO EN 13565 and 11562 standards, automatic edge detection, user-created macros, and flexible results-recording techniques. The suite performs and combines multiple scans into one worksheet for data comparisons. Hardware upgrades for Scan CT and AScan eliminate mechanical noise and vibration for accuracy within 20 nm. Cyber Technologies, Minneapolis, MN, Booth 201

Design Software

The Master Foundry Designer offers solutions for stacked die, flip chip, leadframe, system-in-package (SiP), and package-on-package (PoP) design. The software was developed with input from various packaging companies and includes full technical support. Two-way compatibility with major IC layout tools, advanced DRC checks, and 3-D visuals improve package design workflow. CAD Design Software, San Jose, CA, Booth 731

AOI System

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The STRATUS II automatic inspection model performs inspections on wet or dry substrates and adhesives after printing, burn-in, or laser trimming. The system finds screen aging, screen shift, excessive print, contamination, missing print, mouse bites, bleed-outs, and other problems on ceramic hybrids, LTCCs, wet adhesives, dielectrics, and flex PCBs. It features 4-megapixel cameras, linear motors, and a proprietary illumination subsystem. Operators can load substrates manually, from a conveyor, or from magazines and cassettes. Electronic Production Partners GmbH (EPP), Graefelfing, Germany, Booth 407


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Ultra-fine-precision stencil systems for microelectronic applications, from Murakami, suit LTCC, MLCC, inductor, resistor, and capacitator printing applications. A proprietary surface pretreatment on stainless steel wire mesh, high-resolution customized emulsion system, and trampoline stencil configuration enable printing specifications as low as 30-µms L/S. The stencils offer uniform paste deposit thicknesses, dimensional stability, and accuracy. Murakami Screen, Monterey Park, CA, Booth 816

Aqueous Cleaner

Kyzen Corp.’s µmox MX2188 Low COD aqueous precision cleaner is designed to clean lead-free, water-soluble fluxes within RoHS and environmental safety restrictions. The cleaner will remove flux under low-standoff devices and in tight pitch applications. It suits batch, in-line, and immersion usage. Kyzen Corporation, Nashville, TN, Booth 904

Leak Testing System

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The 2020 single footprint (SF) optical leak test system for hybrid, MEMS, and optoelectronic packages automates leak testing of hermetic electronic packages. The 2020 SF provides simultaneous, full-matrix gross and fine leak testing on up to 200 hermetic devices. Using digital holography, the system measures small changes in package stiffness and leak results as the packages are placed into a helium pressure cell. Optical leak testing is said to exceed conventional helium mass spectroscopy and fluorocarbon bubble testing in repeatability, accuracy, and direct measurement of leak rates (cc-atm/sec. helium). NorCom Systems, Inc., Norristown, PA, Booth 814

Die Bonder

The 2200 evo twin-head multi-chip die bonder incorporates a modular machine concept, optional advanced tape feeder cutter (ATFC), and more than 98% uptime. A bonding area for die attach and flip chips, and an epoxy dispensing area with integrated camera, fit into the small footprint. The machine handles 300-mm wafer magazines. Flux dip and heated bond head options facilitate flip chip bonding. Datacon Technology GmbH, Radfeld, Austria, Booth 923

Ball/Wedge Wedge/Wedge Bonder

The Model 4700 convertible dual-process machine, based on the K&S 4500 series, features a proprietary transducer for wedge and capillary mounting. Changeover from ball/wedge to wedge/wedge bonding is accomplished by swinging an SEFO assembly into position and pressing a switch. The machine’s dials are analog for ease-of-use. Kulicke & Soffa, Fort Washington, PA, Booth 308

Wedge Bonder

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The BONDJET BJ820 automatic wedge bonder groups all fine pitch wire-bonding applications in one platform. Applications such as radio frequency (RF), microwave, chip-on-board (COB), multichip module (MCM), hybrid, and fiber optics can be bonded using aluminum or gold wire at rates of up to 6 wires-per-second. The product’s piezo bond head is coupled with intelligent automation solutions to reduce indexing time. Hesse & Knipps GmbH Semiconductor, Paderborn, Germany, Booth 505

Manual Die Bonder

The Fineplacer Lambda manual version is used for die-attach tasks including flip chip bonding, MEMS, MOEMS, and sensors - bonding to substrates of up to 180 × 136 mm. Placement accuracy reaches within 0.5μm. Optional viewing equipment includes a LEICA microscope or camera-monitor magnification system. The manual version features an FA7 50 × 50 mm heating plate - programmable up to 20˚C/sec. - with an option for heated inert gas integration. FINETECH, Berlin, Germany, Booth 724

Screen Printer

The TF-100 precision stand-alone stencil and screen printer for hybrid microelectronics provides prototyping precision. The machine’s control module allows a variety of print parameter adjustments, including four automatic cycles. A squeegee-up delay of up to 2 seconds allows the stencil to peel off behind the squeegee. MPS’s Mylar alignment system provides one-print registration; a three-point frame registration system simplifies stencil removal and cleaning. A pneumatically raised print head with stencil tilt-away feature provides full access to the stencil and squeegee assembly. The TF-100 is designed with a single squeegee and a pre-set hop-over, which increases squeegee stroke length. Micro Printing Systems Intl., Hacienda Heights, CA, Booth 831

Multipurpose Wire Bonder

Wedge bonder for wedge/wedge; ball bonder for ball/wedge; peg bonder for tacking down pre-aligned leads, ribbons, and bare or insulated wires; and bump bonder for gold stud bumping, the Model 626 multipurpose wire bonder adjusts to each task without switching electrical or mechanical components. Servomotor control and linear vertical movement allow the bond head to move within a 0.750" vertical range without readjusting stage or platform height. It features an LCD display with parameters in actual units, memory for up to 75 recipes, and independent digital parameter settings. HYBOND, Inc., Escondido, CA, Booth 332

Flip Chip Package

The CoreEZ package, built on a HyperBGA manufacturing platform, offers thin core build-up flip chip technology. The core via density reaches 199 µm via-to-via core pitch - an essentially coreless structure - through use of smaller pads and 50-µm laser-drilled holes. CoreEZ features a 25-µm LW/LS. It allows full strip line signal layers on both sides of the core. Die-pad pitch reduction of down to 150 µms enables die shrink, while the thin core is said to improve power distribution and heat dissipation into the PCB. Endicott Interconnect Technologies, Inc., Endicott, NY, 534

Silver Platelets

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A suite of next-generation silver nanoparticles includes spherical powders ranging from 40 to 80 nm in diameter, as well as a 600-nm-long silver platelet. All of the nanomaterials are available as dry powders or pre-dispersed in a solvent. The silver products enter low-fire printed conductors and hybrid microelectronics through ink-jet or direct printing. The material’s conductivity exhibits below 175˚C to creates conductive surfaces on flexible, disposable substrates. NanoDynamics, Buffalo, NY, Booth 537

Acoustic Microscope

The Gen5 C-SAM acoustic microscope offers a two JEDEC tray, 1 sq. ft. scan area, turbo-mode feature to scan 2.5× faster, and meets ESD- and clean-room-compatible specifications. The microscope includes gated trigger mode and bright, ambient sample stage lighting. An active sensor detects installed transducers. Wafer analysis, bondline analysis for zero-level packaging, flip chip underfill void, and solder bump support are all enabled with region-specific analysis and an improved TrayScan. Sonoscan, Inc., Elk Grove Village, IL, Booth 607

Package Sealing Furnace

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The Model 3150 high-vacuum package sealing furnace seals discrete MEMS packages, for the device’s entire lifecycle, with a contained vacuum. At temperatures as high as 1,000˚C, the process chamber attains vacuum levels of 10-07 torr. The furnace can activate lid-mounted getters at temperatures up to 500˚C while maintaining a cool MEMS chip and package. The fully-programmable system also performs low-moisture sealing, void-free die attach, brazing, and glass sealing. SST International, Downey, CA, Booth 273

Hermetic Package

A discrete hermetic package targeting broadband applications, the G2420M-1 features four leads grouped on one side and three more spaced one per side. Glass/ceramic walls frame a 5.21- × 6.22-mm body, with a 2.67- × 3.68-mm cavity. A glass-to-metal sealing process creates the package and protects the device from its environment. It accepts a copper composite insert or base for high-power applications. StratEdge, San Diego, CA, Booth 735

Automatic Die Bonder

The Model 3500-III performs adhesive dispense, component placement, die-attach, and flip chip operations. Its automated eutectic die-attach system uses backside metallized die or preforms and enables thin-die bonding with air bridges. A pulse heat process controls heat througout the process. Look-up and look-down cameras, relative-to-die algorithms that place die and substrates relative to the location of the last-placed component, coincide with a sub-micron axis resolution to create placement reliability of ±12 µm at 3s with fluids; and ±5 µm at 3s with pulse heat. Palomar Technologies, Carlsbad, CA, 409-11

Dispensing System

Asymtek’s compact dispensing system, the DispenseMate 550 series, does potting, dispenses solder paste and adhesive, and performs gasketing in a benchtop unit. It features closed-loop brushless DC motors, pump and valve controls, digital gages, and an optional vision system. Software for the unit includes FluidMove for Windows NT, CAD Import, and Automatic Pattern Recognition. The model 555 dispenses over a 525- × 525-mm area, while the 553 covers 325 × 325 mm. Asymtek, Carlsbad, CA, Booth 711

Thermal Interface Material

NuSil Technology’s EPM-2493 is an electronic packaging material (EPM) designed for low outgassing applications. The thermal interface material has a low viscosity and low outgassing properties to meet requirements for high-temperature, high-stress, and low-contamination products. It is designed to handle drastic temperature cycling. The company created a formula with dispensing ease in mind. NuSil Technology, Carpinteria, CA, Booth 834