Table of Contents

Solid State Technology

Year 2008
Issue 1



Fitting many roads on one map

While laudable for establishing consensus on the current state-of-the-art in semiconductor manufacturing, the International Technology Roadmap for Semiconductors (ITRS) has not been shown to be overly accurate as a predictor of the future.

World News.html

World News

Technology News.html

Technology News

Iedm Report

IEDM shows real details of materials technology, devices

Over 1600 technologists gathered in Washington, DC, last month to explore a wide range of innovative ideas at the 2007 International Electron Devices Meeting (IEDM).

The Problems And Possibi

The problems and possibilities of thin film CIGS solar cells

Among the most promising of thin-film solar cells are those made of copper indium gallium diselenide (CIGS), but controlling film composition is a big hurdle to commercialization.

Chip Forensics

Embedded DRAM makes inroads into SoC devices

This month, presents a special preview of the January edition of Chip Forensics, an online column by Dick James, senior technology adviser at Chipworks, a specialty reverse engineering company that takes apart ICs and electronics systems in order to provide engineering information for its customers.

Industry Forum

Eco-friendly manufacturing the green path to profitability

The semiconductor industry value chain, including materials, equipment, manufacturing, and consumer products, has a long history of creativity and innovation in the “greening” of its operations.


Cover Article

Surface engineering for microfabrication

Richard Feynman predicted the emergence of the nanotechnology field during a now-famous Caltech lecture in 1959 [1].


Reducing USJ-related device variability at 32nm

Single-wafer high current implanter designs with diffusion-less annealing flash or laser equipment result in both global and local micro-uniformity variations.


3D control of photomask etching using advanced CD AFM metrology

A new generation of atomic force microscopes (AFM) has been designed for critical dimension (CD) metrology applications.

Metrology For Lithograph

Laterally resolved phase measurements at 45nm using photomask phase metrology

As the lithography process moves toward the 45nm and 32nm nodes, phase control on the mask is becoming more important than ever.


Nano-engineering enables practical portable fuel cells

A variety of approaches to nano- and micro-engineering have begun to yield portable fuel cells-with dramatic cost and size advantages-for niche markets.


Eliminating micro-cracks, crystal dislocations with single-wafer surface conditioning

Stacked-die-attach package applications require backside metal deposition for device contact within the package.


Product News.html


Product Focus Equipment

Product Focus: Equipment Subsystems