Table of Contents

Solid State Technology

Year 2002
Issue 10


Think Tank

Think Tank

Margaret, who saw Alf, Ben and Chuck exchange sports cards, asked, "How many cards do you guys have?"


Divide and Conquer?

The packaging world has seen profound changes over the decades and we may be faced with another one shortly.


AIT and Nakaya Microdevices Form Joint Venture

TOKYO AND PLEASANTON, CALIF. — Advanced Interconnect Technologies (AIT) and Nakaya Microdevices Corp. of Japan have created a joint venture to provide subcontract assembly and test services to Japan.


Wafer-level Packaging Evolves and Grows

MEPTEC's latest one-day symposium, "International Wafer- level Packaging Conference: The Convergence of Fab and Assembly," focused on one of the hottest topics in the industry.


EEMS Expands 300 mm Packaging Capability

RIETI, ITALY — Assembly and test subcontractor EEMS Italia Spa is increasing its 300 mm capabilities by placing a repeat order for a 300 mm dicing and grinding system from Disco Corp. of Tokyo.


Consolidation Among Taiwan's Subcontractors

HSINCHU and KAOHSIUNG, TAIWAN — Chipbond Technology Corp. and Fupo Electronics Corp., two Taiwan-based packaging subcontractors, will merge.


ASE Introduces Three-tier Fine-pitch Wire Bonding

SANTA CLARA, CALIF. — Advanced Semiconductor Engineering Inc. (ASE) announced a new wire bonding technology with three tiers of fine-pitch wire bonds.


Advanpack Announces Fine-Pitch Lead-free Bumping

SINGAPORE — Advanpack Solutions PTE Ltd. (APS), a packaging developer and contract wafer bumper, announced a new capability to meet the legislative restrictions imposed by the European Commission that require lead-free electronics packaging by January 1, 2006.


Unitive to Install 300 mm Bumping Line

RESEARCH TRIANGLE PARK, N.C. — Unitive announced its intent to install a 300 mm production line and support for electroplated wafer bumping and WLP.


U.K. Companies Find Packaging Niches

LONDON — The United Kingdom is not known as a critical location for semiconductor packaging, but there are numerous companies doing some very interesting work there.


Package Marking Lasers A

Package Marking Lasers and other options

For many years, semiconductor package marking commanded little attention and continued with little change.

Design For Reliability.h

Design for reliability

Package and Board-level Reliability Analysis with CAE

Wafer Bumping Solutions

Wafer Bumping Solutions Consumer to advanced applications

Wafer bumping technology recently has attracted considerable attention in the high-end computing and networking markets, primarily because this technology has enabled high performance for high-density MPU, ASIC and memory device structures.

A Novel Mcm Technology.h

A Novel MCM Technology

Multilayer thin film interconnect on a laminate substrate

Preparing For Next Gener

Preparing for Next-generation Electronics

Since the early 1990s people have been excited about a new generation of consumer electronics — a true "anything, anytime, anywhere" generation that would enable instant communications through a wide range of devices.