Margaret, who saw Alf, Ben and Chuck exchange sports cards, asked, "How many cards do you guys have?"
Divide and Conquer?
The packaging world has seen profound changes over the decades and we may be faced with another one shortly.
AIT and Nakaya Microdevices Form Joint Venture
TOKYO AND PLEASANTON, CALIF. — Advanced Interconnect Technologies (AIT) and Nakaya Microdevices Corp. of Japan have created a joint venture to provide subcontract assembly and test services to Japan.
Wafer-level Packaging Evolves and Grows
MEPTEC's latest one-day symposium, "International Wafer- level Packaging Conference: The Convergence of Fab and Assembly," focused on one of the hottest topics in the industry.
EEMS Expands 300 mm Packaging Capability
RIETI, ITALY — Assembly and test subcontractor EEMS Italia Spa is increasing its 300 mm capabilities by placing a repeat order for a 300 mm dicing and grinding system from Disco Corp. of Tokyo.
Consolidation Among Taiwan's Subcontractors
HSINCHU and KAOHSIUNG, TAIWAN — Chipbond Technology Corp. and Fupo Electronics Corp., two Taiwan-based packaging subcontractors, will merge.
ASE Introduces Three-tier Fine-pitch Wire Bonding
SANTA CLARA, CALIF. — Advanced Semiconductor Engineering Inc. (ASE) announced a new wire bonding technology with three tiers of fine-pitch wire bonds.
Advanpack Announces Fine-Pitch Lead-free Bumping
SINGAPORE — Advanpack Solutions PTE Ltd. (APS), a packaging developer and contract wafer bumper, announced a new capability to meet the legislative restrictions imposed by the European Commission that require lead-free electronics packaging by January 1, 2006.
Unitive to Install 300 mm Bumping Line
RESEARCH TRIANGLE PARK, N.C. — Unitive announced its intent to install a 300 mm production line and support for electroplated wafer bumping and WLP.
U.K. Companies Find Packaging Niches
LONDON — The United Kingdom is not known as a critical location for semiconductor packaging, but there are numerous companies doing some very interesting work there.