Please join us for a free webcast on Advanced Packaging, to be held on September 30th, at 11:00am Eastern, 10:00am Central and 8:00am Pacific. You can register in advance at this link: https://event.webcasts.com/starthere.jsp?ei=1021830
The webcast, which will feature presenters from Texas Instruments and Micron, will address how todayâ€™s packaging technology is driven by a combination of cost, performance, form factor and reliability. The presenters will examine new advances in conventional back-end packaging, including wafer bumping and copper wire bonding, as well as the role of new 2.5D and 3D integration. They will also focus on issues related to cost, performance (speed, power and noise immunity), form factor (thickness, weight, PCB area consumption), and testability, as well as the tradeoff of technical maturity versus risk in high-volume manufacturing. The webcast will also include new information on the Hybrid Memory Cube, a three-dimensional structure with a logic device at its base and a plurality of DRAMs vertically stacked above it using through-silicon via (TSV) connections. This is a revolution in 3D integration packaging technology, as covered in our September issue cover story.
Our first speaker, will be Dr. Mahadevan â€śDevanâ€ť Iyer. As Director of TIâ€™s Worldwide Semiconductor Packaging operations, Dr. Iyer oversees a global team that drives a process to determine the packaging design and technologies that best meet the requirements of our customers in measures of miniaturization, performance cycle time, and cost. Dr. Iyer joined TI in 2008 to lead the global SC Packaging team. He has more than 25 years of experience in the microelectronics industry. Dr. Iyer is a recognized authority in semiconductor packaging technologies.Â He has more than 150 technical publications and 28 patents to his credit.
Our second speaker will be Aron Lunde, a Product Program Manager for Micronâ€™s Hybrid Memory Cube.Â His responsibilities include coordinating Micronâ€™s internal departments to develop, construct, and deliver the HMC to meet the demands of multiple business engagements. Mr. Lunde joined Micron in 1994 and worked as a Test Engineer for Micronâ€™s Boise, Lehi and Singapore facilities.Â He later worked as a Mobile DRAM Designer, implementing repair and test modes on original Micron designs, integrating repair schemes into DRAM and mobile device architectures, and developing tools to evaluate the efficiency of repair schemes. Mr. Lunde has a BS in Electrical Engineering from the University of Idaho and has issued 15 patents.
Thanks to our webcast provider, TalkPoint, youâ€™ll be able to tune in using any mobile device including iPads, tablets and phones!
The webcast will be archived after the event and can be accessed for 12 months. Register now at https://event.webcasts.com/starthere.jsp?ei=1021830