U.S.-China trade war heats up with semiconductor industry caught in the middle
09/25/2018Earlier this week, the U.S. Trade Representative (USTR) released a 10 percent tariff on $200 billion in imports from Chin…
Seven IC products to outpace total 16% IC market growth in 2018
09/18/201813 IC products forecast to show double-digit growth, led by a 39% surge in DRAM sales….
SEMI Korea Members Day: Takeaways and tech trends as Korea leads in fab investment
09/28/2018Korea is on track to top all other regions in fab investment, spending $63 billion between 2017 and 2020, with powerho…
SEMI FabView update: More investments in semiconductor fabs
09/21/2018Global fab construction investment shows continuing strength, with 19 new fab projects expected to begin construction in 2019 and 2020, based…
Tech Papers
Upcoming Webcasts
Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and…
Date and time TBDEUV lithography has been under intense development for years and appears to be close to…





Applied Energy Systems announces acquisition of Advanced Research Manufacturing (ARM)

10/01/2018  AES will add ARM's gas purification technology to supplement and further expand its gas delivery equipment offerings.

Synopsys delivers automotive-grade IP in TSMC 7nm process for ADAS designs

10/01/2018  Synopsys, Inc. today announced delivery of automotive-grade DesignWare Controller and PHY IP for TSMC's 7-nanometer (nm) FinFET process.

Industry visionaries to present at SEMICON Japan 2018 SuperTHEATER

10/01/2018  Visionary keynote speakers and industry luminaries will share insights on Smart technologies that are shaping the future at SEMICON Japan 2018, the largest and most influential exhibition in Japan for electronics manufacturing.

Micron and ATP to collaborate on DDR2 continuity program

10/01/2018  Recognizing the importance of obsolescence mitigation in embedded and industrial systems, two of the biggest names in advanced storage, memory and semiconductor technologies have teamed up to ensure the continuous supply of legacy DDR2 memory modules in the market.

A 'recipe book' that creates color centers in silicon carbide crystals

10/01/2018  Researchers are documenting the different temperature and proton dosages required to make defects that will further allow silicon carbide to be used for quantum technology.

Molex announces agreement to acquire Laird Connected Vehicle Solutions division

09/28/2018  Investment to enhance connected mobility solutions for automotive manufacturers building intelligent next-generation vehicles.

Imagination and GLOBALFOUNDRIES collaborate to deliver ultra-low-power connectivity solutions for IoT applications

09/28/2018  Imagination brings Ensigma Ultra-Low-Power Connectivity IP to GLOBALFOUNDRIES' 22FDX process.

Smart devices could soon tap their owners as a battery source

09/28/2018  The world is edging closer to a reality where smart devices are able to use their owners as an energy resource, say experts from the University of Surrey.

Machine learning helps improving photonic applications

09/28/2018  Nanostructures can increase the sensitivity of optical sensors enormously - provided that the geometry meets certain conditions and matches the wavelength of the incident light. This is because the electromagnetic field of light can be greatly amplified or reduced by the local nanostructure. The HZB Young Investigator Group "Nano-SIPPE" headed by Prof. Christiane Becker is working to develop these kinds of nanostructures.

JCET Group appoints distinguished semiconductor industry executive Dr. Lee Choon Heung as CEO

09/28/2018  Dr. Lee brings to JCET a wealth of expertise and veteran leadership with 20 years of extensive semiconductor packaging and test experience.

Solving the burden of Bourdon tubes

09/27/2018  Mini diaphragm gauges offer a new alternative to Bourdon tubes.

Alpha and Omega Semiconductor announces new TO-leadless packaging technology for high current 400A applications

09/27/2018  Alpha and Omega Semiconductor Limited today introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.

Photonic chips harness sound waves to speed up local networks

09/27/2018  Acoustic noise in chips used to be a nuisance. Now scientists at the University of Sydney Nano Institute have developed a technique to put it to use in receivers of information in fibre-optic networks.

STMicroelectronics unveils highly integrated mobile-security chip

09/27/2018  STMicroelectronics revealed its highly integrated mobile-security solution, the ST54J, a system-on-chip (SoC) containing an NFC (Near-Field Communication) controller, Secure Element, and eSIM.

Canon Marketing Japan announces that it has signed an exclusive distribution agreement with ClassOne Technology Inc.

09/27/2018  Canon Marketing Japan Inc. has signed an exclusive distribution agreement in Japan with ClassOne Technology Inc. and it will start receiving orders for ECD tool Solstice in 2018.

China forecast to account for 90% of pure-play foundry market growth in 2018

09/26/2018  Driven by cryptocurrency device demand, TSMC's China sales are expected to surge by 79% this year.

Picosun-SINANO collaboration yields excellent TiN process

09/26/2018  Picosun Group and Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO) report excellent quality titanium nitride (TiN) deposited with Picosun’s plasma-ALD technology.

Study demonstrates new mechanism for developing electronic devices

09/26/2018  OIST scientists have demonstrated a new mechanism that may help develop electronic devices differently.

WIN Semiconductors Corp integrated GaAs technologies support 5G user equipment and network infrastructure

09/26/2018  WIN Semiconductors Corp., the world’'s largest pure-play compound semiconductor foundry, is driving the development and deployment of 5G user equipment and network infrastructure in the sub-6GHz and mmWave frequency bands.



Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.


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Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

More Technology Papers


Advanced Packaging

  Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:


  Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

  Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts


Munich, Germany
November 13, 2018 - November 16, 2018
EPTC 2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
December 05, 2018 - December 05, 2018

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Leak check semiconductor process chambers quickly and reliably
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