LED Manufacturing

LED MANUFACTURING ARTICLES



Researchers propose new gas-solid reaction for high-speed perovskite photodetector

01/16/2018  The gas-solid reaction method provides a full coverage of the perovskite film and avoids the damage from the organic solvent, which is beneficial for the light capture and electrons transportation, resulting in a faster response time and stability for the perovskite photodetector.

Expanded SiC Schottky diode line from Littelfuse reduces switching losses, increases efficiency and robustness

01/16/2018  Littelfuse, Inc. today introduced four new series of 1200V silicon carbide (SiC) Schottky Diodes from its GEN2 product family, which was originally released in May 2017.

Extremely bright and fast light emission

01/11/2018  An international team of researchers from ETH Zurich, IBM Research Zurich, Empa and four American research institutions have found the explanation for why a class of nanocrystals that has been intensively studied in recent years shines in such incredibly bright colours.

LEDs took half a billion tons of carbon dioxide from the sky in 2017

12/22/2017  The use of LEDs to illuminate buildings and outdoor spaces reduced the total carbon dioxide (CO2) emissions of lighting by an estimated 570 million tons in 2017.

Largest SEMICON China ever targets industry growth

12/19/2017  More than 70,000 players in the electronics manufacturing industry are expected to descend upon SEMICON China for technology and innovation insights to accelerate already strong industry growth.

AMEC wins injunction in patent infringement dispute with Veeco

12/11/2017  The injunction prohibits Veeco Shanghai from importing, manufacturing, selling or offering for sale to any third party any MOCVD systems and wafer carriers used in the MOCVD systems that would infringe AMEC’s patent CN 202492576 in China.

Cree launches industry's first extreme density LED

12/07/2017  The XLamp XD16 LED delivers a lumen density of more than 284 lumens per square-millimeter, which is the highest level achieved by a commercially available lighting-class LED.

TI's new automotive LED lighting controller puts the power in designers' hands

12/01/2017  Texas Instruments introduced the first 3-channel high-side linear automotive light-emitting diode (LED) controller without internal MOSFETs which gives designers greater flexibility for their lighting designs.

Atomistic calculations predict that boron incorporation increases the efficiency of LEDs

11/29/2017  Using predictive atomistic calculations and high-performance supercomputers at the NERSC computing facility, researchers Logan Williams and Emmanouil Kioupakis at the University of Michigan found that incorporating the element boron into the widely used InGaN (indium-gallium nitride) material can keep electrons from becoming too crowded in LEDs, making the material more efficient at producing light.

Transphorm secures investment from Yaskawa Electric

11/29/2017  Transphorm Inc. announced it received a $15 million investment from Yaskawa Electric Corporation.

TEL NEXX modernizes shop floor data collection and quality control with InfinityQS ProFicient

11/16/2017  Quality Intelligence solution enables chip metallization provider to improve accuracy and timeliness of data capture, rapidly respond to issues, and identify opportunities for continuous improvement.

The stacked color sensor

11/16/2017  True colors meet minimization.

SunLike series LEDs from Seoul Semiconductor deliver natural spectrum human-centric lighting sources

11/13/2017  Seoul Semiconductor exhibited its new SunLike Series LEDs, the world's first LED to produce light that closely matches the spectrum of natural sunlight, at the recent Professional Lighting Design Conference.

The next generation of power electronics? Gallium nitride doped with beryllium

11/10/2017  How to cut down energy loss in power electronics? The right kind of doping.

Tech increases microfluidic research data output 100-fold

11/09/2017  Researchers have developed a technique that allows users to collect 100 times more spectrographic information per day from microfluidic devices, as compared to the previous industry standard. The novel technology has already led to a new discovery: the speed of mixing ingredients for quantum dots used in LEDs changes the color of light they emit - even when all other variables are identical.

Pixelligent Technologies appoints Alain Harrus and Gene Banucci to its Board of Directors

11/07/2017  Pixelligent Technologies announced today it has named Alain Harrus, Ph.D. and Gene Banucci, Ph.D. to the Pixelligent Board of Directors.

MagnaChip offers 0.35 micron 700V ultra-high voltage process technology with process simplification

11/06/2017  MagnaChip Semiconductor Corporation announced today it now offers a 0.35 micron 700V Ultra-High Voltage process technology (UHV) that reduces mask counts, manufacturing time and cost for power-related AC-DC products.

Veeco and ALLOS demonstrate 200mm GaN-on-Si performance to enable micro-LED adoption

11/01/2017  Veeco Instruments Inc. (Nasdaq: VECO) announced today the completion of a strategic initiative with ALLOS Semiconductors (ALLOS) to demonstrate 200mm GaN-on-Si wafers for Blue/Green micro-LED production.

Optoelectronics, sensors/actuators and discretes climb

10/30/2017  The O-S-D market segments are growing at above average rates in 2017 and all three are expected to reach new record highs for the first time in six years, says new update.

Power GaN: Everything is in place for volume production

10/25/2017  Yole projects the explosion of the market with 84% CAGR between 2017 and 2022. The market value will so reach US$ 450 million at the end of the period.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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VIDEOS