LED Packaging and Testing

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LED PACKAGING AND TESTING ARTICLES



Optoelectronics market worth $9.80B by 2025

08/10/2018  The market is estimated to be USD 3.88 billion in 2018 and is projected to reach a market size of USD 9.80 billion by 2025, growing at a CAGR of 14.13% during the forecast period.

Seoul Viosys introduces new 'UV WICOP' in the UV LED market

08/10/2018  Seoul Viosys announced that its product named UV WICOP which combines Seoul Semiconductor’s WICOP LEDs with compact and high efficiency technology have been launched.

UCLA engineers develop world's most efficient semiconductor for thermal management

07/19/2018  New material draws heat away from hotspots much faster than current materials.

Quantum dot white LEDs achieve record efficiency

07/12/2018  Novel approach to white LEDs could lead to more energy-efficient lighting.

Photonics integration coming

07/09/2018  Increasingly, the ability to stay on the path defined my Moore's Law will depend on advanced packaging and heterogeneous integration, including photonics integration.

SEMICON West 2018 highlights smart technologies, workforce development, industry growth

07/09/2018  Smart technologies take center stage tomorrow as SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, opens for three days of insights into leading technologies and applications that will power future industry expansion.

Exciton limits are meant to be broken: OLED surpasses 100 percent exciton production efficiency

07/06/2018  Splitting energy using singlet fission opens a new route toward OLEDs with high-intensity emission in the near-infrared.

Toshiba announces new analog output IC photocoupler for automotive applications

07/05/2018  Toshiba Electronic Devices & Storage Corporation announces the launch of a new analog output IC photocoupler that enables high-speed communications in automotive applications – especially electric vehicles (EV) and hybrid electric vehicles (HEV).

High performance nitride semiconductor for environmentally friendly photovoltaics

07/03/2018  A Tokyo Institute of Technology research team has shown copper nitride acts as an n-type semiconductor, with p-type conduction provided by fluorine doping, utilizing a unique nitriding technique applicable for mass production and a computational search for appropriate doping elements, as well as atomically resolved microscopy and electronic structure analysis using synchrotron radiation.

Edmund Optics selects Veeco ion beam sputtering system

06/29/2018  Edmund Optics, a supplier of optical components, has ordered the SPECTOR Ion Beam Sputtering System from Veeco Instruments Inc.

The culprit of some GaN defects could be nitrogen

06/29/2018  Using molecular dynamics, researchers demonstrate the possible role of nitrogen as a major contributor to dislocation-related effects in gallium nitride-based devices.

Global LED market 2018-2022 to post a CAGR of 16%

06/26/2018  Technavio analysts forecast the global LED market to post a CAGR of more than 16% during the forecast period, according to their latest market research report.

Aledia selects Veeco Propel GaN MOCVD platform for large wafer 3D LED production

06/13/2018  Veeco Instruments Inc. has selected Veeco’s Propel GaN MOCVD system to support advanced research and development.

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WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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