LED Packaging and Testing

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LED PACKAGING AND TESTING ARTICLES



Seoul Semiconductor wins patent litigation against Everlight in Germany

12/12/2018  Seoul Semiconductor Co., Ltd. announced that it won a patent litigation against Everlight Electronics Co., Ltd. in Germany.

Colloidal quantum dots make LEDs shine bright in the infrared

12/05/2018  A group of ICFO researchers report on the development of a colloidal quantum-dot light emitting diode with unprecedented quantum and power conversion efficiencies in the infrared range. The study, published in Nature Nanotechnology, has proven that these devices can also be integrated in inorganic solar cells and may lead to even higher efficiencies.

Seoul Semiconductor expands patent infringement litigation against LED TV distributor

11/27/2018  Seoul Semiconductor Co., Ltd., a global innovator of LED products and technology, announced that it has expanded its patent infringement litigation against Fry's Electronics, Inc.

MiniLED technologies: An adoption, first driven by high-end LCD displays

11/27/2018  The excitement about microLEDs has grown exponentially since Apple acquired technology startup Luxvue in 2014.

EV Group partners with Plessey to drive GaN-on-Silicon monolithic microLED technology for AR applications

11/15/2018  Plessey, a developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market.

Veeco and ALLOS technical collaboration accelerates the pace for 200mm GaN-on-Silicon microLED applications

11/08/2018  Veeco Instruments Inc. and ALLOS Semiconductors GmbH announced today the completion of another phase of their mutual effort to provide the industry with leading GaN-on-Silicon epiwafer technology for microLED production.

New efficiency record set for perovskite LEDs

11/05/2018  Researchers have set a new efficiency record for LEDs based on perovskite semiconductors, rivalling that of the best organic LEDs (OLEDs).

Exploring the structure and properties of new graphene-like polymers

11/02/2018  A team of scientists from Siberian Federal University (SibFU) together with foreign colleagues described the structural and physical properties of a group of two-dimensional materials based on polycyclic molecules called circulenes.

Seoul Semiconductor wins multiple patent litigations for Acrich MJT and driver technology

10/12/2018  In 2017, Seoul filed the first patent infringement lawsuit against Archipelago for infringement of 12 LED patents covering various aspects of Seoul’s long-established Acrich technology.

Apple, the best positioned to bring high volume consumer microLEDs to market

10/09/2018  MicroLED displays could potentially match or exceed OLED performance in all critical attributes.

Plessey chooses AIX G5+ C MOCVD tool for GaN-on-Silicon monolithic microLEDs display innovation

09/20/2018  Plessey, a developer of award-winning optoelectronic technology solutions, announces it has placed an order for its next reactor from AIXTRON SE.

MicroLEDs: Technology advancements pave the way for cost reduction

09/14/2018  MicroLEDs technologies are improving rapidly and new technology paths emerging at a rapid pace. According to Yole Developpement's analysts, technology solutions should start converging by the end of 2019.

SUTD researchers resolve a major mystery in 2D material electronics

09/10/2018  Researchers from the Singapore University of Technology and Design (SUTD) have made a major step forward in resolving the mysteries surrounding 2D material Schottky diode.

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TWITTER


WEBCASTS



Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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