LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Aledia selects Veeco Propel GaN MOCVD platform for large wafer 3D LED production

06/13/2018  Veeco Instruments Inc. has selected Veeco’s Propel GaN MOCVD system to support advanced research and development.

Cree announces CFO transition plan

06/08/2018  Cree, Inc. today announced that Executive Vice President and Chief Financial Officer (CFO) Mike McDevitt will retire from his executive positions following a transition period.

Led by Texas Instruments, the industrial semiconductor market grew nearly 12% in 2017

06/06/2018  Analog Devices jumped to second in the market share ranking, after its acquisition of Linear Technology.

ON Semiconductor announces SiC diodes for demanding automotive applications

06/05/2018  Lower losses and higher switching deliver highly efficient, space-saving solutions and reduced overall system costs.

MIT researchers devise new way to make light interact with matter

06/04/2018  Reducing the wavelength of light could allow it to be absorbed or emitted by a semiconductor, study suggests.

OLEDs become brighter and more durable

05/29/2018  Layers made as ultrastable glasses improve device performance.

Lumentum orders Veeco MOCVD system

05/23/2018  Veeco Instruments Inc. announced that Lumentum Holdings Inc. has ordered the Veeco K475i™Arsenide/Phosphide (As/P) Metal Organic Chemical Vapor Deposition (MOCVD) System for production of its advanced semiconductor components.

Understanding light-induced electrical current in atomically thin nanomaterials

05/23/2018  Scientists demonstrated that scanning photocurrent microscopy could provide the optoelectronic information needed to improve the performance of devices for power generation, communications, data storage, and lighting.

Kulicke & Soffa further extends LED capabilities

05/22/2018  Kulicke and Soffa Industries, Inc. today announced it has entered into a licensing agreement with Idaho, US based Rohinni LLC (Rohinni), to facilitate the design, commercialization and distribution of next-generation micro and mini LED solutions.

Global, U.S. electronics supply chains see healthy midyear business conditions

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

Building crystals on a very hot surface

04/19/2018  A chemical reactor that operates at extremely high temperatures is being developed by KAUST and could improve the efficiency and economy of a commonly used process in the semiconductor industry, with flow-on benefits for Saudi Arabia's chemical industry.

Pixelligent Technologies closes $7.6M round of investments

04/19/2018  Latest funding will accelerate product commercialization and global customer adoption.

Toyoda Gosei achieves state-of-the-art high current operation with vertical GaN power semiconductor

04/16/2018  Toyoda Gosei Co., Ltd. has achieved state-of-the-art high current operation in a vertical GaN power semiconductor developed using gallium nitride (GaN), a main material in blue LEDs.

Cree licenses GaN power patents to Nexperia

04/12/2018  Cree, Inc. announces that it signed a non-exclusive, worldwide, royalty-bearing patent license agreement with Nexperia BV, a Dutch company.

Veeco wins compound semiconductor industry innovation award

04/11/2018  Flexible GENxcel™ MBE Deposition System earns Veeco its fourth Innovation Award in seven years.

ON Semiconductor selects Veeco tool for GaN electronics manufacturing

04/10/2018  Veeco Instruments Inc. today announced that ON Semiconductor (Nasdaq: ON) has ordered its Propel High-volume Manufacturing (HVM) Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system.

U.S. federal government R&D spending for 2018 finalized

04/06/2018  Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year.

Osram and Continental sign joint venture contract

04/03/2018  Technology companies Osram and Continental have successfully completed negotiations on their joint venture, which is expected to begin operations in the second half of calendar year 2018.

Apple developing all key elements of microLED display technology

03/29/2018  If we did not know before, now we are all aware: microLEDs for display applications is a very hot topic and Apple is strongly commited to the development of its own technology.

SEMICON West 2018 to spotlight smart technologies, workforce development

03/20/2018  SEMICON West has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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VIDEOS