MAGAZINE SEMICONDUCTORS BLOGS  EUVL Technology Status Update October 16, 2017  Reliability for the Real (New) World September 21, 2017  The ConFab 2018 will be held May 20-23 July 21, 2017  PCM + ReRAM = OUM as XPoint June 22, 2017  Intel Unveils More 10nm Details April 10, 2017  How New Materials Can Solve Contact Resistance January 25, 2017  Transition to ISO 9001:2015: Starting the Journey October 21, 2015 |
LITHOGRAPHY ARTICLES
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WEBCASTSMaterialsDate and time TBD Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.
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MEMSDate and time TBD MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.
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InterconnectsDate and time TBD This webcast will examine the state-of-the-art in conductors and dielectrics, — including contacts and Metal1 through global level — pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.
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TECHNOLOGY PAPERSTesting PAs under Digital Predistortion and Dynamic Power Supply ConditionsThe power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017 Learn the Basics of Power Amplifier and Front End Module MeasurementsThe power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017 Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool MatchingConsistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017 |
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