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LITHOGRAPHY ARTICLES



Value of semiconductor mergers and acquisitions falls considerably

01/17/2019  2018 semiconductor M&A valued at $23.2 billion, down from the record $107.3 billion in 2015.

Gartner reports worldwide PC shipments declined 4.3% in 4Q18 and 1.3% for the year

01/17/2019  Worldwide PC shipments totaled 68.6 million units in the fourth quarter of 2018, a 4.3 percent decline from the fourth quarter of 2017, according to preliminary results by Gartner, Inc.

It’s chilly!

01/16/2019  4Q'18 world electronic supply chain: Slowing electronic equipment growth

Semiconductor leaders' marketshares surge over the past 10 years

01/15/2019  Top 10 companies held 60% of worldwide semiconductor market in 2018, up from 45% in 2008.

Broadcom Inc. appoints Diane M. Bryant to its Board of Directors

01/14/2019  Broadcom Inc. announced today that its board of directors has appointed Diane M. Bryant as an independent director, and as a member of its compensation committee.

Despite uncertainty, long-term semiconductor market outlook remains bright

01/14/2019  This year, SEMI ISS covered it all – from a high-level semiconductor market and global geopolitical overview down to the neuro morphic and quantum level. Here are key takeaways from the Day 1 keynote and Economic Trends and Market Perspectives presentations.

SIA files comments on "emerging" technologies

01/11/2019  SIA today filed comments to the Department of Commerce Bureau of Industry and Security (BIS) in response to an advanced notice of proposed rulemaking of controls for "emerging" technologies.

SEMI ISS 2019: Enabling the next industrial revolution

01/09/2019  The SEMI Industry Strategy Symposium (ISS) opened this week with the theme "Golden Age of Semiconductor: Enabling the Next Industrial Revolution." The annual three-day conference of C-level executives gives the year's first comprehensive outlook of the global electronics manufacturing industry.

SCIS Seals & Valves Group develops seals testing standard

01/08/2019  SCIS is a SEMI Technology Community that tackles critical component defectivity for the semiconductor manufacturing industry.

IBM expands strategic partnership with Samsung to include 7nm chip manufacturing

12/20/2018  Agreement expands 15-year R&D partnership to define leadership roadmap for semiconductor industry.

Microcontamination, despite high yield, can cause long-term reliability issues

12/20/2018  For 7nm node chips, any contaminant can make a chip fail. Microcontamination control is the last line of defense for chipmakers, as even a lot yield in the high 90s percent range can bear chips with long-term reliability issues.

Two industry veterans recognized at SEMICON Japan for longtime contributions to SEMI Standards

12/20/2018  At SEMICON Japan 2019, SEMI recognized two industry veterans active in the Japan chapter for their longtime contributions to the SEMI International Standards program.

Total fab equipment spending reverses course, growth outlook revised downward

12/17/2018  Total fab equipment spending in 2019 is projected to drop 8 percent, a sharp reversal from the previously forecast increase of 7 percent as fab investment growth has been revised downward for 2018 to 10 percent from the 14 percent predicted in August.

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Full Trace Analytics Simplifies Root Cause Analysis, Pinpoints Yield Impacting Events Quicker Than Ever

Tuesday, January 29, 2019 at 1:00 pm EST

In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals. This allows fab engineers to accurately pinpoint the root causes of yield-impacting issues. This webcast will discuss several use cases to showcase how advanced full trace analytics can help not only in provide accurate results, but can also simplify the root cause analysis process and reducing time-to-root-cause, resulting in better yields, lower production costs and increased engineering productivity. In this LIVE webcast, BISTel's Chief Product Management Officer, Gabe Villareal will discuss how BISTel is leading the industry with its new full trace analytics to simply root cause analysis, which enables fab engineers to pinpoint the issues than impact yield and productivity quicker than ever. Full trace analytics enables the comprehensive examination of process trace data to allow the detection of abnormalities and deviations to the finest details.

Sponsored By:
Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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