Lithography

LITHOGRAPHY ARTICLES



China's semi capex forecast to be larger than Europe and Japan combined in 2018

07/12/2018  The Mid-Year Update to the 2018 McClean Report revises IC Insights’ worldwide economic and IC industry forecasts through 2022 that were originally presented in The 2018 McClean Report issued in January.

HEIDENHAIN announces new CEO

07/11/2018  HEIDENHAIN announced the appointment of David Doyle as CEO of HEIDENHAIN CORPORATION, effective Oct. 1, 2018.  At that time, Doyle will assume full responsibility for the HEIDENHAIN CORPORATION customer-focused operations for the U.S., Canada and Mexico.

Developing a resist specific to EUV

07/10/2018  Multi-Trigger chemistry, which is designed specifically for EUV, creates a high-chemical gradient at pattern boundaries, significantly reducing blurring and improving line-edge roughness to reduce the RLS trade off.

Overlay performance of through silicon via last lithography for 3D packaging

07/10/2018  A lithographic method for TSV alignment to embedded targets was evaluated using in-line stepper self metrology, with TIS correction.

The cobbler's children getting shoes?

07/10/2018  There's an old proverb that the shoemaker's children always go barefoot, indicating how some professionals don't apply their skills for themselves. Until lately, that has seemed the case with the semiconductor manufacturing industry which has been good at collecting massive amounts of data, but no so good at analyzing that data and using it to improve efficiency, boost yield and reduce costs.

The devilish details of EUV lithography

07/10/2018  Industry R&D consortium imec runs a series of technology forums around the world, starting in June in Antwerp, Belgium, and including a stop in July in San Francisco in coordination with SEMICON West.

Patterned wafer geometry grouping for improved overlay control

07/09/2018  Process-induced overlay errors from outside the litho cell have become a significant contributor to the overlay error budget including non-uniform wafer stress.

Big changes at the top and bottom of Q1 semiconductor equipment market shares

07/09/2018  Market shares of semiconductor equipment manufacturers shifted significantly in Q1 2018 as Applied Materials, the top supplier dropped, according to the report “Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts,” recently published by The Information Network.

SEMICON West 2018 highlights smart technologies, workforce development, industry growth

07/09/2018  Smart technologies take center stage tomorrow as SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, opens for three days of insights into leading technologies and applications that will power future industry expansion.

Global semiconductor sales in May increase 21% year-to-year

07/06/2018  Global sales in May were 3 percent higher than the April 2018 total of $37.6 billion.

Strategy for U.S. semiconductor leadership to be previewed at SEMICON West

07/06/2018  White House-led panel to address U.S. goal to lead in development of next-generation microelectronics.

Global semiconductor industry reached $115.8B in Q1 2018

07/02/2018  Samsung Electronics continued to lead the semiconductor market, followed by Intel and SK Hynix.

UMC acquires 100% ownership of Mie Fujitsu Semiconductor

06/29/2018  Fujitsu Semiconductor Limited and United Microelectronics Corporation, a global semiconductor foundry, today announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies.

SEMI Americas and Solid State Technology announce 2018 "Best of West" award finalists

06/27/2018  Selected from over 600 exhibitors, SEMI announced today that the following Best of West 2018 Finalists will be displaying their products on the show floor at Moscone Center from July 10-12.

China's semi capex forecast to be larger than Europe and Japan combined in 2018

06/27/2018  Chinese semi firms to spend $11.0 billion in capex this year, up from only $2.2 billion in 2015.

TowerJazz announces 2018 annual Technical Global Symposium events

06/26/2018  TowerJazz, the global specialty foundry, today announced details on its 13th annual Technical Global Symposium (TGS) being held in China, Japan, and the United States.

Synospsys Custom Design Platform accelerates robust custom design for Samsung Foundry's 7LPP process technology

06/22/2018  Samsung and Synopsys release 7LPP Custom Design reference flow.

ON Semiconductor expands manufacturing operations in Mountain Top, Pennsylvania

06/21/2018  ON Semiconductor plans to invest $51 million to support expansion of the Luzerne County facility.

SIA releases statement on Trump Administration tariff announcement

06/20/2018  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, this week released the following statement regarding the Trump Administration's announcement on tariffs on products imported from China.

North American semiconductor equipment industry posts May 2018 billings

06/20/2018  North America-based manufacturers of semiconductor equipment posted $2.70 billion in billings worldwide in May 2018 (three-month average basis), according to the May Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.




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WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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