By Dr. Phil Garrou, Contributing Editor
The 5th annual Suss Technology Forum was recently held at SEMICON West focused on trends in 3DIC and WLP.
Stephan Luetter compared the various temp bonding technologies and their current focus on excimer laser assisted release.Â Â The EDL-300 is their eximer laser debond module which rasters the wafer with a 12x 4mm laser beam. Carrier is lifted of with a vacuum gripper with close to zero mechanical lift-off force. A requirement for laser assisted debonding, is that it uses a glass carrier wafer to allow transmission of the laser light. Suss has concluded that the new materials and simpler process flows allow cost of equipment reduction in the range of 1.5-3X.
The Suss open platform program supports 10 materials suppliers and 4 laser assisted RT debonding processes (including 3M, Brewer, Dow and HD Micro).
Kim Arnold of Brewer introduced their 3rd generation temporary bonding solution BrewerBondÂ which makes use of a laser assisted room temperature debond process.Â Brewer who has been supporting the 3DIC infrastructure for a decade has introduced several product families to meet their customer needs. Each generation has increased throughput and thermal stability better allowing backside processing at higher temperatures.
The BrewerBond process makes use of a light sensitive layer which is decomposed during debonding with a 308nm excimer laser. Arnold indicated that development of a gen 4 product with higher throughput and higher thermal stability is underway.
Mark Oliver of Dow Chemical discussed their laser bond release process. Laser debonding at 308nm is shown below. The adhesive ends up on the device wafer side and is removed with a simple tape peel.
Dow also proposed the use of temp bonding to deal with warping in technologies such as fan out WLP.
Sood of KLA Tencor announced their CIRCL (Concurrent Inspection and Review Cluster)Â platform to address inspection requirements for advanced WLP.
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