Manufacturing

MANUFACTURING ARTICLES



Vertiv completes acquisition of MEMS maintenance business

12/06/2018  Vertiv announced today that it has completed the purchase of the maintenance business of MEMS Power Generation (MEMS), a privately-owned company headquartered in the United Kingdom that specializes in temporary power solutions.

Three CEA projects awarded European Research Council Synergy Grants

11/26/2018  The European Research Council (ERC) has just published the list of 27 projects it selected out of the 299 submitted to the ERC Synergy 2018 call for projects.

Altair Semiconductor and JIG-SAW partner on LTE-enabled sensors for industrial IoT

11/21/2018  Altair Semiconductor announced today it has partnered with JIG-SAW Inc. to develop LTE-enabled sensors for a wide variety of global industrial IoT applications.

SUNY Poly professors awarded $330,000 for two distinct cutting-edge nanotechnology-centered research projects

11/20/2018  Dr. Serge Oktyabrsky received $200,000 from the U.S. Department of Energy to develop next-gen scintillation detectors based on quantum dots to enable a better understanding of basic particles.

SEMICON Korea to showcase AI, smart manufacturing, talent

11/20/2018  With Korea expected to remain the world's largest consumer of semiconductor equipment, building on its 18 percent share in 2018, SEMICON Korea 2019 is poised to connect global electronics manufacturing companies to new opportunities.

MEMS and sensors in autonomous and electric vehicles: Key takeaways from IHS Markit at MSEC

11/15/2018  IHS Markit’s Jérémie Bouchaud provided a closer look at and outlook for this key market at the MEMS and Sensors Executive Congress in late October in Napa. Following are key takeaways from his presentation.

Nanotubes may give the world better batteries

10/26/2018  Rice U. scientists' method quenches lithium metal dendrites in batteries that charge faster, last longer.

Highly efficient wet-processed solar cells with molecules in the same orientation

10/26/2018  Researchers at Kanazawa University report in the journal Organic Electronics documents a new method for controlling the orientation of conducting molecules in organic solar cells that results in the enhanced light adsorption and performance of the cells.

Speeding MEMS innovation and production

10/26/2018  SEMI’s Nishita Rao spoke with Ron Polcawich about the MEMS workshop on rapid innovation that he held earlier this year and his interest in continuing that conversation with a broad audience of MEMS and sensors suppliers attending MEMS & Sensors Executive Congress.

Sensera further expands fabrication capabilities with dicing, wafer bonding and electroplating technologies

10/25/2018  c. announced it has acquired and qualified additional thin-film processing equipment including a dicing saw, a wafer bonder and an electroplating cell to meet the growing customer demand in this segment.

Inexpensive chip-based device may transform spectrometry

10/23/2018  Tiny device could replace expensive lab-scale equipment for many applications.

Leti and Taiwanese National Applied Research Laboratories team up to strengthen microelectronics innovation in France and Taiwan

10/23/2018  Two leading French and Taiwanese research institutes today announced their new collaboration to facilitate a scientific and technological exchange between France and Taiwan.

Autonomy value: The next value for sensors suppliers

10/23/2018  Nicolas Sauvage, senior director of Ecosystem at TDK InvenSense, will present at the fast-approaching MEMS & Sensors Executive Congress on October 29-30, 2018 in Napa, Calif. SEMI’s Nishita Rao spoke with Sauvage to offer MSEC attendees advance insights on Sauvage’s feature presentation.

ULVAC and the CIA: A sensing story about food and agriculture

10/19/2018  ULVAC Technologies’ David Mount is working with The CIA. Is he the Jack Reacher of the MEMS and sensors industry, jetting around the world to secret meetings, you wonder?

Cybersecurity critical to success of MEMS and sensors suppliers

10/18/2018  Cynthia Wright, a retired military officer with over 25 years of experience in national security and cyber strategy and policy, now Principal Cyber Security Engineer at The MITRE Corporation, will give the opening keynote at the upcoming MEMS & Sensors Executive Congress, October 29-30, 2018 in Napa, Calif.

Dynamic Fault Detection: Utilizing AI and IoT to revolutionize manufacturing

10/15/2018  A new approach in Fault Detection and Classification (FDC) allows engineers to uncover issues more thoroughly and accurately by taking advantage of full sensor traces.

Micron Foundation announces $1M grant to advance curiosity in artificial intelligence

10/11/2018  The grant was announced at the inaugural Micron Insight 2018 conference where the technology industry's top minds gathered in San Francisco to discuss the future of AI, machine learning and data science, and how memory technology is essential in bringing intelligence to life.

Intel collaborates on new AI research center at Technion, Israel’s Technological Institute

10/09/2018  Technion, Israel’s technological institute, announced this week that Intel is collaborating with the institute on its new artificial intelligence (AI) research center.

MSEC Tech Showcase to highlight MEMS & sensors innovations

10/04/2018  MEMS & Sensors Industry Group announces Technology Showcase finalists for MEMS & Sensors Executive Congress.

Smart devices could soon tap their owners as a battery source

09/28/2018  The world is edging closer to a reality where smart devices are able to use their owners as an energy resource, say experts from the University of Surrey.




TWITTER


WEBCASTS



Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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VIDEOS