Manufacturing

MANUFACTURING ARTICLES



Silicon Labs expands senior management team

07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication

07/13/2018  Dr. LI Jiafang, from the Institute of Physics, Chinese Academy of Sciences, has recently formed an international team to apply kirigami techniques to advanced 3D nanofabrication.

Broadcom to acquire CA Technologies for $18.9B in cash

07/13/2018  Broadcom Inc. and CA Technologies today announced that the companies have entered into a definitive agreement under which Broadcom has agreed to acquire CA to build one of the world's leading infrastructure technology companies.

The outlook for new metrology approaches

07/10/2018  To keep up with Moore's Law, the semiconductor industry continues to push the envelope in developing new device architectures containing novel materials.

The cobbler's children getting shoes?

07/10/2018  There's an old proverb that the shoemaker's children always go barefoot, indicating how some professionals don't apply their skills for themselves. Until lately, that has seemed the case with the semiconductor manufacturing industry which has been good at collecting massive amounts of data, but no so good at analyzing that data and using it to improve efficiency, boost yield and reduce costs.

Proving the benefits of data analysis

07/10/2018  The semiconductor industry is collecting massive amounts of data from fab equipment and other sources. But is the trend toward using that data in a Smart Manufacturing or Industry 4.0 approach happening fast enough in what Mike Plisinski, CEO of Rudolph Technologies, calls a "very conservative" chip manufacturing sector?

Generating electrical power from waste heat

07/09/2018  New Sandia solid-state silicon device may one day power space missions.

SEMICON West 2018 highlights smart technologies, workforce development, industry growth

07/09/2018  Smart technologies take center stage tomorrow as SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, opens for three days of insights into leading technologies and applications that will power future industry expansion.

SEMICON West: Exponential growth in data volumes drives change in system architecture

06/28/2018  With artificial intelligence (AI) rapidly evolving, look for applications like voice recognition and image recognition to get more efficient, more affordable, and far more common in a variety of products over the next few years.

Closing the gap: On the road to terahertz electronics

06/26/2018  Asymmetric plasmonic antennas deliver femtosecond pulses for fast optoelectronics.

Executive keynotes to identify MEMS, sensors, imaging innovations and megatrends at SEMI-MSIG European Summits

06/19/2018  Industry leaders to share latest developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018, in Grenoble, France.

The MEMS market is showing a 17.5% CAGR between 2018 and 2023

06/11/2018  MEMS market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period.

BISTel unveils first intelligent applications for smart manufacturing

06/01/2018  New Dynamic Fault Detection (DFD) offers full trace analysis, overcomes limitations of legacy FDC systems to improve yield significantly.

STMicroelectronics announces Executive Committee

05/31/2018  New President & CEO Jean-Marc Chery to lead newly formed Executive Committee.

Leti Innovation Days to explore presentations on how microelectronics is fueling innovation

05/29/2018  Leti, a technology research institute of CEA Tech, today announced its annual flagship event, Leti Innovation Days, July 4-5 in Grenoble.

Silicon breakthrough could make key microwave technology much cheaper and better

05/24/2018  Researchers using powerful supercomputers have found a way to generate microwaves with inexpensive silicon, a breakthrough that could dramatically cut costs and improve devices such as sensors in self-driving vehicles.

Cloud computing: the power to optimize manufacturing

05/22/2018  The cloud is an innovation fueled by advanced chip technology, but it has also been a model the industry hesitated to embrace.

SEMICON West adds WT | Wearable Technologies Conference co-location

05/22/2018  U.S. electronics manufacturing event expands with wearables program.

Global, U.S. electronics supply chains see healthy midyear business conditions

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

SiTime opens new Center of Excellence in Michigan

05/17/2018  SiTime Corporation announced it has expanded its global footprint to support its rapid growth with the opening of a new Center of Excellence in Michigan.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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VIDEOS