Manufacturing

MANUFACTURING ARTICLES



Executive keynotes to identify MEMS, sensors, imaging innovations and megatrends at SEMI-MSIG European Summits

06/19/2018  Industry leaders to share latest developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018, in Grenoble, France.

The MEMS market is showing a 17.5% CAGR between 2018 and 2023

06/11/2018  MEMS market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period.

BISTel unveils first intelligent applications for smart manufacturing

06/01/2018  New Dynamic Fault Detection (DFD) offers full trace analysis, overcomes limitations of legacy FDC systems to improve yield significantly.

STMicroelectronics announces Executive Committee

05/31/2018  New President & CEO Jean-Marc Chery to lead newly formed Executive Committee.

Leti Innovation Days to explore presentations on how microelectronics is fueling innovation

05/29/2018  Leti, a technology research institute of CEA Tech, today announced its annual flagship event, Leti Innovation Days, July 4-5 in Grenoble.

Silicon breakthrough could make key microwave technology much cheaper and better

05/24/2018  Researchers using powerful supercomputers have found a way to generate microwaves with inexpensive silicon, a breakthrough that could dramatically cut costs and improve devices such as sensors in self-driving vehicles.

Cloud computing: the power to optimize manufacturing

05/22/2018  The cloud is an innovation fueled by advanced chip technology, but it has also been a model the industry hesitated to embrace.

SEMICON West adds WT | Wearable Technologies Conference co-location

05/22/2018  U.S. electronics manufacturing event expands with wearables program.

Global, U.S. electronics supply chains see healthy midyear business conditions

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

SiTime opens new Center of Excellence in Michigan

05/17/2018  SiTime Corporation announced it has expanded its global footprint to support its rapid growth with the opening of a new Center of Excellence in Michigan.

Advanced materials: processing glass like a polymer

05/17/2018  KIT materials scientists develop new forming technology -- publication in advanced materials.

SEMI position on EC's proposed framework for screening foreign direct investments in the European Union

05/17/2018  In response to the European Commission’s (EC) proposed framework for screening foreign direct investments (FDI), SEMI, representing the global electronics manufacturing supply chain, offers three recommendations for consideration by EU policymakers.

Cohu to acquire Xcerra

05/08/2018  Cohu, Inc. and Xcerra Corporation today announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.

Expecting the unexpected: 5 takeaways from FLEX Japan and MEMS & Sensors Forum Japan 2018

05/08/2018  Peel-and-stick simplicity isn’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.

Analog Devices names four Fellows for outstanding technical achievement and leadership

05/07/2018  Analog Devices, Inc. awarded Bob Reay, Leonard Shtargot, Jesper Steensgaard, and Sam Zhang the title of Analog Devices Fellow.

Samsung begins mass production of 10nm-class 16Gb LPDDR4X DRAM for automobiles

04/26/2018  The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments.

MicroDevices expands fabrication capability with high rate etcher

04/24/2018  Sensera Inc. (MicroDevices) has acquired and qualified a SPTS ASE-HRM etch platform. This etcher adds capability to the fab that was previously outsourced to partners.

Semiconductor expert Johan Lodenius enters the Board of disruptive Swedish IR sensor developer JonDeTech

04/23/2018  Johan Lodenius is joining the Board of JonDeTech, a Swedish company that develops and markets IR sensor technology based on nanotechnology aimed at consumer electronics and mobile phone mass markets.

Global MEMS market for mobile devices forecast to grow at a CAGR of 10.55%

04/12/2018  Global MEMS market for mobile devices to grow at a CAGR of 10.55% during the period 2017-2021.

Worldwide PC shipments declined 1.4% in first quarter of 2018

04/12/2018  Worldwide PC shipments totaled 61.7 million units in the first quarter of 2018, a 1.4 percent decline from the first quarter of 2017, according to preliminary results by Gartner, Inc.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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VIDEOS