Materials and Equipment

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MATERIALS AND EQUIPMENT ARTICLES



Toshiba Machine launches new die casting machines for southeast Asian market

11/19/2018  Toshiba Machine Co., Ltd. has developed the new DC-KT Series Die Casting Machines to meet the needs of the Southeast Asian market and has started sales and production at its plant in Thailand.

MIRPHAB offering design, production and business planning for companies developing mid-infrared devices for chemical sensing and spectroscopic applications

11/14/2018  MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

Renesas Electronics announces absorption-type merger with consolidated subsidiary

10/31/2018  Renesas Electronics Corporation today announced that it has resolved at the Meeting of Board of Directors held on October 31, 2018 to consolidate its wholly-owned subsidiary Renesas Semiconductor Package & Test Solutions Co, Ltd.

Global semiconductor sales in September up 13.8% year-to-year

10/29/2018  Q3 sales are highest on record, 4.1 percent more than previous quarter, 13.8 percent higher than Q3 of last year.

Advanced packaging technologies are key for semiconductor innovation

10/24/2018  In the era of a slowing Moore's Law, advanced packaging has emerged as the savior of future semiconductor development.

Samsung debuts semiconductor innovations at Samsung Tech Day

10/19/2018  Technologies introduced at the event include 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM.

Perovskites: Materials of the future in optical communication

10/16/2018  High performance and stable all? Inorganic metal halide perovskite-based photodetectors for optical communication applications.

Applied Energy Systems announces acquisition of Advanced Research Manufacturing (ARM)

10/01/2018  AES will add ARM's gas purification technology to supplement and further expand its gas delivery equipment offerings.

Alpha and Omega Semiconductor announces new TO-leadless packaging technology for high current 400A applications

09/27/2018  Alpha and Omega Semiconductor Limited today introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.

China forecast to account for 90% of pure-play foundry market growth in 2018

09/26/2018  Driven by cryptocurrency device demand, TSMC's China sales are expected to surge by 79% this year.

KLA-Tencor expands IC packaging portfolio

08/31/2018  KLA-Tencor Corporation announced two new defect inspection products designed to address a wide variety of integrated circuit (IC) packaging challenges.

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

European electronics industry CEOs call on European Commission to bolster sector's competitiveness

08/08/2018  In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

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TWITTER


WEBCASTS



Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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VIDEOS