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MATERIALS AND EQUIPMENT ARTICLES



SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

European electronics industry CEOs call on European Commission to bolster sector's competitiveness

08/08/2018  In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

Future electronic components to be printed like newspapers

07/20/2018  A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.

Silicon Labs expands senior management team

07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

Boston Semi Equipment enhances MEMS sensor testing

07/16/2018  Boston Semi Equipment (BSE) introduced today its Zeus gravity feed solution for handling pressure MEMS devices that require pressure and vacuum stimulus during testing.

Bruker announces acquisition of JPK Instruments

07/13/2018  Bruker Corporation today announced that it has acquired JPK Instruments AG (JPK), located in Berlin, Germany.

Optimized stepping for fan-out wafer and panel packaging

07/09/2018  Optimized stepping, based on parallel analysis of die placement errors and prediction of overlay errors, can increase lithography throughput by more than an order of magnitude and deliver commensurate reductions in cost of ownership. The productivity benefits of optimized stepping are demonstrated using a test reticle with known die placement errors.

Plasma-Therm completes acquisition of France-based CORIAL

06/13/2018  Plasma-Therm, the manufacturer of plasma etch, deposition, and advanced packaging equipment for the production of specialty semiconductor devices, announced today the successful acquisition of CORIAL, a France-based plasma processing equipment supplier.

IEEE Electronics Packaging Society honors heterogeneous integration pioneer and other innovators

06/05/2018  IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Electronics Packaging Society (EPS) today announced Dr. William Chen as the recipient of the 2018 IEEE Electronics Packaging Award.

The advanced packaging industry is on the move

05/30/2018  Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the development of innovative solutions to answer to the market demand dominated by megatrends.

Global substrate-like PCB market: Need for miniaturization drives growth

05/25/2018  The global substrate-like PCB market will grow at a CAGR of over 7% during the forecast period, according to Technavio analysts.

Cohu to acquire Xcerra

05/08/2018  Cohu, Inc. and Xcerra Corporation today announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.

Turning graphene into light nanosensors

04/26/2018  Tuning the graphene embedded in a photonic crystal by varying the external temperature can transform it into a light-sensitive sensor.

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Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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