Materials

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MATERIALS ARTICLES



Most wear-resistant metal alloy in the world engineered at Sandia National Laboratories

08/16/2018  Sandia's materials science team has engineered a platinum-gold alloy believed to be the most wear-resistant metal in the world.

Cabot Microelectronics to acquire KMG Chemicals

08/15/2018  Cabot Microelectronics Corporation and KMG Chemicals, Inc. have entered into a definitive agreement under which Cabot Microelectronics will acquire KMG in a cash and stock transaction with a total enterprise value of approximately $1.6 billion.

For UW physicists, the 2-D form of tungsten ditelluride is full of surprises

08/10/2018  The general public might think of the 21st century as an era of revolutionary technological platforms, such as smartphones or social media. But for many scientists, this century is the era of another type of platform: two-dimensional materials, and their unexpected secrets.

Yale-NUS scientist and collaborators solve open theoretical problem on electron interactions

08/10/2018  The discovery will help scientists better understand electron interaction in new materials, paving the way for developing advanced electronics such as faster processors.

Tying down electrons with nanoribbons

08/08/2018  'Topological' graphene nanoribbons trap electrons for new quantum materials

Nanotube 'rebar' makes graphene twice as tough

08/06/2018  Rice University scientists test material that shows promise for flexible electronics.

'Strange metals' just got stranger

08/03/2018  A material already known for its unique behavior is found to carry current in a way never before observed.

Leti and CMP announce world's first multi-project wafer service with integrated silicon OxRAM

08/02/2018  Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the integrated-circuit industry's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

Optical secrets of disulfide nanotubes are disclosed by Lomonosov MSU Scientists

08/01/2018  They have demonstrated a strong light-matter interaction in suspensions and self-assembled films of tungsten disulfide nanotubes.

A colossal breakthrough for topological spintronics

07/31/2018  BiSb expands the potential of topological insulators for ultra-low-power electronic devices.

EPFL uses excitons to take electronics into the future

07/27/2018  EPFL researchers have developed a transistor based on excitons -- a type of particle most people have not heard of -- that is able to function at room temperature.

Theorists find mechanism behind nearly pure nanotubes from the unusual catalyst

07/27/2018  Growing a batch of carbon nanotubes that are all the same may not be as simple as researchers had hoped, according to Rice University scientists.

And then there was (more) light: Researchers boost performance quality of perovskites

07/26/2018  In a paper published online this spring in the journal Nature Photonics, scientists at the University of Washington report that a prototype semiconductor thin-film has performed even better than today's best solar cell materials at emitting light.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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