Materials

MATERIALS ARTICLES



Gold nanoparticles to find applications in hydrogen economy

07/18/2018  The international team of scientist found a way to improve nanocomposite material to use it in hydrogen economy.

A step closer to quantum computers: NUS researchers show how to directly observe quantum spin effects

07/17/2018  Scientists at NUS have discovered a new way to closely look at the electronic quantum behaviour of materials, giving a deeper understanding of how they could be used for future quantum computing applications.

New regulations coming for nitrous oxide

07/12/2018  Nitrous oxide (N2O) has a variety of uses in the semiconductor manufacturing industry. It is the oxygen source for chemical vapor deposition of silicon oxy-nitride (doped or undoped) or silicon dioxide, where it is used in conjunction with deposition gases such as silane.

Leti and Soitec launch a new substrate innovation center to develop engineered substrate solutions

07/11/2018  Industry-inclusive hub promotes early collaboration and learning from substrate to system level.

Intel wins SEMI Award at SEMICON West for process and integration

07/11/2018  Intel has won SEMI's 2018 Award for the Americas. SEMI honored the celebrated chipmaker for pioneering process and integration breakthroughs that enabled the first high-volume Integrated Silicon Photonics Transceiver. The award was presented yesterday at SEMICON West 2018.

Standards industry leaders honored at SEMICON West 2018

07/11/2018  SEMI yesterday honored two industry leaders at SEMICON West 2018 for their outstanding accomplishments in developing Standards for the electronics and related industries.

High gas flow rates create pumping challenge

07/10/2018  Increasingly complicated 3D structures such finFETs and 3D NAND require very high aspect ratio etches. This, in turn, calls for higher gas flow rates to improve selectivity and profile control. Higher gas flow rates also mean higher etch rates, which help throughput, and  higher rates of removal for etch byproducts.

Void control in die attach joint

07/09/2018  To eliminate voids, it is important to control the process to minimize moisture absorption and optimize a curing profile for die attach materials.

Heat-conducting crystals could help computer chips keep their cool

07/06/2018  Researchers at the University of Texas at Dallas and their collaborators have created and characterized tiny crystals of boron arsenide.

High performance nitride semiconductor for environmentally friendly photovoltaics

07/03/2018  A Tokyo Institute of Technology research team has shown copper nitride acts as an n-type semiconductor, with p-type conduction provided by fluorine doping, utilizing a unique nitriding technique applicable for mass production and a computational search for appropriate doping elements, as well as atomically resolved microscopy and electronic structure analysis using synchrotron radiation.

Materials and subsystem suppliers find solutions to emerging defectivity issues at small geometries

06/29/2018  New metrology and inspection technologies and new analysis approaches made possible by improving compute technology offer solutions to finding the increasingly subtle variations in materials and subsystems that meet specifications but still cause defects on the wafer. More collaboration across the supply chain is helping too.  SEMICON West programs on materials and subsystems will address these issues.   

The culprit of some GaN defects could be nitrogen

06/29/2018  Using molecular dynamics, researchers demonstrate the possible role of nitrogen as a major contributor to dislocation-related effects in gallium nitride-based devices.

Linde continues to invest in products, business continuity planning for sub 10nm geometries

06/28/2018  The Linde Group, a supplier of electronic materials, is investing in the expansion of existing products to improve business continuity planning (BCP), while adding new products with improved purity to meet the growing needs of sub-10nm semiconductor factories and advanced flat panel manufacturers.

Scientists fine-tune carbon nanotubes for flexible, fingertip-wearable terahertz imagers

06/28/2018  Researchers at Tokyo Institute of Technology have developed flexible terahertz imagers based on chemically "tunable" carbon nanotube materials. The findings expand the scope of terahertz applications to include wrap-around, wearable technologies as well as large-area photonic devices.

SEMI launches Electronics Materials Group to serve $69B industry

06/28/2018  SEMI today announced the formation of the SEMI Electronic Materials Group (EMG), a new collaborative technology community that combines the former Chemical & Gas Manufacturers Group (CGMG), the Silicon Manufacturers Group (SMG) and other SEMI member segments to better serve the interests of the electronics materials industry.

Reducing CO2 with common elements and sunlight

06/27/2018  New rare-metal-free photocatalyst turns CO2 into carbon resource.

Entegris acquires Flex Concepts

06/27/2018  Entegris, Inc., a developer of specialty chemicals and advanced materials solutions for the microelectronics industry, announced today that it acquired Flex Concepts, Inc., a technology company focused on bioprocessing single-use bags, and fluid transfer solutions for the life sciences industry. 

TowerJazz announces RF SOI 65nm ramp in its 300mm fab

06/27/2018  TowerJazz, the global specialty foundry, today announced a ramp for its radio frequency silicon-on-insulator (RF SOI) 65nm process in its 300mm Uozu, Japan fab.

Template to create superatoms, created by VCU researchers, could make for better batteries

06/22/2018  he superatoms -- combinations of atoms that can mimic the properties of more than one group of elements of the period table -- could be used to improve semiconductors found in computerized devices.

Graphene assembled film shows higher thermal conductivity than graphite film

06/21/2018  Researchers at Chalmers University of Technology, Sweden, have developed a graphene assembled film that has over 60 percent higher thermal conductivity than graphite film -- despite the fact that graphite simply consists of many layers of graphene. The graphene film shows great potential as a novel heat spreading material for form-factor driven electronics and other high power-driven systems.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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