Materials

MATERIALS ARTICLES



Graphene bilayer provides efficient transport and control of spins

09/20/2018  University of Groningen physicists in collaboration with a theoretical physics group from Universität Regensburg have built an optimized bilayer graphene device which displays both long spin lifetimes and electrically controllable spin-lifetime anisotropy.

Commercially relevant bismuth-based thin film processing

09/19/2018  Researchers from Osaka University demonstrate a photoresponsive film processing technique that balances morphological properties with electronic performance.

Two quantum dots are better than one: Using one dot to sense changes in another

09/19/2018  Osaka University-based collaboration fabricates the first nanoelectronic device that can detect single-electron events in a target quantum dot using a second dot as a sensor.

How will graphene, the 2D wonder material, change the semiconductor industry?

09/19/2018  What materials innovation will the future bring?

When 80 microns is enough

09/17/2018  Moving spins across ever larger (but still small) distances makes for a big advance in spintronics.

Mentor's new LightSuite Photonic Compiler automated layout tool speeds integrated photonic design development

09/14/2018  Mentor, a Siemens business, today announced LightSuite Photonic Compiler -- the industry's first integrated photonic automated layout system.

Probing individual edge states with unprecedented precision

09/12/2018  A study by the University of Basel presents a new technique to obtain an individual fingerprint of the current-carrying edge states occurring in novel materials.

Nano-sandwiching improves heat transfer, prevents overheating in nanoelectronics

09/12/2018  Sandwiching two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases and an ultrathin layer of aluminum oxide can significantly reduce the risk of component failure due to overheating, according to a new study led by researchers at the University of Illinois at Chicago College of Engineering.

Golden sandwich could make the world more sustainable

09/11/2018  Scientists have developed a photoelectrode that can harvest 85 percent of visible light in a 30 nanometers-thin semiconductor layer between gold layers, converting light energy 11 times more efficiently than previous methods.

Air Products to expand supply for Samsung Electronics' semiconductor fab in Giheung, South Korea

09/10/2018  Air Products today announced it has been awarded by Samsung Electronics additional gaseous nitrogen and hydrogen supply to its semiconductor fab in Giheung, South Korea.

SUTD researchers resolve a major mystery in 2D material electronics

09/10/2018  Researchers from the Singapore University of Technology and Design (SUTD) have made a major step forward in resolving the mysteries surrounding 2D material Schottky diode.

Researchers use silicon nanoparticles for enhancing solar cells efficiency

09/06/2018  An international research group improved perovskite solar cells efficiency by using materials with better light absorption properties.

Cannibalistic materials feed on themselves to grow new nanostructures

08/31/2018  Scientists at the Department of Energy's Oak Ridge National Laboratory induced a two-dimensional material to cannibalize itself for atomic "building blocks" from which stable structures formed.

Watching two-dimensional materials grow

08/30/2018  Atomically thin crystals will play an ever greater role in future -- but how can their crystallisation process be controlled? A new method is now opening up new possibilities.

All wired up: New molecular wires for single-molecule electronic devices

08/28/2018  Scientists at Tokyo Institute of Technology designed a new type of molecular wire doped with organometallic ruthenium to achieve unprecedentedly higher conductance than earlier molecular wires.

Worldwide semiconductor revenue hit record $120.8B in Q2 2018

08/22/2018  Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018.

New material could improve efficiency of computer processing and memory

08/22/2018  Discovery could have major impact on semiconductor industry.

Sanan IC goes global, emerges as a world-class III-V technology platform company

08/22/2018  Sanan Integrated Circuit Co., a pure-play compound semiconductor foundry, today announces its entry into the North American, European, and Asia Pacific (APAC) markets with their advanced III-V technology platform.

TowerJazz to showcase SiGe and silicon photonic process solutions for 100 to 400Gb/s optical data links at ECOC

08/21/2018  The Company will showcase its advanced SiGe (Silicon Germanium) process, with speeds in excess of 300GHz, and its newest production SiPho (Silicon Photonics) process built into data center high-speed optical data links.

A valley so low: Electrons congregate in ways that could be useful to 'valleytronics'

08/20/2018  A Princeton-led study has revealed an emergent electronic behavior on the surface of bismuth crystals that could lead to insights on the growing area of technology known as "valleytronics."




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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