Materials

MATERIALS ARTICLES



Mechanical engineers develop process to 3D print piezoelectric materials

01/23/2019  New printing technique and materials could be used to develop intelligent materials and self-adaptive infrastructures and transducers.

Agile manufacturing of glass carriers for advanced packaging

01/22/2019  SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus.

Corning Precision Glass Solutions introduces advanced packaging carriers optimized for fan-out processes

01/22/2019  Corning Incorporated today introduced its latest breakthrough in glass substrates for the semiconductor industry – Advanced Packaging Carriers.

Rudolph Technologies receives orders for over $15M from major memory manufacturer

01/15/2019  Process control systems used for advanced packaging of DRAM products in Korea and China facilities; additional orders expected to meet capacity ramp.

Next generation photonic memory devices are light-written, ultrafast and energy efficient

01/14/2019  Researchers of the Eindhoven University of Technology (TU/e) have developed a 'hybrid technology' which shows the advantages of both light and magnetic hard drives. Ultra-short (femtosecond) light pulses allows data to be directly written in a magnetic memory in a fast and highly energy-efficient way. This research, published in Nature Communications, promises to revolutionize the process of data storage in future photonic integrated circuits.

Chemical synthesis of nanotubes

01/10/2019  Nanometer-sized tubes made from simple benzene molecules.

Would Apple change the power GaN world?

12/20/2018  Today, it is crystal-clear that, from theoretical point of view, GaN offers fantastic technical advantages over traditional Si MOSFETs.

Study on low noise, high-performance transistors may bring innovations in electronics

12/19/2018  A research study on low noise and high-performance transistors led by Suprem Das, assistant professor of industrial and manufacturing systems engineering, in collaboration with researchers at Purdue University, was recently published by Physical Review Applied.

Assessing the promise of gallium oxide as an ultrawide bandgap semiconductor

12/18/2018  Researchers at the University of Florida, the U.S. Naval Research Laboratory and Korea University provide a detailed perspective on the properties, capabilities, current limitations and future developments for one of the most promising UWB compounds, gallium oxide.

MIT team invents method to shrink objects to the nanoscale

12/14/2018  MIT researchers have invented a way to fabricate nanoscale 3-D objects of nearly any shape. They can also pattern the objects with a variety of useful materials, including metals, quantum dots, and DNA.

Topological matters: Toward a new kind of transistor

12/10/2018  X-ray experiments at Berkeley Lab provide first demonstration of room temperature switching in ultrathin material that could serve as a 'topological transistor'.

A new light on significantly faster computer memory devices

12/04/2018  A team of scientists from Arizona State University's School of Molecular Sciences and Germany have published in Science Advances online today an explanation of how a particular phase-change memory (PCM) material can work one thousand times faster than current flash computer memory, while being significantly more durable with respect to the number of daily read-writes.

GLOBALFOUNDRIES announces industry's first 300mm SiGe foundry technology to meet growing data center and high-speed wireless demands

11/29/2018  Industry's most advanced high-speed SiGe technology now available on 300mm manufacturing line for terabit communications and automotive radar applications.

Computational chemistry supports research on new semiconductor technologies

11/19/2018  Functionalizing silicon with other compounds could make light-based signaling feasible.

SFU scientists described the course of reactions in two-layer thin metal films

11/16/2018  A team of researchers from Siberian Federal University (SFU) obtained thin copper/gold and iron/palladium films and studied the reactions that take place in them upon heating. Knowing these processes, scientists will be able to improve the properties of materials currently used in microelectronics.

New Applied Materials R&D center to help customers overcome Moore's Law challenges

11/16/2018  Applied Materials, Inc. today announced plans for the Materials Engineering Technology Accelerator (META Center), a major expansion of the company's R&D capabilities aimed at creating new ways for Applied and its customers to drive innovation as classic Moore's Law scaling becomes more challenging.

Cabot Microelectronics Corporation completes acquisition of KMG Chemicals

11/15/2018  Cabot Microelectronics Corporation (Nasdaq: CCMP), today announced that it has completed its previously announced acquisition of KMG Chemicals, Inc. 

Scientists engineer a functional optical lens out of 2D materials

11/14/2018  A team from the University of Washington and the National Tsing Hua University in Taiwan announced that it has constructed functional metalenses that are one-tenth to one-half the thickness of the wavelengths of light that they focus. Their metalenses, which were constructed out of layered 2D materials, were as thin as 190 nanometers -- less than 1/100,000ths of an inch thick.

Scientists shed light on semiconductor degradation mechanism

11/13/2018  Scientists at Nagoya Institute of Technology (NITech) and collaborating universities in Japan have gained new insights into the mechanisms behind degradation of a semiconductor material that is used in electronic devices.

GaN semiconductor specialist Exagan introduces new high power-conversion solutions for at Electronica Trade Show

11/13/2018  Exagan extends the range of its versatile G-FET and G-DRIVE products for the high-power market's multi-kilowatt applications.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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TECHNOLOGY PAPERS



Keysight’s Parametric Measurement Handbook (Rev 4)

Keysight Technologies’ popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.February 27, 2019
Sponsored by Keysight Technologies

A.I. Enabled Trace Analytics Simplifies Root Cause Analysis and Eliminates Events That Cause Yield Loss

Traditional root cause analysis in manufacturing uses summary data, which is ineffective in the face of complex issues stemming from subtle defects in a process. Full trace analytics, backed by powerful Artificial Intelligence (A.I.) algorithms, uses the entirety of all the sensor and tool data available in a production line for analysis, enabling fabrication engineers to quickly and accurately focus on the causes of issues that negatively affect yield, large and small.February 07, 2019
Sponsored by BISTel

Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

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EVENTS



LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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