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MEMS ARTICLES



Leti demonstrates new waveform for 5G low-power wide-area Internet of Things networks

06/25/2018  Leti, a research institute of CEA Tech, today announced that field trials of its new Low Power Wide Area (LPWA) technology, a waveform tailored for Internet of Things (IoT) applications, showed significant performance gains in coverage, data-rate flexibility and power consumption compared to leading LPWA technologies.

9 of the Top 12 smartphone suppliers headquartered in China​

06/22/2018  China accounted for 7 of top 10 leading smartphone suppliers in 2017, share grows to 42%.

U-M researchers create world's smallest 'computer'

06/21/2018  IBM's announcement that they had produced the world's smallest computer back in March raised a few eyebrows at the University of Michigan, home of the previous champion of tiny computing.

Scientists print sensors on gummi candy

06/21/2018  Printing microelectrode arrays on gelatin and other soft materials could pave the way for new medical diagnostics tools.

Executive keynotes to identify MEMS, sensors, imaging innovations and megatrends at SEMI-MSIG European Summits

06/19/2018  Industry leaders to share latest developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018, in Grenoble, France.

SEMI-FlexTech invites proposals for flexible hybrid electronics advances

06/19/2018  FlexTech, a SEMI Strategic Association Partner, is now soliciting proposals for projects that advance flexible hybrid electronics (FHE) for sensors, power and other key electronic components.

Wireless technologies to comprise 55% of connectivity IC shipments in 2018

06/14/2018  Driven by the colossal Internet of Things (IoT) opportunity, wireless technologies—including wireless local area network (WLAN), Bluetooth, cellular and low-power wireless—will account for 55 percent of connectivity integrated circuit (IC) shipments in 2018, according to a new report from business information provider IHS Markit

Industrial internet and connected vehicles drive IoT sales through 2021​

06/14/2018  IC Market Drivers 2018 Update maintains solid revenue growth across all IoT end-use systems.

MEMS pressure sensor technologies: Multiple ways to success

06/11/2018  The MEMS pressure sensor market is still driven by automotive applications. Established automotive applications increase MEMS pressure sensors adoption in the integrating systems, and also widespread their geographical adoption especially in China thanks to new automotive regulation.

The MEMS market is showing a 17.5% CAGR between 2018 and 2023

06/11/2018  MEMS market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period.

A nanotech sensor that turns molecular fingerprints into bar codes

06/08/2018  Scientists at EPFL's School of Engineering and at Australian National University (ANU) have developed a compact and sensitive nanophotonic system that can identify a molecule's absorption characteristics without using conventional spectrometry.

imec demonstrates compact low-power 140GHz CMOS radar with on-chip antennas

06/07/2018  The achievement is an important step in the development of radar-based sensors for a myriad of smart intuitive applications, such as building security, remote health monitoring of car drivers, breathing and heart rate of patients, and gesture recognition for man-machine interaction.

NVIDIA, Taiwan's MOST unveil collaboration to supercharge AI efforts

06/04/2018  NVIDIA and Taiwan's Ministry of Science and Technology today announced an extensive collaboration that will advance Taiwan's artificial intelligence capabilities.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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