Metrology

METROLOGY ARTICLES



SEMI FabView update: More investments in semiconductor fabs

09/21/2018  Global fab construction investment shows continuing strength, with 19 new fab projects expected to begin construction in 2019 and 2020, based on the latest data published in SEMI’s World Fab Forecast.

TowerJazz annual U.S. Technical Symposium to showcase its advanced analog specialty process offerings

09/18/2018  During TGS, the company will share its vision on industry megatrends: "Wireless Everything, Smart Everything, Green Everything" - and the means by which its analog specialty portfolio helps customers to differentiate their technology solutions.

New fabs invest over $220B; 2019 to mark all-time spending high

09/17/2018  Global fab equipment spending will increase 14 percent this year to US$62.8 billion and is expected to rise 7.5 percent, to US$67.5 billion, in 2019, marking the fourth consecutive year of spending growth and the highest investment year for fab equipment in the history of the industry, according to the latest World Fab Forecast Report published today by SEMI.

Industry growth: Still positive but varies by region

09/14/2018  Manufacturing activity continues to expand -- but at a slowing pace.

"Dreams Start Here" at SEMICON Japan 2018 in era of AI

09/11/2018  Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in Japan's industry-leading event.

Worldwide semiconductor equipment billings reach $16.7B in second quarter 2018

09/10/2018  Worldwide semiconductor manufacturing equipment billings reached US$16.7 billion in the second quarter of 2018, 1 percent lower than the previous record quarter and 19 percent higher than the same quarter a year ago.

Nova's materials metrology solution selected for 5nm technology node

09/07/2018  Nova announced today that a major foundry recently placed an order for its VeraFlex advanced X-Ray metrology solution for 5nm technology node.

ASMC 2019 Call for Papers deadline is October 9, 2018

09/07/2018  Educate the industry about the latest in advanced processes and materials.

Top 10 semiconductor industry innovations

09/07/2018  Over the past three decades, most of the world’s innovations have centered largely on business models and involved iterative advances of existing technologies, with none matching the global impact of the top 10 semiconductor industry discoveries and advances, Dr. Morris Chang, founder of TSMC and the IC foundry model, said at SEMICON Taiwan 2018 this week.

Global semiconductor sales increase 17.4% year-to-year in July

09/06/2018  Global industry posts highest-ever monthly sales; year-to-year growth seen across all major semiconductor product categories and regional markets.

GLOBALFOUNDRIES CTO Gary Patton to deliver opening keynote at GSA Silicon Summit

09/06/2018   Dr. Gary Patton, Chief Technology Officer and Senior Vice President of Worldwide Research and Development at GLOBALFOUNDRIES, will deliver the opening keynote address at the inaugural GSA Silicon Summit – East, being held Tuesday, October 9 in Saratoga Springs, NY. 

Lattice Semiconductor appoints Steve Douglass as Corporate VP, R&D

09/05/2018  Lattice Semiconductor Corporation, a provider of customizable smart connectivity solutions, announced the appointment of Steve Douglass as the Company's Corporate Vice President, R&D, effective immediately.

SEMI Europe and AENEAS collaborate to support European electronics industry growth

09/05/2018  SEMI Europe and AENEAS today announced that they have signed a Memorandum of Understanding (MOU) to form a strategic partnership to support the European electronics industry's growth.

China's semiconductor fab capacity to reach 20% worldwide share in 2020

09/04/2018  The China IC Ecosystem Report, a comprehensive report for the IC manufacturing supply chain, reveals that front-end fab capacity in China will grow to account for 16 percent of the world's semiconductor fab capacity this year, a share that will increase to 20 percent by the end of 2020.

Rudolph Technologies launches second-gen Dragonfly inspection and metrology system

08/29/2018  Rudolph Technologies, Inc. today announced its new Dragonfly G2 platform, which incorporates many of the benefits of the Firefly system onto the Dragonfly platform, including higher sensitivity and throughput and the proprietary Clearfind Technology.

Micron announces $3B investment in U.S. for DRAM and NAND

08/29/2018  Micron Technology, Inc. today announced plans to invest $3 billion by 2030 to increase memory production at its plant in Manassas, Virginia, creating 1,100 new jobs roughly over the next decade.

SEMI testifies against third round of U.S. tariffs citing damage to semiconductor supply chain

08/27/2018  In testimony last week before a U.S. government interagency panel considering tariffs on $200 billion worth of Chinese goods, SEMI called for the removal of nearly 100 tariff lines, all of which cover items critical to the semiconductor manufacturing process, including materials and machines.

North American semiconductor equipment industry posts July 2018 billings

08/24/2018  Global billings declined for the second month in a row, indicative of customer push-outs.

Worldwide semiconductor revenue hit record $120.8B in Q2 2018

08/22/2018  Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018.

Seven top 15 semi suppliers of the first half of 2018 register ≥20% gains

08/20/2018  Samsung extends its number one ranking and sales lead over Intel to 22%.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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