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U.S.-China trade war heats up with semiconductor industry caught in the middle
09/25/2018Earlier this week, the U.S. Trade Representative (USTR) released a 10 percent tariff on $200 billion in imports from Chin…
Seven IC products to outpace total 16% IC market growth in 2018
09/18/201813 IC products forecast to show double-digit growth, led by a 39% surge in DRAM sales….
SEMI FabView update: More investments in semiconductor fabs
09/21/2018Global fab construction investment shows continuing strength, with 19 new fab projects expected to begin construction in 2019 and 2020, based…
New Thinking Required for Machine Learning
09/17/2018Speakers argue the semiconductor community thus far has not been doing enough to enable machine intelligence….
Tech Papers
Upcoming Webcasts
Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and…
Lithography
Date and time TBDEUV lithography has been under intense development for years and appears to be close to…

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NEWS ANALYSIS & FEATURES


Solving the burden of Bourdon tubes

09/27/2018  Mini diaphragm gauges offer a new alternative to Bourdon tubes.

Alpha and Omega Semiconductor announces new TO-leadless packaging technology for high current 400A applications

09/27/2018  Alpha and Omega Semiconductor Limited today introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.

Photonic chips harness sound waves to speed up local networks

09/27/2018  Acoustic noise in chips used to be a nuisance. Now scientists at the University of Sydney Nano Institute have developed a technique to put it to use in receivers of information in fibre-optic networks.

STMicroelectronics unveils highly integrated mobile-security chip

09/27/2018  STMicroelectronics revealed its highly integrated mobile-security solution, the ST54J, a system-on-chip (SoC) containing an NFC (Near-Field Communication) controller, Secure Element, and eSIM.

Canon Marketing Japan announces that it has signed an exclusive distribution agreement with ClassOne Technology Inc.

09/27/2018  Canon Marketing Japan Inc. has signed an exclusive distribution agreement in Japan with ClassOne Technology Inc. and it will start receiving orders for ECD tool Solstice in 2018.

China forecast to account for 90% of pure-play foundry market growth in 2018

09/26/2018  Driven by cryptocurrency device demand, TSMC's China sales are expected to surge by 79% this year.

Picosun-SINANO collaboration yields excellent TiN process

09/26/2018  Picosun Group and Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO) report excellent quality titanium nitride (TiN) deposited with Picosun’s plasma-ALD technology.

Study demonstrates new mechanism for developing electronic devices

09/26/2018  OIST scientists have demonstrated a new mechanism that may help develop electronic devices differently.

WIN Semiconductors Corp integrated GaAs technologies support 5G user equipment and network infrastructure

09/26/2018  WIN Semiconductors Corp., the worldÂ’'s largest pure-play compound semiconductor foundry, is driving the development and deployment of 5G user equipment and network infrastructure in the sub-6GHz and mmWave frequency bands.

China trade brings semiconductor executives to DC for the Fall Washington Forum

09/26/2018  Last week, more than a dozen senior semiconductor executives traveled to Washington, DC for the first-ever Fall Washington Forum.

GLOBALFOUNDRIES delivering 8SW RF SOI client chips on 300mm platform for next-generation mobile applications

09/26/2018  RF SOI technology builds on manufacturing legacy that reaches new milestone with more than 40 billion chips shipped.

UIC chemical engineers first to functionalize boron nitride with other nanosystems

09/25/2018  Researchers unlock potential for improving composite material.

GLOBALFOUNDRIES extends FinFET offering with new features to enable tomorrow's intelligent systems

09/25/2018  Feature-rich semiconductor platform delivers competitive performance and scalability for next-generation compute applications.

Semiconductor analyst Mark Lipacis to present featured keynote at GSA Silicon Summit

09/25/2018  Managing Director of Jefferies Group LLC to discuss next semiconductor growth opportunity at October 9 conference, which is designed to advance technology, business and collaboration.

Oxygen vs. nanochip

09/25/2018  Scientists show the vulnerability of a promising two-dimensional semiconductor to air, and discover new catalyst.

IBM Research - Almaden vice president to keynote at The ConFab 2019

09/25/2018  The ConFab, preeminent semiconductor manufacturing and design conference slated for May 14-17, announces IBM VP and lab director will deliver address on advanced computing technologies for AI.

Professors from MIT, University of Illinois at Urbana-Champaign to be honored for excellence in semiconductor research

09/24/2018  Professors Hoyt and Shanbhag will receive the awards in conjunction with the SIA Annual Award Dinner on Nov. 29, 2018 in San Jose, Calif.

Rice U. study sheds light on -- and through -- 2D materials

09/24/2018  High-performance computing helps to survey optical qualities of atom-thick materials for optoelectronics.

Smaller, faster and more efficient modulator sets to revolutionize optoelectronic industry

09/24/2018  A research team comprising members from City University of Hong Kong (CityU), Harvard University and renowned information technologies laboratory has successfully fabricated a tiny on-chip lithium niobate modulator, an essential component for the optoelectronic industry.

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Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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WEBCASTS

Advanced Packaging

  Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

  Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

  Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

EVENTS

Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018


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NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...