Total fab equipment spending reverses course, growth outlook revised downward
12/17/2018Total fab equipment spending in 2019 is projected to drop 8 percent, a sharp reversal from the previously forecast increase…
Semiconductor equipment sales forecast: $62B in 2018 a new record
12/12/2018The equipment market is expected to contract 4.0 percent in 2019 but grow 20.7 percent to reach $71.9 billion, an all-time high….
Microcontamination, despite high yield, can cause long-term reliability issues
12/20/2018For 7nm node chips, any contaminant can make a chip fail. Microcontamination control is the last line of defense for chipm…
General industry slowing coupled with geopolitical strife
12/12/2018Now that most companies in our sector analyses have reported their calendar third quarter 2018 financial results, we have final or 3Q’18/2Q’17 …
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RECOMMENDED TECHNOLOGY PAPERS
Keysight's Parametric Measurement Handbook (Rev 4)
Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks
For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Maximize uptime and optimize maintenance with AMSMore Technology Papers
Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Full Trace Analytics to Simplify Root Cause Analysis, Pinpointing Yield Impacting Issues Quicker Than Ever
Tuesday, January 29, 2019 at 1:00 pm EST
In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals. This allows fab engineers to accurately pinpoint the root causes of yield-impacting issues. This webcast will discuss several use cases to showcase how advanced full trace analytics can help not only in provide accurate results, but can also simplify the root cause analysis process and reducing time-to-root-cause, resulting in better yields, lower production costs and increased engineering productivity. In this LIVE webcast, BISTel's Chief Product Management Officer, Gabe Villareal will discuss how BISTel is leading the industry with its new full trace analytics to simply root cause analysis, which enables fab engineers to pinpoint the issues than impact yield and productivity quicker than ever. Full trace analytics enables the comprehensive examination of process trace data to allow the detection of abnormalities and deviations to the finest details.
Environment, Safety & Health
Date and time TBD
The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
Wafer ProcessingMore Webcasts
Date and time TBD
As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...