12/21/2018  Intevac, Inc. announced today it has received multiple new program awards that together increase Photonics backlog by over $35 million, to an expected five-year record level at year-end 2018.

12/21/2018  MagnaChip Semiconductor Corporation announced today it now offers foundry customers its third generation 0.18 micron Bipolar-CMOS-DMOS (BCD) process technology.

12/21/2018  Today, Mobile Semiconductor announced their new 22nm FDX ULP (Ultra Low Power) Memory Compiler complete with a comprehensive set of features that cement their leadership position in FDX Memory Compiler offerings.

12/20/2018  Agreement expands 15-year R&D partnership to define leadership roadmap for semiconductor industry.

12/20/2018  Progress in the development of highly reliable and sensitive diamond MEMS sensors.

12/20/2018  Today, it is crystal-clear that, from theoretical point of view, GaN offers fantastic technical advantages over traditional Si MOSFETs.

12/20/2018  At SEMICON Japan 2019, SEMI recognized two industry veterans active in the Japan chapter for their longtime contributions to the SEMI International Standards program.

12/19/2018  Flexible and printed electronics innovations and autonomous mobility sensors will take center stage as more than 700 attendees gather for 120 market and technical presentations, 70 exhibits and four short courses at the co-located FLEX 2019 and MEMS & Sensors Technical Congress (MSTC) in Monterey, California, February 18-21, 2019.

12/19/2018  A research study on low noise and high-performance transistors led by Suprem Das, assistant professor of industrial and manufacturing systems engineering, in collaboration with researchers at Purdue University, was recently published by Physical Review Applied.

12/19/2018  In the holiday season lead-in, 4K TV shipments rose to 44 percent of TV shipments and over 70 percent of revenue.

12/19/2018  Synopsys, Inc. today announced that the Liberty Technical Advisory Board (LTAB) and Interconnect Modeling Technical Advisory Board (IMTAB) have ratified new modeling constructs to address timing and parasitic extraction challenges at process nodes down to two nanometers.

12/19/2018  The billings figure is 4.2 percent lower than the final October 2018 level of $2.03 billion, and is 5.3 percent lower than the November 2017 billings level of $2.05 billion.

12/18/2018  Contributing to improved user productivity and yield through operational monitoring and analysis for semiconductor manufacturing equipment.

12/18/2018  NYU researchers offer major new insights for precise engineering of ultra-small, ultra-sensitive electrochemical sensors.

12/18/2018  An international team of researchers has developed a technique that, for the first time, allows single-crystal hybrid perovskite materials to be integrated into electronics.

12/18/2018  Researchers at the University of Florida, the U.S. Naval Research Laboratory and Korea University provide a detailed perspective on the properties, capabilities, current limitations and future developments for one of the most promising UWB compounds, gallium oxide.

12/17/2018  JEDEC Solid State Technology Association announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard.

12/17/2018  International research team, co-led by UC Riverside physicist, shows how pure graphene efficiently converts light into electricity.

12/17/2018  Using ultrasensitive magnetic probes, researchers unveil a surprising link between emergent magnetism and mechanical pressure in artificially engineered non-magnetic oxide heterostructures.