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GLOBALFOUNDRIES introduces Avera Semi, a wholly owned subsidiary to deliver custom ASIC solutions
11/01/2018GLOBALFOUNDRIES today announced the establishment of Avera Semiconductor LLC, a wholly owned subsidiary…
Advanced packaging technologies are key for semiconductor innovation
10/24/2018In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development….
Global semiconductor sales in September up 13.8% year-to-year
10/29/2018Q3 sales are highest on record, 4.1 percent more than previous quarter, 13.8 percent higher than Q3 of last year….
U.S. announces trade talks with Japan, the EU, and UK; Action will benefit semiconductor industry
10/22/2018Last week, the Office of the U.S. Trade Representative (USTR), on instruction from President Trump, not…
Tech Papers
Upcoming Webcasts
Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and…
Lithography
Date and time TBDEUV lithography has been under intense development for years and appears to be close to…

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NEWS ANALYSIS & FEATURES


2D magnetism: Atom-thick platforms for energy, information and computing research

11/01/2018  Scientists say the tiny 'spins' of electrons show potential to one day support next-generation innovations in many fields.

Rudolph Technologies releases NovusEdge System for edge, notch and backside inspection of unpatterned wafers

11/01/2018  New system combines high sensitivity, repeatability and throughput to deliver the industry's best performance and cost-of-ownership for inspection of critical wafer zones.

MagnaChip Semiconductor appoints semiconductor veteran Jeong Ki Min as Chief of Strategic Planning

11/01/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the appointment of Jeong Ki Min to the newly created position of Chief of Strategic Planning

GSA announces new leadership and multiple market initiatives

10/31/2018  The Global Semiconductor Alliance (GSA) Board of Directors has appointed Dr. Lisa Su, President and Chief Executive Officer of Advanced Micro Devices, Inc. (AMD), as Chair of GSA Board of Directors and Simon Segars, Chief Executive Officer of Arm, as the Vice Chair.

Renesas Electronics announces absorption-type merger with consolidated subsidiary

10/31/2018  Renesas Electronics Corporation today announced that it has resolved at the Meeting of Board of Directors held on October 31, 2018 to consolidate its wholly-owned subsidiary Renesas Semiconductor Package & Test Solutions Co, Ltd.

Innodisk bringing the next-generation NAND flash to the industrial embedded market

10/31/2018  Innodisk is launching its industrial-grade 3D NAND SSD series, making the newest NAND flash technology available for the challenging requirements of embedded and industrial applications.

Netronome announces open chiplet architecture for advanced SoC designs

10/31/2018  Netronome today announced an open architecture for domain-specific accelerators designed to significantly reduce the burgeoning cost of silicon development as demanded by modern data center server, edge computing and automotive applications.

Tests show integrated quantum chip operations possible

10/31/2018  For the first time, an Australian team has combined 2 fundamental quantum techniques on an integrated silicon platform, confirming the promise silicon -- the basis of all modern computer chips -- for quantum computing.

Ultrasensitive toxic gas detector

10/31/2018  In a paper published in NANO, researchers from the School of Microelectronics in Tianjin University have discovered a two-step sputtering and subsequent annealing treatment method to prepare vertically aligned WO3-CuO core-shell nanorod arrays which can detect toxic NH3 gas.

Innodisk enters alliance with subsidiaries and partners to bring AIoT into the spotlight

10/30/2018  Innodisk, along with partners and its four subsidiaries, are expanding into to the sectors where IoT intersects with AI to reach untapped potential.

pSemi announces frequency extension and volume production of the 55 GHz Digital Step Attenuator (DSA)

10/30/2018  This mmWave product is the world's first single-chip silicon-on-insulator (SOI) DSA to support the entire 9 kHz to 55 GHz frequency range.

German research institute drives flexible electronics innovations

10/30/2018  SEMI spoke with Prof. Christoph Kutter, executive director, Fraunhofer EMFT, about trends and innovations in flexible hybrid electronics ahead of his presentation at the 2018 FLEX Europe - Be Flexible conference at SEMICON Europa 2018, 13-16, November 2018, in Munich, Germany.

A solar cell that does double duty for renewable energy

10/30/2018  Researchers develop an artificial photosynthesis system that generates hydrogen fuel and electricity at the same time.

Synopsys advances Test Fusion technology with test points to reduce manufacturing costs and boost quality

10/29/2018  Accelerates achieving test goals while meeting power, performance, and area targets.

New chip measures multiple cellular responses to speed drug discovery

10/29/2018  Researchers from the Georgia Institute of Technology have designed a cellular interfacing array using low-cost electronics that measures multiple cellular properties and responses in real time.

SEMI Europe supports joint call to candidates for 2019 European elections

10/29/2018  SEMI Europe today confirmed its support for the joint call to future Members of the European Parliament to put industry at the core of the European Union's future.

SEMI shares industry feedback on RoHS review roadmap with European Commission

10/26/2018  SEMI recently shared industry feedback with the European Commission on the roadmap for reviewing RoHS (the Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment).

Nanotubes may give the world better batteries

10/26/2018  Rice U. scientists' method quenches lithium metal dendrites in batteries that charge faster, last longer.

Highly efficient wet-processed solar cells with molecules in the same orientation

10/26/2018  Researchers at Kanazawa University report in the journal Organic Electronics documents a new method for controlling the orientation of conducting molecules in organic solar cells that results in the enhanced light adsorption and performance of the cells.

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Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

More Technology Papers

WEBCASTS

Advanced Packaging

  Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

  Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

  Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

EVENTS

Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018


More Events

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...