09/17/2018  Results of annual Perceptions and Mask Makers' Surveys to be presented at SPIE Photomask Technology Conference; TEL joins eBeam Initiative.

09/17/2018  Moving spins across ever larger (but still small) distances makes for a big advance in spintronics.

09/17/2018  The 2 new embedded FPGA devices were designed with low power, small package size, and low cost in mind. 

09/17/2018  SEMI-THERM is currently accepting submissions for extended abstracts, peer-reviewed papers and presentation only abstracts. The deadline for each of these submissions types is October 12, 2018.

09/14/2018  MicroLEDs technologies are improving rapidly and new technology paths emerging at a rapid pace. According to Yole Developpement's analysts, technology solutions should start converging by the end of 2019.

09/14/2018  Adesto Technologies announced the successful completion of its previously announced acquisition of Echelon Corporation.

09/14/2018  Axcelis Technologies, Inc., a supplier of enabling ion implantation solutions for the semiconductor industry, announced that it has appointed John Kulungian as vice president of quality.

09/14/2018  Mentor, a Siemens business, today announced LightSuite Photonic Compiler -- the industry's first integrated photonic automated layout system.

09/13/2018  MEMS & Sensors Executive Congress speakers to provide insights into enabling connected devices for wearables, robotics, cars, and autonomous applications October 29-30 in Napa Valley, Calif.

09/13/2018  MCU sales and units shipments driven by the spread of embedded control in systems, more sensors, and the rush to connect end-use applications to the Internet of Things (IoT).

09/13/2018  NSF grant supports SUNY Poly research for scalable computing infrastructure that mimics the synaptic functionality of the human brain.

09/13/2018  SEMI's Serena Brischetto caught up with Zimmer and Peacock Director Martin Peacock to discuss sensor opportunities and challenges ahead of the European MEMS & Sensors and Imaging & Sensors Summits.

09/12/2018  A study by the University of Basel presents a new technique to obtain an individual fingerprint of the current-carrying edge states occurring in novel materials.

09/12/2018  A new wearable ultrasound patch that non-invasively monitors blood pressure in arteries deep beneath the skin could help people detect cardiovascular problems earlier on and with greater precision.

09/12/2018  Sandwiching two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases and an ultrathin layer of aluminum oxide can significantly reduce the risk of component failure due to overheating, according to a new study led by researchers at the University of Illinois at Chicago College of Engineering.

09/12/2018  Amkor Technology announced on September 10th the opening of its new manufacturing and test plant at Longtan Science Park in Taiwan.

09/11/2018  Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in Japan's industry-leading event.

09/11/2018  Scientists have developed a photoelectrode that can harvest 85 percent of visible light in a 30 nanometers-thin semiconductor layer between gold layers, converting light energy 11 times more efficiently than previous methods.

09/11/2018  This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.