Nova’s materials metrology solution selected for 5nm technology node

Nova (NASDAQ : NVMI ) announced today that a major foundry recently placed an order for its VeraFlex advanced X-Ray metrology solution for 5nm technology node.

Nova’s solution utilizes X-ray Photoelectron Spectroscopy (XPS) to simultaneously measure composition and thickness of complex film stacks through the fabrication process. The integration of these film stacks is significantly more complicated than previous nodes both in terms of the materials used and their multi-layer composition, requiring sophisticated process control to minimize device variation. The VeraFlex product portfolio provides the requisite sensitivity and precision needed for these challenging measurements.

As a result of this selection, Nova expects more than $12 million in aggregate business from this customer across 2018 and 2019.

“We are excited about this selection which confirms the applicability of our technology for 5nm and emphasizes the growing need for advanced materials metrology solutions in advanced nodes,” said Adrian Wilson, General Manager of Nova’s Materials Metrology Division. “In order to achieve better performance in smaller devices, our Logic customers are required to modify their materials strategy beyond the traditional architectural changes. These innovative developments increase the need for Materials control and our available market accordingly. We look forward to additional orders as 5nm moves into volume production and further applications are qualified.”

Nova is a innovator and key provider of metrology solutions for advanced process control used in semiconductor manufacturing.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won’t automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *


KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit…
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample…
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t…