Mobile Semiconductor introduces a 22nm FDX (FDSOI) ULP memory compiler

Today, Mobile Semiconductor announced their new 22nm FDX ULP (Ultra Low Power) Memory Compiler complete with a comprehensive set of features that cement their leadership position in FDX Memory Compiler offerings.

This new Memory Compiler offers an Ultra-Low Power mode at 0.65V that is useful to a wide range of wearable and battery powered devices.  The 22nm FDX ULP joins their expanding 22nm FDX Memory Compiler family that currently covers a wide range of speeds, power requirements, and ultra-low leakage offerings.  The 22nm ULP product draws from the expertise developed over the past three years with our successful 28nm and 55nm Memory Compilers.

Cameron Fisher, CEO and Founder of Mobile Semiconductor, said, “We believe our approach to anticipating the needs of engineers, and building in industry leading features, set us apart.  Examples mentioned by current customers includes low power level shifters and isolation cells.  Without these features, the designer cannot power off the memory entirely resulting in wasted energy and a substandard product.  Mobile Semiconductor Memory Compilers truly allow for complete power down and rapid start-up.”

The Mobile Semiconductor / GlobalFoundries 22FDX platform include 100% of what a design team demands:

  • 0.65V and 0.5V Logic Support
  • Integrated Power Solutions
  • Output Isolation
  • Multiple Power Modes
  • Single Port and Register File Compilers
  • Pseudo Dual Port Support
  • Flexible Reverse Body Bias Support

Fisher continued, “Mobile Semiconductor remains the leader in providing low power memory complier solutions.  But it’s not enough to have a feature rich offering on one product like the 22nm FDX ULP, we also believe that it’s our obligation to provide a range of other products such as 28nm and 55nm AND to design them with the features that best support the demands of the market segments.”


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