Packaging and Testing

PACKAGING AND TESTING ARTICLES



SEMICON Korea to showcase AI, smart manufacturing, talent

11/20/2018  With Korea expected to remain the world's largest consumer of semiconductor equipment, building on its 18 percent share in 2018, SEMICON Korea 2019 is poised to connect global electronics manufacturing companies to new opportunities.

MIRPHAB offering design, production and business planning for companies developing mid-infrared devices for chemical sensing and spectroscopic applications

11/14/2018  MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

Global semiconductor sales in September up 13.8% year-to-year

10/29/2018  Q3 sales are highest on record, 4.1 percent more than previous quarter, 13.8 percent higher than Q3 of last year.

Autonomy value: The next value for sensors suppliers

10/23/2018  Nicolas Sauvage, senior director of Ecosystem at TDK InvenSense, will present at the fast-approaching MEMS & Sensors Executive Congress on October 29-30, 2018 in Napa, Calif. SEMI’s Nishita Rao spoke with Sauvage to offer MSEC attendees advance insights on Sauvage’s feature presentation.

Cybersecurity critical to success of MEMS and sensors suppliers

10/18/2018  Cynthia Wright, a retired military officer with over 25 years of experience in national security and cyber strategy and policy, now Principal Cyber Security Engineer at The MITRE Corporation, will give the opening keynote at the upcoming MEMS & Sensors Executive Congress, October 29-30, 2018 in Napa, Calif.

CMOS image sensors: Yole Développement is increasing its forecasts again

10/04/2018  2017 saw aggregated CIS industry revenue of US$13.9 billion. And 5 years later, the consulting company Yole announces more than US$ 23 billion.

Leti and EFI launch project to improve reliability and speed of low-cost electronic devices for autos

09/18/2018  Leti, a research institute of CEA Tech, and EFI Automotive, an international supplier of sensors, actuators and embedded smart modules for the automotive industry, today announced a project to dramatically improve reliability and response time of low-cost automotive components by equipping the devices with sophisticated model predictive control techniques.

Seven IC products to outpace total 16% IC market growth in 2018

09/18/2018  13 IC products forecast to show double-digit growth, led by a 39% surge in DRAM sales.

The role of autonomous mobility in driving MEMS & sensors to $100B market

09/13/2018  MEMS & Sensors Executive Congress speakers to provide insights into enabling connected devices for wearables, robotics, cars, and autonomous applications October 29-30 in Napa Valley, Calif.

Gartner identifies five emerging technology trends that will blur the lines between human and machine

08/23/2018  The 35 must-watch technologies represented on the Gartner Inc. Hype Cycle for Emerging Technologies, 2018 revealed five distinct emerging technology trends that will blur the lines between humans and machines.

Worldwide semiconductor revenue hit record $120.8B in Q2 2018

08/22/2018  Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018.

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

Xperi partners with UMC to support production of direct and hybrid bonding 3D semiconductor technologies

08/02/2018  Partnership enables UMC to develop and manufacture products utilizing Invensas DBI and ZiBond technologies.

Testing modules and multi-chip packages in the full temperature range

07/25/2018  TheXcerra MT2168 XT pick-and-place handler was installed for a tri-temp module test application at a major player in global semiconductor manufacturing.

Park Systems announces Park Nanoscience Lab at Indian Institute of Science in India

07/23/2018  Park Systems announced the opening of the Park Nanoscience Lab at the prestigious Indian Institute of Science (IISC) Bangalore India, which has been upgraded to the status of Institute of Eminence.

Boston Semi Equipment enhances MEMS sensor testing

07/16/2018  Boston Semi Equipment (BSE) introduced today its Zeus gravity feed solution for handling pressure MEMS devices that require pressure and vacuum stimulus during testing.

Bruker announces acquisition of JPK Instruments

07/13/2018  Bruker Corporation today announced that it has acquired JPK Instruments AG (JPK), located in Berlin, Germany.

Imec demonstrates hybrid finFET-silicon photonics technology for ultra-low power optical I/O

07/09/2018  Today at its Imec Technology Forum USA in San Francisco, imec, the research and innovation hub in nano-electronics and digital technology, announced that it has demonstrated ultra-low power, high-bandwidth optical transceivers through hybrid integration of Silicon Photonics and FinFET CMOS technologies.

9 of the Top 12 smartphone suppliers headquartered in China​

06/22/2018  China accounted for 7 of top 10 leading smartphone suppliers in 2017, share grows to 42%.

Executive keynotes to identify MEMS, sensors, imaging innovations and megatrends at SEMI-MSIG European Summits

06/19/2018  Industry leaders to share latest developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018, in Grenoble, France.




TWITTER


WEBCASTS



Full Trace Analytics Simplifies Root Cause Analysis, Pinpoints Yield Impacting Events Quicker Than Ever

Tuesday, January 29, 2019 at 1:00 pm EST

In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals. This allows fab engineers to accurately pinpoint the root causes of yield-impacting issues. This webcast will discuss several use cases to showcase how advanced full trace analytics can help not only in provide accurate results, but can also simplify the root cause analysis process and reducing time-to-root-cause, resulting in better yields, lower production costs and increased engineering productivity. In this LIVE webcast, BISTel's Chief Product Management Officer, Gabe Villareal will discuss how BISTel is leading the industry with its new full trace analytics to simply root cause analysis, which enables fab engineers to pinpoint the issues than impact yield and productivity quicker than ever. Full trace analytics enables the comprehensive examination of process trace data to allow the detection of abnormalities and deviations to the finest details.

Sponsored By:
Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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VIDEOS