Packaging and Testing

PACKAGING AND TESTING ARTICLES



Boston Semi Equipment enhances MEMS sensor testing

07/16/2018  Boston Semi Equipment (BSE) introduced today its Zeus gravity feed solution for handling pressure MEMS devices that require pressure and vacuum stimulus during testing.

Bruker announces acquisition of JPK Instruments

07/13/2018  Bruker Corporation today announced that it has acquired JPK Instruments AG (JPK), located in Berlin, Germany.

Imec demonstrates hybrid finFET-silicon photonics technology for ultra-low power optical I/O

07/09/2018  Today at its Imec Technology Forum USA in San Francisco, imec, the research and innovation hub in nano-electronics and digital technology, announced that it has demonstrated ultra-low power, high-bandwidth optical transceivers through hybrid integration of Silicon Photonics and FinFET CMOS technologies.

9 of the Top 12 smartphone suppliers headquartered in China​

06/22/2018  China accounted for 7 of top 10 leading smartphone suppliers in 2017, share grows to 42%.

Executive keynotes to identify MEMS, sensors, imaging innovations and megatrends at SEMI-MSIG European Summits

06/19/2018  Industry leaders to share latest developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018, in Grenoble, France.

The MEMS market is showing a 17.5% CAGR between 2018 and 2023

06/11/2018  MEMS market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period.

Leti Innovation Days to explore presentations on how microelectronics is fueling innovation

05/29/2018  Leti, a technology research institute of CEA Tech, today announced its annual flagship event, Leti Innovation Days, July 4-5 in Grenoble.

SiTime opens new Center of Excellence in Michigan

05/17/2018  SiTime Corporation announced it has expanded its global footprint to support its rapid growth with the opening of a new Center of Excellence in Michigan.

Cohu to acquire Xcerra

05/08/2018  Cohu, Inc. and Xcerra Corporation today announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.

Expecting the unexpected: 5 takeaways from FLEX Japan and MEMS & Sensors Forum Japan 2018

05/08/2018  Peel-and-stick simplicity isn’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.

Amkor factories receive key automotive certification

04/16/2018  Amkor Technology, Inc. today announced that multiple factories have passed certification audits for IATF 16949:2016, a key certification required for manufacturers who supply products to the automotive market

Global MEMS market for mobile devices forecast to grow at a CAGR of 10.55%

04/12/2018  Global MEMS market for mobile devices to grow at a CAGR of 10.55% during the period 2017-2021.

U.S. trade tensions with China hit fever pitch

03/21/2018  Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

SEMICON West 2018 to spotlight smart technologies, workforce development

03/20/2018  SEMICON West has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California.

The ConFab 2018 announces conference agenda and speakers

03/16/2018  Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

Synopsys and industry technologists to address the path to 2nm SoC design

03/16/2018  Synopsys, Inc. today announced it is hosting an advanced-technology panel on "EUV, High-NA, Metallurgy and FinFET++ - Where We Go from Here for Next-Generation Design" at the Synopsys Users Group (SNUG) Silicon Valley event on Thursday, March 22.

Are the major DRAM suppliers stunting DRAM demand?

03/07/2018  Skyrocketing DRAM prices potentially open the door for startup Chinese competitors.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

A marriage of light-manipulation technologies

03/01/2018  Researchers have, for the first time, integrated two technologies widely used in applications such as optical communications, bio-imaging and Light Detection and Ranging (LIDAR) systems that scan the surroundings of self-driving cars and trucks.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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VIDEOS