Packaging and Testing

PACKAGING AND TESTING ARTICLES



Automotive sensing: A mature yet highly dynamic market

08/29/2017  Despite its age and maturity, the automotive market has witnessed many unexpected developments over the past two years. And as has always been the case, safety drives the market.

Large wafers, complex IC designs among advanced packaging trends

08/15/2017  The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.

NXP announces production of security chips in its US manufacturing facilities

08/04/2017  NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the United States.

Universities obtain new funding from nano-bio manufacturing consortium

07/28/2017  Three leading U.S. universities are the latest recipients of funding from the Nano-Bio Manufacturing Consortium (NBMC), operated by SEMI.

The pervasiveness of ASICs in the IoT era

07/28/2017  For an increasing number of designs, companies are finding it beneficial to design their own ASICs with system-on-a- chip (SoC) complexity. For reasons of cost reduction, quality improvement, IP protection and security, a full turn-key ASIC can be achieved for $1-5 million, particularly if the design can be built using mature technology nodes.

Boston Semi Equipment receives repeat order for Zeus pressure MEMS test handler

07/10/2017  Boston Semi Equipment (BSE), a global semiconductor test handler company, announced today it has received a follow on order for multiple Zeus gravity test handling systems for pressure MEMS.

Nonstop CMOS image sensor sales records seen through 2021

06/28/2017  Embedded imaging applications in cars, security, machine vision, medical, virtual reality, wearable systems, and other new uses will offset slow growth in camera phones, says O-S-D Report.

How SEMI Standard E175 is saving energy and cutting costs

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

Exploring smart sensor explosive growth at SEMICON West 2017

06/20/2017  MEMS & Sensors Industry Group announces programs and speakers for SEMICON West 2017 (July 11-13).

The automotive electronics market: A view from a material supplier

06/16/2017  With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

Sensor/actuator sales take off as price erosion eases

05/22/2017  Strong unit growth continues to be driven by the spread of automated embedded controls, wearable systems, and the Internet of Things, says new O-S-D Report.

STMicroelectronics appoints Jean-Marc Chery as Deputy CEO and names new executive team

04/27/2017  STMicroelectronics announced today the appointment of Jean-Marc Chery as Deputy CEO, effective July 1, 2017.

A novel method for the fabrication of active-matrix 3-D pressure sensors

04/05/2017  A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

Mentor Graphics Team Receives the Harvey Rosten Award for Thermal Heatsink Optimization Methodology

03/23/2017  Mentor Graphics Corporation today announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics.

Linde Invests Over EUR 110M in China to Strengthen Position as Supplier of Choice for Electronics Manufacturers

03/22/2017  Gases and engineering company The Linde Group, through its electronics gases joint venture in China, Linde LienHwa, is expanding its commitment to China and the Asia Pacific region through investments of over EUR 110 million.

SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

Mentor Graphics Launches Unique Xpedition PCB Systems Vibration and Acceleration Simulation Solution

03/06/2017  Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.

Global MEMS manufacturer selects ULVAC Technologies' plasma ashing system

03/01/2017  ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

Picosun and Hitachi MECRALD Process

02/24/2017  ALD fab films at lower temperatures.

Flemish government increases financial support of imec

02/21/2017  Today, the research and innovation hub in nanoelectronics and digital technology imec, and the Flemish Government announced a new, 5-year strategic commitment that aims at strengthening the pioneering role of Flanders' renowned research hub.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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VIDEOS