Packaging Materials

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PACKAGING MATERIALS ARTICLES



Template to create superatoms, created by VCU researchers, could make for better batteries

06/22/2018  he superatoms -- combinations of atoms that can mimic the properties of more than one group of elements of the period table -- could be used to improve semiconductors found in computerized devices.

Graphene assembled film shows higher thermal conductivity than graphite film

06/21/2018  Researchers at Chalmers University of Technology, Sweden, have developed a graphene assembled film that has over 60 percent higher thermal conductivity than graphite film -- despite the fact that graphite simply consists of many layers of graphene. The graphene film shows great potential as a novel heat spreading material for form-factor driven electronics and other high power-driven systems.

The fingerprints of harmful molecules could be detected noninvasively via black silicon

06/20/2018  Scientists of the Far Eastern Federal University (FEFU) in cooperation with colleagues from the Russian Academy of Sciences (RAS), Australian and Lithuanian Universities have improved the technique of ultrasensitive nonperturbing spectroscopic identification of molecular fingerprints.

Interaction of paired and lined-up electrons can be manipulated in semiconductors

06/20/2018  The way that electrons paired as composite particles or arranged in lines interact with each other within a semiconductor provides new design opportunities for electronics, according to recent findings in Nature Communications.

Could this material enable autonomous vehicles to come to market sooner?

06/19/2018  New material has optical properties that could enable better infrared detection for autonomous vehicles and assist firefighters.

pSemi GaN FET driver delivers fast switching to solid-state LiDAR systems

06/14/2018  pSemi Corporation (formerly known as Peregrine Semiconductor), a Murata company focused on semiconductor integration, announces the availability of the PE29101 gallium nitride (GaN) field-effect transistor (FET) driver for solid-state light detection and ranging (LiDAR) systems.

WIN Semiconductors releases new platform integrating high performance 0.1um GaAs pHEMT with monolithic PIN and vertical Schottky diodes

06/13/2018  WIN Semiconductors Corp, the world's largest pure-play compound semiconductor foundry, has expanded its portfolio of highly integrated GaAs technologies with the release of a new pHEMT technology.

NXP introduces new high power RF products for 5G networks

06/12/2018  Company expands its Gallium Nitride (GaN) and LDMOS technology portfolios to offer a full range of high power products.

Entegris announces agreement to acquire SAES Pure Gas business

06/07/2018  Entegris, Inc., a distributor of specialty chemicals and advanced materials solutions, announced today it has entered into a definitive agreement to acquire the SAES Pure Gas business.

Fungi-produced pigment shows promise as semiconductor material

06/06/2018  Researchers at Oregon State University are looking at a highly durable organic pigment, used by humans in artwork for hundreds of years, as a promising possibility as a semiconductor material.

Applied Materials breakthrough accelerates chip performance in the big data and AI era

06/05/2018  Applied Materials, Inc. today announced a breakthrough in materials engineering that accelerates chip performance in the big data and AI era.

Physicists devise method to reveal how light affects materials

06/05/2018  The new method adds to the understanding of the fundamental laws governing the interaction of electrons and light.

Exagan introduces unique intelligent GaN power solution

06/05/2018  Company showcases G-FET and G-DRIVE products for easy-to-design electrical converters and a small, highly efficient 65-watt USB PD 3.0 charger demonstration.

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Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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