Packaging

MAGAZINE



PACKAGING ARTICLES



MEMS and sensors in autonomous and electric vehicles: Key takeaways from IHS Markit at MSEC

11/15/2018  IHS Markit’s Jérémie Bouchaud provided a closer look at and outlook for this key market at the MEMS and Sensors Executive Congress in late October in Napa. Following are key takeaways from his presentation.

MIRPHAB offering design, production and business planning for companies developing mid-infrared devices for chemical sensing and spectroscopic applications

11/14/2018  MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

Micron collaborates with premium German automaker to advance automotive memory technologies

11/14/2018  Micron Technology, Inc., (Nasdaq: MU) today announced at Electronica 2018 that it will collaborate with the BMW Group to further advance the development of automotive memory solutions used in vehicles.

IHP cooperates with EV Group on low-temperature covalent wafer bonding

11/12/2018  EVG ComBond enables wafer-level packaging and heterogeneous integration for advanced MEMS, high-performance logic, power and "Beyond CMOS" devices with micron-level alignment accuracy.

GLOBALFOUNDRIES, indie Semiconductor deliver performance-enhanced microcontrollers for automotive applications

11/12/2018  GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF's 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash) technology.

Unlocking the secrets of metal-insulator transitions

11/09/2018  X-ray photon correlation spectroscopy at NSLS-II's CSX beamline used to understand electrical conductivity transitions in magnetite.

MRSI announces HVM3 die bonding demonstration capability in Shenzhen China

11/09/2018  MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China.

Semiconductor Research Corporation welcomes SK hynix to its acclaimed GRC and NST research programs

11/08/2018  SRC research focused on next-generation semiconductor technology continues to attract the world's leading semiconductor design and manufacturing companies.

Pinnacle Imaging Systems and ON Semiconductor collaborate on new HDR surveillance solution using Xilinx technology

11/07/2018  Pinnacle Imaging Systems and ON Semiconductor today jointly announced a new lower cost HDR video surveillance solution capable of capturing high contrast scenes (120 dB) with 1080p and 30 frames per second (fps) output.

SkyWater appoints Tom Legere as Senior Vice President of Operations

11/06/2018  SkyWater Technology Foundry today announced that Tom Legere has been appointed as Senior Vice President of Operations.

SEMI wins award for Nano-Bio Materials Consortium to grow digital health industry

11/05/2018  SEMI announced today that it has signed a new agreement with the U.S. Air Force Research Laboratory (AFRL) to expand the Nano-Bio Materials Consortium's (NBMC) work in advancing human monitoring technology innovations for telemedicine and digital health.

Renesas Electronics announces absorption-type merger with consolidated subsidiary

10/31/2018  Renesas Electronics Corporation today announced that it has resolved at the Meeting of Board of Directors held on October 31, 2018 to consolidate its wholly-owned subsidiary Renesas Semiconductor Package & Test Solutions Co, Ltd.

Innodisk bringing the next-generation NAND flash to the industrial embedded market

10/31/2018  Innodisk is launching its industrial-grade 3D NAND SSD series, making the newest NAND flash technology available for the challenging requirements of embedded and industrial applications.

MORE PACKAGING ARTICLES

TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

More Technology Papers

EVENTS



EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018
SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019


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VIDEOS