Packaging

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PACKAGING ARTICLES



General industry slowing coupled with geopolitical strife

12/12/2018  Now that most companies in our sector analyses have reported their calendar third quarter 2018 financial results, we have final or 3Q'18/2Q'17 growth estimates for the world electronic supply chain.

Lattice Semiconductor appoints Glenn O'Rourke as Corporate VP, Global Operations

12/11/2018  Lattice Semiconductor Corporation announced the appointment of Glenn O’Rourke as the Company’s Corporate Vice President, Global Operations, effective immediately.

HEIDENHAIN opens new office on west coast

12/11/2018  As the Silicon Valley in California and the West Coast continue to be the hub of the semiconductor manufacturing in the U.S., HEIDENHAIN has expanded its motion systems support by establishing an ETEL facility in Fremont, CA.

Emerging NVM : PCM finally takes off in stand-alone applications

12/10/2018  Ever-growing data generation driven by mobile devices, the cloud, the IoT , and big data, as well as novel AI applications, all part of the megatrends, requires continuous advancements in memory technologies.

Synopsys and imec demonstrate accelerated modeling of complementary FET (CFET) technology

12/10/2018  Synopsys, Inc. announced today another milestone in its longstanding partnership with imec.

SEMI launches new semiconductor manufacturing workforce development campaign

12/05/2018  The semiconductor manufacturing industry is fighting to attract, educate, and retain the necessary talent for its continued growth.

CEA-Leti moves 3D sequential integration closer to commercialization

12/04/2018  Leti, a research institute at CEA Tech, has reported breakthroughs in six 3D-sequential-integration process steps that previously were considered showstoppers in terms of manufacturability, reliability, performance or cost.

New quantum materials could take computing devices beyond the semiconductor era

12/03/2018  Mutliferroics are promising candidates for new type of memory and logic circuits.

CEA-Leti and Silvaco to develop gate-all-around SPICE compact models for circuit design and tech co-optimization

12/03/2018  Leti and Silvaco Inc. today announced during the IEDM 2018 conference a project to create innovative and unified SPICE compact models for the design of advanced circuits using nanowire and nanosheet technologies.

Micron President and CEO Sanjay Mehrotra elected chair of Semiconductor Industry Association

11/30/2018  Keith Jackson, President, CEO, and Director of ON Semiconductor, elected SIA Vice Chair.

MagnaChip to commence volume production of high-voltage IGBT products for power module

11/26/2018  MagnaChip Semiconductor announced that volume production has commenced for an IGBT product for power module targeted to high-voltage industrial applications.

Mentor adds DECA Technologies to growing Mentor OSAT Alliance for high density advanced package (HDAP) designs

11/20/2018  Mentor, a Siemens business, today announced that DECA Technologies has become the latest member of Mentor's (outsourced assembly and test) OSAT Alliance.

Toshiba Machine launches new die casting machines for southeast Asian market

11/19/2018  Toshiba Machine Co., Ltd. has developed the new DC-KT Series Die Casting Machines to meet the needs of the Southeast Asian market and has started sales and production at its plant in Thailand.

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FD-SOI: An Optimal Technology for Integrated IoT and 5G Designs

Thursday, December 13, 2018 at 1 p.m. Eastern

As digital-centric scaling pursues solutions in 3D device architectures such as gate-all-around (GAA) transistors, most applications in new leading-edge growth markets such as Edge AI/ML, IoT, automotive and 5G mmWave demand post-bulk processing power and also next-generation analog and RF performance. This webinar is an overview of production-proven fully-depleted silicon-on-insulator (FD-SOI), the only post-bulk planar transistor technology. We will explain and demonstrate how FD-SOI delivers FinFET-like performance, excellent mismatch and noise characteristics and best-in-class Ft and Fmax required for energy-efficient mmWave applications.

Sponsored By:
Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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