Packaging

MAGAZINE



PACKAGING ARTICLES



Samsung debuts semiconductor innovations at Samsung Tech Day

10/19/2018  Technologies introduced at the event include 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM.

Perovskites: Materials of the future in optical communication

10/16/2018  High performance and stable all? Inorganic metal halide perovskite-based photodetectors for optical communication applications.

Gartner identifies the Top 10 strategic technology trends for 2019

10/15/2018  Analysts explore top industry trends at Gartner Symposium/ITxpo 2018, October 14-18 in Orlando.

MagnaChip introduces high-voltage super junction MOSFET

10/15/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the introduction of a new High-Voltage Super Junction MOSFET with a 900V breakdown voltage and low total gate charge.

Global semiconductor sales grow as the industry embraces IoT and blockchain technology

10/12/2018  Many semiconductor companies are beginning to embrace IoT to drive new revenue and growth models.

GLOBALFOUNDRIES expands RFwave Partner Program to speed time-to-market for wireless connectivity, radar and 5G

10/11/2018  GLOBALFOUNDRIES today announced the addition of nine new partners to its growing RFwave Partner Program.

GOWIN Semiconductor's GW1NS family of products named Arm TechCon 2018 Innovation Award finalist for design innovation of the year

10/10/2018  GOWIN Semiconductor today announced that its GW1NS product family was named a 2018 Arm TechCon Innovation Award finalist for design innovation of the year.

Automating 200mm semiconductor fabs to meet growing demand

10/10/2018  SEMI met with Heinz Martin Esser, managing director at Fabmatics GmbH, to discuss how existing 200mm semiconductor fabs can master the challenges of a 24x7 production under highest cost and quality pressure by implementing intralogistics automation solutions.

Synopsys Design Platform enabled for TSMC's multi-die 3D-IC advanced packaging technologies

10/05/2018  Synopsys, Inc. today announced the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) advanced packaging technologies.

Overcoming challenges of futuristic transistor technology below 5nm node

10/05/2018  To scale down a transistor below a 5nm node is one of the vital concerns for VLSI industry as there are various challenges due to the shrinking of components. Several researches are going on worldwide to overcome the challenges of future technology nodes. Among them, this article reviews the potential transistor structures and materials like Carbon Nano-tube FET, Gate-All-Around FET, and Compound Semiconductors as solutions to overcome the problems of scaling the existing silicon FinFET transistor below 5nm node.

CMOS image sensors: Yole Développement is increasing its forecasts again

10/04/2018  2017 saw aggregated CIS industry revenue of US$13.9 billion. And 5 years later, the consulting company Yole announces more than US$ 23 billion.

DRAM market braces for slower growth

10/03/2018  History suggests that DRAM ASP and market growth will soon trend downward; suppliers cautious and stand ready to adjust capex expansion plans.

Applied Energy Systems announces acquisition of Advanced Research Manufacturing (ARM)

10/01/2018  AES will add ARM's gas purification technology to supplement and further expand its gas delivery equipment offerings.

MORE PACKAGING ARTICLES

TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

More Technology Papers

EVENTS



Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018


More Events

VIDEOS