Packaging

MAGAZINE



PACKAGING ARTICLES



Rice U. researchers unveil Internet of Things security feature

02/20/2019  'Physically unclonable function' is 10 times more reliable than previous methods.

CEA-Leti and Stanford target edge-AI apps with breakthrough NVM memory cell

02/20/2019  Researchers at CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

GlobalFoundries and Dolphin Integration to deliver differentiated FD-SOI adaptive body bias solutions

02/19/2019  IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration.

eSilicon builds momentum as a strong tier one FinFET ASIC supplier

02/15/2019  eSilicon, a provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement of multiple milestones related to the company's growth in the tier one FinFET ASIC market, serving high-bandwidth networking, high-performance computing, AI and 5G infrastructure.

Cadence selected as primary EDA tool vendor by GLOBALFOUNDRIES

02/15/2019  Cadence Design Systems, Inc. today announced that GLOBALFOUNDRIES (GF) has chosen Cadence as the primary EDA tool vendor for use in Avera Semi, a GF subsidiary, for advanced node chip design projects.

Advanced packaging: At the heart of innovation

02/14/2019  The semiconductor industry showed impressive figures in 2017: +21.6% YoY growth to reach about US$ 412 billion.

Who is leading the RF GaN IP landscape?

02/13/2019  The RF GaN industry is showing an impressive growth with a 23% CAGR between 2017 and 2023, driven by telecom and defense applications. By the end of 2017, the total RF GaN market was close to US$380 million and 2023 should reach more than US$1.3 billion with an evolving industrial landscape.

The "Wall," political gridlock and China: SEMI's take on SOTU address

02/12/2019  For public policy lovers, civic-minded, engaged U.S. citizens, and people around the world interested in the U.S. President’s positions and priorities, the annual State of the Union address (SOTU) is "must-see TV."

Mark Majewski named new intelliFLEX CEO

02/04/2019  Electronics industry veteran succeeds founding CEO Peter Kallai as organization shifts head office from Ottawa to GTA.

KLA-Tencor appoints Victor Peng to Board of Directors

02/01/2019  KLA Corporation today announced the appointment of Victor Peng to its board of directors.

Semiconductor R&D spending will step up after slowing

02/01/2019  3D die-stacking technologies, manufacturing barriers, and growing complexities in end-use systems among the technical challenges that are expected to lift R&D growth rates through 2023.

Intel names Robert Swan CEO

01/31/2019  Intel Corporation today announced that its board of directors has named Robert (Bob) Swan as chief executive officer.

SEMI 3D & Systems Summit showcases heterogeneous 3D integration

01/30/2019  Inaugural summit offers latest insights in semiconductor manufacturing and applications.

MORE PACKAGING ARTICLES

TWITTER


WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



A.I. Enabled Trace Analytics Simplifies Root Cause Analysis and Eliminates Events That Cause Yield Loss

Traditional root cause analysis in manufacturing uses summary data, which is ineffective in the face of complex issues stemming from subtle defects in a process. Full trace analytics, backed by powerful Artificial Intelligence (A.I.) algorithms, uses the entirety of all the sensor and tool data available in a production line for analysis, enabling fabrication engineers to quickly and accurately focus on the causes of issues that negatively affect yield, large and small.February 07, 2019
Sponsored by BISTel

Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

More Technology Papers

EVENTS



SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


More Events

VIDEOS