Packaging

MAGAZINE



PACKAGING ARTICLES



Keysight Technologies acquires Thales Calibration Services

08/13/2018  This acquisition establishes Keysight as the largest calibration and support services organization in Australia.

DRAM sales forecast to top $100B this year with 39% market growth

08/09/2018  With 24% IC marketshare, DRAM expected to account for nearly one in four IC sales dollars spent.

Multilayer chip beads with high rated currents

08/08/2018  TDK Corporation has developed the new MPZ0603-H series of multilayer chip beads for power lines in an IEC 0603 package that feature twice the rated current and about half the DC resistance of the existing MPZ0603-C series.

European electronics industry CEOs call on European Commission to bolster sector's competitiveness

08/08/2018  In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

Achronix and Mentor partner to provide link between high-level synthesis and FPGA technology

08/07/2018  Achronix Semiconductor Corporation today announced availability of an optimized High-Level Synthesis (HLS) flow from its partner, Mentor, a Siemens business, for its FPGA technology products.

Mid-year global semiconductor sales up 20.4% compared to 2017

08/06/2018  Q2 sales are highest on record, 6.0 percent more than previous quarter, 20.5 percent higher than Q2 of last year.

Samsung Electronics starts mass production of industry's first 4-bit consumer SSD

08/06/2018  Samsung Electronics Co., Ltd. today announced that it has begun mass producing the industry’s first 4-bit (QLC, quad-level cell) 4-terabyte (TB) SATA solid-state drive (SSD) for consumers.

SEMI High-Tech Facility events: Shaping the future of smart factories in Taiwan

08/02/2018  The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories.

Xperi partners with UMC to support production of direct and hybrid bonding 3D semiconductor technologies

08/02/2018  Partnership enables UMC to develop and manufacture products utilizing Invensas DBI and ZiBond technologies.

Leti and CMP announce world's first multi-project wafer service with integrated silicon OxRAM

08/02/2018  Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the integrated-circuit industry's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

Toshiba develops 40V N-channel power MOSFETs with improved thermal performance

07/31/2018  New packaging provides double-sided cooling for improved heat dissipation.

Global GDP impact on worldwide IC market growth forecast to rise

07/31/2018  Correlation coefficient expected to reach a very high level of 0.95 in the 2018-2022 timeframe.

Imec scientist awarded ERC starting grant to develop ultra-small microscopes

07/30/2018  Imec, a research and innovation hub in nanoelectronics and digital technologies, announces that Niels Verellen, one of its young scientists, has been awarded an ERC Starting Grant.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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VIDEOS