Packaging

MAGAZINE



PACKAGING ARTICLES



Imec furthers high-mobility nanowire FETs for nodes beyond 5nm

06/19/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology presented considerable progress in enabling germanium nanowire pFET devices as a practical solution to extend scaling beyond the 5nm node.

Micross announces new executive appointment

06/15/2018  Marshall (Mac) Blythe has joined Micross in the role of General Manager of Component Modification Services (CMS) located in Hatfield, PA.

FormFactor announces breakthrough improvements in productivity for RF probe systems

06/15/2018  FormFactor, Inc., a electrical test and measurement supplier to the semiconductor industry, has extended its Contact Intelligence technology.

pSemi GaN FET driver delivers fast switching to solid-state LiDAR systems

06/14/2018  pSemi Corporation (formerly known as Peregrine Semiconductor), a Murata company focused on semiconductor integration, announces the availability of the PE29101 gallium nitride (GaN) field-effect transistor (FET) driver for solid-state light detection and ranging (LiDAR) systems.

Wireless technologies to comprise 55% of connectivity IC shipments in 2018

06/14/2018  Driven by the colossal Internet of Things (IoT) opportunity, wireless technologies—including wireless local area network (WLAN), Bluetooth, cellular and low-power wireless—will account for 55 percent of connectivity integrated circuit (IC) shipments in 2018, according to a new report from business information provider IHS Markit

Plasma-Therm completes acquisition of France-based CORIAL

06/13/2018  Plasma-Therm, the manufacturer of plasma etch, deposition, and advanced packaging equipment for the production of specialty semiconductor devices, announced today the successful acquisition of CORIAL, a France-based plasma processing equipment supplier.

Winbond extends performance of Serial NAND Flash memory with 1Gbit device with maximum data-transfer rate of 83MB/s

06/08/2018  Winbond’s new high-performance Serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s.

Sales increase 20% year-to-year in April; double-digit annual growth projected for 2018

06/06/2018  Industry forecast projects sales will increase 12.4 percent in 2018 and 4.4 percent in 2019.

Single molecular insulator pushes boundaries of current state of the art

06/06/2018  Breakthrough could pave the way for smaller transistors.

ROHM and GaN Systems join forces for GaN power semiconductors

06/06/2018  ROHM and GaN Systems announced their collaboration in the GaN (gallium nitride) Power Semiconductor business, with the goal of contributing to the continuing evolution of power electronics.

NXP brings standard packages to RF power

06/05/2018  New RF power transistors simplify design and manufacturing.

IEEE Electronics Packaging Society honors heterogeneous integration pioneer and other innovators

06/05/2018  IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Electronics Packaging Society (EPS) today announced Dr. William Chen as the recipient of the 2018 IEEE Electronics Packaging Award.

Dow unveils two new silicone adhesives formulated to deliver processing options for device and displays assembly

06/04/2018  Dow Performance Silicones further enhanced design flexibilities and processing options for consumer device and display OEMs today with the addition of DOWSIL™ SE 9100 and DOWSIL™ SE 9160 Adhesives to its portfolio of one-part, room-temperature cure (RTV) silicone solutions.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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