Process Materials

MAGAZINE



PROCESS MATERIALS ARTICLES



MIT team invents method to shrink objects to the nanoscale

12/14/2018  MIT researchers have invented a way to fabricate nanoscale 3-D objects of nearly any shape. They can also pattern the objects with a variety of useful materials, including metals, quantum dots, and DNA.

Topological matters: Toward a new kind of transistor

12/10/2018  X-ray experiments at Berkeley Lab provide first demonstration of room temperature switching in ultrathin material that could serve as a 'topological transistor'.

A new light on significantly faster computer memory devices

12/04/2018  A team of scientists from Arizona State University's School of Molecular Sciences and Germany have published in Science Advances online today an explanation of how a particular phase-change memory (PCM) material can work one thousand times faster than current flash computer memory, while being significantly more durable with respect to the number of daily read-writes.

GLOBALFOUNDRIES announces industry's first 300mm SiGe foundry technology to meet growing data center and high-speed wireless demands

11/29/2018  Industry's most advanced high-speed SiGe technology now available on 300mm manufacturing line for terabit communications and automotive radar applications.

Computational chemistry supports research on new semiconductor technologies

11/19/2018  Functionalizing silicon with other compounds could make light-based signaling feasible.

SFU scientists described the course of reactions in two-layer thin metal films

11/16/2018  A team of researchers from Siberian Federal University (SFU) obtained thin copper/gold and iron/palladium films and studied the reactions that take place in them upon heating. Knowing these processes, scientists will be able to improve the properties of materials currently used in microelectronics.

New Applied Materials R&D center to help customers overcome Moore's Law challenges

11/16/2018  Applied Materials, Inc. today announced plans for the Materials Engineering Technology Accelerator (META Center), a major expansion of the company's R&D capabilities aimed at creating new ways for Applied and its customers to drive innovation as classic Moore's Law scaling becomes more challenging.

Cabot Microelectronics Corporation completes acquisition of KMG Chemicals

11/15/2018  Cabot Microelectronics Corporation (Nasdaq: CCMP), today announced that it has completed its previously announced acquisition of KMG Chemicals, Inc. 

Scientists engineer a functional optical lens out of 2D materials

11/14/2018  A team from the University of Washington and the National Tsing Hua University in Taiwan announced that it has constructed functional metalenses that are one-tenth to one-half the thickness of the wavelengths of light that they focus. Their metalenses, which were constructed out of layered 2D materials, were as thin as 190 nanometers -- less than 1/100,000ths of an inch thick.

Scientists shed light on semiconductor degradation mechanism

11/13/2018  Scientists at Nagoya Institute of Technology (NITech) and collaborating universities in Japan have gained new insights into the mechanisms behind degradation of a semiconductor material that is used in electronic devices.

GaN semiconductor specialist Exagan introduces new high power-conversion solutions for at Electronica Trade Show

11/13/2018  Exagan extends the range of its versatile G-FET and G-DRIVE products for the high-power market's multi-kilowatt applications.

Graphene takes a step towards renewable fuel

11/07/2018  Researchers at Linköping University, Sweden, are working to develop a method to convert water and carbon dioxide to the renewable energy of the future, using the energy from the sun and graphene applied to the surface of cubic silicon carbide

Praxair signs long-term supply agreement with Samsung in Hwaseong, South Korea

11/06/2018  This is the fifth plant Praxair will build at this site to help enable Samsung to meet increased global semiconductor demand.

MORE PROCESS-MATERIALS ARTICLES

TWITTER


WEBCASTS



Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

More Technology Papers

EVENTS



SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


More Events

VIDEOS