Process Materials

PROCESS MATERIALS ARTICLES



GaN semiconductor specialist Exagan forms Taiwan subsidiary

10/18/2018  Exagan, an innovator of gallium nitride (GaN) semiconductor technology enabling smaller and more efficient electrical converters, has established Exagan Taiwan Ltd. with a new sales and applications center in Taiwan.

Exploring new spintronics device functionalities in graphene heterostructures

10/18/2018  Graphene Flagship researchers have shown in a paper published in Science Advances how heterostructures built from graphene and topological insulators have strong, proximity induced spin-orbit coupling which can form the basis of novel information processing technologies.

Controlling organic semiconductor band gaps by electron-acceptor fluorination

10/17/2018  Researchers from Osaka University develop a fluorinated electron-acceptor unit for high performance organic semiconductors.

Electrical enhancement: Engineers speed up electrons in semiconductors

10/17/2018  Researchers from Graduate School of Bio-Applications and Systems Engineering at Tokyo University of Agriculture and Technology (TUAT) have sped up the movement of electrons in organic semiconductor films by two to three orders of magnitude. The speedier electronics could lead to improved solar power and transistor use across the world, according to the scientists.

Hidden gapless states on the path to semiconductor nanocrystals

10/12/2018  When chemists from the Institute of Physical Chemistry of the Polish Academy of Sciences in Warsaw were starting work on yet another material designed for the efficient production of nanocrystalline zinc oxide, they didn't expect any surprises. They were greatly astonished when the electrical properties of the changing material turned out to be extremely exotic.

Researchers quickly harvest 2-D materials, bringing them closer to commercialization

10/12/2018  Efficient method for making single-atom-thick, wafer-scale materials opens up opportunities in flexible electronics.

Research on light-matter interaction could improve electronic and optoelectronic devices

10/11/2018  Fundamental research sheds light on new many-particle quantum physics in atomically thin semiconductors.

Study opens route to flexible electronics made from exotic materials

10/10/2018  Cost-effective method produces semiconducting films from materials that outperform silicon.

Boron nitride separation process could facilitate higher efficiency solar cells

10/04/2018  A team of semiconductor researchers based in France has used a boron nitride separation layer to grow indium gallium nitride (InGaN) solar cells that were then lifted off their original sapphire substrate and placed onto a glass substrate.

DRAM market braces for slower growth

10/03/2018  History suggests that DRAM ASP and market growth will soon trend downward; suppliers cautious and stand ready to adjust capex expansion plans.

Transition metal dichalcogenides could increase computer speed, memory by a million times

10/03/2018  Transition metal dichalcogenides (TMDCs) possess optical properties that could be used to make computers run a million times faster and store information a million times more energy-efficiently, according to a study led by Georgia State University.

Picosun-SINANO collaboration yields excellent TiN process

09/26/2018  Picosun Group and Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO) report excellent quality titanium nitride (TiN) deposited with Picosun’s plasma-ALD technology.

Study demonstrates new mechanism for developing electronic devices

09/26/2018  OIST scientists have demonstrated a new mechanism that may help develop electronic devices differently.

UIC chemical engineers first to functionalize boron nitride with other nanosystems

09/25/2018  Researchers unlock potential for improving composite material.

Oxygen vs. nanochip

09/25/2018  Scientists show the vulnerability of a promising two-dimensional semiconductor to air, and discover new catalyst.

Rice U. study sheds light on -- and through -- 2D materials

09/24/2018  High-performance computing helps to survey optical qualities of atom-thick materials for optoelectronics.

STMicroelectronics and Leti develop GaN-on-silicon technology for power conversion applications

09/24/2018  STMicroelectronics and Leti, a research institute of CEA Tech, today announced their cooperation to industrialize GaN (Gallium Nitride)-on-Silicon technologies for power switching devices.

Graphene bilayer provides efficient transport and control of spins

09/20/2018  University of Groningen physicists in collaboration with a theoretical physics group from Universität Regensburg have built an optimized bilayer graphene device which displays both long spin lifetimes and electrically controllable spin-lifetime anisotropy.

Commercially relevant bismuth-based thin film processing

09/19/2018  Researchers from Osaka University demonstrate a photoresponsive film processing technique that balances morphological properties with electronic performance.

Two quantum dots are better than one: Using one dot to sense changes in another

09/19/2018  Osaka University-based collaboration fabricates the first nanoelectronic device that can detect single-electron events in a target quantum dot using a second dot as a sensor.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018


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VIDEOS