09/27/2018  Mini diaphragm gauges offer a new alternative to Bourdon tubes.

09/27/2018  Alpha and Omega Semiconductor Limited today introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.

09/27/2018  Acoustic noise in chips used to be a nuisance. Now scientists at the University of Sydney Nano Institute have developed a technique to put it to use in receivers of information in fibre-optic networks.

09/27/2018  STMicroelectronics revealed its highly integrated mobile-security solution, the ST54J, a system-on-chip (SoC) containing an NFC (Near-Field Communication) controller, Secure Element, and eSIM.

09/27/2018  Canon Marketing Japan Inc. has signed an exclusive distribution agreement in Japan with ClassOne Technology Inc. and it will start receiving orders for ECD tool Solstice in 2018.

09/26/2018  Driven by cryptocurrency device demand, TSMC's China sales are expected to surge by 79% this year.

09/26/2018  Picosun Group and Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO) report excellent quality titanium nitride (TiN) deposited with Picosun’s plasma-ALD technology.

09/26/2018  OIST scientists have demonstrated a new mechanism that may help develop electronic devices differently.

09/26/2018  WIN Semiconductors Corp., the world’'s largest pure-play compound semiconductor foundry, is driving the development and deployment of 5G user equipment and network infrastructure in the sub-6GHz and mmWave frequency bands.

09/26/2018  Last week, more than a dozen senior semiconductor executives traveled to Washington, DC for the first-ever Fall Washington Forum.

09/26/2018  RF SOI technology builds on manufacturing legacy that reaches new milestone with more than 40 billion chips shipped.

09/25/2018  Researchers unlock potential for improving composite material.

09/25/2018  Feature-rich semiconductor platform delivers competitive performance and scalability for next-generation compute applications.

09/25/2018  Managing Director of Jefferies Group LLC to discuss next semiconductor growth opportunity at October 9 conference, which is designed to advance technology, business and collaboration.

09/25/2018  Scientists show the vulnerability of a promising two-dimensional semiconductor to air, and discover new catalyst.

09/25/2018  The ConFab, preeminent semiconductor manufacturing and design conference slated for May 14-17, announces IBM VP and lab director will deliver address on advanced computing technologies for AI.

09/24/2018  Professors Hoyt and Shanbhag will receive the awards in conjunction with the SIA Annual Award Dinner on Nov. 29, 2018 in San Jose, Calif.

09/24/2018  High-performance computing helps to survey optical qualities of atom-thick materials for optoelectronics.

09/24/2018  A research team comprising members from City University of Hong Kong (CityU), Harvard University and renowned information technologies laboratory has successfully fabricated a tiny on-chip lithium niobate modulator, an essential component for the optoelectronic industry.