Beyond the wafers themselves, the semiconductor industry employs thousands of different kinds of materials. These range from the materials used in wafer manufacturing — chemicals and gases, photoresists and developers, anti-reflection coatings, CMP slurries, adhesion promoters, etc. — to the materials used in the manufacturing equipment and the wafer carriers. On the packaging side, materials include laminate substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics, and thermal interface materials.

The market for semiconductor materials is on the same level as capital equipment. In 2015, SEMI reported that the total wafer fabrication materials and packaging materials markets in 2014 were $24.0 billion and $20.4 billion, respectively. Comparable revenues for these segments in 2013 were $22.7 billion for wafer fabrication materials and $20.4 billion for packaging materials. The wafer fabrication materials segment increased 6 percent year-over-year, while the packaging materials segment remained flat. However, if bonding wire were excluded from the packaging materials segment, the segment increased more than 4 percent last year. The continuing transition to copper-based bonding wire from gold is negatively impacting overall packaging materials revenues.

For the fifth consecutive year, Taiwan was the largest consumer of semiconductor materials due to its large foundry and advanced packaging base, totaling $9.8 billion. Japan claimed the second spot during the same time. Annual revenue growth was the strongest in the Taiwan market. The materials market in North America had the second largest increase at 5 percent, followed by China, South Korea and Europe. The materials markets in Japan and Rest of World were flat relative to 2013 levels. (The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets.)

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SUPPLIERS


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Amkor Technology: http://www.amkor.com



QuantumClean: http://www.quantumclean.com



ARTICLES



Vacuum pump market growing at 6%. CAGR to cross $6.5B by 2024

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New laser-based sample prep solution

07/12/2018  3D-Micromac AG (booth #1645 in the South Hall) this week introduced the microPREP 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis (FA).

Subfab data growing in importance

07/11/2018  The importance of data gathered and analysed in the subfab – the place where vacuum pumps, abatements systems and other supporting equipment operates – is growing. Increasingly, manufacturers are finding that these systems have a direct impact on yield, safety, cost-of-ownership and ultimately capacity and cycle time.

3D-Micromac introduces selective laser annealing system for semiconductor and MEMS manufacturing

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Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.

Understanding ALD, MLD and SAMs as they enter the fab

03/01/2018  As the world of advanced manufacturing enters the sub-nanometer scale era, it is clear that ALD, MLD and SAM represent viable options for delivering the required few-atoms-thick layers required with uniformity, conformality, and purity.

US demand for semiconductor machinery to total $7.4B in 2021

02/16/2018  Growth in demand for wafer processing equipment will account for the majority of value growth.

CSTIC and SEMICON CHINA 2018: Brooks Instrument to present new mass flow controller with self-diagnostics​

02/09/2018  Brooks Instrument will showcase its newly enhanced GF125 mass flow controller (MFC) with high-speed EtherCAT connectivity and embedded self-diagnostics at the China Semiconductor Technology International Conference (CSTIC) in conjunction with SEMICON China 2018 in Shanghai.

Leak check semiconductor process chambers quickly and reliably

02/08/2018  INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams to easily check the tightness of vacuum chambers for wafer production.

Boston Semi Equipment develops custom automation modules for strip handling equipment

01/31/2018  Boston Semi Equipment (BSE) today announced that it has started shipping units of its new strip load/unload module to a top 10 semiconductor manufacturer.

Turbulent times ahead for trade

01/25/2018  International trade is one of the best tools to spur growth and create high-skill and high-paying jobs. Over 40 million American jobs rely on trade, and this is particularly true in the semiconductor supply chain. Over the past three decades, the semiconductor industry has averaged nearly double-digit growth rates in revenue and, by 2030, the semiconductor supply chain is forecast to reach $1 trillion.

NAURA Akrion Inc. acquired Akrion’s surface preparation business

01/18/2018  Beijing NAURA Microelectronics Equipment Co.,Ltd. and Akrion Systems LLC today jointly announced that the previously announced acquisition by NAURA has been completed.