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China market drives essentially all pure-play foundry growth in 2018
01/08/2019Cryptocurrency boom in 1H18 helped China’s pure-play foundry market surge 41% last year….
AI drives next wave of chip innovation and growth: Ajit Manocha, SEMI President and CEO
01/07/2019We are living in a digital world where semiconductors are taken for granted, AI is bringing semiconductors back i…
Despite uncertainty, long-term semiconductor market outlook remains bright
01/14/2019This year, SEMI ISS covered it all – from a high-level semiconductor market and global geopolitical overview down to the neu…
Global semiconductor sales up 9.8% year-to-year in November
01/07/2019Year-to-date sales through November top annual total from 2017; month-to-month sales in November slip 1.1 percent….

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NEWS ANALYSIS & FEATURES


Broadcom Inc. appoints Diane M. Bryant to its Board of Directors

01/14/2019  Broadcom Inc. announced today that its board of directors has appointed Diane M. Bryant as an independent director, and as a member of its compensation committee.

Next generation photonic memory devices are light-written, ultrafast and energy efficient

01/14/2019  Researchers of the Eindhoven University of Technology (TU/e) have developed a 'hybrid technology' which shows the advantages of both light and magnetic hard drives. Ultra-short (femtosecond) light pulses allows data to be directly written in a magnetic memory in a fast and highly energy-efficient way. This research, published in Nature Communications, promises to revolutionize the process of data storage in future photonic integrated circuits.

Breakthrough in organic electronics

01/14/2019  Researchers from Chalmers University of Technology, Sweden, have discovered a simple new tweak that could double the efficiency of organic electronics. OLED-displays, plastic-based solar cells and bioelectronics are just some of the technologies that could benefit from their new discovery, which deals with "double-doped" polymers.

Advanced testing paradigm shifting in era of heterogeneous integration

01/14/2019  SEMI Taiwan Testing Committee founded to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications.

SIA files comments on "emerging" technologies

01/11/2019  SIA today filed comments to the Department of Commerce Bureau of Industry and Security (BIS) in response to an advanced notice of proposed rulemaking of controls for "emerging" technologies.

More stable light comes from intentionally 'squashed' quantum dots

01/11/2019  Exploiting new 'strain engineering' approach produces highly stable, narrow linewidth light from individual quantum dots.

Flash memory remains primary target for capex spending

01/11/2019  2019 to be third year of greater than $25.0B in spending for flash, topping both DRAM, foundry.

Future shines bright for European photonics industry

01/10/2019  SEMI met with Dr. Jose Pozo, director of Technology and Innovation at EPIC (European Photonics Industry Consortium), to discuss how 3D packaging applications and heterogeneous integration trends are shaping the European technology landscape.

Chemical synthesis of nanotubes

01/10/2019  Nanometer-sized tubes made from simple benzene molecules.

Spintronics 'miracle material' put to the test

01/10/2019  Physicists build devices using mineral perovskite.

SEMI ISS 2019: Enabling the next industrial revolution

01/09/2019  The SEMI Industry Strategy Symposium (ISS) opened this week with the theme "Golden Age of Semiconductor: Enabling the Next Industrial Revolution." The annual three-day conference of C-level executives gives the year's first comprehensive outlook of the global electronics manufacturing industry.

SEMI enhances global advocacy focus with addition of public policy veteran Mike Russo

01/09/2019  SEMI, the global industry association serving the electronics manufacturing supply chain, today announced that Mike Russo has joined SEMI as vice president of Global Industry Advocacy.

Rudolph Technologies announces rapid adoption of the Dragonfly G2 system for advanced packaging inspection

01/08/2019  One quarter after release, the new Dragonfly platform achieves market recognition in advanced macro inspection with multiple deliveries to world’s largest OSAT.

SCIS Seals & Valves Group develops seals testing standard

01/08/2019  SCIS is a SEMI Technology Community that tackles critical component defectivity for the semiconductor manufacturing industry.

SEMI, imec to drive industry roadmap alignment and innovation in healthcare, transportation and IoT

01/08/2019  SEMI and imec are joining forces to drive innovation and deepen industry alignment on technology roadmaps and international standards while adding technology depth to SEMI's five vertical application platforms including Smart Transportation, Smart MedTech and Smart Data.

Samsung unveils future of displays with groundbreaking modular microLED technology at CES

01/07/2019  Samsung Electronics Co., Ltd. today introduced its latest innovations in modular MicroLED display technology during its annual First Look CES event at the Aria Resort & Casino in Las Vegas.

Quantum scientists demonstrate world-first 3D atomic-scale quantum chip architecture

01/07/2019  UNSW researchers at the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) have shown for the first time that they can build atomic precision qubits in a 3D device - another major step towards a universal quantum computer.

China wafer production capacity growth fastest in the world

01/07/2019  Unwavering in its drive to build a strong, self-sufficient semiconductor supply chain, China plans more new fab projects than any other region in the world from 2017 to 2020, and its expansion of fab capacity recently picked up pace on the strength of new foundry and memory projects from both domestic and foreign companies.

Intevac announces significant increase in photonics backlog

12/21/2018  Intevac, Inc. announced today it has received multiple new program awards that together increase Photonics backlog by over $35 million, to an expected five-year record level at year-end 2018.

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Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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WEBCASTS

Full Trace Analytics Simplifies Root Cause Analysis, Pinpoints Yield Impacting Events Quicker Than Ever

  Tuesday, January 29, 2019 at 1:00 pm EST

In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals. This allows fab engineers to accurately pinpoint the root causes of yield-impacting issues. This webcast will discuss several use cases to showcase how advanced full trace analytics can help not only in provide accurate results, but can also simplify the root cause analysis process and reducing time-to-root-cause, resulting in better yields, lower production costs and increased engineering productivity. In this LIVE webcast, BISTel's Chief Product Management Officer, Gabe Villareal will discuss how BISTel is leading the industry with its new full trace analytics to simply root cause analysis, which enables fab engineers to pinpoint the issues than impact yield and productivity quicker than ever. Full trace analytics enables the comprehensive examination of process trace data to allow the detection of abnormalities and deviations to the finest details.

Sponsored By:
Environment, Safety & Health

  Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

  Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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EVENTS

SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...