Semiconductors

MAGAZINE



SEMICONDUCTORS ARTICLES



IHP cooperates with EV Group on low-temperature covalent wafer bonding

11/12/2018  EVG ComBond enables wafer-level packaging and heterogeneous integration for advanced MEMS, high-performance logic, power and "Beyond CMOS" devices with micron-level alignment accuracy.

GLOBALFOUNDRIES, indie Semiconductor deliver performance-enhanced microcontrollers for automotive applications

11/12/2018  GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF's 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash) technology.

Micron joins CERN openlab, bringing new machine learning capabilities to advance science and research

11/12/2018  Micron Technology, Inc. today announced the company has joined CERN openlab, a unique public-private partnership, by signing a three-year agreement.

Spin Memory teams with Applied Materials to produce a comprehensive embedded MRAM solution

11/12/2018  Spin Memory, Inc. (Spin Memory), the MRAM developer, today announced a commercial agreement with Applied Materials, Inc. (Applied) to create a comprehensive embedded MRAM solution.

Nine Top-15 2018 semi suppliers forecast to post double-digit gains

11/12/2018  Samsung expected to extend its number one ranking and sales lead over Intel to 19%.

Toyoda Gosei to launch corporate venture capital

11/09/2018  Toyoda Gosei Co., Ltd. will establish a Corporate Venture Capital Department in January 2019.

MRSI announces HVM3 die bonding demonstration capability in Shenzhen China

11/09/2018  MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China.

Entegris expands clean manufacturing facility in Malaysia

11/08/2018  30% increase in total manufacturing capacity of advanced technology FOUPs to meet customer demands for the next decade.

SEMI supports U.S. return to trade talks with China, issues trade negotiation principles

11/08/2018  SEMI today voiced support and encouragement for trade discussions between U.S. President Donald Trump and People's Republic of China President Xi Jinping -- talks that are planned for Dec. 1 during the G20 Summit in Argentina.

Semiconductor Research Corporation welcomes SK hynix to its acclaimed GRC and NST research programs

11/08/2018  SRC research focused on next-generation semiconductor technology continues to attract the world's leading semiconductor design and manufacturing companies.

Pfeiffer Vacuum opens new facility in Nashua, New Hampshire

11/07/2018  Pfeiffer Vacuum, a provider of high-tech vacuum solutions for the semiconductor, industrial, coating, analytical and R&D markets, opened up a new 27,000 square foot building in Nashua, NH, on October 25.

Pinnacle Imaging Systems and ON Semiconductor collaborate on new HDR surveillance solution using Xilinx technology

11/07/2018  Pinnacle Imaging Systems and ON Semiconductor today jointly announced a new lower cost HDR video surveillance solution capable of capturing high contrast scenes (120 dB) with 1080p and 30 frames per second (fps) output.

Micron announces mass production of industry's highest-capacity monolithic memory for mobile applications

11/07/2018  Micron Technology, Inc. today announced that it has begun mass production of the industry's highest-capacity and first monolithic 12Gb low-power double data rate 4x (LPDDR4x) DRAM for mobile devices and applications.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018
SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019


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