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SEMICONDUCTORS ARTICLES



Micron begins volume production of GDDR6 high performance memory

06/25/2018  Micron Technology, Inc. today announced volume production on its 8GB GDDR6 memory.

Cadence delivers the first broad cloud portfolio for the development of electronic systems and semiconductors

06/25/2018  Cadence Design Systems, Inc. today launched the Cadence Cloud portfolio, the first broad cloud portfolio for the development of electronic systems and semiconductors.

Synospsys Custom Design Platform accelerates robust custom design for Samsung Foundry's 7LPP process technology

06/22/2018  Samsung and Synopsys release 7LPP Custom Design reference flow.

Global organic CMOS image sensor market expected to reach $1,750.0M by 2025

06/22/2018  The global organic CMOS image sensor market is expected to value at $696.0 million in 2020, and is projected to reach $1,750.0 million by 2025, registering a CAGR of 20.9% from 2021 to 2025.

ON Semiconductor expands manufacturing operations in Mountain Top, Pennsylvania

06/21/2018  ON Semiconductor plans to invest $51 million to support expansion of the Luzerne County facility.

Graphene assembled film shows higher thermal conductivity than graphite film

06/21/2018  Researchers at Chalmers University of Technology, Sweden, have developed a graphene assembled film that has over 60 percent higher thermal conductivity than graphite film -- despite the fact that graphite simply consists of many layers of graphene. The graphene film shows great potential as a novel heat spreading material for form-factor driven electronics and other high power-driven systems.

The memory market will grow 40% to US$177 billion in 2018

06/21/2018  The semiconductor industry posted record results in 2017, with revenue exceeding US$400 billion.

SIA releases statement on Trump Administration tariff announcement

06/20/2018  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, this week released the following statement regarding the Trump Administration's announcement on tariffs on products imported from China.

The fingerprints of harmful molecules could be detected noninvasively via black silicon

06/20/2018  Scientists of the Far Eastern Federal University (FEFU) in cooperation with colleagues from the Russian Academy of Sciences (RAS), Australian and Lithuanian Universities have improved the technique of ultrasensitive nonperturbing spectroscopic identification of molecular fingerprints.

Interaction of paired and lined-up electrons can be manipulated in semiconductors

06/20/2018  The way that electrons paired as composite particles or arranged in lines interact with each other within a semiconductor provides new design opportunities for electronics, according to recent findings in Nature Communications.

North American semiconductor equipment industry posts May 2018 billings

06/20/2018  North America-based manufacturers of semiconductor equipment posted $2.70 billion in billings worldwide in May 2018 (three-month average basis), according to the May Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

imec presents complementary FET as scaling contender for nodes beyond N3

06/20/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology, will present a process flow for a complementary FET (CFET) device for nodes beyond N3.

Imec furthers high-mobility nanowire FETs for nodes beyond 5nm

06/19/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology presented considerable progress in enabling germanium nanowire pFET devices as a practical solution to extend scaling beyond the 5nm node.

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Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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