Semiconductors

SEMICONDUCTORS ARTICLES



SEMICON West 2018 highlights smart technologies, workforce development, industry growth

07/09/2018  Smart technologies take center stage tomorrow as SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, opens for three days of insights into leading technologies and applications that will power future industry expansion.

$62.7B semiconductor equipment forecast: Top previous record, Korea at top but China closes the gap

07/09/2018  Releasing its Mid-Year Forecast at the annual SEMICON West exposition, SEMI, the global industry association representing the electronics manufacturing supply chain, today reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase 10.8 percent to $62.7 billion in 2018, exceeding the historic high of $56.6 billion set last year.

Global semiconductor sales in May increase 21% year-to-year

07/06/2018  Global sales in May were 3 percent higher than the April 2018 total of $37.6 billion.

Heat-conducting crystals could help computer chips keep their cool

07/06/2018  Researchers at the University of Texas at Dallas and their collaborators have created and characterized tiny crystals of boron arsenide.

Strategy for U.S. semiconductor leadership to be previewed at SEMICON West

07/06/2018  White House-led panel to address U.S. goal to lead in development of next-generation microelectronics.

Merging antenna and electronics boosts energy and spectrum efficiency

07/05/2018  Research could lead to longer talk time and higher data rates in 5G devices.

Automotive is driving SiC adoption

07/05/2018  The SiC power market is now on the road, asserts Yole Développement (Yole). Therefore, since 2017, the market research and strategy consulting company identified more than 20 strategic announcements, showing the dynamism of this market and attractiveness of the technology.

ROHM's new CMOS op-amp delivers leading-class low noise

07/05/2018  Ideal for industrial applications that demand high-accuracy sensing, including sonar and optical sensors.

Ultimate precision for sensor technology using qubits and machine learning

07/05/2018  Extracting information quickly from quantum states is necessary for future quantum processors and super-sensitive detectors in existing technologies.

Ultimate precision for sensor technology using qubits and machine learning

07/03/2018  Extracting information quickly from quantum states is necessary for future quantum processors and super-sensitive detectors in existing technologies.

High performance nitride semiconductor for environmentally friendly photovoltaics

07/03/2018  A Tokyo Institute of Technology research team has shown copper nitride acts as an n-type semiconductor, with p-type conduction provided by fluorine doping, utilizing a unique nitriding technique applicable for mass production and a computational search for appropriate doping elements, as well as atomically resolved microscopy and electronic structure analysis using synchrotron radiation.

EV Group accelerates 3D-IC packaging roadmap with breakthrough wafer bonding technology

07/03/2018  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView NT3 aligner.

Global semiconductor industry reached $115.8B in Q1 2018

07/02/2018  Samsung Electronics continued to lead the semiconductor market, followed by Intel and SK Hynix.

Cadence full-flow digital and signoff tools certified on Samsung Foundry’s 7LPP process technology

07/02/2018  Reference flow enables systems and semiconductor companies to accelerate delivery of 7nm LPP process designs.

Alta Devices breaks solar energy efficiency record

07/02/2018  Alta Devices has today announced that its most recent single junction solar cell has been certified by NREL (National Renewable Energy Laboratory) as being 28.9% efficient.

New infrastructure and sensors extract actionable information from mature IoT

07/02/2018  For medtech applications to flourish, sensors need a supporting infrastructure that translates the data they harvest into actionable insights, says Qualcomm Life director of business development Gene Dantsker, who will speak about the future of digital healthcare in the Medtech program at SEMICON West.

Edmund Optics selects Veeco ion beam sputtering system

06/29/2018  Edmund Optics, a supplier of optical components, has ordered the SPECTOR Ion Beam Sputtering System from Veeco Instruments Inc.

Materials and subsystem suppliers find solutions to emerging defectivity issues at small geometries

06/29/2018  New metrology and inspection technologies and new analysis approaches made possible by improving compute technology offer solutions to finding the increasingly subtle variations in materials and subsystems that meet specifications but still cause defects on the wafer. More collaboration across the supply chain is helping too.  SEMICON West programs on materials and subsystems will address these issues.   

UMC acquires 100% ownership of Mie Fujitsu Semiconductor

06/29/2018  Fujitsu Semiconductor Limited and United Microelectronics Corporation, a global semiconductor foundry, today announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies.

The culprit of some GaN defects could be nitrogen

06/29/2018  Using molecular dynamics, researchers demonstrate the possible role of nitrogen as a major contributor to dislocation-related effects in gallium nitride-based devices.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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