Semiconductors

SEMICONDUCTORS ARTICLES



Keep the light off: A material with improved mechanical performance in the dark

05/18/2018  Researchers at Nagoya University find an inorganic semiconductor is brittle when exposed to light, but flexible in the dark.

Global, U.S. electronics supply chains see healthy midyear business conditions

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

SEMI opposes trade tariffs against China, cites damaging impact to chip industry in U.S. government testimony

05/18/2018  Testifying before a U.S. interagency panel weighing trade tariffs against China, a representative from the semiconductor manufacturing industry yesterday called for the removal of more than 100 products from the list of proposed tariffs, stressing that an escalation of the U.S.-Sino dispute could trigger a full-blown trade war and hasten deep, unintended damage including higher consumer prices, an expanded U.S. trade deficit, and a slowdown in U.S. economic growth.

Plasma-Therm earns multiple 'RANKED 1st' awards in industry survey

05/17/2018  For the 20th year, a worldwide survey of semiconductor manufacturers has resulted in Plasma-Therm winning multiple awards for its systems and superior customer service.

3D-Micromac receives order for new microMIRA excimer laser lift-off system from dpiX

05/17/2018  More than 400 laser systems from 3D-Micromac installed worldwide; dozens of excimer laser systems used for display and microelectronics manufacturing.

Molex announces acquisition of BittWare

05/17/2018  New Hampshire company specializes in high-end FPGA computing platforms designed to improve performance and time-to-revenue for OEMs.

Advanced materials: processing glass like a polymer

05/17/2018  KIT materials scientists develop new forming technology -- publication in advanced materials.

SEMI position on EC's proposed framework for screening foreign direct investments in the European Union

05/17/2018  In response to the European Commission’s (EC) proposed framework for screening foreign direct investments (FDI), SEMI, representing the global electronics manufacturing supply chain, offers three recommendations for consideration by EU policymakers.

Crossbar announces licensing relationship agreement with Microsemi

05/16/2018  Companies announce strategic collaboration to integrate ReRAM technology in Microsemi products.

New device could increase battery life of electronics by a hundred-fold

05/16/2018  Researchers developed the device and are working on commercializing it.

Researchers control the properties of graphene transistors using pressure

05/16/2018  A Columbia University-led international team of researchers has developed a technique to manipulate the electrical conductivity of graphene with compression, bringing the material one step closer to being a viable semiconductor for use in today's electronic devices.

Thirteen Top-15 1Q18 semi suppliers register double-digit gains

05/16/2018  Samsung extends its number one ranking and sales lead over Intel to 23%.

Synopsys IC Validator certified by GLOBALFOUNDRIES for signoff physical verification

05/15/2018  Synopsys, Inc. today announced that GLOBALFOUNDRIES (GF) has certified the Synopsys IC Validator tool for physical signoff on the GF 14LPP process technology.

Sciaky receives order for multiple Electron Beam Additive Manufacturing systems

05/15/2018  Sciaky, Inc. announced today that it has received an order for multiple Electron Beam Additive Manufacturing systems to bolster the nation's defense and power generation programs.

EV Group secures lithography order from VTT Technical Research Centre

05/15/2018  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received an order for its EVG120 automated resist processing system from VTT Technical Research Centre of Finland (VTT).

First quarter 2018 silicon wafer shipments increase quarter-over-quarter to record level

05/14/2018  Reaching their highest recorded quarterly level ever, worldwide silicon wafer area shipments jumped to 3,084 million square inches during the first quarter 2018, a 3.6 percent increase over fourth quarter 2017 area shipments of 2,977 million square inches and a 7.9 percent rise over first quarter 2017 shipments.

Waterloo chemists create faster and more efficient way to process information

05/11/2018  Moore's Law extended with the use of light.

ORS acquires Silicon Cert Laboratories

05/10/2018  ORS Labs, Inc., the parent company of Oneida Research Services, Inc. (ORS), announces the acquisition of Silicon Cert Laboratories in Reading, Pennsylvania.

Integration with global ecosystem key to growth of China's semiconductor industry

05/10/2018  The growth of China’s semiconductor industry outstripped sector expansion in many other regions in 2017 thanks in part to heavy government investments and supportive state policies.

ON Semiconductor Rochester assembly and test facility expands manufacturing operation

05/10/2018  ON Semiconductor Corporation announced the expansion of their manufacturing facility in Rochester, New York.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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