Join us for a MEMS-focused webcast on Thursday, June 19th at 12:00pm Eastern time. Click here to go directly to the registration page.
Jay Esfandyari, Director of MEMS and Analog Product Marketing at STMicroelectronics, will discuss the rise of MEMS sensors. Although Micro-Electro-Mechanical Systems (MEMS) have been around for a long time, the introduction of the technology into consumer markets, with Nintendoâ€™s Wii in late 2006, opened the floodgates with multiple MEMS â€“ accelerometers, gyros, compasses, pressure sensors and microphones — now in smartphones and tablets. And you ainâ€™t seen nothing, yet!
Next, Simone Severi, lead for SiGe MEMS at imec, will discuss SiGe MEMS technology for monolithic integration on CMOS. He will describe the recent development of MEMS technologies at imec that enables the monolithic integration of MEMS on CMOS. This approach represents a potential key advantage for a variety of MEMS systems as it can lead to a device performance improvement and to the scaling of the system area with consequent cost and package size reduction. Systems requiring multiple MEMS devices on chip or large MEMS array will benefit the most out of this approach.
One route focuses on the direct post processing on top of CMOS of a low temperature SiGe material, fully compatible with standard Al back end of line processes. This platform can realize a compact system for multi sensing applications. Accelerometers, capacitive pressure, compass and temperature sensors are among the candidate sensors to be combined on the same chip, e.g., to yield implantable (or wearable) products for the medical field, chips for the consumer or automotive market. Array of Capacitive Micromachined Ultrasonic Transducers are demonstrated for potential medical imaging systems. Key asset for the success of this CMOS-MEMS monolithic approach is the implementation of an hermetic thin film packaging technology. Thin film hermetic SiGe packages are demonstrated with cavity pressure ranging from few Pa up to several 100mBar. This technology has the potential to enable a scaling of the form factors while reducing packaging and testing costs.
Jay Esfandyari has more than 20 years of industry experience in Semiconductor Technology, integrated circuits fabrication processes, MEMS & sensors design and development, sensor networking, product marketing, business development and product strategy. Jay holds a masterâ€™s degree and a Ph.D. in Electrical Engineering from the University of Technology of Vienna, Austria. He has more than 60 publications and conference contributions. Jay is currently the Director of MEMS and Analog Product Marketing at STMicroelectronics and he is located in Dallas, Texas.
Simone Severi joined IMEC Leuven in 2007, working on microsystems for mass data storage devices, poly-SiGe surface micromachining technology and CMOS integrated biosensors. In 2009 he became the team leader of the specialty component group at IMEC, with specific focus on MEMS and Bio-Photonics sensors.
Severi received his M.S. degree in microelectronic engineering from the University of Bologna, Italy, in 2001 and his Ph. D degree from the Katholieke Universiteit Leuven in 2006. During his Ph.D course he worked on ultimate device scaling, innovative channel engineering and processing for future CMOS devices technologies.