Topic Index

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Collaboration Joins Sensor, PCB, and MEMS Companies

Tue, 1 Jan 2007
(January 9, 2007) PITTSBURGH, PA and HSINCHU, Taiwan — Virtus Advanced Sensors, which specializes in MEMS-based sensors, entered into a collaboration agreement with several UMC Group companies including PCB manufacturer Unimicron and affiliated MEMS foundry Chipsense, both based in Taiwan.

Laser System for Flex

Tue, 4 Apr 2007
The MicroLine UV cuts openings in polyimide coverlayer foils and flex circuits, performing routing, skiving, drilling, pocket cutting, etch/solder-resist structuring, and ceramic substrate micromachining. It suits prototyping and pre-series production environments.

Tronics Expands MEMS Capabilities

Wed, 4 Apr 2007
(April 18, 2007) CROLLES, France — Tronics Microsystems SA expanded its characterization, assembly, packaging, and testing capabilities with additional space and tools. The expansion will support design-to-manufacturing services, and support its MEMS device supply chain.

Synova Appoints North America Manager

Wed, 1 Jan 2007
(January 24, 2007) LAUSANNE, Switzerland — Synova appointed Notker Kling as general manager, overseeing operations in the company's North American micromachining centers (MMCs) in Boston and Silicon Valley.

Single Mode Green Laser

Mon, 11 Nov 2008
AVIA 532-45 from Coherent, Inc. is a powerful diode-pumped, solid state green laser that delivers diffraction-limited output. This laser is said to provide 45W of average power (at 120 kHz) at 532nm, in a single mode output beam (M2 < 1.3).

High-power UV Laser for Micromachining

Mon, 8 Aug 2008
The AVIA 355-28, from Coherent extends the company's family of micromachining lasers to deliver] 28 Watts of output at 355 nm (at 110 kHz). This high power and repetition rate is said to increase throughput for micromachining applications in semiconductor fabrication and packaging. Target applications include dicing and scribing of silicon wafers and low-k semiconductors, and via-hole drilling in PCBs and flip chips.

MEMS, 3D packaging major factors in iNEMI roadmap

Tue, 8 Aug 2011

The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.

Upcoming SMTA events: IWLPC keynote named, SMTAI seeks presenters

Tue, 1 Jan 2012

The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.

Tessera changes CFO, Neely brings high-tech experience

Thu, 8 Aug 2012

Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company

New MEMS, 3D IC packaging working group chairs at GSA

Tue, 7 Jul 2012

Global Semiconductor Alliance (GSA) recently named Jay Esfandyari, STMicroelectronics, as its MEMS Working Group chairman and Ken Potts, Cadence Design Systems, as the 3D IC Working Group chairman.

Conference report: IITC closes with talks from EUV to TSV

Thu, 6 Jun 2012

Day 3 of the 15th IITC (International Interconnect Technology Conference) opened in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.

SUSS buys Tamarack for lithography, laser structuring lines

Fri, 3 Mar 2012

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.

Conference Report: MEMS Executive Congress Europe

Mon, 4 Apr 2012

Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.


SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

Mon, 4 Apr 2012

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.

Field Report: Sensors in Design 2012

Thu, 3 Mar 2012

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.

2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

Wed, 2 Feb 2012

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.

JPSA expands Ultrafast laser machining technology

Wed, 2 Feb 2012

JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.

Tokyo Electron (TEL) establishes organic EL and FPD departments, eliminates MEMS dev

Fri, 2 Feb 2012

Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.

SUSS combines resist coat and develop platforms

Mon, 3 Mar 2012

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.

CVD Equipment doubles manufacturing space with new NY facility

Mon, 3 Mar 2012

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.

MATHESON incorporates RFID, pressure monitoring in compressed gas control system

Wed, 3 Mar 2012

MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.

Vacuum pumps improve throughput by 90% with new rotary design

Tue, 4 Apr 2012

Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.

Attend joint sessions at VLSI Technology and Circuits

Tue, 4 Apr 2012

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.

Supramolecular researchers install NanoInk lithography system

Thu, 1 Jan 2012

Researchers at INCDTIM in Romania will use NanoInk's NanoFabrication Systems Division's DPN 5000 system for supramolecular structure fabrication, molecular recognition and self-assembling process applications.

Fabs in high-risk zones, 450mm, 3D IC themes of Semico's Semiconductor Fab Database

Wed, 1 Jan 2012

36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions. 

European microelectronics fab database tracks major changes over past 5 years

Mon, 2 Feb 2012

Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.

Texas Instruments (TI, TXN) names top suppliers

Thu, 4 Apr 2012

Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.

ASMC will focus on productivity and technology challenges

Wed, 4 Apr 2012

The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.

Conference Report: MRS Spring 2012, Day 5

Mon, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.

Conference Report: MRS Spring 2012, Day 3

Thu, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

International Solid-State Circuits preview: imec's wireless sensor, organic electronics work

Mon, 2 Feb 2012

At International Solid-State Circuits Conference (ISSCC), imec and Holst Centre are presenting 14 papers on low-power design for wireless communication and wireless sensor networks, and organic electronics.

MIT's nanowire growth control method could optimize LEDs, other semiconductors

Wed, 2 Feb 2012

MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.

IRPS set for April in Anaheim

Tue, 2 Feb 2012

The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.

MEMS Symposium Report: Chasing 1 Trillion

Thu, 5 May 2012

The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”

Present at IEEE IEDM 2012

Wed, 5 May 2012

IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.

SEMICON Europa 2012 seeks presenters

Fri, 3 Mar 2012

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.

SST Book Review: Energy Harvesting for Autonomous Systems

Mon, 4 Apr 2012

Contributing editor Steve Groothuis reviews a book titled “Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).” The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices. 

MEI semiconductor wet process tools built to prevent contamination

Fri, 4 Apr 2012

MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.

NCSU researchers create functional oxide films

Wed, 3 Mar 2012

Researchers from North Carolina State University have developed the first functional oxide thin films that can be used efficiently in electronics, opening the door to an array of new high-power devices and smart sensors.

Semi equipment demand still sinking

Mon, 10 Oct 2012

In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.

SEMI adds session, extends abstract deadline for China chip conference

Tue, 10 Oct 2012

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.

GSA forms technology steering committee to guide working groups

Tue, 10 Oct 2012

The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."

Process Watch: Cycle time’s paradoxical relationship to inspection

Tue, 12 Dec 2012

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

IEDM 2012: Late papers on silicon photonics, large TFTs, III-V devices

Tue, 12 Dec 2012

With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.

ST exiting mobile chip JV with Ericsson, but still committed to FD-SOI

Mon, 12 Dec 2012

STMicroelectronics has a new strategic plan that will focus on five product areas (MEMS/sensors, smart power, automotive products, microcontrollers, and application processors), and also exit its mobile chip JV with communications giant Ericsson.

SEMI: Chip equipment slump extending into 2013, across-the-board rebound in 2014

Thu, 12 Dec 2012

Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.

KLA-Tencor's updated LED wafer inspection tool boosts throughput, efficiency

Thu, 12 Dec 2012

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.

MIPI Alliance forms group to study sensor integration in mobile systems

Mon, 11 Nov 2012

MIPI Alliance has formed an open "Birds of a Feather" (BoF) group that will investigate the requirements related to integrating sensors into mobile systems. The group will address challenges facing the sensor and wireless markets.

EV Group completes cleanroom expansion, opens new R&D labs

Wed, 11 Nov 2012

EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.

Semiconductor equipment demand: Shades of 2009?

Fri, 11 Nov 2012

The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.

Brewer Science introduces CNT inks for printed electronics

Thu, 11 Nov 2012

Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.

IEDM 2012 slideshow 14

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IEDM 2012 slideshow: Sneak preview of 14 conference papers

Tue, 12 Dec 2012

We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.

Singapore IME, Nikon building R&D lab for sub-20nm semiconductor litho

Thu, 12 Dec 2012

Nikon and the Singapore A*STAR IME are jointly setting up a R&D lab to develop optical ArF lithography technology for semiconductor manufacturing to and below the 20nm device node.

Gartner: Fab equipment still getting softer, next upcycle starts in 2014

Thu, 12 Dec 2012

Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.

Canon stepper targets LED, MEMS, power device manufacturing

Tue, 12 Dec 2012

Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.

Edwards tailors vacuum pump for LED, compound semiconductor manufacturing

Tue, 6 Jun 2012

Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.

JPSA picosecond laser micromachining platform reduces debris and thermal damage

Tue, 6 Jun 2012

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.

Terry Brewer chats about SEMI and semiconductors at SEMICON West

Fri, 7 Jul 2012

Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.

Conference report: MEMS Business Forum

Fri, 5 May 2012

The first MEMS Business Forum, sponsored by MEMS Journal and MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 24 at the Santa Clara Biltmore Hotel. Ten speakers presented on topics ranging from near- and mid-term business opportunities to roles of MEMS in broad visions for the future.

ITF: New approaches in the battle against cancer

Fri, 5 May 2012

At imec's International Technology Forum, Denis Wirtz, co-director of the John Hopkins Institute for NanoBio Technology, described the latest efforts to fight cancer.

ITF: Healthcare applications of silicon photonics

Fri, 5 May 2012

At imec's International Technology Forum, Roel Baets, director of the Centre for Nano- and Biophotonics Ghent University, Belgium, said silicon photonics will drastically change the way bio research is conducted.

ITF: Connecting biology with microsystems

Fri, 5 May 2012

At imec’s International Technology Forum, Peter Peumans, department director bio-nano electronics of imec, described promising examples of : technologies that connect biology and Microsystems: Biotechnology: bioreactors, neuroprobes, high speed cell inspection, and high-throughput molecular analysis.

Top conference reports from H1 2012

Fri, 7 Jul 2012

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.

AMAT’s Varian integration continues with Dickerson named president

Wed, 6 Jun 2012

In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.

Singapore IME, MOSIS to offer silicon photonics wafer prototyping service

Tue, 9 Sep 2012

Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.

Laser nanofabrication for mass production at the nanoscale

Fri, 8 Aug 2012

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.

From fuzzy to focused: Phase I in project development

Fri, 10 Oct 2012

Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.

Europe to unite research efforts in Silicon Europe cluster alliance

Mon, 10 Oct 2012

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”

Technology licensing company Rambus restructures, creates CTO role

Thu, 8 Aug 2012

Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.

Analyst: Fab spending softness 2012 extending into 2013

Thu, 10 Oct 2012

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.

Japan's semiconductor industry: Fabs, equipment, and materials

Wed, 10 Oct 2012

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.

IBM demos high-performance CMOS on flexible plastic substrates

Tue, 9 Sep 2012

At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.

IEDM unveils 2012 program highlights

Mon, 9 Sep 2012

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

Chip demand still sliding, hopes for soft 3Q landing and recovery

Fri, 9 Sep 2012

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.

MEMS for mobile industry will reach $6.4B by 2018

Thu, 6 Jun 2013

Market demand for new sensors will lead to a $6.4B market by 2018.

Bosch and STM hold joint honors as No. 1 MEMS suppliers for 2012

Tue, 6 Jun 2013

For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelectronics ending up evenly splitting the title of No. 1 supplier for the year.

Alchimer to collaborate with imec on advanced nano-interconnect technologies

Tue, 6 Jun 2013

In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.

Necessary attributes of a MEMS engineer for new product development

Mon, 6 Jun 2013

In the development of new MEMS products, the team is the most important factor.

Bosch reaches 3 billion sensor milestone

Tue, 6 Jun 2013

Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.

Fab equipment spending: 23% growth for 2014

Tue, 6 Jun 2013

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

Leti to present latest R&D results in MEMS at Transducers’ 2013 in Barcelona

Wed, 5 May 2013

CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.

M2M Forum 2013 explores MEMS and the future of medical devices

Tue, 4 Apr 2013

MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.

Automotive, wireless applications to drive pressure sensors to become top-selling MEMS devices

Mon, 4 Apr 2013

MEMS pressure sensors will achieve accelerated growth this year and become the leading type of MEMS device, driven by increasing use in automotive and the fast-growing handset space, according to insights from the IHS iSuppli MEMS & Sensors Service from information and analytics provider IHS.

Leading MEMS microphone suppliers ride Apple’s gravy train to the top

Wed, 5 May 2013

Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.

Kurt Petersen, MEMS industry pioneer and technology vision, joins IMT board of directors

Tue, 4 Apr 2013

IMT, the largest pure-play MEMS foundry in the US, announced today the appointment of MEMS industry pioneer and technology visionary Dr. Kurt Petersen to the IMT board of directors.


Fri, 4 Apr 2013


Memory, foundry and LED markets drive fab spending in southeast Asia

Thu, 4 Apr 2013

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.

Health awareness spurs quadrupling in MEMS sensor market for wearable electronics

Tue, 4 Apr 2013

From smart wristwatches that record heart rates, to intelligent armbands that track physical activities, wearable electronics and fitness monitoring devices are attracting increased attention from health-conscious consumers, causing shipments of MEMS sensors used in these products to more than quadruple in just five years.

Combo MEMS inertial sensors report brisk growth in automotive market

Mon, 5 May 2013

Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems.

Top 30 MEMS companies of 2012

Fri, 4 Apr 2013

The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on Yole Développement’s annual ranking of the Top 30 MEMS companies.

Examining the MEMS gyroscope patent landscape

Wed, 4 Apr 2013

The gyroscope market is driven by mobile applications, where until recently only two players, STMicroelectronics (ST) and InvenSense, were competing.

Corporate partnership produces next generation MEMS handler

Fri, 2 Feb 2013

TESEC Corporation today announced the development and sales of the ULTRA MEMS Handler, targeting Inertial (Accelerometer, Gyroscope and Magnetometer) MEMS devices.

2013: Beyond CMOS, steady growth and accelerating change across non-mainstream chip markets

Thu, 1 Jan 2013

Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes in technology and  market structures.

2013: MEMS devices better, faster, smaller

Thu, 1 Jan 2013

While the consumer market continues to evolve and the demand for better, faster, smaller increases even further, MEMS should continue to grow and find success as they are designed into more and more devices.

2013: Outlook for secondary equipment

Thu, 1 Jan 2013

The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.

2013: Building the internet of things with MEMS and 3D advances

Wed, 1 Jan 2013

It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.

2013: Fab Equipment Spending Shrinks Back to Flat

Wed, 1 Jan 2013

The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.

Global market for MEMS microphone to more than double in five years

Wed, 2 Feb 2013

The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.

MEMS devices shape medical industry, microsystem devices to reach $6.6 billion in 2018

Wed, 2 Feb 2013

Microelectromechanical (MEMS) devices are shaping the competitive landscape in the global medical device industry.

Tronics to produce submicron MEMS technology of CEA-LETI

Mon, 2 Feb 2013

Tronics kicks-off the industrialization of a unique piezoresistive nanowire MEMS technology that can take 9 DOF motion sensors to a new level of competitiveness.

Opinion: MEMS new product development: The first prototype

Mon, 2 Feb 2013

In the second article of the MEMS new product development blog, the importance of the first prototype will be discussed.

STMicroelectronics and University of Amsterdam Faculty of Science use advanced MEMS to soar with birds

Thu, 2 Feb 2013

STMicroelectronics and the University of Amsterdam Faculty of Science have announced that a sophisticated bird-tracking system developed by the university is using advanced MEMS sensing technology from ST.

MEMS revenue to climb a healthy 8 percent this year

Thu, 2 Feb 2013

A strong uptake in consumer and mobile devices will power the market for microelectromechanical systems (MEMS) to solid revenue growth in 2013, with breakthroughs in new sensor applications also expected this year, according to insights from the IHS iSuppli MEMS service at information and analytics provider IHS.

Institute of Microelectronics and Stanford University to develop switch technology for efficiency in mobile devices

Fri, 2 Feb 2013

A*STAR’s Institute of Microelectronics, or IME, and Stanford University will collaborate to advance innovations in nano-electromechanical systems (NEMS) switch technology for ultra-low power digital systems.

Smartphones and tablets drive continued double-digit growth in MEMS motion sensor market

Thu, 2 Feb 2013

Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.

memsstar lands multiple MEMS etch R&D system orders in Asia

Tue, 1 Jan 2013

memsstar Limited announced two etch system order wins from new MEMS customers in Asia

MEMS Industry Group announces MEMS Executive Congress Europe 2013

Mon, 1 Jan 2013

MEMS Industry Group (MIG) will host its second annual MEMS Executive Congress® Europe, March 12, 2013 in Amsterdam.

World’s most complex 2d laser beamsteering array demonstrated

Thu, 1 Jan 2013

DARPA researchers have recently demonstrated the most complex 2-D optical phased array ever. The array, which has dimensions of only 576µm x 576µm is composed of 4,096 (64 x 64) nanoantennas integrated onto a silicon chip.

Manufacturing innovations to drive MEMS equipment market to a >5% CAGR over 2012-2018

Tue, 2 Feb 2013

In its new report MEMS Front-End Manufacturing Trends, Yole Développement goes further in the equipment and materials market forecasts and in the manufacturing trends for MEMS. The report gives detailed analyses about MEMS device technology process flow, manufacturing trends and manufacturing cost breakdown.

JEDEC elects two new members to its Board of Directors

Mon, 2 Feb 2013

JEDEC Solid State Technology Association, a developer of standards for the microelectronics industry, announced today that its Board of Directors has appointed two new members: Mr. Jong H. Oh, Vice President, SK hynix and Mr. Hung Vuong, Qualcomm. 

Avnet Memec signs agreement with MEMS sensor line

Fri, 3 Mar 2013

InvenSense, Inc. and Avnet Memec this week announced the formation of a pan-European distribution agreement. With the new partnership, Avnet Memec is chartered with sales and support for InvenSense’s MotionTracking devices throughout Europe and Israel.

MEMS microphone shipments to climb 30% this year

Thu, 2 Feb 2013

Shipments of MEMS microphones in 2012 amounted to 2.05 billion units, up 57% from 1.30 billion in 2011, according to IHS iSuppli. Shipments will climb by another 30% to 2.66 billion units in 2013, to be followed by at least three more years of notable double-digit-rate increases.

STMicroelectronics is first $1 billion MEMS company

Wed, 2 Feb 2013

Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.

IDT announces world’s lowest jitter MEMS oscillators with integrated frequency margining capability

Tue, 3 Mar 2013

Integrated Device Technology, Inc. yesterday announced the industry’s first differential MEMS oscillators with 100 femtosecond (fs) typical phase jitter performance and integrated frequency margining capability.

“State of the MEMS Industry” market study to be presented at Smart Systems Integration Conference

Mon, 3 Mar 2013

Roger Grace to present MEMS Commercialization Report Card at annual international technical forum.

Digi-Key Corporation and MEMSIC announce global distribution agreement

Fri, 3 Mar 2013

Global electronic components distributor Digi-Key Corporation today announced the signing of a global distribution agreement with MEMSIC, a provider of MEMS sensor components, sophisticated inertial systems, and leading-edge wireless sensor networks.

Nanoelectronics Conference will focus on semiconductor industry’s future

Fri, 3 Mar 2013

How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25-28, 2013, at its campus in Gaithersburg, Md.

Fujitsu releases new 1 Mbit and 2 Mbit FRAM products

Thu, 3 Mar 2013

Latest offerings enhance power efficiency and miniaturization for smart meters, industrial machinery and medical devices.

MEMS pressure sensors in cellphones set to rise to 681M units in 2016

Wed, 3 Mar 2013

Shipments this year are expected to double to 162 million units, as presented in the attached figure, primarily due to Samsung’s usage of pressure sensors in the Galaxy S4 and other smartphone models.

New miniaturization record by STMicroelectronics makes more room for mobile functionality

Mon, 4 Apr 2013

STMicroelectronics has introduced the world's smallest TVS diode for protecting sensitive electronics in consumer products and handhelds.

STMicroelectronics heads European research team in advanced MEMS devices development

Thu, 4 Apr 2013

STMicroelectronics has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU), a public-private partnership in nanoelectronics.

Brewer Science installs scale-up reactor to support electronics-grade carbon nanotube materials

Mon, 3 Mar 2013

Brewer Science, a developer of lithography enhancement materials for semiconductor manufacturing, announces the installation of a scale-up reactor to increase production of its CNTRENE C100 family of electronics-grade CNT materials by tenfold.

Chinese cellphone and tablet makers gain share in MEMS sensor purchasing in 2012

Thu, 3 Mar 2013

China-based manufacturers of cellphones and tablets in 2012 more than doubled their share of purchases of MEMS motion sensors, reflecting the rising prominence of the companies in the global market, according to an IHS iSuppli MEMS Topical Report from information and analytics provider IHS.

SiTime enters smartphone market with first MEMS oscillator

Wed, 3 Mar 2013

SiTime Corporation, one of the fastest growing semiconductor companies, today introduced the SiT15xx family of 32 kHz MEMS oscillators that are intended to replace legacy quartz crystal resonators.

Emerging consumer applications are boosting the growth of the MEMS pressure sensor market

Tue, 3 Mar 2013

MEMS pressure sensor is one of the very first MEMS components appearing in the microsystem world. The technologies are quite mature and the market is big and expected to grow from $1.9B in 2012 to $3B in 2018.

Smallest MEMS microphone designed for hearing aid applications features low EIN and power consumption

Tue, 3 Mar 2013

Analog Devices ADMP801 MEMS microphone delivers 27 dBA EIN, consumes only 17 µA at 1 V supply, and is available in a 7.3 mm³ package.

High-value MEMS market growth slows due to weak medical electronics and industrial sectors

Tue, 4 Apr 2013

The high-value microelectromechanical system (MEMS) market experienced soft growth last year, mainly due to weakness in the mainstay medical electronics and industrial sectors, according to an IHS iSuppli MEMS High-Value MEMS Market Tracker Report from information and analytics provider IHS.

Unsettled economic situation leaves mark on microtechnology industry

Tue, 4 Apr 2013

A year ago, the microtechnology, nanotechnology, and advanced materials industry looked out on the year 2012 with quite positive expectations. As it turned out, the unstable economic situation has left its mark on these industries, too. For 2013, at least, the companies expect a slight upwards trend.

UMC debuts 200mm Al BEOL fab process

Fri, 12 Dec 2011

United Microelectronics Corporation (UMC) launched the A+ technology platform, a specialized 0.11

IEST cleanroom apparel doc update includes measurement guide

Thu, 12 Dec 2011

The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.

ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab

Thu, 12 Dec 2011

ULVAC Inc. developed the ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system for CVD-Ni and CVD-Co silicidation of 3D semiconductor gates and MEMS. The system is a response to a semiconductor industry transition from PVD to CVD in advanced 3D gate structure film step coverage, ULVAC reports.

SEMICON West 2012: Submit an abstract today

Mon, 12 Dec 2011

SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.

imec's IEDM papers reach "record number"

Wed, 12 Dec 2011

imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.

SEMICON Taiwan preview: Forums span key technology, markets

Tue, 8 Aug 2011

SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.

Flat silicon wafer shipments will pick up in 2012, 2013

Wed, 10 Oct 2011

While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.

TSMC announces entry into MEMS market

Mon, 5 May 2008
May 5, 2008 - Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has unveiled plans to enter the MEMS business, presenting a roadmap of the MEMS process and desires to cover trends in MEMS production at "CMOS integrated MEMS foundries," according to Nikkei Microdevices magazine.

AMIS hands future "Smart Power" R&D to IMEC

Mon, 1 Jan 2008
Jan. 28, 2008 - AMI Semiconductor and European R&D consortium IMEC say they have entered into a new two-year program to develop AMIS' future 14T "Smart Power" platform technology, which will allow the creation of complex systems-on-chip integrating high-voltage and power functions with dense logic, processors and memories.

DALSA to play major role in Quebec Microelectronics Innovation Center

Fri, 9 Sep 2009

DALSA Semiconductor VP/GM Claude Jean talks with SST about the new $218M microelectronics center being formed in Quebec, and how the company will contribute to its focus on MEMS and 3D wafer-level packaging and vice-versa.

Report: MEMS-based system market to generate $13B supply chain revenue in 2012

Tue, 8 Aug 2009
MEMS-based systems were a $46 billion business in 2008, and despite the recession MEMS-based systems should see 12% annual growth through 2012 to an $83 billion industry, meaning a $13 billion market for MEMS devices and the equipment and materials needed to produce them, according to a report on the MEMS supply chain from SEMI and Yole Développement.

IMEC Tech forum: Leading-edge "insight," radio chips, multithreaded processors

Tue, 10 Oct 2009

Among a spate of presentations at IMEC's annual Technology Forum this week, the European R&D consortium trotted out a new program for foundries and fabless companies, an "incubation" pact with TSMC, and developments in multithreading and radio chips.

MEMS sensor firm adds 150mm line

Wed, 10 Oct 2006
October 11, 2006 - Silicon Microstructures, Inc. (SMI), a developer of silicon pressure sensors, says it has ramped to 40,000 sensors/day on a new 150mm MEMS manufacturing line.

April 2006 Exclusive Feature: LITHOGRAPHY

Processing and characterization of a positive thick photoresist

Fri, 5 May 2006
By Shang-Chou Chang, Shen Chi Hsieh, Kun Shan U., Taiwan; Tsung Chieh Cheng , Bau Tong Dai, National Nano Device Laboratories, Taiwan

OVERVIEW There is increasing interest in the thick, positive, epoxy-based photoresist made of the material AZ P4620 because of its wide applications in micro-fluidic devices and micro-electromechanical systems (MEMS). The optimization of polymerization for this material under near ultraviolet (UV) lithography...

Fuji Photo buys Dimatix for inkjet technology

Tue, 6 Jun 2006
June 13, 2006 - Fuji Photo Film Co. Ltd. has agreed to acquire Dimatix Inc., a developer and manufacturer of industrial inkjet printheads, precision micropumps, and specialized print systems, for an undisclosed amount. The company develops systems for jetting fluids such as nanoparticle-based metallic and organic materials in applications such as microelectronic packaging substrates.

Study: TI, inkjet print heads top MEMS drivers ranks

Mon, 4 Apr 2007
April 23, 2007 - Texas Instruments is the number one MEMS company worldwide thanks to its DLP chips business, raking in a record-setting $905 million in sales in 2006, nearly twice as much as No. 2 ranked Hewlett-Packard, according to German research firm Wicht Technologie Consulting. The firm's updated MEMS market survey also shows that HP led a pack of firms focusing on the biggest current MEMS cash cow: inkjet print heads.

Startup shows new diamond-coated wafers for MEMS

Mon, 7 Jul 2007
July 16, 2007 - Advanced Diamond Technologies, Inc. (ADT), a startup targeting development and applications for diamond films, is revealing new product lines of diamond-coated wafers at SEMICON West.

Alcatel, Tronics join for MEMS DRIE

Thu, 6 Jun 2007
June 7, 2007 - Tronics Microsystems SA and Alcatel Micro Machining Systems (AMMS) say they will jointly develop deep reactive ion etch (DRIE) systems for "extreme-performance" MEMS.

View from Japan: MEMS players to watch

Mon, 3 Mar 2005
By Paula Doe, Contributing Editor

A crowd of Japanese suppliers are gambling that rising demand for MEMS devices for high volume products is about to spur a real volume market for production tools and services. There are now 20 Japanese companies offering microelectromechanical foundry services and 12 supplying MEMS etching equipment, according to a recent report from PennWell partner Nikkei Microdevices.

European collaboration will use SOI for MEMS fabrication

Fri, 4 Apr 2005
New technology developed by QinetiQ, Malvern, UK, is to be used by Tronic's Microsystems SA, Crolles, France, for the volume production of innovative micro-electromechanical system (MEMS) devices. The technology teams will collaborate to achieve process design and compatibility, including full process statistics.

Fab owners form manufacturing alliance

Tue, 2 Feb 2005
February 8, 2005 - Nine global semiconductor companies, representing 500,000 200mm-equivalent wafers/month and $7 billion in combined annual revenues, have formed the Fab Owners Association (FOA) to identify problems and potential solutions for common manufacturing issues.

Transparent Networks moves to new HQ

Wed, 7 Jul 2002
July 17, 2002 - Milpitas, CA - Transparent Networks Inc., a developer of intelligent photonic switching systems, has expanded and relocated its headquarters from Santa Clara to Milpitas, CA.

Sandia and Ardesta: A partnership changed by 9-11

Thu, 8 Aug 2002
Roughly a year ago, Sandia National Laboratories, Albuquerque, NM, and Ardesta LLC, Ann Arbor, MI, announced a partnership aimed at transferring MEMS and microsystems technology to start-up companies in the commercial sector.

SMI finishes MEMS fab

Mon, 9 Sep 2003
September 16, 2003 - Silicon Microstructures Inc. (SMI), Milpitas, CA, says it has completed expansion at its MEMS wafer fab in Milpitas two months ahead of schedule.

STMicroelectronics introduces MEMS-based rotational accelerometer

Mon, 8 Aug 2001
Aug. 20, 2001 - Geneva, Switzerland - STMicroelectronics has introduced a new rotational acceleration sensor device based on MEMS technology that addresses applications in hard disk drives and consumer products.

Modeling MEMS at Sandia

Wed, 11 Nov 2001
Modelers at Sandia National Laboratories are helping micromachine designers choose the device they want fully fabricated through new nano-modeling programs.

MEMS-Industry Group trade association launches

Thu, 1 Jan 2001
Pittsburgh, Pennsylvania--A new trade association has been launched by leading microelectromechanical systems (MEMS) developers in the U.S. to represent the growing $2 billion technology sector. The association, MEMS-Industry Group, will function as a member-resource, sharing technology roadmaps, global market information, state of the industry reports, and acting as an advocate in public policy issues.

MEMS Software Tools

Tue, 1 Jan 2008
The schematic-based MEMS design environment ARCHITECT features a 3D visualization tool called Scene3D, which allows users to create 3D views of an ARCHITECT schematic and visualize simulation results with fully contoured 3D animations.

3D Interconnection Cube

Fri, 12 Dec 2008
The 3D interconnection chip carrier from Microcertec S.A.S 3-D combines precision-grinding of ceramics with thin-film metallization and laser micromachining to create a 3D package option for chips and ICs.

High-powered Ultra-violet Laser

Tue, 12 Dec 2008
The Q304-HD laser from JDSU is a high-powered ultra-violet (UV) laser based upon the company's Q Series UV laser platform. This laser reportedly provides 50% more power and is designed to increase throughput, or the rate at which it conducts micromachining functions such as hole drilling, wafer cutting or singulation, and solar cell processing.

Freescale Establishes Advanced 200-mm MEMS Production Line

Mon, 1 Jan 2008
(January 14, 2008) TUCSON, AZ — Freescale Semiconductor has established an advanced microelectromechanical systems (MEMS) 200-mm (8-in.) production line to address growing sensors market demand. The newly added line at Freescale's Oak Hill Fab in Austin, TX, complements the company's existing 150-mm (6-in.) MEMS capacity in Sendai, Japan.

Freescale Ramps Up with Advanced 200-mm MEMS Production Line

Thu, 1 Jan 2008
(January 17, 2008) AUSTIN — Freescale Semiconductor has established an advanced microelectromechanical systems (MEMS) 200-mm (8-inch) production line to address growing sensors market demand. The newly added line at Freescale's Oak Hill Fab in Austin, TX, complements the company's existing 150-mm (6-inch) MEMS capacity in Sendai, Japan.

Flexible Pulsed Laser Platform for Industrial Microprocessing

Mon, 3 Mar 2008
The PyroFlex 2 series of industrial pulsed laser platforms is capable of shaping pulse parameters to exact specifications for microprocessing applications. The platform utilizes a unique software pulse control process. It combines the advantages of proven high-reliability fiber-coupled laser diode pumping technology with the benefits of programming control, and incorporates an optional optical isolator for good pulse stability.

Wet Copper Seed Deposition Process Spells the End for PVD in TSV Construction

Mon, 5 May 2008
By Steve Lerner, CEO, Alchimer
It seems hard to believe that in just half a century the semiconductor industry has emerged from obscurity to become a key indicator for global economic prosperity. In that time it has developed a cyclic nature; periods of high growth followed by periods of low (or even negative) growth that, due to our overriding dependency on semiconductors, now impacts greatly on the developed world.

AML Ships R&D and Production Systems

Tue, 7 Jul 2007
(July 3, 2007) DIDCOT, OXON, U.K. — Applied Microengineering Ltd. (AML) won a European tender to supply Fraunhofer Institute for Mechanics of Materials (IWMH — Halle, Germany) with a wafer bonder for R&D, and an order from Semefab (Scotland, U.K.) for a production-volume bonder for use in MEMS manufacture.

PhotoMachining Expands UV Laser Offerings

Wed, 7 Jul 2007
(July 11, 2007) PELHAM, NH — PhotoMachining, Inc., will expand its micromachining capabilities with ultraviolet (UV) laser systems. The UV photons perform cold ablation, machine small feature sizes, and control material removal better than conventional infrared (IR) sources, according to the company.

DALSA Semiconductor to License Alchimer's eG ViaCoat Technology

Mon, 12 Dec 2008
(December 15, 2008) BROMONT, Canada and MASSY, France —DALSA Semiconductor, supplier of specialized and custom wafer foundry services announced successful tests creating conformal copper seed layers on through-silicon via structures (TSVs) using the eG ViaCoat process from Alchimer S.A. As a result DALSA reportedly intends to license Alchimer's technology to enhance its MEMS production capabilities.

Fiber-based Industrial Laser

Fri, 5 May 2008
With over 18 watts of average power at a pulse repetition rate of 200 kHz (pulsewidth < 15 ps), the Talisker, a fiber-based laser from Coherent, enables precision micromachining at high throughput rates with a negligible heat affected zone (HAZ). And with a choice of infrared (1064 nm), visible (532 nm) or ultraviolet (355 nm) output, it can be used on virtually any material type, including metals, polymers, glass and semiconductors.

Solid-State UV Laser for Drilling and Micromachining

Mon, 12 Dec 2007
The AVIA 355-7 Q-switched, frequency-tripled, solid-state laser delivers over 7W of average power at 355 nm in a package designed to maximize reliability for a minimum cost of ownership.

Synova Funds Global Initiative

Tue, 8 Aug 2006
(August 15, 2006) LAUSANNE, Switzerland — Synova announced that it received financing for $8.1 million, or 10 million Swiss francs (CHF), to develop micromachining centers (MMCs) in several international locations. Swiss banks will fund Synova's worldwide MMC growth strategy. The company plans to construct localized support networks, build application labs offering on-site product demonstrations, and promote laser MicroJet technology applications.

Letter to the Editor

Tue, 6 Jun 2006
Dear Editor, Your editorial on the term "nanotechnology" did not go as far as it could in highlighting the ambiguity of the current usage of the "nano" prefix. I have always grudgingly accepted the definition containing features in the 1-100-nm scale as a useful first step in describing what it is we do to a layman. I am surprised to find that the U.S. Nanotechnology Initiative has used this infantile definition in setting out guidelines for what constitutes nanotechnology.

Laser Dicing Systems

Tue, 6 Jun 2006
The IX-200 ChromaDice DPSS version is a high-precision wafer dicing system suitable for wafer trimming and scribing applications.

Microfabrica Kicks Off MEMS Design Competition

Fri, 9 Sep 2005
Burbank, Calif. — Microfabrica and MOSIS have launched the EFAB Access Design Competition for microdevices. Offered by MOSIS, EFAB Access, a low-cost prototyping service for MEMS and microdevice development, is the first multi-project run service to offer Microfabrica's EFAB 3-D micromanufacturing technology. The three winning microdevice designs will be built free of charge through the EFAB Access program.

Yole Reports on MEMS

Tue, 12 Dec 2006
(December 5, 2006) LYON, France — Yole Développement's market research report, "Status of the MEMS Industry," examines markets, fiscal forecasts, and geographical considerations for MEMS through 2010. Yole studies various business models in the sector as well as emerging MEMS activities in India and China. Analysis of the packaging and test business linked to MEMS manufacturing is also supplied. Yole expects MEMS to reach $10B by 2010, and defines reasons for growth.

Baolab Selects Coventor 3-D Micro-emulation Tool

Thu, 6 Jun 2005
(June 02, 2005) Cary, N.C. — Baolab MicroSystems has picked Coventor Inc.'s 3-D micro-emulation tool, MEMulator, to verify its design in the pre-fabrication stage. MEMulator provides realistic 3-D design-rule checks visualization and mechanical connection color scheming to check for etch and connection errors before foundry processes. Baolab has incorporated MEMulator into its design process to catch errors and reduce fabrication runs.

MEMS drive supply chain changes with new applications

Thu, 9 Sep 2011

Yole Développement shares highlights from its latest "Status of the MEMS Industry" report, noting changes in the MEMS supply chain as companies add foundries or go fab-lite, and multi-chip MEMS packages create new relationships between companies.

MEMS product development -- why is it so hard?

Fri, 9 Sep 2011

Commercializing MEMS can take years and millions of dollars. While the MEMS industry shares some aspects with the larger semiconductor industry, the comparison is not fair in product development. Karen Lightman, MEMS Industry Group and Alissa M. Fitzgerald of A.M. Fitzgerald & Associates explain what makes developing new MEMS devices so hard.

Graphene races CNT for nanomaterial commercialization

Wed, 9 Sep 2011

Both graphene and carbon nanotubes (CNT) suit applications from flexible displays to silicon-replacing transistors. In a relatively short time, graphene has emerged as a low-cost, tunable material for all kinds of electronics. Will graphene overtake CNTs as the nanomaterial of future devices?

NIST etches MEMS out of diamonds

Wed, 9 Sep 2011

NIST developed a method to etch diamond crystals, exploiting the cubic nature of diamond crystals. These diamond-etched features could lead to better micro electro mechanical system (MEMS) devices.

Hamamatsu Photonics helps Lemoptix commercialize MOEMS

Wed, 9 Sep 2011

Lemoptix and Hamamatsu Photonics signed a long-term collaboration agreement to develop, industrialize and commercialize micro optical electro mechanical system (MOEMS) laser scanning and microprojection devices.

MIT names Microsystems Technology Lab leader

Thu, 9 Sep 2011

MIT named Vladimir Bulović as director of MIT's Microsystems Technology Laboratories (MTL). Bulović has experience in a range of advanced electronics technologies, from photovoltaics to MEMS.

memsstar expands in Silicon Glen

Tue, 10 Oct 2011

The maturing MEMS market and increased adoption of secondary equipment for semiconductor manufacturing have led deposition and etch tool supplier memsstar Limited to expand in Livingston, Scotland. memsstar added new positions in logistics, administration, and skilled and semi-skilled engineering to its jobs roster in conjunction with the expansion.

Present on MEMS manufacturing, inspection

Wed, 10 Oct 2011

Submit an abstract now to present at a group of co-located micro/nano manufacturing conferences. MM Live USA 2012 will co-locate with MEMS Live USA and NANO Live USA in Rosemont, IL, March 7-8.

NASA grants BMC contract to refine microfabrication process

Wed, 12 Dec 2011

Boston Micromachines Corporation will use a NASA contract to develop better microfabrication processes for deformable mirrors, which will be used in exoplanet imaging research.

MEMS die size grows, test evolves, and other trends

Mon, 12 Dec 2011

Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.

Tegal sells deposition patents

Fri, 12 Dec 2011

Tegal sold over 30 patents from the NLD portfolio, Lots 1-3, covering pulsed-chemical vapor deposition (CVD), plasma-enhanced atomic-layer deposition (PEALD) and NLD.

Imec demos faster HBTs in SiGe for wireless, imaging

Mon, 10 Oct 2011

Imec says it has developed a fT/fMAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, useful for future high-volume millimeter-wave circuits in various applications.

Custom SOI wafers debut from IQE for MEMS, related manufacturing

Tue, 10 Oct 2011

Wafer supplier IQE released a customizable range of silicon on insulator (SOI) products that IQE reports afford improved thickness and doping control.

VTI Technologies sold to Murata Manufacturing

Tue, 10 Oct 2011

EQT III will sell VTI Technologies, leading independent designer and manufacturer of high-performance MEMS sensors, to the publicly listed Japanese electronic components company Murata Manufacturing.

X-FAB, Senodia ramp MEMS gyroscope production

Thu, 10 Oct 2011

X-FAB Silicon Foundries Group and Senodia Technologies (Shanghai) Co., Ltd today announced they have concluded development and are ramping production of microelectromechanical system (MEMS) gyroscopes for high-volume consumer applications.

mPhase develops MEMS membrane at Argonne Labs

Fri, 10 Oct 2011

mPhase Technologies was granted access to the technical facilities at the Center for Nanoscale Materials, Argonne National Labs, for work on its MEMS Smart silicon membrane, a key component of the mPhase Smart NanoBattery.

MIT etches MEMS structures with glass stamp

Wed, 10 Oct 2011

MIT researchers developed a glass-stamp-based technique that helps fabricate lab-on-chip sensors at a lower cost than e-beam lithography and in a more reproducible manner than nanoimprint lithography.

NIST, CU microchip combines microfluidics and magnetism without power drain

Mon, 10 Oct 2011

Researchers from NIST and University of Colorado Boulder developed a low-power microchip combining microfluidics and magnetic switches to trap and transport magnetic beads.

ScanNano partners with STMicroelectronics on MEMS devices

Thu, 10 Oct 2011

Helsinki-based ScanNano,a private Finnish R&D firm that specializes in MEMS technology at the nanoscale, has partnered with STMicroelectronics with the goal of combining RF MEMS and CMOS.

Innovative Solutions Bulgaria buys large MEMS fab

Mon, 11 Nov 2011

Innovative Solutions Bulgaria Ltd. acquired Bulgaria’s largest MEMS fab, built north of Sofia in 2004. This new facility provides space to expand production capacity of AFM products.

ST chooses China's winning iNEMO student designs

Thu, 12 Dec 2011

STMicroelectronics (NYSE:STM), MEMS maker, named a winner in its 2011 iNEMO Campus Design Contest in China: Sky Worker Team 1 from Tsinghua University. ST operates the open competition in China and Taiwan, and the US.

New sensors use ancient metallurgical technique

Fri, 12 Dec 2011

A multi-institution team has produced a cobalt/iron alloy that could be the basis for a new class of sensors and micromechanical devices controlled by magnetism. The alloy does not use rare-earth elements to achieve its properties.

AMAT BSI image sensor CVD tool operates at low processing temps

Mon, 12 Dec 2011

Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. It deposits low-temperature conformal films that boost the low-light performance of the sensor while improving its durability.

Cornell, SRC develop RF MEMS technologies

Wed, 12 Dec 2011

Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.

imec presents MEMS energy harvester at IEDM

Thu, 12 Dec 2011

Imec and Holst Centre micromachined a vibration-energy harvester with 489µW output power, using piezoelectric material in a MEMS cantilever. The team presented results at IEEE's International Electron Devices Meeting (IEDM) this week in Washington DC.

Tronics wins MEMS fab contract from DelfMEMS

Tue, 12 Dec 2011

DelfMEMS SA named Tronics as its micro electro mechanical systems (MEMS) foundry partner. Tronics will manufacture RF MEMS switches for DelfMEMS, with high-capacity runs starting in 2012.

Micrel ramps MEMS manufacturing in San Jose foundry

Tue, 11 Nov 2011

Micrel Inc. (Nasdaq:MCRL) has begun manufacturing MEMS at its San Jose, CA wafer foundry operations, offering 6" wafer fab and tools to produce advanced MEMS devices.

HUN sells MEMS printing fab technology to DDD

Tue, 11 Nov 2011

Huntsman Corporation (NYSE:HUN) Advanced Materials division sold its stereolithography resin and Digitalis MEMS manufacturing machine businesses to 3D Systems Corporation (NYSE:DDD) for $41 million in cash.

Micronit launches MEMS division

Wed, 11 Nov 2011

Micronit opened its MEMS division, specializing in the design, prototyping and manufacturing of MEMS devices and wafers based on glass and silicon.

Sand 9 is halfway to $6M funding goal

Fri, 11 Nov 2011

Sand 9, a MEMS oscillator developer, reports that it has raised $3,095,262 of its 6,190,528 equity funding round, in a recent SEC filing.

Multiple-memory material garners Ontario entrepreneurship award

Wed, 11 Nov 2011

The Ontario Centres of Excellence gave the Martin Walmsley Fellowship for Technological Entrepreneurship award, totalling $50,000, to Innovative Processing Technologies Inc.

Measurement Specialties amends credit facility

Wed, 11 Nov 2011

Measurement Specialties Inc. (NASDAQ:MEAS), sensor designer and manufacturer, entered into an amendment to its senior secured credit facility dated June 1, 2010, among JPMorgan Chase Bank N.A. and certain other parties.

NSF funds MEMS made with cellulose nanocrystals

Mon, 11 Nov 2011

Auburn University chemical engineering researchers William R. Ashurst and Virginia A. Davis were awarded a National Science Foundation grant to investigate cellulose nanocrystals in MEMS.

Thin-film ferroelectric sensor challenges microbolometers

Tue, 11 Nov 2011

Optex Systems entered into an MoU with Bridge Semiconductor Corporation to develop and sell thermal systems for a range of military applications. The thin-film ferroelectric technology aims to displace microbolometers for uncooled thermal sensing applications.

US atmospheric plasma tech company joins Precision Mechatronics

Wed, 11 Nov 2011

Precision Mechatronics Pty Ltd acquired Surfx Technologies, which specializes in high-speed atmospheric plasma technology for MEMS, microfluidics, semiconductors, solar cells, medical devices, and other manufacturing.

DARPA looks to Aurrion for E-PHI program to mix electronic, photonic, and MEMS components on one silicon chip

Wed, 11 Nov 2011

Microelectronics experts at Aurrion Inc. are seeking to develop military microelectronics technology for optoelectronic microsystems, under terms of a $13.9 million DARPA contract.

TowerJazz brings European partner to India and Brazil

Thu, 11 Nov 2011

Specialty foundry TowerJazz signed a non-exclusive memorandum of understanding (MOU) with a European entity to transfer processes and projects to India and Brazil, including semiconductor and MEMS devices.

MEMS costing tool calculates price structure of MEMS designs

Mon, 11 Nov 2011

System Plus Consulting releases MEMS CoSim+ V3.0, a comprehensive simulation tool for the non-standard manufacturing process of MEMS sensors.

Microfabricated piezoelectric creates hyper-active MEMS

Mon, 11 Nov 2011

University of Wisconsin-Madison engineers and physicists have integrated highly piezoelectric single-crystal material onto silicon to fabricate a low-voltage MEMS for communications, energy harvesting, sensing, actuators and other applications.

Tronics expands MEMS manufacturing, HQ

Mon, 9 Sep 2011

MEMS foundry Tronics upgraded its Grenoble headquarters and manufacturing facilities, making a more than half a million euro investment, along with new equipment capital expenditures.

Sanmina-SCI tapped for Kaiam MEMS-based optical component fab

Mon, 9 Sep 2011

Sanmina-SCI Corporation (Nasdaq:SANM) will produce a family of optical components based on Kaiam's MEMS hybrid integration technology.

Aerotech nanopositioners provide lab accuracy at fab

Tue, 2 Feb 2011

ANT95-R and ANT130-R rotary stages Aerotech ANT95-R and ANT130-R direct-drive rotary stages offer in-position stability of 0.005 arc sec and incremental motion of 0.01 arc sec using the company's direct-drive technology. They suit disk-drive and MEMS manufacture and test, fiber-optic device alignment, as well as laboratory R&D applications.

Imec taps into silicon photonics advanced imaging 3D visualization

Mon, 2 Feb 2011

MEMS, imecResearchers at imec -- Danae Delbeke and Francesco Pessolano -- discuss announcements made in conjunction with Photonics West regarding the research consortium's NVISION program (for advanced imaging solutions) and silicon. Imec's silicon photonics platform allows for the miniaturization of complex photonic functions on a single chip.

USHIO brings NIL ashing system to US market

Wed, 2 Feb 2011

USHIO develops and begins marketing nano-imprint VUV ashing system "CHIPs" (Photo: Business Wire)USHIO America will start marketing the nano-imprint vacuum ultra violet (VUV) ashing system "CHIPs (Compact HiPower System)" in the US. Incorporated into nano-imprint lithography (NIL) equipment, the CHIPs allows non-contact and damage-free cleaning, surface improvement, and ashing of templates and workpieces.

MIG seminar targets MEMS testing

Wed, 3 Mar 2011

A two-day seminar later this month in San Jose will offer insights into testing of MEMS inertial sensors and a "strategic plan" to decrease cost and increase efficiency of MEMS device testing.

Novel bulk metallic glasses mold like plastics, perform like metals

Tue, 3 Mar 2011

Yale materials scientist Jan SchroersYale's Jan Schroers and his team are using a new processing technique to fabricate miniature resonators for microelectromechanical systems (MEMS) as well as gyroscopes and other resonator applications from bulk metallic glasses (BMGs) twice as strong as steel.

Microchannel heat exchanger cuts bonding costs 90

Fri, 4 Apr 2011

Surface-mount adhesives can create microchannels on a wide variety of metals. SOURCE: Oregon State UniversityEngineers at Oregon State University have invented a new way to use surface-mount adhesives (SMAs) in the production of low-temperature, microchannel heat exchangers. University officials are now seeking a commercial partner in private industry to continue development and marketing of the technology.

MEMS ferroelectric thin films report

Mon, 4 Apr 2011

Ferroelectric materials were considered exotic semiconductor materials in the past. Thanks to better knowledge and industrialization of these materials, they are increasingly used in many new applications, especially in the MEMS field, says Yole Développement.

Coventor updates SEMulator3D software for semiconductor and MEMS processes

Mon, 3 Mar 2011

Coventor Inc. announced availability of SEMulator3D 2011, the latest version of its virtual fabrication software for semiconductor and MEMS process development organizations. It includes the debut of SEMulator3D Reader.

CNT-based thin-film structures create new MEMS/NEMS

Thu, 5 May 2011

Using lithography-compatible nano self-assembly, plasma etching, and sacrificial etch release, University of Minnesota researchers created carbon nanotube (CNT) based thin film MEMS/NEMS structures.

Silicon magnetically actuated MEMS micromirror from Lemoptix replaces galvanometer and rotating mirrors

Tue, 4 Apr 2011

MEMS mirror chip.To significantly reduce size and power consumption and increase performance of micromirror devices, Lemoptix used semiconductor-like equipment to build micromirrors with actuation based on magnetic and heat-dissipating principles instead of gearings.

Piezoelectric deposition tech wins $3M investment, SolMateS plans MEMS fab equip penetration

Thu, 5 May 2011

SolMateS PiezoFlare 1200SolMateS received investments for the final development of the PiezoFlare 1200 piezoelectric thin film deposition machine. PiezoFlare 1200 is an automated deposition system for PZT thin films on 6" or 8" wafers, based on pulsed laser deposition.

Optics Balzers offers optical patterning processes

Fri, 5 May 2011

Optics Balzers is offering a portfolio of patterning technologies for producing high-grade optical components. Depending on the application, patterning techniques such as photolithography, laser ablation, or masked coatings are available.

Newport laser microfabrication station optimized for MEMS research

Wed, 5 May 2011

Laser µFAB from Newport CorporationNewport Corporation, lasers and photonics technology provider, introduced the Laser µFAB tabletop laser microfabrication workstation for researchers. Equipped with submicron resolution and a large stage, the tool can perform polymerization and ablation for MEMS, microelectronics, and other applications.

Fraunhofer ISIT joins MEMS Industry Group

Fri, 8 Aug 2011

The MEMS Industry Group welcomed Frauhofer Institute for Silicon Technology to its membership. The research facility focuses on microelectronics and microsystems technology. Siconnex, which builds diverse MEMS fab equipment, also joined the association.

poLight taps SVTC for optical MEMS commercialization ramp

Tue, 9 Sep 2011

poLight will work with SVTC Technologies to optimize its TLens production process for large volumes.

Asian MEMS foundry installs SPTS DRIE tool

Wed, 9 Sep 2011

SPTS Technologies received an order for an Omega deep reactive ion etch (DRIE) process module from an Asian MEMS foundry. This marks SPTS' 900th DRIE tool sold.

Microsystem commercialization center breaks ground in OH

Fri, 9 Sep 2011

The Entrepreneurship Innovation Center at Lorain County Community College in Ohio hosted a groundbreaking ceremony today for its Richard Desich SMART Commercialization Center for Microsystems.

Microfluidics module handles single- and multi-phase flow simulation

Fri, 5 May 2011

Based on COMSOL Multiphysics simulation software, the new COMSOL Inc. Microfluidics Module enables users to study microfluidic devices and rarefied gas flows. The module is designed for microfluidics and vacuum researchers and engineers.

NIST collaborates on MEMS roadmaps: ITRS, iNEMI

Mon, 5 May 2011

As smartphones usher in a host of new high-volume MEMS applications, semiconductor and electronics roadmaps are paying serious attention to the manufacturing and costs gaps in MEMS production. NIST's Michael Gaitan and the MEMS Industry Group are helping shape iNEMI, ITRS roadmaps with MEMS in the spotlight.

The future of MEMS: Rethinking business strategies and manufacturing technology for volume systems markets

Tue, 6 Jun 2011

SEMICON West preview: Rapid growth in mainstream consumer markets is changing the structure of the MEMS industry from an artisanal to a volume manufacturing business -- creating a new set of challenges and opportunities to companies to find better ways to speed the production ramp, find better ways to integrate multiple die and software, and to find the right business models.

Deep silicon etch from Oxford Instruments offers process flexibility

Mon, 6 Jun 2011

PlasmaPro Estrelas100 deep silicon etch technology from Oxford Instruments.Oxford Instruments debuted the PlasmaPro Estrelas100 deep silicon etch technology for the MEMS R&D and fabrication market. The tool is designed to be flexible, accomodating multiple processes without changing chamber hardware, and multiple wafer sizes for R&D-to-production ramp.

Gas-based etch enables MEMS materials flexibility, commercial reliability at Fraunhofer

Fri, 6 Jun 2011

A researcher operates Fraunhofer's MEMS production tools. Copyright Fraunhofer IMS.Fraunhofer Institute for Microelectronic Circuits and Systems IMS developed a gas-based etch step that allow MEMS designers to use a wider range of materials for the functional layer, while preventing device damage during etch.

Levelling tech from NanoInk enables better nano-printed arrays

Tue, 6 Jun 2011

NanoInk's NanoFabrication Systems Division is launching a force sensor and levelling devices at the Nanotech Conference and Expo, part of TechConnect World. NanoInk will also be presenting on Dip Pen Nanolithography (DPN) advances.

FEI plasma FIB tool suits MEMS, 3D packaging

Mon, 6 Jun 2011

High-speed sectioning of TSVs with plasma FIB. The device was located, cross-sectioned, polished, and imaged with PFIB. SOURCE: FEI FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.

X-FAB MEMS accelerometer design IP blocks shorten dev time

Thu, 6 Jun 2011

X-FAB Silicon Foundries released ready-to-use design IP blocks for MEMS accelerometers, as part of its MEMS foundry service offerings. The IP blocks can be used in gyroscopes and accelerometers spec'd up to 100 G-force, shortening NPI and HVM ramp.

Introduction to MEMS gyroscopes

Mon, 11 Nov 2010

MEMS gyroscope introductionJay Esfandyari, Roberto De Nuccio, Gang Xu, STMicroelectronics, introduce how MEMS gyroscopes work and their applications, the main parameters of a MEMS gyroscope with analog or digital outputs, practical MEMS gyroscope calibration techniques, and how to test the MEMS gyroscope performance in terms of angular displacement.

Microfabrica and MOSIS launch MEMS fab service

Tue, 1 Jan 2005

JPSA announces micromachining for medical device manufacture

Thu, 1 Jan 2005

Coventor names new VP of marketing, biz dev

Wed, 2 Feb 2005

Companies launch fab owner's association

Thu, 2 Feb 2005

Dalsa, Primaxx partner on MEMS

Fri, 2 Feb 2005

Akrion names senior VP for sales

Thu, 3 Mar 2005

Olympus, Movaz launch joint venture

Fri, 4 Apr 2006

Surface Technology nets MEMS order

Thu, 3 Mar 2006

mPhase names nano researcher chief scientist

Wed, 2 Feb 2006

SmalTec launches advanced micro-EDM, nano-grinding equipment

Wed, 12 Dec 2006
SmalTec International LLC, a Naperville, Ill., microtechnology solutions provider, announced the launch of its most advanced micro-EDM / nano-grinding equipment.

JPSA intros new rotary stage

Mon, 12 Dec 2006
J. P. Sercel Associates (JPSA) announced a new integrated Z-theta motorized stage that it says offers high precision operation for wafer processing and positioning.

Entrepix selected by defense contractor to provide CMP for infrared sensor production

Fri, 12 Dec 2006
Entrepix Inc., a Tempe, Ariz., provider of CMP foundry and equipment services, announced the signing of a CMP FastForward volume pricing agreement with a leading aerospace defense contractor.

Dalsa receives new CCD contracts

Thu, 3 Mar 2006

Block MEMS nets funds to develop gas sensor

Thu, 10 Oct 2006
Block MEMS LLC of Marlborough, Mass., announced it was recently awarded a $4.5 million contract by the U. S. Army Research Office.

SMI moves into high volume with 6-inch MEMS fab

Tue, 10 Oct 2006
Silicon Microstructures Inc. (SMI) of Milpitas, Calif., announced production levels of more than 40,000 pressure sensors per day on its recently installed six-inch wafer MEMS manufacturing line.

MEMS fab nets automotive ISO certification

Tue, 10 Oct 2006
Silicon Microstructures Inc. (SMI), a Milpitas, Calif., silicon sensor designer and manufacturer, announced it has achieved ISO/TS 16949:2002 certification for its new six-inch MEMS production line.

Synova secures order for water jet-guided laser fom Vishay

Tue, 9 Sep 2006
Synova, a developer of water jet-guided laser technology, announced it has received a follow-on order from Vishay Intertechnology, one of the world's largest manufacturers of discrete semiconductors and passive components, for its Laser Dicing System (LDS) 200.

Coventor software used in MEMS design contest

Wed, 12 Dec 2007
Coventor Inc.'s 3D MEMS Designer and Analyzer software has been selected by Hong Kong University and Kyoto University as the platform for a MEMS design contest.

SiTime surpasses MEMS production milestone of 100,000/week

Fri, 8 Aug 2007
SiTime Corp., developer of MEMS-based timing solutions, says that its SiT8002 and SiT1 oscillator families are shipping at a production rate of more than 100,000 units per week. This, the company says, makes these products the top-selling MEMS-based oscillators worldwide.

Yole's new MEMS foundry ranking reveals dramatic growth, key differences

Thu, 5 May 2007
In a just-released update to its MEMS Foundry Ranking, Yole Developpement reports that global MEMS foundry and contract manufacturing grew at a rate of 35% in 2006. The firm predicts similar growth for the next three years.

Micralyne and Polychromix partner for manufacturing

Mon, 5 May 2007
Micralyne Inc., an independent MEMS fabrication company, has announced a partnership with Polychromix, developer of inspection and analysis tools, to manufacture MEMS near-infrared (NIR) devices for the Polychromix's Phazir product line.

SUSS targets MEMS production with double-sided alignment tool

Wed, 5 May 2007
SUSS MicroTec's new DSM200 is an automated metrology system for double-sided (front-to-back) alignment and exposure applications. The tool serves applications in the manufacture of MEMS devices, power semiconductors, and optoelectronics.

Virtus to collaborate with Unimicron Group and affiliated MEMS foundry ChipSense

Wed, 1 Jan 2007
Virtus Advanced Sensors of Pittsburgh announced it has entered into a strategic collaboration agreement with several Taiwan-based UMC Group companies including Unimicron, Taiwan's largest printed circuit board (PCB) manufacturer and affiliated MEMS foundry ChipSense.

Tronics and Alcatel partner on advanced MEMS DRIE

Thu, 6 Jun 2007
Tronics Microsystems SA and Alcatel Micro Machining Systems have announced a joint development project on DRIE for extreme-performance MEMS. The partners hope to establish a new performance benchmark for the MEMS industry.

Fab Owners Association forms FOA Purchasing Partners, Inc.

Tue, 6 Jun 2007
The Fab Owners Association (FOA), the association of semiconductor / MEMS manufacturing executives and suppliers, has announced the formation of a semiconductor Group Purchasing Organization (GPO), to be called FOA Purchasing Partners, Inc. (PPI). PPI will be the official group purchasing organization of the FOA and its device maker members, providing procurement services, including aggregation of demand, contract negotiations and contract management for semiconductor manufacturing consumables.

InvenSense's patented MEMS process addresses consumer market

Thu, 6 Jun 2007
InvenSense's patented MEMS process addresses consumer market

ISSYS raises funds for drug delivery products

Fri, 9 Sep 2005

Tegal ships Endeavor tool to wireless device supplier

Wed, 10 Oct 2005

Magnetic sensors turn cell phones into locators

Wed, 8 Aug 2004
Honeywell is making millions of the anisotropic major mobile phone makers. The sensor-enabled phones are being launched this year – first in Europe, followed closely by Asia. Eventually, the technology will make its way to phones manufactured in the U.S.

Oki set to enter MEMS sensor market

Thu, 8 Aug 2004

Where's the road to the 'last mile'? Perhaps in the packaging

Tue, 3 Mar 2004
Industry watchers predict 2004 will see progress in getting “fiber to the home” – telecom’s long-sought solution to the problem of directly delivering high-quality and high-speed video, voice and data. But the rollout still moves at a glacial pace because of the high costs of deploying fiber-optic networks to individual homes and businesses. Two Danish firms hope to offer some price-busting help in a small package.

Microfabrica delivers RF parts for Air Force

Wed, 5 May 2004

Japan's Oki set to enter MEMS sensor market

Mon, 10 Oct 2004
After several years of helping others bring MEMS to market, a Tokyo-based fab facility is launching its own line. Oki Electric Industry Co. Ltd. has developed a tri-axis accelerometer module designed for mobile phones as well as other products. Oki expects to send sample shipments in October to Japanese and North American customers, and ramp up to high volume by April.

AML drops MEMS design, foundry services

Fri, 2 Feb 2004
Applied Microengineering Ltd., a U.K.-based MEMS equipment supplier, is giving up on its design house and foundry services and reverting to more traditional fabrication of MEMS chips, according to a news release.

Micralyne signs MEMS manufacturing deal

Mon, 2 Feb 2004
Micralyne Inc., an Edmonton, Alberta, based MEMS manufacturer, has signed a contract worth more than $2 million to make components for chemical analysis instrumentation, according to a news release.

Olympus adds optical to foundry services

Mon, 2 Feb 2004
Olympus Partnership Development Group (Profile, Web) has added an optical foundry to its MEMS design and manufacturing facility, according to a news release.

MemsTech on board with products, public offering

Mon, 6 Jun 2004
As MemsTech is preparing to raise money, it is also raising its profile as a product-oriented company. The Singapore-based company is planning an initial public offering this summer on Malaysia's Mesdaq market. MemsTech expects to raise about $15 million for research and development. But MemsTech wants to be seen as more than the sum of the services it provides.

Microbridge chooses German foundry

Fri, 1 Jan 2004
Microbridge Technologies Inc., a Montreal-based microsystems developer, has chosen X-FAB Semiconductor Foundries AG to make its microresistor device that adjusts the electrical current flow of components in a circuit.

Stents rivalry to intensify as Boston Scientific enters market

Tue, 2 Feb 2004
Rival developers of drug-releasing stents have been battling for supremacy on the patent front. Now, there are issues of safety on the patient front as the two-way tussle moves to the marketplace. Boston Scientific Corp. is preparing early this year to follow Johnson & Johnson’s Cordis Corp. into the U.S. market with its own tiny, pop-up scaffolding implanted in arteries to keep them open and free of clogs.

MEMS Industry Group releases report

Tue, 1 Jan 2006

IMT offers getter deposition for wafer-level MEMS packaging

Tue, 4 Apr 2007
Innovative Micro Technology (IMT) now offers getter deposition services for wafer-level packaging of MEMS and other devices requiring hard vacuum for performance. IMT says it has routinely achieved vacuum levels below 10 mTorr in production of inorganic devices.

WTC reveals MEMS industry drivers, rankings

Wed, 4 Apr 2007
Texas Instruments is still the number one MEMS company worldwide, with record revenue of $905 million in 2006, according to German research firm WTC. WTC has updated its MEMS market data with rankings of the top 30 MEMS developers and the top 10 MEMS foundry service providers.

MEMS group names new director

Wed, 5 May 2003
The MEMS Industry Group named a Honeywell International Inc. official as its new executive director.

Ziptronix announces $17M second round

Thu, 5 May 2003
Ziptronix Inc., a developer of semiconductor and MEMS design and manufacturing processes, announced $17.4 million second-round funding.

What can Europe teach America? A little self-help, for starters

Thu, 5 May 2003
Is the United States from Mars, Europe from Venus? Europeans' affinity for debate vs. Americans' penchant to go it alone seems to be swirling around many arenas these days. Recent world events aside, the contrast might also apply to the MEMS industry: Europeans like to talk, while Americans remain stoically silent.

NanoFab and research institute help Edmonton gain prominence

Tue, 11 Nov 2004
Edmonton was known in the 1800s as a fur-trading post. In the 1900s, it gained fame for its oil and gas industry. This century, it appears to be evolving into Canada's showcase for micro and nanotechnologies, and a possible world leader in their commercialization. A new $31-million NINT building now under construction is designed to be one of the world’s most technologically advanced research facilities.

MEMS fabrication demands close collaboration

Thu, 11 Nov 2004
By using known manufacturing processes, a foundry can shorten development time and ensure higher yields during early fabrication runs. While that puts the onus on the foundry to offer well-defined and repeatable processes, the benefit is that customers know that a product will work right out of the gate.

IntelliSense, PhoeniX link on MEMS software

Tue, 5 May 2004
IntelliSense Software Corp. and PhoeniX BV will combine their MEMS design tools as part of a strategic alliance, according to a news release.

Zyvex getting down to business; Nanobots? That's for another day

Fri, 10 Oct 2003
Tom Cellucci has a very simple job description. “He’s going to start bringing money in,” said his new boss, Jim Von Ehr, chief executive of Zyvex Corp. The company is shifting its focus from the distant possibilities of nanotech to the practical realities of cash flow. It's a big change for Von Ehr, who has regaled listeners over the years with his dreams of molecular manufacturing.

FormFactor honored by In-Stat/MDR

Tue, 10 Oct 2003

Foundry orders MEMS line from SUSS

Mon, 11 Nov 2003
MicroFAB Bremen GmbH, a German MEMS foundry and microsystems supplier, has ordered a complete MEMS process line from SUSS MicroTec, according to a news release.

SRU Biosystems tries to lighten the load for drug discovery

Mon, 11 Nov 2003
Detecting biological compounds, friendly or otherwise, can be tricky. So Brian Cunningham decided to shed some light on the problem. He asked himself why he couldn't create a new type of device that bridges the gap between optical sensors and high-throughput screening. Cunningham couldn’t really think of a reason why not – and so SRU Biosystems Inc. was born.

Montreal home to new nanoscience center

Wed, 11 Nov 2003
McGill University in Montreal has opened a $9 million nanoscience research center that offers the latest tools for micromachining, modeling and manipulation, according to a news release.

Coventor to sell Zyvex micro design tool

Fri, 9 Sep 2003
Coventor Inc. will license and sell a microdevice design tool developed by Zyvex Corp., according to a news release.

Olympus Optical forms MEMS division

Wed, 9 Sep 2003
Olympus Partnership Development Group Ltd. announced that its parent company, Tokyo-based Olympus Optical Co. Ltd. of Japan, has formed a new MEMS Technology Division, according to a news release.

With new cash, facility and focus, Tronic's tries for new markets

Mon, 7 Jul 2003
Tronic’s Microsystems does not intend to remain at the research stage. The French company recently announced a new MEMS production facility and the close of two rounds of funding worth more than $12 million. Its next goal: The U.S. and Asian markets.

Exacting world of laser surgery can change in a femtosecond

Thu, 11 Nov 2003
Scalpel and needle will always remain ideal instruments for most medical work, and biological compounds will still be crucial to prod cells to certain actions. What has been missing so far, however, is something to manipulate cellular structures at the micrometer and nanometer scale. Enter Harvard physicist Eric Mazur's femtosecond laser. “Now I think we have the tool to close that gap,” he said.

Sony to make and sell MEMS devices

Mon, 11 Nov 2003

India MEMS program selects Coventor software

Thu, 11 Nov 2003
An advanced technology development program in India has selected Coventor Inc.'s software for a MEMS Initiative Program, according to a news release.

FLX Micro nabs new funding

Mon, 11 Nov 2003
FLX Micro has closed on an additional, but undisclosed, amount of venture financing.

Southeast France plants seeds for a fertile small tech future

Tue, 11 Nov 2003
With the recent launch of a MEMS fab in Crolles, near Grenoble, the southeast of France is beginning to look more like the French version of Silicon Valley. Tronic's Microsystems' new facility will start producing custom-made MEMS later this year and will allow the company to quadruple its production capacity.

Making profitability a priority ensures funding options in future

Tue, 5 May 2005
In the MEMS industry five years ago, venture capital financing was relatively easy to secure and many MEMS-based businesses raised millions of dollars at sky-high company valuations. Today, most of those companies are out of business or at the very least did not deliver on the promises made to their financiers. We could have followed the same path but didn't.

MEMS makers’ efforts bear fruit as Apple embraces sensor

Mon, 3 Mar 2005
If there is any one company whose use of a new technology signals that innovation’s arrival in the mainstream, it is Apple Computer. Apple’s use of the computer mouse and the graphical user interface 20 years ago catapulted those technologies into homes and offices as other computer makers adopted them in a rush to compete. In more recent years, Apple has done the same with wireless networking and devices like the MP3 player.

Microfabrica takes EFAB process to new heights

Fri, 3 Mar 2005

Dimatix opens MEMS fabrication facility

Mon, 5 May 2005

Bosch forms MEMS subsidiary

Fri, 7 Jul 2005
Headquartered in Kusterdingen, Germany, Bosch Sensortec GmbH will apply MEMS sensors to high growth markets like consumer electronics.

Cepheid patent could boost DNA testing

Thu, 12 Dec 2003
Cepheid Inc. has been issued a U.S. patent that covers the design of a sample preparation cartridge containing a microfluidic chip for extracting and purifying multiple DNA targets simultaneously, according to a news release.

Don't stop after you set standards; VCs also look at best practices

Fri, 12 Dec 2003
This summer, while discussing the push for MEMS standardization with a venture capitalist, a very interesting question was posed in regard to current business models: What about best practices? This question is very well-timed because the MEMS industry's focus seems to be shifting toward sustaining a successful business.

Small tech companies outduel all comers at Purdue competition

Tue, 4 Apr 2003
Small tech companies took two out of three top prizes at Purdue University’s Life Sciences Business Plan competition last week, besting contenders that offered cures for multiple sclerosis, high blood pressure and improvements in pharmaceutical manufacturing.

Coatings and arrays help put medication where it's needed

Fri, 6 Jun 2003
Small tech is helping medicinal molecules such as proteins, peptides, genes and vaccines reach the right destination with greater precision, speed and control. And the mechanisms – including implants, particles and patches – are as varied as the types of payloads delivered. Delivering materials directly inside targeted cells could improve cancer treatments and help reduce side effects, and it holds promise as a better way to offer gene therapies.

Three up to MEMS Design Challenge

Tue, 6 Jun 2003

ISSYS launches nanomaterial subsidiary

Wed, 6 Jun 2003
Integrated Sensing Systems Inc. (ISSYS) has launched a new business for its nanomaterial designed to boost the performance of MEMS and other devices.

Olympus' partnership across the Pacific expands its MEMS borders

Mon, 6 Jun 2003
Experience can be an advantage when establishing yourself in a new market, and the Olympus Partnership Development Group of San Jose, Calif., is banking on its parent company’s 20 years worth of expertise in MEMS to be successful. It also doesn’t hurt to have a global brand presence and the deep resources of a multibillion-dollar company like Olympus Optical Co.

MEMS standards, while small, may mean much for the industry

Tue, 8 Aug 2003
Standards in the MEMS industry may have taken a small step with the recent publication of National Institute of Standards and Technology (NIST) micromachine measurements, but the larger debate continues over standardization of such a diverse industry. Industry leaders say they hope the new development leads to more efficient manufacturing, improved reliability and greater trust from MEMS purchasers.

Axsun isn't sitting by the phone, waiting for telecom to call again

Mon, 8 Aug 2003
Axsun makes MEMS components for the telecommunications industry. To put it mildly, that does not seem to be the best business plan these days. Jack Kay, Axsun's own chief executive, knows this and he is unafraid to say so. He banished telecom to Axsun's back burner while the company pitches its capacity to manufacture MEMS components.

Not exactly quicker than a ray of light, but optical MEMS will fly

Fri, 8 Aug 2003
Say the word “communications,” and chances are you’ll think of optical networking. This is mostly due to the staggering drop in earnings over the past couple of years, high-profile bankruptcy filings and countless failed startups that took with them loads of VC money and any remaining faith in the market.

Laser stamp reveals gun behind bullet

Fri, 6 Jun 2002

Standard MEMS to liquidate

Fri, 11 Nov 2002
The case of Standard MEMS Inc., the Burlington, Mass.-based MEMS fab that sought Chapter 11 reorganization protection in September, has been converted to a Chapter 7 liquidation bankruptcy, according to court records.

Swiss MEMS fab navigates new funding while it guides missiles

Fri, 11 Nov 2002
Intel Capital, along with others, has invested $10 million in MEMS manufacturer Colibrys. Its fastest growing market at the moment is aerospace and military. These customers are ordering inertial navigation systems and accelerometers, which have to be robust enough to withstand the shock of a missile launch, but sensitive enough to do the job once the system is in flight.

Process is MUSiC to FLX Micro's ears

Fri, 11 Nov 2002
FLX Micro said it has finished the first manufacturing run of a micromachining process using a material it said is stronger and more durable than standard silicon.

Coventor co-invents products while it reinvents itself

Mon, 11 Nov 2002
In 1994, Mike Jamiolkowski became fascinated by MEMS technology and incorporated Microcosm Technologies to develop MEMS design software. Today, the company now known as Coventor Inc. is getting ready for a December unveiling of its latest software release, CoventorWare2003. But the past eight years have seen many Coventor technology makeovers.

MEMSCAP releases Q3 revenues

Fri, 11 Nov 2002
MEMSCAP S.A. (Euronext: MEMS), a MEMS provider based in Grenoble, France, announced third quarter revenues of $1.29 million, versus $0.99 million for the same period last year. The company did not release information about earnings or losses.

TRONIC'S inks deals with two Japanese firms

Fri, 10 Oct 2002
TRONIC'S Microsystems SA said it has signed distribution deals with two Japanese firms.

Zyvex makes pact with Honeywell

Thu, 10 Oct 2002
Zyvex Corp. on Thursday officially announced the addition of Honeywell International Inc. to an existing five-year, $25 million industry-government program to create microscale assemblers and then bring them down to nanoscale.

Calient launches new switch, payment plan

Mon, 6 Jun 2002

Big Blue wants its little MEMS
working inside your cell phone

Fri, 6 Jun 2002
A year and a half from now, your next mobile phone may be smaller and more powerful with the help of new micromachines from IBM. The company has announced a new process for building RF, or radio frequency, microdevices directly onto chips. The typical cell phone today uses about 10 of the components IBM would like to replace with MEMS versions.

Five major MEMS commercialization hurdles entrepreneurs need to know

Tue, 10 Oct 2010

Steven Walsh, U of NM Albert Franklin Black Professor of Entrepreneurship, recently spoke about the lessons learned from 25 years of MEMS technology, educating attendees of the MEMS Technology Summit. Walsh discusses MEMS with ElectroIQ editor Debra Vogler.

MEMS manufacturing rotary stages from Aerotech enable speed, accuracy

Wed, 9 Sep 2010

Aerotech rotary stages for MEMS manufactureANT95-R and ANT130-R direct-drive rotary stages, part of Aerotech's nano Motion Technology product line, offer in-position stability (0.005 arc sec) and incremental motion (0.01 arc sec) using the company's direct-drive technology.

Affinity Biosensors partners with MEMS foundry IMT

Tue, 7 Jul 2010

Affinity Biosensors and IMT entered into a strategic foundry partnership today for volume production of SMR MEMS devices enabling particle measurement in fluidic solutions with femtogram resolution. The SMR MEMS devices are the chips that drive Affinity Biosensors' ARCHIMEDES Particle Measurement System.

Swiss Mimotec sees the future
in the U.S. microfluidics market

Mon, 6 Jun 2002
Quietly perking away in a small town in Switzerland is Mimotec, which expects to use income from sales of its micromachined metal parts to finance its current push into the microfluidic component market. In fact its CEO believes micromolds will be the company's best shot at the U.S. market.

Only a few community colleges
training future MEMS workforce

Thu, 6 Jun 2002
It’s a rare breed they nurture at the Albuquerque Technical Vocational Institute: students studying MEMS. TVI had a classroom full of them this spring, and local employers are welcoming the move to train more future engineers in MEMS. But TVI's program is rare on the ground floor of higher education. For the most part, MEMS is still stuck in the ivory tower.

India ready to launch its first
privately funded MEMS lab

Thu, 7 Jul 2002
The small tech industry in India is poised to take a step forward this October, with the launch of the new CranesSci MEMS Lab, a collaboration between the Indian Institute of Science and Cranes Software International Ltd. The MEMS industry in India is still in its infancy, but given the interest some companies are showing, it is expected to grow very quickly.


Mon, 4 Apr 2002

A study by members of Europe’s key MEMS and microsystems association sees the world market for the products more than doubling from its 2000 level by 2005. A new market research report predicts that the worldwide market for microsystems technology will grow from $30 billion in 2000 to $68 billion in 2005.

Lasers make the cut as small tech shrinks

Thu, 4 Apr 2002
Lasers are playing a larger role in small tech, finding more applications in everything from thin-film technology to sensors to micromachining, and the market is growing.


Tue, 2 Feb 2002

The name of a Swiss custom MEMS manufacturer, Colibrys, tells much about current trends in the industry. The name comes from the French word for hummingbird, a creature that moves up, down and sideways. Colibrys officials say they are keeping with the spirit of their name in the company's ability to quickly move in any direction, altering its MEMS designs to fit the customers.


Fri, 2 Feb 2002

Swiss small tech entrepreneurs, research institute executives, government officials and venture investors will visit three major U.S. cities in May to learn from their American counterparts – and possibly even lure some Swiss scientists back home. Switzerland, long known for its precision machine enterprises, is dedicating an increasing amount of public and private investment to small-tech projects, and the May road show is part of that effort.


Wed, 2 Feb 2002

What's life inside a MEMS fab like? Small Times takes a snapshot inside the high-pressure, high-precision challenge of spinning up a state-of-the-art, multimillion-dollar MEMS foundry. Kionix Inc. of Ithaca, N.Y., built one of the most sophisticated MEMS production sites in the world from the ground up.


Thu, 1 Jan 2002

Standing on the third floor of the construction site that is soon to become the biggest MEMS factory in the world, MEMSCAP'S president and chief executive still can't get over it. “Seven months ago, this was a corn field,” he said, pointing at the fields on the outskirts of Grenoble, France. “We actually had to buy the corn from the farmer before we could start construction.” Jean Michel Karam doesn't like to go step by step when building his company. He plunges head first.

Transparent Networks moves, expands

Thu, 7 Jul 2002

A DARPA-funded project turned into
MEMS telecom supplier Polychromix

Mon, 7 Jul 2002
Though the dream of a truly all-optical network has been put on hold while the telecom industry reacquaints itself with fiscal responsibility, a phalanx of startups continue to position themselves. The latest to announce its entry into optical components is Polychromix, which uses MEMS technology for monitoring and managing multiple wavelengths in long-haul and metro optical networks.

Wayne State gets $2.64 million for sensor research

Fri, 7 Jul 2002

Tegal sells system to Taiwanese MEMS maker

Thu, 6 Jun 2002

Saab, SensoNor make one-stop MEMS shop

Thu, 6 Jun 2002

BigBangwidth sets out to create
a new universe of smart switches

Mon, 6 Jun 2002
Brian Moore, president and chief technology officer for BigBangwidth, wants to revolutionize the use of fiber optic networks through his Edmonton, Alberta-based company.


Thu, 6 Jun 2001

The playboy days are over for Small Tech. Now, it needs to choose a partner, defining how if not with whom it wants to make its destiny, industry experts say.


Wed, 7 Jul 2001

Engineering professors at Michigan Technological University are designing what they say is the country's first Web-based master of engineering program in small tech and hope to have the first courses online by fall 2002.


Thu, 6 Jun 2001


Sun, 5 May 2001

Venture capitalists say e-commerce crash has created attractive values in optical, biomed startups.


Mon, 10 Oct 2001

Small tech will soon lead to a "revolution" that "will change the ways in which neurosurgeons interact with the environment," says a group of researchers. Medical devices that contain MEMS will allow neurosurgeons to perform with better precision. But there are critics who say the high cost of the devices and difficulty in training surgeons remain tough barriers.

MEMX nets $8 million B round

Wed, 2 Feb 2003
MEMX Inc., a Palo Alto, Calif., developer of MEMS and MEMS processes, has secured $8 million in a Series B round of financing, according to a news release.

Mancal increases Micralyne stake

Wed, 1 Jan 2003
Mancal Corporation Ltd., a Calgary, Alberta, diversified holding company, has increased its stake in Edmonton, Alberta-based MEMS foundry Micralyne Inc., according to Chris Lumb, Micralyne's president and chief executive. Mancal increased its share in Micralyne to a percentage "in the teens," Lumb said.

Coventor launches upgraded MEMS software

Thu, 1 Jan 2003
Coventor Inc. said it has launched a major upgrade to its CoventorWare MEMS design software.

MEMGen lays down MEMS challenge

Wed, 1 Jan 2003
MEMGen Corp. said it has launched what it's dubbed the world's first microdevice design contest.

MEMS industry hopes to hire, while veterans see growing pains

Fri, 1 Jan 2003
Although few are currently hiring, companies operating in the MEMS industry intend to hire new employees this year, according to a recent survey. Industry veterans say turnover is necessary for growth and compare it to the early years of semiconductors. Out of 42 companies responding, only one company reported it would not be hiring one year from now and only two companies indicated fewer employees than they had a year ago.

Survey finds 'disconnects' between MEMS developers and fabs

Wed, 2 Feb 2003
Launching the next MEMS device that duplicates the success of the air bag accelerometer will require a closer bond between makers and sellers, according to a new MEMS Industry Group report. "Focus on Fabrication" found that the largest issue looming in the MEMS industry is lack of standardized materials and processes in making MEMS devices.

Coventor, Cadence link on MEMS software

Wed, 2 Feb 2003
Coventor Inc. is teaming up with Cadence Design Systems Inc. to offer new MEMS design software, according to a news release.

Intel donates $17.5M in tools for MEMS fab

Mon, 2 Feb 2003
Intel Corp. is donating $17.5 million worth of equipment to a public-private economic development group for a MEMS fabrication facility in New Mexico.

Top 20 MEMS foundry ranks gain an IC foundry

Mon, 5 May 2010

An IC foundry has made it into the ranks of the Top 20 MEMS foundries for the first time, as TSMC’s roughly $10 million in MEMS foundry revenues put it into 14th place on Yole Developpement’s 2009 listing. STMicro improved slightly, continuing to dominate the MEMS foundry arena. TI slipped, holding onto #2; Dalsa gained, and grabbed the #3 slot.

New MEMS manufacturing approaches

Thu, 1 Jan 2011

MEMS and sensors analysis. Source: YoleYole Développement released details of its upcoming report, MEMS Manufacturing & Packaging. This report analyzes the main MEMS manufacturing evolution. MEMS drivers include size, cost, and performance, though in different ways than ICs. New MEMS manufacturing and packaging technologies and specific materials are necessary.


Mon, 11 Nov 2010

GigOptix (GGOX) named Innovative Micro Technology (IMT) as its optical chip fabrication partner. GGOX is now in the process of transferring production of its Thin Film Polymer on Silicon  (TFPS) optical modulator chips to IMT in expectation of volume production ramping in 2011.

Wafer-level microlens molding process from EV Group pushes CMOS image sensor roadmap by eliminating glass substrates

Wed, 12 Dec 2010

EV Group (EVG) developed a micro-lens molding process that can enable volume production of very-high-resolution (up to 8MP and higher) wafer-level optics for use in smart phones, pico projectors and myriad other applications.


Thu, 12 Dec 2010

Tegal Corporation (Nasdaq: TGAL) is launching a new member of its ProNova family of high-density inductively coupled plasma (ICP) reactors for the company’s DRIE series wafer processing products. The ProNova2 is targeted for fast-growing 200mm MEMS and 3D IC applications.

IEDM: IMEC, Panasonic tip record MEMS resonator

Tue, 12 Dec 2010

At this week's IEDM, IMEC and Panasonic reveal a new MEMS resonator with the industry's highest-recorded quality factor, thanks to two key process and manufacturing steps.

IEDM observations: Getting back to the mechanical in MEMS

Fri, 12 Dec 2010

MEMS at IEDMTechcet's Michael A. Fury reports in-depth from sessions at IEDM 2010, looking at paper 18.3, "Prospects for MEM Logic Switch Technology," on a reverse trend from electronic switching back to mechanical switching in the form of MEMS devices.

Dual axis MEMS gyroscope Wii gets reverse costing engineering analysis by Research and Markets

Tue, 1 Jan 2011

Research and Markets added the "Invensense IDG 600/650 MEMS gyro 2-axes Reverse Costing" report to their offering. The report offers reverse costing & engineering process analysis of the Dual-Axis MEMS Gyroscope IDG-600/650 supplied by InvenSense and integrated in Wii motion accessory, including physical analysis, reconstruction of the process flow, and estimates on manufacturing and selling prices.

IEDM: IMEC, Panasonic tip record MEMS resonator

Tue, 12 Dec 2010

At this week's IEDM, IMEC and Panasonic reveal a new MEMS resonator with the industry's highest-recorded quality factor, thanks to two key process and manufacturing steps.

N.J. officials detail plan
for nanotech consortium

Thu, 8 Aug 2002
New Jersey Gov. James McGreevey announced at a news conference Wednesday that the state will contribute $2 million from its 2003 budget to the New Jersey Nanotechnology Consortium, which will launch with lab facilities based at Bell Laboratories. Lucent's facilities give the state the advantage of having a "world class, fully staffed facility that was ready to roll."

For Triad, it's not the MEMS,
it's the method of making them

Wed, 10 Oct 2002
Triad Sensors prefers to think of its new MEMS chip as a bargaining chip. The startup has made hundreds of them primarily to pitch its process – a potentially better way to make MEMS. Triad serves a field that has many different production methods, but no set standard. So, it's touting its approach as a way to make many different microdevices in existing foundries.

Report: MEMS attractive to semiconductor industry

Wed, 10 Oct 2002
MEMS can provide a boost to the slumping semiconductor market, according to a new report.

Kodak, Kionix make MEMS for imaging R&D

Tue, 10 Oct 2002
Eastman Kodak Co. has tapped Kionix Inc. to provide MEMS fab services at its new manufacturing plant in New York.

Corning launches lens for MEMS

Tue, 10 Oct 2002
Corning Inc. said it has launched a miniature lens that enables a significant reduction in size for MEMS and other optical parts packaging.

BridgeWave nets $4.75 million

Mon, 9 Sep 2002
BridgeWave Communications Inc., a Santa Clara, Calif.-based developer of high-speed semiconductor interconnects and packaging, has received $4.75 million in fourth round financing, according to Gregg Levin, senior vice president of marketing and business development.

Rise and decline of Standard MEMS:
Was it just 'too much, too early'?

Wed, 8 Aug 2002
Six months ago, Standard MEMS Inc. was one of five companies voted "most promising" at San Francisco's Semiconductor Venture Fair. Now it is down to 25 employees from its height of 270. One fab is closed and another is idle. Even its Web site's home page is offline. What happened?

Transparent Networks, SMI sign foundry pact

Thu, 9 Sep 2002
Transparent Networks said it has signed a MEMS foundry services deal with Silicon Microstructures Inc.

MEMSCAP launches fab's first MEMS

Wed, 9 Sep 2002
MEMSCAP Inc. said it has begun shipping samples of photonic switches and variable optical attenuators for metro and access levels of optical networks.

Asylum research appoints ex-MEMS foundry exec

Fri, 10 Oct 2008
October 3, 2008: Asylum Research, a maker of atomic force and scanning probe microscopy (AFM/SPM) for materials and bioscience applications, has named small-tech veteran Monteith Heaton as EVP of marketing and business development for the company's line of atomic force and scanning probe microscopes (AFM/SPM).

Micralyne named one of Alberta's Top 40 employers

Tue, 10 Oct 2008
October 21, 2008: Independent MEMS foundry Micralyne Inc. has been named one of Alberta's Top 40 Employers for 2009 by Mediacorp Canada, for the third year in a row.

RF Micro Devices introduces MEMS for 3G phones

Mon, 11 Nov 2007
RF Micro Devices, designer and manufacturer of high-performance radio frequency systems, has introduced RF MEMS transmit/receive switch and mode switch for 3G (third generation) mobile phone handsets.

Report: MEMS-based system market to generate $13B supply chain revenue in 2012

Tue, 8 Aug 2009
MEMS-based systems were a $46 billion business in 2008, and despite the recession MEMS-based systems should see 12% annual growth through 2012 to an $83 billion industry, meaning a $13 billion market for MEMS devices and the equipment and materials needed to produce them, according to a report on the MEMS supply chain from SEMI and Yole Développement.

Freescale establishes 200-mm MEMS line to address sensor demand growth

Tue, 1 Jan 2008
Freescale's new advanced MEMS 200-mm (8-inch) production line addresses growing demand for sensors in the price-sensitive automotive, industrial, medical and consumer markets.

mPhase touts progress for nanobattery polymer coating

Fri, 8 Aug 2009
August 28, 2009: mPhase Technologies says that work with a MEMS foundry partner has determined that a recently-discovered polymer coating for its Smart NanoBattery "appear[s] to be able to be replicated in a foundry manufacturing environment."

Micralyne begins MEMS manufacturing expansion for microfabrication, testing, and assembly

Fri, 2 Feb 2007
Micralyne's facility renovation will substantially increase its manufacturing capacity to accommodate a growing customer base. The addition includes 10,000 sq ft of new manufacturing space with Class 10 and Class 1000 clean rooms for silicon MEMS fabrication, testing, and assembly.

NanoRite opens in Wisconsin

Mon, 9 Sep 2007
NanoRite, a $5 million center designed to house and advance business ventures in the ultrasmall, has opened in Eau Claire, Wisconsin. Small Times guest contributor Jim Mortwedt reports.

Micralyne disputes Tronics' claim as first pure-play MEMS foundry to achieve consistent profitability

Wed, 10 Oct 2007
Small Times' report of Tronics' recent profit announcement has drawn a response from Chris Lumb, CEO of rival Micralyne Inc. "Tronics' profitability claim . . . is wrong: It is not the first pure play contract manufacturer of advanced MEMS devices to achieve consistent profitability," he noted.

RedShift, IMT partner to disrupt thermal imaging with MEMS device

Tue, 9 Sep 2007
RedShift Systems has selected MEMS foundry Innovative Micro Technology (IMT) to produce its Thermal Light Valve (TLV), which allows standard CMOS and CCD digital cameras to "see heat." RedShift says the TLV enables new, affordable devices that will rapidly expand the market for thermal imaging.

Microchip, Skyworks join Fab Owners Association for best-practices exchange

Fri, 3 Mar 2007
Fab Owners Association attracts new device-maker members

Knutti, Allen launch Acuity Inc. for high-performance MEMS pressure sensors

Wed, 6 Jun 2008
June 11, 2008 -- MEMS industry veterans Jim Knutti and Henry Allen have formed Acuity Inc., which they say will bring to market a line of high-performance, MEMS-based pressure sensors. The new company has a production agreement with MEMS foundry Semefab, where first product wafers are already in process.

ESI releases high-performance micromachining system; secures multi-system order

Wed, 6 Jun 2008
June 25, 2008 -- Electro Scientific Industries, Inc., a provider of photonic and laser systems for micro-engineering applications, announced that its newest dual-beam, high-power micromachining system is commercially available.

Sandia announces 2008 MEMS design competition winners

Mon, 6 Jun 2008
June 9, 2008 -- A mechanical micromuscle with nanoscale functionality and a micro-creep-and-stress tester, both designed by students, were the top winners in Sandia National Laboratories' fourth annual University Alliance Design Competition for MEMS designs.

SVTC chooses Tegal for time-to-market advantage, MEMS etch collaboration

Thu, 6 Jun 2008
June 12, 2008 -- Tegal Corp., provider of systems used in the production of MEMS and nanotechnology, has received an order for its 6500 HRe plasma etch tool from R&D fab SVTC Technologies, which serves markets including MEMS/MOEMS, photovoltaics, biotechnology, and image sensors. Further, Tegal and SVTC are collaborating on process recipe development.

Nippon Kayaku acquires MicroChem, supplier of chemicals for MEMS production

Mon, 2 Feb 2008
Nippon Kayaku Co. Ltd. of Tokyo, a $1 billion diversified chemical company and global supplier of epoxy resins for microelectronic applications, has acquired longtime partner MicroChem of Massachusetts.

IMT invests to expand BioMEMS foundry/manufacturing services

Mon, 6 Jun 2008
June 2, 2008 -- MEMS contract manufacturer/foundry partner Innovative Micro Technology (IMT) announced today that it is expanding its efforts and personnel in the BioMEMS arena. The company told Small Times that medical applications now comprise about 30% of its work.

MEMS suppliers, equipment maker join MIG Hall of Fame

Mon, 5 May 2012

MEMS Industry Group (MIG) inducted 3 members into its MIG Hall of Fame, from EV Group (EVG), Acuity Inc. and Analog Devices Inc. (ADI).

SEMICON West preview: Conference keynotes and "Extreme Electronics"

Fri, 5 May 2012

SEMICON West is less than 2 months away, July 10-12 in San Francisco, CA. Plan your attendee schedule now with highlights from the Extreme Electronics “show within a show;” 4 strong keynotes; sessions on device architecture and node shrink, lithography, 450mm wafers and more.

ST claims InvenSense infringed on patents

Fri, 5 May 2012

InvenSense Inc. (NYSE:INVN) says STMicroelectronics (ST, NYSE:STM) filed a complaint in the Northern District of California, alleging that InvenSense infringes 9 of ST’s patents. InvenSense contests these claims.

UC Berkeley installs sp3 CVD diamond reactor for MEMS development

Mon, 5 May 2012

sp3 Diamond Technologies Inc. shipped its Model 655D series hot-filament CVD diamond reactor system to the University of California, Berkeley Marvell Nanofabrication Laboratory.

Murata completes VTI Technologies buy, announces Murata Electronics Oy

Mon, 5 May 2012

VTI Technologies, a leading manufacturer of 3D MEMS sensors that has formed part of Murata since January 2012, is now Murata Electronics Oy.

Ricoh develops ink jettable piezoelectric material for future MEMS

Tue, 5 May 2012

Ricoh Company developed an ink-jet printing technique that can produce lead zirconate titanate piezoelectric material in a voluntary pattern shape at 2µm film thickness. Ricoh simultaneously developed a lead-free piezoelectric material, bearing the same deformation properties as the PZT material on a silicon substrate.

CrossFiber attains ISO 9001:2008 certification for photonic switch production

Tue, 5 May 2012

CrossFiber Inc. has been certified to ISO 9001:2008 standards by registrar PJR. CrossFiber provides all-optical photonic switching solutions for data centers and fiber optic telco networks.

MEMS processing unit completed at X-FAB silicon foundry in Germany HQ

Mon, 6 Jun 2012

X-FAB Silicon Foundries completed its dedicated noble metal facility for MEMS and post-CMOS processing in Erfurt. The company also marked a milestone, shipping its 1 billionth MEMS device.

X-FAB to manufacture MEMS energy harvesters for MicroGen Systems

Fri, 6 Jun 2012

MicroGen Systems Inc. chose X-FAB Semiconductor Foundries to produce MicroGen’s first MEMS energy harvesters.

Tohoku University and imec partner to advance research

Mon, 6 Jun 2012

Tohoku University of Sendai, Japan and imec signed a collaboration agreement during the Belgian economic mission to Japan, expanding their R&D into areas such as MRAM and 3D semiconductor packaging.

MEMS researchers at UToronto purchase plasma etch tool from Oxford Instruments

Tue, 6 Jun 2012

Plasma etch and deposition processing system maker Oxford Instruments Plasma Technology won an order for its recently launched PlasmaPro Estrelas100 deep silicon etch tool from the University of Toronto.

SEMICON West preview: Maturing MEMS sector looks at ways to work together

Tue, 6 Jun 2012

Driven by the volume consumer business, the maturing MEMS sector starts to look at ways to reduce costs and speed time to market by coming together on things like easing integration, common test methods, and tool replacement parts, reports Paula Doe, SEMI. Fast-moving high-volume markets may also drive MEMS makers toward paring down the vast diversity of processes and packages used, and into more collaboration on a mature ecosystem.

SPTS Technologies joins MEMS consortium

Thu, 6 Jun 2012

SPTS Technologies joined the MEMS Consortium, led by the Institute of Microelectronics (IME), a member of the Agency for Science, Technology and Research (A*STAR) in Singapore.

Sensors Expo report: MEMS Pre-Conference Symposium

Mon, 6 Jun 2012

Karen Lightman, MEMS Industry Group (MIG), reports on the group's pre-Sensors Expo symposium on MEMS. The coordination of equipment vendors, materials suppliers, foundries, device manufacturers, end-users, and OEMs is "music to her ears."

Canon intros lithography stepper for high-volume MEMS and LED production

Wed, 6 Jun 2012

Canon Inc. launched the FPA-3030i5+ i-line stepper for manufacturing MEMS and energy-efficient “green” devices such as power semiconductors in solar and wind applications and LEDs.

SEMICON West preview: MEMS manufacturing changes with HV consumer apps

Wed, 6 Jun 2012

Paula Doe, SEMI Emerging Markets, covers developments at Applied Materials, Coventor, and other members of the MEMS equipment supply chain that will make MEMS less expensive, smaller, and easier to manufacture.

SMIC quals Microstaq MEMS chip for fluid control

Mon, 10 Oct 2009

Microstaq, a developer of silicon MEMS-based fluid control technology, has qualified its Ventilum MEMS-based chip at Semiconductor Manufacturing International Corp (SMIC), billed as both an advancement in electronic valve technology and a new facet to the Chinese foundry's MEMS capabilities.

X-Fab takes majority stake in MFI, widens MEMS portfolio to support growth push

Thu, 11 Nov 2012

X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.

MEMS seeing strong growth in military sector

Mon, 12 Dec 2012

Demand for microelectromechanical systems (MEMS) devices, particularly pressure sensors for harsh environments, will grow 20% in 2012 on the way to a 9% CAGR for the next several years.

Low-cost MEMS fabrication using injection molding

Fri, 12 Dec 2012

Researchers in Japan have devised a MEMS fabrication technology using lower-cost production methods of printing and injection molding, enabling MEMS devices to be applied for fields such as lighting -- and producable by firms outside the semiconductor sector.

Wales welcomes nano companies to health care conference

Tue, 3 Mar 2009
March 17, 2009: The government of Wales is encouraging nanotechnology companies to participate in a technology conference in May, describing the region as becoming "increasingly recognized as the hot spot for new technology and innovation in the sector."

Norcada intros new TEM window array

Mon, 3 Mar 2009
March 2, 2009: Norcada Inc., a MEMS design and product development company, has announced the availability of a new TEM (transmission electron microscope) nitride window array device to the TEM research community.

Micralyne, SVTC team up on 8-in. MEMS

Mon, 3 Mar 2009
March 30, 2009: Micralyne Inc., a MEMS developer and manufacturer, and SVTC Technologies LLC, an independent MEMS and CMOS commercialization company, plan to collaborate on development and manufacturing of MEMS devices using 8-in. fabrication technology.

Attend MEMS Executive Congress: Keynotes on MEMS in our world

Mon, 8 Aug 2012

MEMS Executive Congress 2012 in Scottsdale, AZ, will host keynotes from Ajith Amerasekera, TI Fellow, IEEE Fellow, in Texas Instruments’ Kilby Labs, who will discuss how immersive intelligent systems will change the management of our cities, buildings, personal life, health, transportation, safety and security; and Robert Brunner, founder, creative director and partner, Ammunition, who will explore the critical connection between brand identity and connection to consumers.

Focus on MEMS at SEMICON Taiwan

Mon, 8 Aug 2012

SEMICON Taiwan 2012, held September 5-7, will feature both Taiwan MEMS suppliers and global MEMS elites -- including Asia Pacific Microsystems, Freescale, InvenSense, and STMicroelectronics -- who will discuss innovation in MEMS design, manufacture, packaging, testing and equipment.

How to participate in SensorsCon 2013

Mon, 8 Aug 2012

The second annual SensorsCon 2013, the conference for Sensors Technology, Design and Applications, March 6, 2013, Techmart Center, Santa Clara, CA, is accepting applications for exhibitors, sponsors and speakers.

Wafer-level optics maker orders Heidelberg Instruments lithography tool

Tue, 8 Aug 2012

Heptagon, wafer-level optics maker, ordered an advanced DWL 2000 maskless lithography system from Heidelberg Instruments. The tool has sophisticated Gray Scale Exposure capability.

Attend the MEMS & NANO live seminar program in the UK

Thu, 8 Aug 2012

The MEMS & NANO free 2-day conference, presented by JEMI, Nanotechnology KTN, and MANCEF, will cover advances in MEMS and nanoscale processes for electronics, industrial and biomedical applications.

CrossFiber lands $13M funding for 3D MEMS photonics switches

Mon, 9 Sep 2012

CrossFiber, a San Diego, CA maker of photonic switches that incorporate MEMS technology, says it has completed the final tranche of a Series D round of funding, which closes totaling $13.4 million.

X-Fab offering MEMS 3D inertial sensor process

Wed, 9 Sep 2012

X-Fab Silicon Foundries has debuted an open-platform MEMS 3D inertial sensor process, what it claims is the first to be made available directly from a high-volume pure-play foundry.

X-Fab investing $50M in MEMS business, eyes top-three ranking

Wed, 9 Sep 2012

X-Fab Silicon Foundries says it will invest more than $50M over the next three years in its microelectromechanical systems (MEMS) operations, aiming to grow the business to become among the top MEMS foundries worldwide.

Micro-rheometer, microdevice adsorbtion get nods in Sandia student MEMS design contest

Thu, 9 Sep 2012

A device that measures very thin quantities of liquid, such as the synovial fluid in knee joints, and a device that measures change in mass when a microdevice adsorbs small amounts of material, earned top honors in Sandia National Labs' annual student MEMS design contest.

GlobalFoundries to fab Sand 9's MEMS timing products

Tue, 10 Oct 2012

Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).

New MEMS-Based Systems Solutions Session at Sensors Expo

Fri, 5 May 2009
A technical session titled "Think Outside the Chip: MEMS-Based Systems Solutions" will be held at the Sensors Expo Chicago 2009. In the all-day session on Monday June 8, industry analyst (and Small Times contributing editor) Roger Grace will be joined by more than 20 other world recognized leaders in the microelectromechanical (MEMS) area representing North America, Asia and Europe.

HP bridges cost/performance gap with new inertial MEMS sensor

Mon, 11 Nov 2009

HP execs David Erickson and Grant Pease give Small Times the skinny on the company's new MEMS sensor technology they say is 1000× more sensitive than current products -- and why applications like bridge monitoring are particularly ripe for implementation.

MIT's maskless MEMS wafer patterning promises cheaper, higher-mix manufacturing

Thu, 4 Apr 2012

MIT researchers say new maskless patterning and other MEMS-targeted fab techniques, and improved CAD tools, would break through limitations on MEMS adoption.

Coventor boosts predictive process modeling for advanced device nodes

Mon, 4 Apr 2012

Coventor launched SEMulator3D 2012, featuring improved predictive process modeling tools with increased capacity, speed, and automation for leading-edge process technology nodes.

Smallest 3-axis MEMS gyroscope: Teardown report released

Wed, 4 Apr 2012

Research and Markets released the "ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis" report, providing a teardown of STMicroelectronics’ MEMS gyroscope in an LGA package.

Micrel MEMS fab graded 98% following multi-million-dollar expansion

Mon, 4 Apr 2012

Micrel Inc. (NASDAQ:MCRL) received a 98% performance rating for its services and materials to a top-20 global MEMS designer and manufacturer in in a report covering Q4 2011.

Laser lithography tool uses piezo stage to construct submicron features

Tue, 4 Apr 2012

The new laser lithography tool from Nanoscribe GmbH produces complex 3D submicron structures up to 1mm with 150nm widths, boasting full automation and precise repeatability. It is based on a 3-axis piezo nano-positioning stage from PI (Physik Instrumente).

Silex Microsystems adds board member with new markets eye

Thu, 4 Apr 2012

Silex Microsystems named Fredrik Jönsson, CEO of Beijer Electronics, to its Board of Directors.  Beijer Electronics provides industrial automation and data communications solutions.

Magnetic MEMS under development at Silex thanks to new research grant

Wed, 4 Apr 2012

Silex Microsystems, a pure-play MEMS foundry, will develop ferromagnetic materials for next-generation MEMS devices, under a new VINNOVA research grant worth nearly 3 million Swedish Kronor.

CNSE STC designated trusted foundry for DOD Defense Microelectronics Agency

Thu, 4 Apr 2012

The College of Nanoscale Science and Engineering's (CNSE) Smart System Technology and Commercialization Center of Excellence (STC), Canandaigua, NY, was designated as a Trusted Foundry by the US Department of Defense's Defense Microelectronics Agency.

Dolomite, LioniX partner on microfluidics design, manufacturing, more

Wed, 5 May 2012

Dolomite and LioniX BV formed a partnership covering the design, development, fabrication, and distribution of microfluidic devices and systems.

Hanking builds MEMS fab in China

Fri, 5 May 2012

Hanking Industrial Group Co., Ltd., broke ground on a micro electro mechanical system (MEMS) manufacturing campus in Fushun City, China, outside of Shenyang.

MEMS formed with laser, diamond combo

Mon, 5 May 2012

Western Michigan University developed a device combining a laser and diamond cutting system, enabling users to process hard, brittle materials that are difficult to machine. Initial applications include MEMS manufacturing, and other fabrication on semiconductor materials.

memsstar appoints CEO with semiconductor and packaging experience

Tue, 5 May 2012

memsstar Limited, deposition and etch equipment supplier to the MEMS and semiconductor industries, named Mike Thompson as CEO.

Baolab expands NEMS fab technology in pursuit of CMOS-integrated IMU

Tue, 5 May 2012

Baolab Microsystems will modify the structures of its 3D NanoCompass to build a range of other motion sensors, with the end-goal of low-cost, smart, reconfigurable inertial measurement units (IMUs).

ST’s MEMS revenues jump 82% in 2011, but TI holds onto #1 spot

Wed, 5 May 2012

The top 3 MEMS manufacturers by revenue -- Texas Instruments, Hewlett Packard, and Bosch -- fought for market share in 2011, but #4, STMicroelectronics, experienced the biggest revenue jump year-to-year.

Sensory Swarms and MEMS roadmaps on docket at MEPTEC MEMS Technology Symposium

Thu, 5 May 2012

MEPTEC will host its 10th Annual MEMS Technology Symposium in San Jose, CA. Keynotes cover “sensory swarms” and motion interfaces, and sessions will cover MEMS roadmaps; design, manufacturing, and test of MEMS; MEMS architectures and uses, and more.

Guide to MEMS at SEMICON West 2012

Thu, 6 Jun 2012

Paula Doe, SEMI Emerging Markets, shares the annual guide for navigating the MEMS events at SEMICON West, July 10-12 at Moscone Center in San Francisco, CA.

ST opens sensors and electronics lab with China's Harbin Institute of Technology

Mon, 7 Jul 2012

STMicroelectronics (NYSE:STM) partnered with China’s Harbin Institute of Technology (HIT) to open a joint laboratory researching electronics.

MEMS to top $20 billion in 5 years, with double-digit growth

Fri, 7 Jul 2012

MEMS will continue to see steady, sustainable, double-digit growth for the next 6 years, with 20% compound average annual growth in units and 13% growth in revenues, to become a $21 billion market by 2017, according to Yole.

SUSS coating/developing platform suits MEMS, packaging, LED fab, more

Tue, 7 Jul 2012

SUSS MicroTec uncrated the third generation of the ACS200 Coating and Developing Platform, developed from the company’s ACS200Plus and Gamma platforms for a compact, highly precise MEMS, LED, and related fab tool.

Sweden funds high-tech MEMS-based gas sensing research

Wed, 7 Jul 2012

Sweden funds high-tech MEMS-based gas sensing research

Wed, 7 Jul 2012

MiQro Innovation Collaborative Center adds process tools, MES to MEMS facility

Wed, 7 Jul 2012

The MiQro Innovation Collaborative Centre (C2MI) is improving its state-of-the-art MEMS facility with Eyelit Manufacturing software to support R&D and the commercial activities of sponsor companies. C2MI is also installing a suite of new wafer processing tools from SPTS Technologies.

Oxford Instruments increases throughput on plasma etch and deposition tool

Mon, 7 Jul 2012

Oxford Instruments launched the PlasmaPro 100 etch and deposition tool for manufacturing MEMS, HB-LED, semiconductors, and other applications.

Kionix adds to top-level leadership in products, sales

Mon, 7 Jul 2012

Kionix Inc., maker of MEMS accelerometers, added Paul Bryan as EVP of product management and strategy, and promoted Drake Margiotta in sales.

Self-calibrating MEMS override manufacturing variations

Wed, 7 Jul 2012

Purdue researchers have demonstrated self-calibrating MEMS, which enable higher accuracy for existing and new MEMS applications and could eliminate 30% of manufacturing costs by skipping test processes.

Goodrich expands MEMS fab in US for commercial and military aerospace systems

Mon, 7 Jul 2012

Goodrich Corporation (NYSE: GR) added 46,00sq.ft. to its high-tech manufacturing facility in Burnsville, MN, with advanced production, design and development areas for MEMS.

Yole updates World MEMS Players database for 2012

Tue, 7 Jul 2012

Yole updated its MEMS industry database, World MEMS Players 2012. The product includes contact information for MEMS players, geographical breakdown of the industry, and various MEMS device categories.

MEMS researcher among President Obama’s outstanding scientists

Fri, 7 Jul 2012

President Obama bestowed the Presidential Early Career Awards for Scientists and Engineers upon 96 researchers. It is the highest honor from the US government for science and engineering professionals in the early stages of their independent research careers.

Knowles, Vectron partner with SiTime to grow MEMS timing devices

Thu, 8 Aug 2012

Vectron International and Knowles Electronics entered into a strategic partnership with SiTime Corporation, aiming to grow MEMS timing components in the frequency control products market.

NIST promotes lab-on-chip testing standard dev

Wed, 8 Aug 2012

Standardized testing and measurement methods, NIST argues, will enable MEMS lab-on-chip manufacturers to accurately determine important physical characteristics of LOC devices such as dimensions, electrical surface properties, and fluid flow rates and temperatures. These must be calculable at all stages of production, from processing of raw materials to final rollout of products.

JCAP, Enpirion partner on MEMS manufacturing

Tue, 1 Jan 2012

Enpirion, Inc. entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) for the manufacturing of silicon-based magnetics utilizing Enpirion's proprietary micro electronic magnetic silicon (MEMS) technology.

MEMS sensors in integrated smart systems

Wed, 1 Jan 2012

Embedded features and sensor integration will determine the future applications of MEMS sensors. Jay Esfandyari et al, STMicroelectronics, share an overview of future trends of sensor integration -- sensor fusion -- and some of the features available today in digital MEMS inertial sensors.

MEMS panel, tablet teardown, smart grid talk highlights of upcoming Sensors in Design

Thu, 1 Jan 2012

Sensors in Design 2012 takes place March 28-29 in San Jose, CA. With speakers from Texas Instruments and Intel, InvenSense, Analog Devices, and more, the event is designed for attendees to better understand sensor technologies and their applications.

Purdue's simplified microtweezers construct MEMS, advanced sensors

Fri, 1 Jan 2012
Purdue University researchers have created microtweezers for the manufacture of tiny structures in MEMS, printing coatings on advanced sensors, and live stem cell sphere manipulation.

Present at MEMS and nano manufacturing conferences in the UK

Fri, 1 Jan 2012

MM, MEMS & NANO Live UK 2012 will take place at NEC Birmingham, UK, September 25-26, co-located with TCT Live, Mediplas, and Sensing Technology 2012.. Submit an abstract by February 28.

Silex devs wafer-level MEMS fab technologies for mobile devices

Mon, 1 Jan 2012

Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.

MEMS foundries order 4Wave ion beam sputtering tools

Tue, 1 Jan 2012

Si-Ware platform creates MOEMS on-wafer with lithographic alignment

Tue, 1 Jan 2012

Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.

Heidelberg direct-write lithography system suits MEMS prototyping

Wed, 1 Jan 2012

Heidelberg Instruments launched the µPG 501 table-top direct-write lithography system for prototyping MEMS, integrated optics, microfluidic/lab-on-a-chip, and other devices as well as mask production.

Implantable MEMS sensor gets jiggy with self-powering design

Fri, 1 Jan 2012

Straight outta Purdue University, a miniaturized implantable medical micro electro mechanical (MEMS) pressure sensor chip can be recharged with the block-rockin beats -- acoustic waves -- of rap music.

CNSE MEMS center earns ISO 9001:2008 registration

Mon, 3 Mar 2012

The CNSE STC, which performs micro electromechanical system (MEMS) and nanotechnology-enabled manufacturing and packaging, successfully completed ISO 9001:2008 registration.

Tour MEMS lines and clinical bio-MEMS research labs in Grenoble

Tue, 3 Mar 2012

AEPI and CEA-Leti will co-host a site visit to CEA-Leti and other facilities on the MINATEC campus, Grenoble, following MEMS Executive Congress Europe on March 23.

Micro-optics formed with halftone gel lithography, bio inspiration

Thu, 3 Mar 2012

Researchers at the University of Massachusetts Amherst have developed a new tool for manufacturing three-dimensional shapes easily and cheaply, to aid advances in biomedicine, robotics and tunable micro-optics.

Attend Image Sensors 2012 in London

Fri, 3 Mar 2012

Image Sensors 2012, March 20-22 in London, will highlight the emergence of CMOS image sensors against those based on TFTs, applications possibilities for 3D cameras and non-visual spectrum cameras, and more.

Qualtre adds MEMS-industry veteran for customer/partner development

Mon, 3 Mar 2012

Qualtré appointed Mark Laich as VP of sales and business development, responsible for customer and partner development as Qualtré launches its latest iteration of inertial sensing technologies.

MEMS supply chain stronger 1 year after Japanese earthquake

Fri, 3 Mar 2012

The Great East Japan Earthquake, March 11, 2011 off Sendai, was "a Darwinian event" for the MEMS market. The MEMS supply chain came out of the disaster much richer, more diverse, and better positioned for growth, shows the IHS iSuppli MEMS & Sensors Service.

SPTS sends dry MEMS etch tool to China research institute

Wed, 3 Mar 2012

SPTS Technologies delivered its first VHF etch system in China, installing a Primaxx Monarch 3 at the Shanghai Institute of Microsystem and Information Technology for a MEMS accelerometer development project.

Top MEMS suppliers near $1 billion in sales

Mon, 3 Mar 2012

The market for MEMS grew 17% to $10.2 billion in 2011, according to Yole Développement. The top 2 suppliers -- Texas Instruments (TXN, TI) and STMicroelectronics (STM, ST) -- neared $1 billion in sales each.

Vistec e-beam lithography tool installed for nano/microelectronics research in Finland

Mon, 3 Mar 2012

Micronova Nanofabrication Centre selected a Vistec Lithography e-beam litho system for its nanotechnology laboratory in Finland. The litho tool will be used for nanoelectronics, nanofabrication, microelectronics, nanophotonics and microfabrication research in a multi-user environment.


Tue, 3 Mar 2012

MEMS company InvenSense Inc. (NYSE:INVN) announced dual-source capability for its CMOS-MEMS supply from semiconductor foundries TSMC and GLOBALFOUNDRIES.

Bosch's Akustica enters analog MEMS sector with 2-chip offering

Wed, 3 Mar 2012

Akustica, known for its monolithic single-chip digital MEMS devices, introduced its first analog 2-chip MEMS microphone for mobile handsets, the AKU340.

MEMS foundry IMT names semiconductor veteran as CEO

Mon, 1 Jan 2012

Pure-play MEMS foundry Innovative Micro Technology (IMT) named Craig Ensley its president and CEO, joining the company with 30+ years of semiconductor and entrepreneurial experience.

Coventor updates MEMS design software

Mon, 1 Jan 2012

Coventor Inc.'s CoventorWare 2012 MEMS design software offers full 64-bit support, a new hex-dominant extrude meshing capability, a new Python scripting interface for its enhanced suite of MEMS field solvers, and a new intuitive user interface.

Tessera expects MEMS optics design win in smartphones early in 2012

Wed, 2 Feb 2012

Tessera Technologies Inc. (NASDAQ:TSRA) expects a mobile phone design win for its MEMS optical imaging technology in H1 2012, reported Robert A. Young, president and CEO.

Inertial MEMS sensor maker Qualtre names engineering leader

Thu, 2 Feb 2012

Qualtré, silicon MEMS inertial sensors developer, appointed Dr. Ijaz Jafri as VP of engineering, responsible for all aspects of product development and commercialization. Jafri has 16+ years of experience in MEMS and semiconductors.

MEMS supplier Si-Ware Systems launches US subsidiary

Wed, 2 Feb 2012

Si-Ware Systems (SWS) launched a US subsidiary, Si-Ware Systems Inc. Scott Smyser, a new EVP for worldwide marketing and business development, will manage the US business.

Colibrys relocates to new premises with $10M investment

Thu, 2 Feb 2012

MEMS maker Colibrys SA will relocate locally, to the Y-Parc at Yverdon-les-Bains, Canton Vaud, Switzerland. The new location will enable Colibrys to branch out into new application sectors.

MagnaChip launches 0.35um mixed-signal foundry service for MEMS devices

Mon, 2 Feb 2012

MagnaChip Semiconductor Corporation (NYSE:MX) began ramping its 0.35µm mixed-signal foundry service process for MEMS accelerometers.

Picosun ALD achieves record particle levels at Fraunhofer installation

Thu, 2 Feb 2012

Picosun Oy announced record particle levels -- 1-2 added particles (>70nm) per wafer -- with its PICOSUN P-300B ALD batch tool installed at Fraunhofer IPMS.

Attend "MEMS Commercialization" at MM/MEMS/NANO Live USA

Fri, 2 Feb 2012

At MM/MEMS/NANO Live USA, Professor Yogesh Gianchandani, University of Michigan Wireless Integrated Microsystems and Sensors Center, will keynote the MEMS Commercialization: From Lab to Fab to the Market session.

CEA-Leti demos optical modulator in silicon with 40Gbit/s capabilities

Tue, 2 Feb 2012

CEA-Leti unveiled a 40Gbit/s optical modulator in silicon with a record extinction ratio of 10dB, developed by the HELIOS Project members.

Texas Instruments develops HVM for poLight optical MEMS component

Thu, 2 Feb 2012

poLight collaborated with Texas Instruments to produce the optical MEMS component of poLight's TLens, aiming for faster focus time and lower power consumption in high volumes.

ST uses shape memory alloy actuators in motion sensing devices

Thu, 2 Feb 2012

STMicroelectronics (STM) is implementing shape memory alloys (SMA) in its optical image stabilization (OIS) motion sensor designs. Actuators made of SMAs contract upon heating.

STM ships 2B MEMS sensors

Fri, 2 Feb 2012

STMicroelectronics has shipped 2 billion MEMS sensors to date, after hitting 1 billion only 15 months ago. The company recently increased its MEMS production capacity to 3 million+ sensors a day.

Tokyo Electron joins Luxtera investors in $21.7M Round C

Mon, 2 Feb 2012

Luxtera closed $21.7 million in Round C financing, with participation from NEA, August Capital, Sevin Rosen, Funds, and Lux Capital, as well as new investor Tokyo Electron (TEL), and personal investment from an industry titan.

MIT designs completely 3D MEMS

Wed, 2 Feb 2012

MIT researchers have come up with a new approach to MEMS design that enables engineers to design 3D configurations using existing fabrication processes. They built a MEMS device that enables 3D sensing on a single chip.

MEMSIC (MEMS) shares 2012 goals

Thu, 3 Mar 2012

After reporting Q4 2011 results, MEMS supplier MEMSIC Inc. (NasdaqGM: MEMS) discussed its 2 main goals for 2012.

Tessera gains camera module manufacturing assets through Flextronics deal

Fri, 3 Mar 2012

Tessera Technologies Inc. (NASDAQ:TSRA), through its wholly owned subsidiary, DigitalOptics Corporation (DOC) will acquire certain assets of Vista Point Technologies, a Tier-One-qualified camera module manufacturing business of Flextronics.

MEMS foundry Tronics Microsystems claims revenue growth of 56%

Tue, 4 Apr 2008
Tronics Microsystems, the MEMS foundry that stirred controversy last Fall when it claimed that its profitability "validates the pure-play MEMS foundry model," now says it has achieved a 56% increase in annual revenue, to 10.5 million Euros ($15.4 million), in its fiscal year ended Dec. 31, 2007. The company's net profit represents 12% of total revenue.

FUJIFILM Dimatix materials printer leverages MEMS for research

Tue, 4 Apr 2008
Researchers at Colorado State University used the MEMS-based Dimatix Materials Printer (DMP) to devise a novel method of rapidly producing, testing, and optimizing new materials that hold promise for efficiently producing hydrogen from water and sunlight. The DMP-2800 jetted smaller-than-nano droplets of compounds to help quantify optimal proportions and deposition conditions.

U. of Alberta MEMS spinoff recognized

Tue, 11 Nov 2008
November 11, 2008: Micralyne Inc., a global independent MEMS manufacturer, was recently recognized by TEC Edmonton for its success as a spin-off innovation company from the University of Alberta.

MEMS pioneer Petersen joins APM foundry's technical advisory board

Tue, 5 May 2008
Taiwan-based Asia Pacific Microsystems (APM), an independent MEMS foundry service provider, says that MEMS pioneer Dr. Kurt Petersen has joined its technical advisory board. Petersen, who co-founded SiTime, Cepheid, and NovaSensor, will advise APM on its 8-inch transition strategy, advanced technology roadmap, new MEMS applications, and new partnership opportunities.

MEMS development in less than half the time

Tue, 5 May 2008
How did designers at Kodak complete an 8-10 year MEMS project for the EASYSHARE printer in just 3 years? Kodak senior research scientist Christopher N. Delametter explains.

Semiconductor foundry giant TSMC announces entry into MEMS market

Fri, 5 May 2008
May 2, 2008 -- Taiwan Semiconductor Manufacturing Co (TSMC), the world's largest dedicated semiconductor foundry, has unveiled plans to enter the MEMS business. The company will reportedly detail the plans later this month -- and cover trends in MEMS production at "CMOS integrated MEMS foundries."

MEMS foundry SVTC launches photovoltaics-development initiative

Mon, 5 May 2008
May 5, 2008 -- SVTC Technologies, a semiconductor foundry offering MEMS services, is launching a photovoltaics (PV) development center. Solar industry veteran Kurt Laetz will head up SVTC Solar, which aims provide "the most complete set of capabilities available in the U.S."

Qualcomm, Foxlink partner to open dedicated mirasol MEMS fab

Wed, 5 May 2008
May 7, 2008 -- Qualcomm MEMS Technologies and Taiwan-based Cheng Uei Precision Industry Co. ("Foxlink") are collaborating to open a MEMS fabrication plant that will enable increased volume, reduced time to market for MEMS-based mirasol displays.

MEMS development/prototype service company, Silicon Resources, appoints director

Thu, 5 May 2008
Silicon Resources LLC, a microelectromechanical systems (MEMS) development and prototype company based in the Ann Arbor, Michigan area, has appointed Christopher Campbell as Business Director. According to Frank DiPiazza, Founder and Technical Director of the company -- a service provider for companies designing MEMS -- said, "His unique skills will allow us to accelerate our forward momentum."

CrossFiber buys assets of MEMS photonic switch maker OMM

Thu, 9 Sep 2012

CrossFiber, a San Diego, CA maker of photonic switches that incorporate microelectromechanical system (MEMS) technology, has acquired substantially all the assets of 2D MEMS switch firm OMM.

Antenna-on-a-chip promises faster light processing with silicon photonics

Mon, 11 Nov 2012

Researchers from Rice U. say they have developed a micron-scale spatial light modulator (SLM) built on SOI that runs orders-of-magnitude faster than its siblings used in sensing and imaging devices.

STMicroelectronics and Movea collaborate to bring ultra-low-power, context-aware motion-recognition platform

Fri, 9 Sep 2013
STMicroelectronics and Movea today announced their agreement to integrate Movea’s SmartMotion technology into the STM32F401 microcontroller operating as a low-power sensor-hub controller.

Cisco awards STMicroelectronics Excellence in Sustainability award

Tue, 10 Oct 2013
STMicroelectronics today announced that it has received the 2013 Excellence in Sustainability Award from Cisco.

SPICEing up circuit design

Wed, 9 Sep 2013
Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, blogs about the challenges of designing for yield using SPICE models.

All ST’s front-end manufacturing sites achieves ISO 50001 energy-management certification

Tue, 10 Oct 2013
STMicroelectronics this week has announced that all six of its front-end manufacturing sites have achieved certification to the latest, most stringent ISO 50001 energy-management standard.

From smart cars to smart cities: Shaping the future of microelectronics at ITPC 2013

Wed, 10 Oct 2013
Experts in aerospace, automotive, mobile communications, Smart Cities and more join semiconductor leaders to shape the future of microelectronics at the International Technology Partners Conference (ITPC), to be held in Maui, Hawaii, on November 10-13.

InvenSense opens Korean design center

Wed, 10 Oct 2013
InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the opening of a new design center in Seoul, Korea.

STMicroelectronics receives Innovation Management Award for chip manufacturing tech

Wed, 10 Oct 2013
STMicroelectronics announced on Tuesday it has won a prestigious BearingPoint Innovation Management Award for its FD-SOI technology in the "Innovation Ecosystem" category.

Nordic Semiconductor launches world’s first concurrent ANT+ and Bluetooth low energy combo chip

Wed, 10 Oct 2013
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA today announces the release of the world's first multi-protocol SoC solution offering concurrent ANT+ and Bluetooth low energy wireless communication natively in a single chip.

IBM breaks record with silicon nanowire MOSFET

Fri, 10 Oct 2013
IBM devices with a 90nm gate pitch demonstrated the highest performance ever reported for a SiNW device at a gate pitch below 100 nm.

Monolithic 3D chip fabricated without TSVs

Fri, 10 Oct 2013
Researchers from Taiwan’s National Nano Device Laboratories avoided the use of TSVs by fabricating a monolithic sub-50nm 3D using a novel CMP technique.

MEMS is still on a dynamic growth path, targeting USD 22.5 billion in 2018

Tue, 8 Aug 2013

In 2012, the IC industry saw a two percent decline, but Yole Développement's research reveals the MEMS sector managed another 10 percent growth to become an $11B business.

InvenSense announces headquarters relocation

Fri, 8 Aug 2013

InvenSense, Inc., a provider of MotionTracking system on chip devices, is relocating its headquarters to 1745 Technology Drive, San Jose, California.

Infinite Graphics expands medium area mask capability

Fri, 8 Aug 2013

Infinite Graphics Inc. (IGI), a supplier of service and software products for the Medium Area Mask (MAM) market, has added new capability in the form of new and upgraded equipment.

Installed capacity for 300mm wafer processing to rise to 70% of total capacity by 2017

Tue, 7 Jul 2013

Capacity for 200mm wafers forecast to slip more than 10 points during same period.

Scrubber developed for POU abatement of wet bench gases

Thu, 7 Jul 2013

DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.

Micralyne and Adament to develop MEMS-based fiber-optic subsystems

Wed, 7 Jul 2013

Companies announce alliance to bring high-performance sensors to market.

Driven by Apple and Samsung, light sensors achieve double-digit revenue growth

Tue, 7 Jul 2013

Light and proximity sensors in mobile handsets and tablets are set for expansive double-digit growth within a five-year period, thanks to increasing usage by electronic giants Samsung and Apple.

MEMS New Product Development: The importance of product validation

Wed, 7 Jul 2013

Product validation is an essential part of all successful MEMS new product developments. It is the process of testing products under various environmental, mechanical or electrical conditions to simulate life in an accelerated manner.

New NIST nanoscale indenter takes novel approach to measuring surface properties

Thu, 7 Jul 2013

Researchers from the National Institute of Standards and Technology (NIST) and the University of North Carolina have demonstrated a new design for an instrument, a "instrumented nanoscale indenter," that makes sensitive measurements of the mechanical properties of thin films -- ranging from auto body coatings to microelectronic devices -- and biomaterials.

MediaTek introduces tablet SoC

Mon, 7 Jul 2013

MediaTek Inc., a  fabless semiconductor company for wireless communications and digital multimedia solutions, today announced its breakthrough MT8135 system-on-chip (SoC) for high-end tablets.

Sand 9 launches new MEMS timing products

Tue, 9 Sep 2013
Sand 9, Inc. today announced the first MEMS timing products specifically designed to meet the stringent performance, cost, size and reliability requirements of high-volume mobile applications

Next level of MEMS industry development to be examined at SEMICON Europa

Thu, 9 Sep 2013
Driven by value-creating applications in mobile phones, automotive, displays and other systems, the global MEMS industry has grown to over $11 billion in 2012, a 10 percent compound annual average growth rate since 2008.

Tailored gyroscopes from STMicroelectronics target shake-free images on mobiles and cameras

Tue, 9 Sep 2013
STMicroelectronics has introduced a new family of gyroscopes specifically optimized for optical image stabilization in smartphones and digital still cameras.

Leading-edge technology to be responsible for 2013 increase in pure-play foundry sales

Tue, 9 Sep 2013
TSMC forecast to sell $6.33 billion worth of ≤28nm devices this year, a 3x increase over 2012.

Sensors market for automotive applications worth $33.59 billion by 2022

Wed, 9 Sep 2013
The total automotive sensor market is expected to reach $33.59 billion by 2022 at a CAGR of 7.8 percent.

STMicroelectronics chip controls Pebble Smartwatch

Wed, 9 Sep 2013
STMicroelectronics announced this week that its STM32 microcontroller is the brain controlling the innovative Pebble Smartwatch for iPhone and Android.

Blog Review October 14 2013

Mon, 10 Oct 2013
Recent blogs address semiconductors in healthcare (blood cell sorters), FinFETs and logic roadmaps, 450mm progress, panel level embedded tech, materials innovation, options to reduce mask write time, SOI and EUV.

NY’s Marcy lands $1.5B deal, “Nano Utica”

Thu, 10 Oct 2013
NY’s Marcy Nanocenter, the largest remaining shovel-ready, greenfield site in New York State’s Tech Valley near Utica, is another step closer to the goal of attracting major semiconductor manufacturing companies.

High mobility InGaAs MOSFETs get triangular

Tue, 10 Oct 2013
A research team in Japan has built a triangular InGaAs-on-insulator n-MOSFETs using MOVPE that has a high on-current of 930 µA/µm.

IBM develops sub-20nm nanofluidic channels for lab-on-chip

Tue, 10 Oct 2013
At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.

MEMS Technology Showcase finalists highlight “MEMS Inside the Machine”

Thu, 10 Oct 2013
MEMS Technology Showcase will give MEMS Executive Congress US attendees an intimate look at some of the most unique and inspiring MEMS-enabled applications in the business. After a competitive application process, MEMS Industry Group (MIG) has selected five finalists that show how MEMS enhances the consumer experience, highlighting the “MEMS inside the machine.”

Grant funds development of improved nanoscale additive manufacturing

Tue, 10 Oct 2013
A new Department of Energy grant will fund research to advance an additive manufacturing technique for fabricating three-dimensional (3D) nanoscale structures from a variety of materials. Using high-speed, thermally-energized jets to deliver both precursor materials and inert gas, the research will focus on dramatically accelerating growth, improving the purity and increasing the aspect ratio of the 3D structures.

UK photonics industry must connect higher in the value chain

Wed, 10 Oct 2013
Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), moderated a discussion with executives from the UK photonics industry and filed this report.

EV Group ships lithography system to Micronit for lab-on-chip MEMS device production

Mon, 10 Oct 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has delivered an EVG 6200 semi-automated mask alignment system to Micronit, a manufacturer of lab-on-a-chip products used in life sciences applications, such as molecular diagnostics and point-of-care, as well as micro-processed glass substrates for MEMS applications.

SUNY Nanocollege and Albany Law School partner to create nanotech education program

Tue, 11 Nov 2013
‘Ecosystem for Nanotechnology, Entrepreneurship and Law’ (eNTEL) will provide unmatched student experience as launch pad for development of startup companies and attraction of business investment.

MIG honors STMicroelectronics with three different awards

Mon, 11 Nov 2013
STMicroelectronics has been selected by MEMS Industry Group and affiliated voters as the Company of the Year for its continuing success in growing its MEMS business, expanding its product line, and demonstrating industry leadership and vision.

Annual MEMS Executive Conference shows why MEMS is growing 2x faster than semiconductors

Fri, 11 Nov 2013
MEMS Industry Group (MIG)'s MEMS Executive Congress -- held November 7-8, 2013 in Napa, CA -- showed why the MEMS industry is outpacing the semiconductor industry, in both growth and innovation.

SUSS MicroTec installs excimer laser stepper at Fraunhofer IZM Berlin

Wed, 11 Nov 2013
SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

Will MEMS applications be the driver for future growth of thin film PZT?

Thu, 11 Nov 2013
In September 2013, EPSON announced its next generation inkjet technology, PrecisionCore, introducing for the first time MEMS inkjet heads manufactured with thin film PZT technology. This announcement has been highly publicized: first, thin film PZT MEMS applications are now on the market, proving the reliability and maturity of this technology. Second, more inkjet head players will soon follow.

STMicroelectronics boosts safety, reliability and efficiency of industrial-automation systems

Thu, 11 Nov 2013
STMicroelectronics announced that it is launching its new ISO8200B, an innovative isolated power switch that enables smaller, more robust and energy-efficient controllers for industrial automation equipment.

Multitest ships first MEMS tri-temp solution for 3+2 axis magnetic test and calibration

Mon, 11 Nov 2013
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that its solution for 3-axis magnetometer plus 2-axis low g-test and calibration fully supports the technical features of today’s advanced 3D hall sensors.

Leti announces MEMS research collaboration with OMRON

Wed, 11 Nov 2013
CEA-Leti today announced a development agreement that will utilize Leti’s deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, healthcare and consumer-goods industries.

STMicroelectronics reveals advanced MEMS accelerometers

Tue, 12 Dec 2013
Innovative design boosts the sensor's thermal and mechanical stability to deliver robust high performance in ultra space-saving footprint.

Graphene-based nano-antennas may enable networks of tiny machines

Thu, 12 Dec 2013
Networks of nanometer-scale machines offer exciting potential applications in medicine, industry, environmental protection and defense, but until now there's been one very small problem: the limited capability of nanoscale antennas fabricated from traditional metallic components.

SPTS named Supplier of the Year at the Annual MEMS Executive Congress

Mon, 12 Dec 2013
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, was named MEMS Supplier of the Year at the MEMS Executive Congress U.S. 2013 held in Napa last month

"Crisis? What Crisis?": New paradigm adjustments for capacity and equipment spending

Thu, 1 Jan 2014
Worldwide, the semiconductor industry growth rate back in 1973 was about 30 percent and slipped into 1975 with negative sales growth rates.

7) MEMSIC announces wearable connected watch kit

Sun, 1 Jan 2010

8) Entropic and NAGRA to integrate SoC for set-top boxes

Sun, 1 Jan 2010

STMicroelectronics reveals industry's best connected STM32 F0 microcontrollers

Thu, 1 Jan 2014
STMicroelectronics has extended its STM32 F0 microcontrollers based on the ARM Cortex-M0 core with new models that support crystal-less USB design, accurate sensing and smart power management for next-generation smart devices and connectivity products.

Semiconductors that detect cancer

Thu, 1 Jan 2014
As exciting as it is to watch the semiconductor industry push to sub-10nm dimensions, 450mm wafers, finFETs, 3D ICs and the like, what’s even cooler is the potential of semiconductor technology to make a real difference in medicine.

2014 Outlook: An era of unprecedented change

Fri, 1 Jan 2014
We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

2014 outlook: MEMS on the rise

Thu, 1 Jan 2013
Looking at the global MEMS market, industry experts are predicting double-digit device growth in the next three to five years.

MEMS Industry Group explores the “MEMS-enabled Life” at MEMS Executive Congress Europe 2014

Tue, 1 Jan 2014
MEMS Industry Group (MIG) will host its third annual MEMS Executive Congress® Europe, 11 March, 2014 in Munich, Germany.

New "photodetector" nanotechnology allows photos in near darkness

Wed, 1 Jan 2014
Dark and blurry low light photos could soon be a thing of the past, thanks to the development of game-changing ultrathin “nanosheets,” which could dramatically improve imaging technology used in everything from cell phone cameras, video cameras, solar cells, and even medical imaging equipment such as MRI machines.

"MEMS and NEMS processing advances" discussed at IEMN, Lille, France workshop on 8th April 2014

Mon, 2 Feb 2014
"Nanoscale Processing for NEMS and MEMS" is the topic for the next Oxford Instruments technical workshop, being hosted in conjunction with the Institute of Electronics Micro-electronics and Nanotechnology (IEMN) in Lille, France on 8th April 2014.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

Thu, 2 Feb 2014
The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

6 and 9-axis DOF sensors are creating a new paradigm in the combos business

Tue, 3 Mar 2014
Over the last years, inertial MEMS have been subject to dramatic market & technological evolution. This has been driven by a large increase of the consumer market.

MEMS microphones broadcast strong growth

Fri, 4 Apr 2014
Global revenue for MEMS microphones is forecast to reach $1.04 billion this year, up a robust 24 percent from $836.9 million in 2013.

Global scientific team "visualizes" a new crystallization process

Thu, 4 Apr 2014
Sometimes engineers invent something before they fully comprehend why it works. To understand the "why," they must often create new tools and techniques in a virtuous cycle that improves the original invention while also advancing basic scientific knowledge.

imec reports 4 percent growth in 2013 fiscal year

Thu, 4 Apr 2014
Revenue for 2013 totaled 332 million euro, a four percent growth from the previous year.

Sensor hubs make big gains while enabling the future of sensing

Wed, 4 Apr 2014
Sensor hubs that offload tasks from power-hungry application processors and let mobile devices like smartphones and tablets run longer on a single battery charge are reaping gargantuan gains thanks to the global microelectromechanical systems (MEMS) market

InvenSense unveils gyroscope for high speed motion and wearable applications

Wed, 6 Jun 2014
InvenSense, Inc., the provider of MotionTracking system on chip (SoC) and sound devices, announced the world’s widest full scale range (FSR) 3-axis MEMS gyroscope for high impact wearable applications.

memsstar relocates; Increases manufacturing capacity by 40%

Wed, 6 Jun 2014
memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today announced that it has relocated to a new, larger facility.

The bright future of Si photonics

Wed, 6 Jun 2014
Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.

National Science Foundation tests out the assembly line of the future

Tue, 8 Aug 2014
NSF's Center for Hierarchical Manufacturing proves good test bed for large-scale nanomanufacturing designs .

Smart, sustainable manufacturing: new sensors for process monitoring

Thu, 7 Jul 2014
Industries ranging from chemicals to agri-food to bio-tech and pharmaceuticals are looking at new sensor technologies to streamline processes and improve quality control.


Tue, 7 Jul 2014
The Center aims to accelerate the development of next generation CMP technology, and to drive improvement in the yield and cost of ownership of CMP processes.

NJR and UMC extend collaboration on MEMS microphone manufacturing

Thu, 8 Aug 2014
New Japan Radio Co., Ltd. and United Microelectronics Corporation, a global semiconductor foundry, today announced that the two companies have successfully collaborated to achieve high-volume manufacturing for NJR's MEMS microphone products.

Eco-friendly "pre-fab nanoparticles" could revolutionize nano manufacturing

Wed, 8 Aug 2014
A team of materials chemists, polymer scientists, device physicists and others at the University of Massachusetts Amherst today report a breakthrough technique for controlling molecular assembly of nanoparticles over multiple length scales that should allow faster, cheaper, more ecologically friendly manufacture of organic photovoltaics and other electronic devices.

Global pressure sensors market is expected to reach $9.36B in 2020

Thu, 8 Aug 2014
The global pressure sensors market was valued at $6.53 billion USD in 2013, growing at a CAGR of 6.2% from 2014 to 2020 to account for $9.36 billion USD in 2020.

MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer

Fri, 8 Aug 2014
MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

The industry's first foundry business for MEMS utilizing thin-film piezoelectric elements

Thu, 8 Aug 2014
ROHM has recently established a process for MEMS utilizing thin-film piezoelectric elements, and implemented the industry's first foundry business that integrates product design and manufacturing processes, from wafer pulling to mounting, in order to meet a variety of customer needs.

MEMS Industry Group hosts 10th annual MEMS Executive Congress US

Thu, 8 Aug 2014
MEMS Industry Group (MIG) will host MEMS Executive Congress US 2014, an annual business conference and networking event for the MEMS and sensors industry, November 5-7, 2014 in Scottsdale, AZ.

Analog Devices releases high-temperature MEMS gyroscope

Wed, 9 Sep 2014
Analog Devices, Inc. today introduced the first and only MEMS gyroscope specified to withstand temperatures of up to 175 degrees Celsius commonly encountered by oil and gas drilling equipment.

Oxford Instruments launches 3rd annual Indian nanotechnology seminars in Kolkata and Delhi

Thu, 9 Sep 2014
Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

Rudolph introduces new acoustic metrology and defect inspection technology

Thu, 9 Sep 2014
Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

Wearable sensor market to expand sevenfold in five years

Thu, 10 Oct 2014
Driven by rising demand for fitness and health monitoring features as well as by improved user interfaces, shipments of sensors used in wearable electronic devices will rise by a factor of seven from 2013 through 2019

MEMS Industry Group goes to the 'Shark Tank' for MEMS and sensor-based products

Mon, 10 Oct 2014
MIG announces finalists for Elevator Pitch Session at MEMS Executive Congress US 2014.

Mergers, acquisitions reshape the automotive semi supplier landscape

Wed, 10 Oct 2014
Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been undergoing a wave of merger and acquisition (M&A) activity that has shaken up the competitive order of the market.

Finalists announced for MEMS Executive Congress US 2014

Thu, 10 Oct 2014
Six companies selected from a pool of applicants will compete in MEMS Industry Group's (MIG)'s MEMS & Sensors Technology Showcase at MEMS Executive Congress.

STMicroelectronics tops five billion MEMS sensors shipped

Thu, 10 Oct 2014
Beyond gaming systems, smartphones, tablets, navigation systems, and other widely adopted applications, ST’s sensors have also been used in thousands of other useful, fun, and valuable applications.

Apple and Samsung drive adoption of next-generation sensors

Mon, 11 Nov 2014
Propelled by the race between Apple and Samsung to enhance their mobile products with cutting-edge sensor technology, the market for sensors in cellphones and tablets is set to nearly triple from 2012 through 2018, according to IHS Technology.

'Nanomotor lithography' answers call for affordable, simpler device manufacturing

Tue, 11 Nov 2014
Nanoengineers at the University of California, San Diego recently invented a new method of lithography in which nanoscale robots swim over the surface of light-sensitive material to create complex surface patterns that form the sensors and electronics components on nanoscale devices.

MEMS Industry Group announces first open-source Algorithm Community

Thu, 11 Nov 2014
MEMS Executive Congress -- Karen Lightman, executive director of MEMS Industry Group (MIG), today announced the first open-source algorithm cooperative, Accelerated Innovation Community (AIC), during her opening remarks at MEMS Executive Congress US 2014.

Cavendish Kinetics secures funding to accelerate the growth of the RF MEMS market

Tue, 11 Nov 2014
Cavendish Kinetics, the provider of high-performance RF MEMS tuning solutions for mobile and wearable devices, today announced the closing of a $7 million funding round as well as the appointment of Gilles Delfassy to its board of directors.

mCube named MEMS Start-Up of the Year at MEMS Executive Congress

Thu, 11 Nov 2014
mCube, provider of the world’s smallest MEMS motion sensors, today announced the company secured three awards at last week’s MEMS Executive Congress for its significant innovations in MEMS and sensors

STMicroelectronics, AKM, InvenSense and Bosch share 75% of the consume inertial combo market

Wed, 11 Nov 2014
Combo sensors continue their growth in a market expected to reach US$ 1.4 billion in 2019 overcoming discrete sensors.

Holst Centre, imec and CARTAMUNDI join forces to create the near field communication chip of the future

Wed, 11 Nov 2014
Holst Centre, set up by the Belgian nanoelectronics research center imec and the Dutch research institute TNO, and Cartamundi NV have announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags.

X-FAB MEMS Foundry wins “Foundry of the Year” Award at MEMS Executive Congress

Thu, 11 Nov 2014
X-FAB MEMS Foundry today announced it received the “MEMS Foundry of the Year” award at the Best in MEMS & Sensors Innovation Awards ceremony, as part of the MEMS Industry Group’s 10th annual MEMS Executive Congress held in Scottsdale, Arizona last week.

11) 3D Integration of Diverse Technologies for Self-Driving Vehicles

Tue, 11 Nov 2013

13) Combating Alzheimer’s Disease with MEMS Technology

Tue, 11 Nov 2013

Wireless nanorod-nanotube film enables light stimulation of blind retina

Wed, 12 Dec 2014
Breakthrough could lead to artificial retinas for visually impaired. Combining semiconductor nanorods and carbon nanotubes, it could potentially form part of a future prosthetic device that replaces damaged retinal cells.

Imec and Holst Centre announce IC and open hardware development kit for personal health monitoring

Thu, 12 Dec 2014
At next week’s mHealth Summit 2014, held Dec. 7-11 in Washington, D.C., nanoelectronics research center imec and Holst Centre will showcase at their booth a development kit based on an open hardware platform using a highly integrated multi-sensor data acquisition chip.

What’s next for MEMS?

Tue, 12 Dec 2014
The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ease use and grow applications. But it is also bringing plenty of demands for new technologies, and changes in how companies will compete.

IoT's divergent needs will drive different types of technologies

Fri, 12 Dec 2014
Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical.

Piezoelectricity in a 2-D semiconductor

Mon, 12 Dec 2014
Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS.

Internet of Things stimulates MEMS market

Tue, 12 Dec 2014
The explosive expansion of the Internet of things (IoT) is driving rapid demand growth for microelectromechanical systems (MEMS) devices in areas including asset-tracking systems, smart grids and building automation.

HLMC develops specialty technology in pursuit of growing IoT market

Mon, 1 Jan 2015
Chinese IC manufacturer Shanghai Huali Microelectronics Corporation gave a presentation on its outlook for the Internet of Things (IoT) market and the wide application of its specialty technology at the 2014 China Semiconductor Industry Association IC Design Branch Annual Conference ("ICCAD"), which was recently held at Hong Kong Science Park.

InvenSense to ship over 1B MEMS sensors worldwide

Tue, 1 Jan 2015
InvenSense, Inc., a provider of intelligent sensor solutions, announced that since starting shipment of MEMS-based sensors in late 2006, it will reach 1 billion devices shipped in Q1 of calendar 2015.

Spotlight on MEMS: SEMI launches new European MEMS Summit

Wed, 1 Jan 2015
SEMI today announced the launch of the European MEMS Summit, to be held on 17-18 September 2015 in Milan, Italy.

Temporary tattoo offers needle-free way to monitor glucose levels

Fri, 1 Jan 2015
Nanoengineers at the University of California, San Diego have tested a temporary tattoo that both extracts and measures the level of glucose in the fluid in between skin cells. This first-ever example of the flexible, easy-to-wear device could be a promising step forward in noninvasive glucose testing for patients with diabetes.

Apple Watch spurs rapid growth of market for wireless charging in wearable technology in 2015

Tue, 1 Jan 2015
Propelled by the arrival of the Apple Watch, the global market for wireless power and charging in wearable applications is set to attain a gargantuan 3,000 percent expansion this year compared to 2014.

Scientists 'bend' elastic waves with new metamaterials that could have commercial applications

Fri, 1 Jan 2015
Engineering researchers at the University of Missouri have developed a material that has the ability to control these waves, creating possible medical, military and commercial applications with the potential to greatly benefit society.

Fabrication of patterns with linewidths down to 1.5nm

Tue, 2 Feb 2015
Researchers at aBeam Technologies, Lawrence Berkeley National Laboratory and Argonne National Laboratory have developed a technology to fabricate test patterns with a minimum linewidth down to 1.5nm.

MIG announces finalists for MEMS & Sensors Technology Showcase

Thu, 2 Feb 2015
Selected from a pool of applicants, finalist companies will demo their MEMS/sensors-based applications as they vie for attendees’ votes.

Apple dictates the ranking of top 10 MEMS manufacturers in 2014

Wed, 3 Mar 2015
Apple boosted Bosch’s MEMS revenue in 2014 again as Bosch is the sole supplier of the pressure sensors added to the iPhone 6 and 6+.

Dr. Terry Brewer receives the Kathryn C. Hach Award for Entrepreneurial Success from the American Chemical Society

Wed, 3 Mar 2015
Dr. Terry Brewer, founder and CEO of Brewer Science, was presented the Kathryn C. Hach Award for Entrepreneurial Success on Tuesday, March 24, 2015, at the American Chemical Society’s 249th National Meeting.

ULVAC announces world's first, low temperature PZT sputtering technology

Thu, 3 Mar 2015
ULVAC, Inc. this week announced industry's first low temperature PZT sputtering technology in mass production scale, enabling future advanced MEMS device integrated on CMOS which will be the mainstream of next generation MEMS devices.

Standing Egg chooses MIPS CPUs for sensor hubs targeting mobile, IoT, wearables and automotive

Tue, 4 Apr 2015
Imagination Technologies announces that South Korea based MEMS sensor development company Standing Egg has licensed Imagination's MIPS Warrior M-class CPU for use in its next-generation sensor hubs targeting an expanding range of products including mobile devices, IoT, wearables, and automotive.

MEMS shipments to reach 43.3B units by 2018, says Semico Research

Thu, 4 Apr 2015
The market for MEMS has been growing at a fast rate. But growth will come as a result of a wide variety of emerging MEMS and will be driven by the growth of the Internet of Things (IoT), where MEMS devices will replace conventional sensors, and by the introduction of new sensor technologies.

Sensor shipments strengthen but falling prices cut sales growth

Fri, 4 Apr 2015
Sensor shipments are getting a big boost from the spread of embedded measurement functions for automated intelligent controls in systems and new high-volume applications, but sales growth is being pulled down significantly by price erosion in this once high-flying semiconductor marketplace.

Engineer improves rechargeable batteries with MoS2 nano 'sandwich'

Fri, 4 Apr 2015
The key to better cellphones and other rechargeable electronics may be in tiny "sandwiches" made of nanosheets, according to mechanical engineering research from Kansas State University.

Mentor Graphics releases design solutions for the independent engineer

Tue, 4 Apr 2015
Mentor Graphics Corporation this week announced the delivery of three new PADS family products starting at five thousand dollars to address the advancing needs of the independent engineer.

Sensor competition, actuator recovery impact supplier ranking

Thu, 4 Apr 2015
Sensor leader Bosch grabs 20 percent of worldwide sales in 2014 while ST falls from second to fourth place with a 19 percent drop in dollar volume last year, says new O-S-D Report.

MEMS industry influencers to present at SEMI European MEMS Summit

Thu, 5 May 2015
SEMI has announced that executives from MEMS giants Bosch and STMicroelectronics, MEMS largest fabless Invensense and dominating IC foundry TSMC will be delivering the keynote talks at the European MEMS Summit.

New approaches to vision with microchips holds out prospects for the blind

Mon, 5 May 2015
To date, chip-based retinal implants have only permitted a rudimentary restoration of vision. However, modifying the electrical signals emitted by the implants could change that.

Moore's Law to keep on 28nm

Wed, 5 May 2015
Scaling is now bifurcating - some scaling on with 28/22nm, while other push below 14nm.

Janusz Bryzek joins MEMS Industry Group to lead new TSensors division

Thu, 5 May 2015
MEMS Industry Group (MIG), the trade association advancing micro-electromechanical systems (MEMS) and sensors across global markets, today announced the creation of a new TSensors division headed by TSensors Summit, Inc.

Growing in maturity, the MEMS industry is getting its second wind

Tue, 5 May 2015
In 2014, the MEMS sector represented an $11.1B business for Si-based devices. According to Yole Développement (Yole) latest MEMS report “Status of the MEMS Industry”, the MEMS industry is preparing to exceed $20B by 2020.

Technology for tomorrow’s market opportunities and challenges at LetiDays Grenoble

Fri, 5 May 2015
The 17th annual LetiDays Grenoble on June 24-25 will expand the conversation with presentations about Internet of Things-augmented mobility, which is revolutionizing the way we interact with appliances, infrastructure and countless common objects that are part of our daily lives.

MEMS suppliers ride automotive safety wave

Tue, 6 Jun 2015
Suppliers of MEMS-based devices rode a safety sensing wave in 2014 to reach record turnover in automotive applications, according to analysis from IHS.

MIPT physicists develop ultrasensitive nanomechanical biosensor

Wed, 6 Jun 2015
t can analyze the chemical composition of substances and detect biological objects, such as viral disease markers, which appear when the immune system responds to incurable or hard-to-cure diseases, including HIV, hepatitis, herpes, and many others.

Leti Workshop on June 26 to cover latest R&D successes in innovative memory technologies

Wed, 6 Jun 2015
CEA-Leti is hosting its seventh workshop on innovative memory technologies following the 17th annual LetiDays Grenoble, June 24-25, on the Minatec campus.

ASCENT project offers unparalleled access to European nanoelectronics infrastructure

Thu, 6 Jun 2015
Europe’s leading nanoelectronics institutes, Tyndall National Institute in Ireland, CEA-Leti in France and imec in Belgium, have entered a €4.7 million collaborative open-access project called ASCENT (Access to European Nanoelectronics Network).

MEMSIC's SmartSensing tech delivers highest performance in inertial measurement systems

Thu, 6 Jun 2015
MEMSIC announced the launch of its latest addition, the INS380, to its portfolio of Inertial Systems enabled with SmartSensing technology targeted to a broad range of precision motion sensing applications.

Fairchild launches MEMS product line

Tue, 6 Jun 2015
Fairchild, a supplier of high-performance semiconductor solutions, today launched the FIS1100 6-axis MEMS Inertial Measurement Unit (IMU), the company’s first MEMS product stemming from its strategic investments in MEMS and motion tracking.

Researchers grind nanotubes to get nanoribbons

Mon, 6 Jun 2015
A simple way to turn carbon nanotubes into valuable graphene nanoribbons may be to grind them, according to research led by Rice University.

World's thinnest lightbulb -- graphene gets bright

Mon, 6 Jun 2015
A team of scientists from Columbia, Seoul National University (SNU), and Korea Research Institute of Standards and Science (KRISS) reported today that they have demonstrated -- for the first time -- an on-chip visible light source using graphene, an atomically thin and perfectly crystalline form of carbon, as a filament.

A KAIST research team develops the first flexible phase-change random access memory

Mon, 6 Jun 2015
Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics.

SEMI Reports Second Quarter 2015 Worldwide Semiconductor Equipment Figures

Tue, 9 Sep 2015
SEMI reported that worldwide semiconductor manufacturing equipment billings reached US$9.4 billion in the second quarter of 2015.

Renesas Electronics announces Synergy Platform for IoT

Mon, 6 Jun 2015
Renesas Electronics, a supplier of advanced semiconductor solutions, today announced the Renesas Synergy Platform.

Plasma-Therm presents workshop at China University

Tue, 6 Jun 2015
Plasma-Therm recently presented an advanced plasma processing workshop at Xidian University in Xi’an, China that was attended by researchers, students and industry representatives and featured a day-long series of presentations about plasma processing.

Bosch selects Rudolph for semiconductor inspection solutions

Mon, 6 Jun 2015
Rudolph Technologies, Inc. announced today that the MEMS company, Robert Bosch GmbH, has selected Rudolph to supply several different configurations of its F30 Inspection System for various steps in the front- and back-end fabrication processes of micro electrical mechanical systems (MEMS) devices.

MEMS applications take the stage in the first edition of the European MEMS Summit

Mon, 6 Jun 2015
The first edition of this Summit will take place on September 17-18, 2015 in Milan, Italy and its theme will be “Sensing the Planet, MEMS for Life.”

imec and Holst Centre present a gas sensing platform for intuitive IoT applications

Tue, 6 Jun 2015
Imec and Holst Centre have developed a small NO2 sensor featuring a low power consumption in the mW range.

Toward tiny, solar-powered sensors

Wed, 6 Jun 2015
Last week, at the Symposia on VLSI Technology and Circuits, MIT researchers presented a new power converter chip that can harvest more than 80 percent of the energy trickling into it, even at the extremely low power levels characteristic of tiny solar cells.

MEMS foundry X-FAB selects ClassOne Solstice for electroplating

Wed, 7 Jul 2015
Semiconductor equipment manufacturer ClassOne Technology announced that X-FAB — recently named “MEMS Foundry of the Year” — has just purchased a new Solstice S8 Electroplating System.

Ambiq Micro appoints Mike Noonen as interim CEO

Wed, 7 Jul 2015
Ambiq Micro, a developer of ultra-low power integrated circuits for power-sensitive applications, today announced the appointment Mike Noonen as interim Chief Executive Officer with immediate effect.

Graphene-based film can be used for efficient cooling of electronics

Fri, 7 Jul 2015
Researchers at Chalmers University of Technology have developed a method for efficiently cooling electronics using graphene-based film.

Wearable systems give major boost to total IoT sales in 2015

Thu, 7 Jul 2015
Market revenues associated with network communications, sensing, and control functions in subsystems and objects attached to the Internet of Things (IoT) are forecast to grow 29% in 2015 to $62.4 billion after increasing 21% in 2014 to about $48.4 billion.

MEMS Industry Group Conference Asia explores MEMS and sensors opportunities in global IoT

Tue, 8 Aug 2015
MEMS Industry Group (MIG) will gather the world’s leading providers of micro-electromechanical systems (MEMS) and sensors technology for its second annual MEMS Industry Group Conference Asia in Shanghai, China on September 8-11, 2015.

Flexible dielectric polymer can stand the heat

Fri, 8 Aug 2015
Easily manufactured, low cost, lightweight, flexible dielectric polymers that can operate at high temperatures may be the solution to energy storage and power conversion in electric vehicles and other high temperature applications, according to a team of Penn State engineers.

Challenges for MEMS, sensors, and semiconductors

Tue, 8 Aug 2015
Leading industry experts participated in the joint SEMI-MEMS Industry Group (MIG) workshop during SEMICON West 2015 to discuss industry challenges – and potential solutions and collaborative approaches – in the MEMS, sensors and semiconductor industries.

SUSS MicroTec announces new competence-center for nanoimprint in North America

Tue, 8 Aug 2015
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, and the Singh Center for Nanotechnology at the University of Pennsylvania (Penn) are announcing a cooperation agreement in the field of nanoimprint technologies.

MEMS Executive Congress US 2015 examines commercial forces driving MEMS & sensors to $20B by 2020

Tue, 8 Aug 2015
MEMS Industry Group (MIG)'s next MEMS Executive Congress US 2015 will explore the market drivers behind the double-digit growth propelling MEMS and sensors to more than $20+ billion by 2020.

EV Group organizes Photonics Workshop in conjunction with MNE Conference

Tue, 8 Aug 2015
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, will host a special session at the 41st Micro and Nano Engineering (MNE 2015) conference.

What to expect from the European MEMS Summit Conference

Tue, 8 Aug 2015
As Bosch, InvenSense and STMicroelectronics continue to go head-to-head in an attempt to capture the biggest shares of the growing MEMS market, SEMI has announced that it will bring these MEMS giants together in an unprecedented European conference & exhibition to discuss the future of MEMS and Sensors.

These microscopic fish are 3-D-printed to do more than swim

Wed, 8 Aug 2015
These proof-of-concept synthetic microfish will inspire a new generation of "smart" microrobots that have diverse capabilities such as detoxification, sensing and directed drug delivery, researchers said.

Three markets will drive the wearable industry

Fri, 8 Aug 2015
Yole’s analysts explain wearable is, without doubts, a promising industry. But, who will take benefit of this attracting market, growing from US$22 billion in 2015 to more than US$ 90 billion by 2020?

BeSpoon's position-tracking system captures and displays real-time data to improve sports teams' performance

Mon, 8 Aug 2015
BeSpoon SAS today launched BeSpoon Sport Edition, an ultra-precise position-tracking system that allows teams to measure and analyze player movement in three dimensions and provide immediate feedback to improve performance.

Knowm first to deliver memristors capable of bi-directional learning

Wed, 9 Sep 2015
Milestone confirmed by groundbreaking new data; bi-directional incremental capability allows startup to leapfrog IBM and other established competitors in emerging computing fields.

The future of MEMS in the IoT

Thu, 9 Sep 2015
SEMI’s European MEMS Summit will be held on 17-18 September 2015 in Milan, Italy. Over the course of the two-day event, more than 20 keynote and invited speakers from the entire supply chain will share their perspectives and latest updates, including participation by European MEMS leaders. In addition, a focused industry exhibition will complement the conferences offering with additional networking opportunities.

Qualcomm Acquires Capsule Technologie

Mon, 9 Sep 2015
Qualcomm Incorporated today announced that its subsidiary, Qualcomm Life, Inc., has acquired Capsule Technologie.

OEM Group Announces New Cintillio-S (TM) Automated Batch Wet Chemical Processing System

Mon, 9 Sep 2015
Global semiconductor capital equipment manufacturer OEM Group announced today that it has launched its new Cintillio-S (TM) automated batch wet chemical processing system.

IBM Launches Internet of Things and Education Business Units

Mon, 9 Sep 2015
IBM announced two new business units that will apply the company's considerable knowledge in Big Data, advanced analytics and cognitive computing to the Internet of Things (IOT) and Educations markets.

2015 International Conference on Planarization/CMP Technology (ICPT 2015)

Wed, 9 Sep 2015
September 30 - October 2, 2015, Wild Horse Pass Hotel & Casino, Chandler, AZ, USA. ICPT 2015 provides the largest forum for academic researchers, industrial practitioners and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies.

Radiant introduces the ProMetric (R) I29 ultra high-resolution imaging colorimeter

Wed, 9 Sep 2015
Radiant Vision Systems announced the release of the ProMetric (R) I29, an ultra high-resolution imaging colorimeter developed for high-volume display and consumer electronics manufacturers.

Leti demos MEMS fabrication on its 300mm line, pointing the way to lower manufacturing costs

Thu, 9 Sep 2015
CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.

Europe's secondary industry in the spotlight

Tue, 9 Sep 2015
The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

Can the development of the electronic sector help plan the future of the photovoltaic industry?

Wed, 9 Sep 2015
The current photovoltaic industry seems to have a lot of similarities with development of the electronic sector. This analysis investigates some lessons the industry can learn.

ULVAC launches dry vacuum pump accessory ECO-SHOCK ES4A

Fri, 9 Sep 2015
ULVAC, Inc. announced that it has recently developed and started selling the ECO-SHOCK ES4A, a power saving accessory for dry vacuum pumps that can reduce power consumption.

Tektronix expands DPO70000SX ATI high performance oscilloscope family

Mon, 9 Sep 2015
Tektronix, Inc. today announced the expansion of its DPO70000SX Performance Oscilloscope Series to include 50 GHz and 23 GHz models.

Rudolph acquires inspection technology of Stella Alliance, LLC

Tue, 9 Sep 2015
Acquired patents to enhance Rudolph’s inspection capabilities in advanced packaging and extend inspection into new applications

eBeam Initiative survey shows rising optimism in EUV lithography, multi-beam technology for photomask production

Tue, 9 Sep 2015
The eBeam Initiative announced the completion of its fourth annual eBeam Initiative members' perceptions survey.

IBM research eyes post-silicon future with carbon nanotube electronics

Thu, 10 Oct 2015
IBM Research announced an engineering breakthrough that could accelerate carbon nanotubes replacing silicon transistors to power future computing technologies.

Monolithic 3D - Game-Changing 2.0 at IEEE S3S

Mon, 10 Oct 2015
The path to alternative scaling is now open.

Altatech adds new high-speed inspection system dedicated to ultra-thin substrates for 3D applications

Mon, 10 Oct 2015
Altatech announced the expansion of its Eclipse series with a new, high-speed inspection system dedicated to ultra-thin, transparent and bonded substrates inspection for 3D applications in power, MEMS, and mobile technologies.

SEMI announces FlexTech Alliance as first Strategic Association Partner

Wed, 10 Oct 2015
SEMI announced today that FlexTech Alliance has become the first SEMI Strategic (Association) Partner.

Japan well positioned to support IoT and the industry

Tue, 10 Oct 2015
Japan has long played a critical role in semiconductor manufacturing and accounts for the largest portion of the global total installed fab capacity in 2015 according to the SEMI Fab database.

VeriSilicon to acquire Vivante Corporation

Tue, 10 Oct 2015
VeriSilicon Holdings Co., Ltd. and Vivante Corporation announced a definitive merger agreement.

Automotive MEMS sensors market to grow 6% from 2015-2020, P&S Market Research

Thu, 10 Oct 2015
The global automotive MEMS sensor market was valued at $2,600.5 million in 2014, and it is expected to grow at a CAGR of 6.0%, during the period 2015-2020.

Silver: The promising electrode winner for low-cost perovskite solar cells

Fri, 10 Oct 2015
A study published in Advanced Materials Interfaces by the Energy Materials and Surface Sciences Unit at the Okinawa Institute of Science and Technology Graduate University (OIST) reveals a cause for the short lifetime of perovskite solar cells with silver electrodes.

Applied Materials and A*STAR announce new R&D joint lab in Singapore for advanced semiconductor technology

Mon, 10 Oct 2015
Applied Materials, Inc. announced it plans to establish a new R&D laboratory in Singapore in collaboration with the Agency for Science, Technology and Research (A*STAR).

Next-generation perovskite solar cells made stable by metal oxide "sandwich"

Mon, 10 Oct 2015
New solar cell construction extends the cell's effective life in air by more than 10 times, with only a marginal loss of efficiency converting sunlight to electricity.

Evonik and SCREEN FT enter strategic partnership to promote iXsenic technology

Mon, 10 Oct 2015
German chemical company Evonik Industries AG and Japanese FPD production equipment manufacturer SCREEN Finetech Solutions Co., Ltd. have signed a contract for a strategic partnership.

Historic era of consolidation for chip makers

Mon, 10 Oct 2015
We are in a historic era for consolidation among semiconductor manufacturers, and the reasons are surprising.

Sitri launches in Silicon Valley to accelerate innovation in “More than Moore” and IoT technologies

Tue, 10 Oct 2015
SITRI announced the opening of SITRI Innovations in Belmont, California during a recent event attended by many of Silicon Valley's leading investors, technologists, entrepreneurs, and incubators.

Stanford engineers create artificial skin that can send pressure sensation to brain cell

Tue, 10 Oct 2015
Stanford engineers have created a plastic "skin" that can detect how hard it is being pressed and generate an electric signal to deliver this sensory input directly to a living brain cell.

Western Digital announces acquisition of SanDisk

Wed, 10 Oct 2015
Western Digital Corporation and SanDisk Corporation today announced that they have entered into a definitive agreement where Western Digital will purchase SanDisk.

Lam Research to acquire KLA-Tencor

Wed, 10 Oct 2015
Lam Research Corporation (LRCX) and KLA-Tencor Corporation (KLAC) announced that they have entered into a definitive agreement for Lam Research to acquire all outstanding KLA-Tencor shares in a cash and stock transaction.

North American semiconductor equipment industry posts September 2015 book-to-bill ratio of 1.07

Fri, 10 Oct 2015
North America-based manufacturers of semiconductor equipment posted $1.60 billion in orders worldwide in September 2015 (three-month average basis) and a book-to-bill ratio of 1.07.

Manipulating wrinkles could lead to graphene semiconductors

Mon, 10 Oct 2015
RIKEN scientists have discovered that wrinkles in graphene can restrict the motion of electrons to one dimension, forming a junction-like structure that changes from zero-gap conductor to semiconductor back to zero-gap conductor.

Brewer Science and Arkema announce partnership to bring high-performance material to semiconductor market

Tue, 10 Oct 2015
Brewer Science, Inc., and Arkema announced a partnership to produce high-quality directed self-assembly (DSA) materials for use in semiconductor manufacturing.

IDT to Acquire ZMDI for $310 Million

Tue, 10 Oct 2015
Integrated Device Technology, Inc. announced an agreement to acquire privately held ZMDI for total consideration of $310M in cash.

mCube unveils the world's smallest 1x1mm accelerometer

Tue, 10 Oct 2015
mCube announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size.

Soraa announces LED manufacturing expansion in Syracuse, NY

Fri, 10 Oct 2015
Soraa announced that it will open a new semiconductor fabrication plant in Syracuse, New York.

InvenSense announces UltraPrint mass-manufacturable ultrasound fingerprint touch sensor solution

Wed, 10 Oct 2015
InvenSense announced it has released for OEM review UltraPrint, its ultrasonic fingerprint imaging solution, manufactured on the proprietary InvenSense CMOS-MEMS Platform (ICMP).

Reports: TI, STMicro to add to semiconductor acquisitions spree

Fri, 10 Oct 2015
Texas Instruments (Maxim Integrated) and STMicro (Fairchild) may be considering large acquisitions.

Ziptronix and Fraunhofer collaborate on low-cost 3D integration solutions

Fri, 10 Oct 2015
Ziptronix, Inc. announced it has entered into a development agreement with Fraunhofer IZM-ASSID.

X-FAB announces investments to further expand X-FAB Sarawak capacity

Mon, 11 Nov 2015
X-FAB Silicon Foundries announced it will expand the capacity and capabilities of its Kuching-based foundry operation, X-FAB Sarawak Sdn. Bhd., to meet accelerating demand for its core technologies.

China's Tsinghua Unigroup invests in Taiwan's Powertech

Tue, 11 Nov 2015
Tsinghua Unigroup Ltd., a Chinese government-owned chipmaker will make a $600 million investment in Powertech Technology of Taiwan, according to multiple reports.

DCG Systems addresses localization of electrical shorts with EBIRCH technology

Tue, 11 Nov 2015
DCG Systems announced the release of EBIRCH, a technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits.

Global semiconductor sales increase 1.5 percent in third quarter

Tue, 11 Nov 2015
SIA announced worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015, an increase of 1.5 percent compared to the previous quarter.

New Helios G4 Series DualBeam from FEI sets new standards

Tue, 11 Nov 2015
FEI announced the Helios G4 DualBeam series, which offers the highest throughput ultra-thin TEM lamella preparation for leading-edge semiconductor manufacturing and failure analysis applications.

FEI announces agreement to acquire DCG Systems

Tue, 11 Nov 2015
FEI Company and DCG Systems, Inc. announced an agreement where FEI willacquire DCG for $160 million in an all cash transaction.

China to dominate flat panel display manufacturing by 2018, IHS

Thu, 11 Nov 2015
China is quickly adding capacity in all flat-panel display (FPD) manufacturing segments.

GLOBALFOUNDRIES achieves 14nm finFET technology success for next-generation AMD products

Fri, 11 Nov 2015
GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD products using its most advanced 14nm FinFET process technology.

Advance could bring commercial applications for silver nanowires

Tue, 11 Nov 2015
New research suggests wrapping silver nanowires with an ultrathin layer of graphene protects the structures from damage and could represent a key to realizing their commercial potential.

Shipments of residential Internet of Things devices expected to total over $330 billion through 2025

Tue, 11 Nov 2015
A recent report from Navigant Research suggests the global market for residential IoT devices will grow strongly through 2025.

Analog market to reach $56.5B in 2020

Wed, 11 Nov 2015
The world electronics market will consume over 121 billion analog ICs in 2015 and grow to over $56 billion by 2020.

Gartner: 6.4B connected "Things" in use in 2016

Wed, 11 Nov 2015
Gartner, Inc. forecasts that 6.4 billion connected things will be in use worldwide in 2016, up 30 percent from 2015, and will reach 20.8 billion by 2020.

GLOBALFOUNDRIES launches high-performance ASIC offering on 14nm FinFET process technology

Wed, 11 Nov 2015
GLOBALFOUNDRIES today announced the availability of FX-14, an ASIC offering built on the company's next-generation 14nm FinFET process technology.

Security by design

Fri, 11 Nov 2015
The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.

Bosch Sensortec CEO recognized with Lifetime Achievement Award

Fri, 11 Nov 2015
Bosch Sensortec announced that its CEO, Dr. Stefan Finkbeiner, has been chosen by the MEMS & Sensors Industry Group to receive its prestigious MEMS/Sensors Lifetime Achievement Award.

Wafer bonding for high performance MEMS, power devices, and RF components

Tue, 11 Nov 2015
Recent trends and future directions for wafer bonding are reviewed, with a focus on MEMS.

What lies beneath? 50 years of enabling Moore’s Law

Tue, 11 Nov 2015
Vacuum technology trends can be seen over the period of innovation defined by Moore’s Law, particularly in the areas of increasing shaft speed, management of pumping power, and the use computer modeling.

Europe’s secondary industry in the spotlight

Tue, 11 Nov 2015
The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

Highlights from Day 1 of IDTechEx Printed Electronics USA 2015

Thu, 11 Nov 2015
IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with eight co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

Trillium announces acquisition of Oxford Instruments - Austin Division

Tue, 11 Nov 2015
Trillium US Inc, headquartered in Clackamas, OR, has announced the acquisition of the Oxford Instruments - Austin division.

The inertial MEMS device market keeps on growing. What's next?

Mon, 11 Nov 2015
Gyroscope and accelerometer production volumes are also growing, with the following CAGR: 7.9% and 1.6% respectively over the same period. Every sector will keep growing. So, what’s next?

SITRI and Bosch announce IoT technology collaboration

Wed, 12 Dec 2015
The agreement covers IoT applications such as smart home, wearable devices, smart city, Industry 4.0 and robotics.

Measuring nanoscale features with fractions of light

Fri, 12 Dec 2015
National Institute of Standards and Technology (NIST) researchers are seeing the light, but in an altogether different way. And how they are doing it just might be the semiconductor industry's ticket for extending its use of optical microscopes to measure computer chip features that are approaching 10 nanometers, tiny fractions of the wavelength of light.

imec, Coventor expand project on 7nm semiconductor manufacturing process

Mon, 12 Dec 2015
Kicking off IEDM, imec and Coventor are expanding their existing joint development project to explore process variation issues in 7nm chip technology.

New approaches for hybrid solar cells

Thu, 12 Dec 2015
Using a new procedure researchers at the Technical University of Munich (TUM) and the Ludwig Maximillians University of Munich (LMU) can now produce extremely thin and robust, yet highly porous semiconductor layers. A very promising material - for small, light-weight, flexible solar cells, for example, or electrodes improving the performance of rechargeable batteries.

Engineers invent a bubble-pen to write with nanoparticles

Thu, 1 Jan 2016
Researchers at the Cockrell School of Engineering at The University of Texas at Austin have developed a device and technique, called bubble-pen lithography, that can gently and effectively handle nanoparticles.

Vesper collaborates with GLOBALFOUNDRIES to deliver first piezoelectric MEMS microphones

Wed, 1 Jan 2016
Acoustic sensing company works with top foundry to support mass-market consumer products.

Technavio: Top two emerging trends impacting the global MEMS microphone market through 2020

Fri, 1 Jan 2016
According to the report, the global MEMS microphone market is expected to reach close to USD 2 billion by 2020, posting a CAGR of over 12%.

Led by iPhone 6S, sensor hubs market is growing fast

Mon, 1 Jan 2016
The demand for sensor hubs, dedicated processing elements used for low-power sensor processing tasks, is booming.

Apple products are driving market growth for MEMS microphones

Wed, 2 Feb 2016
The popularity of Apple’s iPhone 6S and other products is boosting the microelectromechanical-systems (MEMS) microphones market to a compound annual growth rate (CAGR) of 11 percent from 2015 to 2019.

Advance could aid development of nanoscale biosensors

Thu, 2 Feb 2016
Researchers from Brown University's School of Engineering have made an important fundamental advance that could make such devices more practical.

Vesper partners with AAC Technologies on piezoelectric MEMS microphones

Mon, 2 Feb 2016
Vesper today announced a partnership with AAC Technologies Holdings Inc. for the commercialization of the world’s first piezoelectric MEMS microphones for consumer electronic devices.

imec and iMinds to merge and create high-tech research center

Mon, 2 Feb 2016
Nanoelectronics research center, imec, and digital research and incubation center, iMinds, announced that its respective board of directors have approved the intention to merge the research centers.

New NTU microchip shrinks radar cameras to fit into a palm

Tue, 2 Feb 2016
NTU's new radar chip was presented and published at the prestigious International Solid-State Circuits Conference (ISSCC) 2016.

EV Group brings 300mm wafer bonding to MEMS manufacturing with GEMINI Automated Wafer

Mon, 3 Mar 2016
EV Group (EVG) today announced that its EVG GEMINI 300mm automated wafer bonding system is ready for implementation into MEMS high-volume manufacturing.

IoT Planet to co-locate with SEMICON Europa in 2016

Wed, 3 Mar 2016
IoT Planet, a new European event dedicated to the Internet of Things (IoT), will co-locate this year with SEMICON Europa (25-27 October) in Grenoble, France.

Imec opens new 300mm cleanroom for 7nm and beyond chip scaling

Fri, 3 Mar 2016
Nanoelectronics research center imec has today announced the opening of its new 300mm cleanroom.

Semiconductor IP market worth $7.01B by 2022

Wed, 3 Mar 2016
The semiconductor IP market is expected to reach $7.01 billion USD by 2022 from USD 3.09 Billion in 2015, at a CAGR of 10.55% between 2016 and 2022, according to the newly released report from MarketsandMarkets.

SITRI, CEA-Leti and MINATEC to cooperate in "More than Moore" technology development

Thu, 3 Mar 2016
SITRI and CEA-Leti, in affiliation with MINATEC, this week announced the signing of a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies to power the emerging Internet of Things (IoT) market.

Entrepreneurs to compete in MEMS Shark Tank at Hilton Head 2016

Thu, 3 Mar 2016
Teams vie for expert consulting services, MEMS foundry package, specialized software tools, industry group membership.

A new virtuous cycle for the MEMS industry

Thu, 3 Mar 2016
Since 2000, we have entered the age of sensing and interacting with the wide diffusion of MEMS and sensors that give us a better, safer perception of our environment. MEMS have grown in volume to be almost a 15 billion units market today.

Heat and light get larger at the nanoscale

Fri, 4 Apr 2016
In a new study recently published in Nature Nanotechnology, researchers from Columbia Engineering, Cornell, and Stanford have demonstrated heat transfer can be made 100 times stronger than has been predicted, simply by bringing two objects extremely close--at nanoscale distances--without touching.

STMicroelectronics accelerates STM8 sales past two billion units

Tue, 4 Apr 2016
STMicroelectronics has surpassed two billion unit sales of its robust and versatile STM8 microcontrollers, less than two years after reaching one billion unit sales, noting particularly strong success in China.

New nanodevice shifts light's color at single-photon level

Mon, 4 Apr 2016
Scientists at the National Institute of Standards and Technology (NIST) have now developed a miniaturized version of a frequency converter, using technology similar to that used to make computer chips.

Many mixes to match litho apps

Fri, 4 Apr 2016
The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?

Imec, Holst Centre and Barco Silex collaborate on data security for wearables and IoT networks

Wed, 5 May 2016
Nanoelectronics research center imec, Holst Centre (set up by imec and TNO) and micro-electronic design house Barco Silex, belonging to the Barco group, today announced that they will collaborate to implement data security into sensors for wearable devices and Internet of Things (IoT) sensor networks.

MEMS technology is contributing to the inkjet printing industry revolution

Wed, 5 May 2016
With a market reaching US$ 1 billion in 2021, the MEMS printhead is one of the most mature MEMS devices.

Cadence next-generation Virtuoso platform deployed by STMicroelectronics for SmartPower Technologies

Thu, 6 Jun 2016
Cadence Design Systems, Inc. today announced that STMicroelectronics has qualified and actively deployed the next-generation Cadence Virtuoso platform for its SmartPower technologies.

ams acquires CCMOSS

Thu, 6 Jun 2016
ams, a manufacturer of high performance sensor and analog solutions, has signed an agreement to acquire 100% of the shares in Cambridge CMOS Sensors Ltd (CCMOSS), a developer of micro hotplate structures for gas sensing and infrared applications, in an all-cash transaction.

EV Group scores fourth consecutive triple crown win in annual VLSIresearch customer satisfaction survey

Tue, 6 Jun 2016
EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey.

Brite Semiconductor and Semitech Semiconductor collaborate on industrial M2M SoC

Fri, 6 Jun 2016
This SoC is designed to support M2M communication in the global industrial and energy transmission market via PLC/wireless modes.

SMIC acquires LFoundry

Mon, 6 Jun 2016
Semiconductor Manufacturing International Corporation jointly announces with LFoundry Europe GmbH and Marsica Innovation S.p.A., the signing of an agreement on June 24, 2016 to purchase a 70% stake of LFoundry for a consideration of 49 million EUR.

Building a smart cardiac patch

Mon, 6 Jun 2016
'Bionic' cardiac patch could one day monitor and respond to cardiac problems.

HITRS roadmap aims to integrate photonic devices in SiP

Wed, 6 Jun 2016
A new roadmap, the Heterogeneous Integration Technology Roadmap for Semiconductors (HITRS), aims to integrate fast optical communication made possible with photonic devices.

EV Group expands high-vacuum wafer bonding capabilities of EVG ComBond platform

Wed, 7 Jul 2016
EV Group (EVG) today introduced new capabilities on the EVG ComBond automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices

Unisem ships 1 billion packaged MEMS devices

Tue, 7 Jul 2016
Unisem reported it recently shipped its one billionth packaged MEMS device and continues to invest capex in both MEMS assembly equipment and the development of additional factory floor space for this expanding market.

Research team led by NUS scientists develop plastic flexible magnetic memory device

Wed, 7 Jul 2016
Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance.

Automotive MEMS sensor unit-shipments rose in 2015, even as revenue stalled

Thu, 7 Jul 2016
Although shipments of microelectromechanical systems (MEMS) sensors used in automotive applications grew 8.4 percent in 2015, revenues were flat compared to the previous year, reaching $2.7 billion.

Sensor sales keep hitting new records but price erosion curbs growth

Fri, 7 Jul 2016
Double-digit unit shipment increases continue with demand being strong for low-cost sensors in wearable systems, Internet of Things, and automated embedded control.

Why are some MEMS devices successful while others are not?

Thu, 7 Jul 2016
Beyond its gloom, the MEMS industry is showing numerous emerging devices that hold promise for future growth.

Busch to open a new service center in Austin, Texas

Thu, 7 Jul 2016
Busch, LLC this week announced plans to build a new 44,000 sq. ft. building in Austin, Texas.

STMicroelectronics acquires ams' NFC and RFID reader assets

Fri, 7 Jul 2016
STMicroelectronics today announced that it has acquired ams' assets related to NFC1 and RFID2 reader business

STMicroelectronics earns MEMS Manufacturer of the Year Award

Mon, 8 Aug 2016
STMicroelectronics has been named the MEMS Manufacturer of the Year at the MEMS World Summit, the MEMS Manufacturing Conference gathering the top executives in the Worldwide MEMS Manufacturing Industry.

Top MEMS sensor suppliers of 2015

Tue, 8 Aug 2016
Micro-electrical mechanical systems (MEMS) sensor revenue declined by 3.4% in 2015 with slow growth expected to start from 2017. While microphones and other MEMS categories grew, other categories declined -- most notably, motion sensors.

ams launches the industry's smallest module to offer color, ambient light and proximity sensing

Tue, 8 Aug 2016
ams AG has launched the smallest ever optical sensor module that delivers a combination of colour (RGB), ambient light and proximity sensing, providing OEMs with design flexibility and the ability to provide a better display viewing experience.

Samco opens new office in Malaysia

Thu, 8 Aug 2016
Samco, a semiconductor process equipment developer and manufacturer based in Japan, announced that it will open its Malaysia branch office on Aug. 10, 2016 in Petaling Jaya, a suburb of Kuala Lumpur.

ON Semiconductor joins Automotive Equipment Supplier Association

Fri, 8 Aug 2016
ON Semiconductor (Nasdaq: ON) this week announced that it is joining the Original Equipment Suppliers Association.

MEMS & Sensors Industry Group Conference Asia explores MEMS, sensors in IoT of today and tomorrow

Mon, 8 Aug 2016
MEMS & Sensors Industry Group (MSIG) will hold its third annual MEMS & Sensors Industry Group Conference Asia in Shanghai, China on September 13-14, 2016.

imec orders etch and deposition systems from Plasma-Therm

Fri, 8 Aug 2016
A major research institution has placed orders for two Advanced Vacuum plasma processing systems that will provide etch and deposition capabilities to be used in nanoelectronics research and development.

Full program for SEMI European MEMS Summit announced

Wed, 8 Aug 2016
Leading companies will present the latest and most impactful trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September, 2016.

S. Korean University employs Advanced Vacuum plasma systems in nanotechnology research

Wed, 8 Aug 2016
A leading South Korean research university has successfully integrated two Advanced Vacuum plasma processing systems from Plasma-Therm into its nanotechnology fabrication lab, which supports multiple users engaged in wide-ranging nanotechnology research.

Global MEMS market to grow at a CAGR of close to 12% until 2020

Fri, 8 Aug 2016
According to the latest market study released by Technavio, the global micro-electro-mechanical-systems (MEMS) market is expected to reach USD 20.26 billion by 2020, growing at a CAGR of nearly 12%.

Thinner wafers are fostering the growth and emergence of new dicing technologies

Tue, 9 Sep 2016
Driven by rising demand for thinner wafers and stronger die, dicing technology is evolving.

Memory for future wearable electronics

Fri, 9 Sep 2016
Stretchable, flexible, reliable memory device inspired by the brain.

SEMI European MEMS Summit brings industry leaders to Stuttgart

Tue, 9 Sep 2016
Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016.

IC Insights updates semiconductor outlook for Internet of Things

Wed, 9 Sep 2016
Lower sales projections for connected cities leads to reduced semiconductor IoT market forecast.

High-volume processes for next-generation biotechnology devices

Mon, 9 Sep 2016
Over the past several decades, miniaturization has significantly improved clinical diagnostics, pharmaceutical research and analytical chemistry. Modern biotechnology devices— such as biosensors, fully integrated systems for diagnostics, cell-analysis or drug discovery—are often chip-based and rely on close interaction of biological substances at the micro- and nanoscale. Thus, process technologies that enable the production of surface patterns and integration of fluidic components with small feature sizes are needed.

Solid State Technology announces expanded conference for The ConFab 2017

Wed, 9 Sep 2016
The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

Leti orders HERCULES NIL system from EV Group for joint nanoimprint lithography program

Wed, 9 Sep 2016
EV Group (EVG) and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES NIL track system from EV Group.

Synopsys and TSMC collaborate to certify Custom Compiler for 16FFC process

Thu, 9 Sep 2016
Synopsys, Inc. today announced a collaboration with TSMC to complete the certification for its 16-nanometer (nm) FinFET Compact (16FFC) process for a suite of Synopsys' digital, custom and signoff tools from the Galaxy Design Platform.

EV Group extends volume manufacturing expertise to biotech and medical applications

Mon, 9 Sep 2016
EV Group today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market.

MEMS & Sensors Industry Group highlights near-term and future connected tech at annual Executive Conference

Mon, 9 Sep 2016
MEMS & Sensors Industry Group (MSIG) today announced highlights of its twelfth annual business conference, MEMS & Sensors Executive Congress 2016 in Scottsdale, AZ on November 9-11, 2016.

Process Watch: Salami slicing your yield

Mon, 9 Sep 2016
The Process Watch series explores key concepts about process control -- defect inspection and metrology -- for the semiconductor industry. This new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing.

SiTime introduces high-precision MEMS oscillators

Tue, 9 Sep 2016
SiTime Corporation today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators.

imec and Holst Centre present the world's most energy-efficient biomedical sensor hub

Tue, 10 Oct 2016
imec and Holst Centre (established by imec and TNO), today announced a new sensor hub integrated as a system-on-chip (SoC) intended for a broad range of wearable health devices and applications.

Silicon Labs acquires leading RTOS company Micrium

Mon, 10 Oct 2016
Silicon Labs today announced the acquisition of Micrium, a supplier of real-time operating system (RTOS) software for the Internet of Things (IoT).

New sensor material could enable more sensitive readings of biological signals

Fri, 10 Oct 2016
Scientists have created a material that could make reading biological signals, from heartbeats to brainwaves, much more sensitive.

First demonstration of brain-inspired device to power artificial systems

Fri, 10 Oct 2016
New research, led by the University of Southampton, has demonstrated that a nanoscale device, called a memristor, could be used to power artificial systems that can mimic the human brain.

MEMS & Sensors Industry Group reveals Tech Showcase finalists

Tue, 10 Oct 2016
MSIG today announced the shortlist of finalists who will compete for the title of winner at this year's event.

New perovskite solar cell design could outperform existing commercial technologies

Fri, 10 Oct 2016
Stanford, Oxford team creates high-efficiency tandem cells.

Revenue growth sounding strong for suppliers of packaged MEMS microphones

Fri, 10 Oct 2016
Knowles, Goertek and AAC ranked as the top three global suppliers of packaged MEMS microphones for 2015.

Next-generation smartphone battery inspired by the gut

Wed, 10 Oct 2016
Researchers have developed a prototype of a next-generation lithium-sulphur battery which takes its inspiration in part from the cells lining the human intestine. The batteries, if commercially developed, would have five times the energy density of the lithium-ion batteries used in smartphones and other electronics.

When it comes to atomic-scale manufacturing, less really is more

Fri, 10 Oct 2016
Electrical currents can be now be switched on and off at the smallest conceivable scale enabling a new generation of 'green electronics' with the potential for great impact on the digital economy.

Managing particle flows in process exhaust for safety and profitability

Fri, 10 Oct 2016
Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.

A tiny machine

Mon, 10 Oct 2016
UCSB electrical and computer engineers design an infinitesimal computing device.

The gas sensor market is about to change

Wed, 11 Nov 2016
Nowadays, the number of enforceable patents dedicated to miniaturized gas sensors is increasing worldwide, and several companies already stand out by their strong IP position.

WORLD OF IOT grows with 30 new exhibitors at SEMICON Japan

Thu, 11 Nov 2016
Today, SEMI announced that WORLD OF IOT, a show-within-a-show at SEMICON Japan 2016, will expand with the addition of 30 new exhibitors.

Automotive systems forecast to show strongest growth through 2020

Thu, 11 Nov 2016
Newly updated report reviews many of the end-use system applications that are presently impacting and that are forecast to help propel the IC market through 2020.

Analog Devices makes MEMS switch technology a commercial reality

Tue, 11 Nov 2016
Analog Devices, Inc. (ADI) today introduced a breakthrough in switch technology that provides a long-sought replacement for electromechanical relay designs first adopted by the electronics industry more than 100 years ago.

MicroVision and STMicroelectronics to co-market MEMS mirror-based laser beam scanning solutions

Thu, 11 Nov 2016
MicroVision, Inc. and STMicroelectronics today announced that they plan to work together to develop, sell, and market Laser Beam Scanning (LBS) technology.

Fan-in wafer-level packaging market to grow due to high demand for miniaturized electronics

Fri, 11 Nov 2016
According to the latest market study released by Technavio, the global fan-in wafer-level packaging (WLP) market is expected to reach USD 4.75 billion by 2020, growing at a CAGR of almost 10%.

SMIC and IMECAS sign an agreement for MEMS R&D and foundry platform

Tue, 11 Nov 2016
Semiconductor Manufacturing International Corporation and The Institute of Microelectronics of the Chinese Academy of Sciences announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.

Lab4MEMS project recognized with European Innovation Award

Mon, 11 Nov 2016
Project developed pilot line for next-generation MEMS devices.

QuickLogic joins GLOBALFOUNDRIES FDXcelerator Partner Program

Thu, 12 Dec 2016
QuickLogic Corporation, a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

Delivering a power punch

Mon, 12 Dec 2016
Microscale energy storage units for wearable and miniaturized electronic devices are improved using porous materials.

EVG and Korea National NanoFab Center program on novel display coatings delivers outstanding results

Wed, 12 Dec 2016
EV Group and the Korea National NanoFab Center announced preliminary results on improved transparent nanostructured anti-reflective coatings for next-generation displays.

ClassOne reports record sales, crediting WLP and "More than Moore"

Wed, 12 Dec 2016
“We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

Global semiconductor sales increase 5% year-over-year in October

Thu, 12 Dec 2016
The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

State of the art sensors made from graphene and children's toy silly putty

Fri, 12 Dec 2016
World-first graphene innovation could be used for applications in medical devices and diagnostics.

Stamping technique creates tiny circuits with electronic ink

Fri, 12 Dec 2016
New stamping technique creates functional features at nanoscale dimensions.

62 new facilities start operation 2017 and beyond

Mon, 12 Dec 2016
Data from SEMI’s recently updated World Fab Forecast report reveal that 62 new Front End facilities will begin operation between 2017 and 2020.

Advance in intense pulsed light sintering opens door to improved electronics manufacturing

Thu, 12 Dec 2016
Faster production of advanced, flexible electronics is among the potential benefits of a discovery by researchers at Oregon State University's College of Engineering.

A year in review: Top 10 stories of 2016

Fri, 12 Dec 2016
From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

Bosch launches smallest high performance barometric pressure sensor at CES 2017

Wed, 1 Jan 2017
Today, Bosch Sensortec launches the BMP380, the company's smallest and best performing barometric pressure sensor, with a compact size of only 2.0 x 2.0 x 0.75 mm3.

Vesper and DSP Group demo near-zero-power voice-activation for battery-powered devices at CES 2017

Thu, 1 Jan 2017
Vesper, DSP Group and Sensory will demonstrate their new development platform from January 5-8, 2017 during CES 2017.

Microsemi honored as M2M Network Equipment Technology Company of the Year by IoT Breakthrough Awards

Fri, 1 Jan 2017
Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it was named M2M Network Equipment Technology Company of the Year by the inaugural IoT Breakthrough Awards.

Researchers create practical and versatile microscopic optomechanical device

Mon, 1 Jan 2017
Trapping light and mechanical waves within a tiny bullseye, design could enable more sensitive motion detection.

STMicroelectronics incorporates CWS’ SiPEX in the RF PDK H9 SOI FEM

Wed, 1 Jan 2017
Coupling Wave Solutions, S.A. and STMicroelectronics today announced that they partnered together to reduce time-to-market for high-performance radio frequency (RF) silicon-on-insulator (SOI) designs

New low-cost technique converts bulk alloys to oxide nanowires

Fri, 1 Jan 2017
A simple technique for producing oxide nanowires directly from bulk materials could dramatically lower the cost of producing the one-dimensional (1D) nanostructures.

New report from IHS Markit names top four trends driving the IoT in 2017 and beyond

Tue, 1 Jan 2017
Fueled by lightning-fast demand for ubiquitous connectivity, the number of connected Internet of Things (IoT) devices globally will jump by 15 percent year-over-year to 20 billion in 2017, according to new analysis from IHS Markit.

ams announces completion of transaction to acquire Heptagon

Wed, 1 Jan 2017
ams, a worldwide supplier of high-performance sensor and analog solutions, announces the completion of the transaction to acquire 100% of the shares in Heptagon and related capital.

Executive viewpoints: 2017 outlook

Wed, 1 Jan 2017
Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

Do not go where the path may lead

Fri, 1 Jan 2017
What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

imec debuts plastic NFC tag, compatible to ISO protocols

Tue, 2 Feb 2017
Innovative tag is the thinnest and mechanically most robust technology compatible to ISO protocols.

SEMI appoints Ajit Manocha as president and CEO

Tue, 2 Feb 2017
SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Flemish government increases financial support of imec

Tue, 2 Feb 2017
Today, the research and innovation hub in nanoelectronics and digital technology imec, and the Flemish Government announced a new, 5-year strategic commitment that aims at strengthening the pioneering role of Flanders' renowned research hub.

Improved polymer and new assembly method for ultra-conformable 'electronic tattoo' devices

Wed, 2 Feb 2017
Process uses household inkjet printer without soldering to create 750nm-thin elastomeric sheet.

Nano 'sandwich' offers unique properties

Mon, 2 Feb 2017
Rice University researchers simulate two-dimensional hybrids for optoelectronics.

Global MEMS manufacturer selects ULVAC Technologies' plasma ashing system

Wed, 3 Mar 2017
ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

Semiconductor manufacturing's next big thing at ASMC 2017

Thu, 3 Mar 2017
Manufacturers, suppliers and academia gather to understand the road ahead.

Eutelsat, ST announce low-cost, low-power System-on-Chip for interactive satellite terminals

Wed, 3 Mar 2017
ST and Eutelsat complete development of chip for Eutelsat's next-generation SmartLNB.

SEMICON China 2017 opens tomorrow in Shanghai

Mon, 3 Mar 2017
Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

Intel elects two new members to Board of Directors

Thu, 3 Mar 2017
Intel Corporation today announced that Omar Ishrak and Greg Smith have been elected to Intel’s board of directors.

Researchers make flexible glass for tiny medical devices

Fri, 3 Mar 2017
Glass can bend over and over again on a nanoscale.

Imec to honor Samsung's Dr. Kinam Kim with "Lifetime of Innovation Award"

Mon, 3 Mar 2017
The selection recognizes Dr. Kim's leadership and strategic vision, as well as his undeniable impact in the semiconductor industries.

Intel appoints Chief Strategy Officer

Wed, 3 Mar 2017
Intel Corporation today announced the appointment of Aicha S. Evans as chief strategy officer, effective immediately.

Leti marks 50th anniversary with events and workshops in France, Japan, Taiwan, and the U.S.

Thu, 3 Mar 2017
Leti, a research institute of CEA Tech, is marking its 50th anniversary this year during industry events and workshops in Grenoble, Tokyo, and Taipei and at both SEMICON West and IEDM 2017 in San Francisco.

IEEE unveils next lifecycle phase of the IRDS to drive computing industry beyond Moore’s Law

Fri, 3 Mar 2017
Series of nine white papers mark milestone effort for strategic initiative that identifies challenges and solutions to help guide future roadmaps.

Global semiconductor sales up 16.5% year-to-year

Tue, 4 Apr 2017
Year-to-year sales increased by double digits across most regional markets, with the China and Americas markets showing particularly strong growth.

A novel method for the fabrication of active-matrix 3-D pressure sensors

Wed, 4 Apr 2017
A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

Has SOI's turn come around again?

Wed, 12 Dec 2016
Analysts see another chance for Silicon-on-Insulator technology, as proponents claim technical and cost advantages for fully-depleted SOI.

March billings reached levels not seen since March 2001, reports SEMI

Fri, 4 Apr 2017
North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in March 2017, according to the March Equipment Market Data Subscription Billings Report published today by SEMI.

Engineering technique is damaging materials, research reveals

Fri, 4 Apr 2017
Widely used microscopy technique has unintended consequences, new Oxford University research reveals.

Racyics launches 'makeChip' design service platform for GLOBALFOUNDRIES’ 22FDX technology

Fri, 5 May 2017
Racyics GmbH announced today it has launched makeChip, an design service platform, developed using GLOBALFOUNDRIES' 22FDX process technology and supported by Cadence.

EV Group announces milestone: More than 1100 wafer bond chambers installed worldwide

Mon, 5 May 2017
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices and CMOS image sensors.

Sensor/actuator sales take off as price erosion eases

Mon, 5 May 2017
Strong unit growth continues to be driven by the spread of automated embedded controls, wearable systems, and the Internet of Things, says new O-S-D Report.

OEM Group expands P5000 capabilities to compound semiconductor substrates

Thu, 5 May 2017
OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market.

The automotive electronics market: A view from a material supplier

Fri, 6 Jun 2017
With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

ULVAC Technologies opens California office

Tue, 6 Jun 2017
ULVAC Technologies, Inc., a supplier of production systems, instrumentation and vacuum pumps for technology industries, has opened an office in Santa Clara, California.

How SEMI Standard E175 is saving energy and cutting costs

Tue, 6 Jun 2017
Industry experts answer questions about the new standard in a virtual roundtable.

Digital revolution: The path to innovation is opened by disruption

Thu, 7 Jul 2017
Digital disruption begets innovation. Challenges equal opportunities.

NUS engineers achieve significant breakthrough in spin wave-based information processing technology

Mon, 7 Jul 2017
Novel method of propagating spin waves could pave the way for high-speed, miniaturized data processing devices.

Intel completes tender offer for Mobileye

Tue, 8 Aug 2017
The combination of Intel and Mobileye will allow Mobileye's computer vision expertise (the "eyes") to complement Intel's high-performance computing and connectivity expertise (the "brains") to create automated driving solutions from cloud to car.

NanoString and Lam Research announce strategic development collaboration

Wed, 8 Aug 2017
NanoString Technologies, Inc. and Lam Research Corporation today announced a strategic collaboration to develop NanoString's proprietary Hyb & Seq next-generation sequencing platform.

MRSI Systems launches high speed die bonder for photonics high volume manufacturing

Tue, 8 Aug 2017
MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements.

SiFive and Rambus to provide IP to the 'DesignShare' economy

Tue, 8 Aug 2017
SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it will partner with Rambus to make Rambus cryptography technology available for the SiFive Freedom platforms.

High-speed switching for ultrafast electromechanical switches and sensors

Tue, 8 Aug 2017
Unlike the slow ferroelastic domain switching expected for ceramics, high-speed sub-microsecond ferroelastic domain switching and simultaneous lattice deformation are directly observed for the Pb(Zr0.4Ti0.6)O3 thin films. This exciting finding paves the way for high-frequency ultrafast electromechanical switches and sensors.

Automotive sensing: A mature yet highly dynamic market

Tue, 8 Aug 2017
Despite its age and maturity, the automotive market has witnessed many unexpected developments over the past two years. And as has always been the case, safety drives the market.

Technology Showcase finalists revealed for European MEMS & Sensors Summit

Tue, 8 Aug 2017
Five companies compete for attendee votes at SEMI European MEMS & Sensors Summit, September 20-22, 2017, Grenoble, France.

STMicroelectronics boosts its ecosystem with partner program that connects customers with qualified third parties

Thu, 8 Aug 2017
STMicroelectronics has strengthened its ecosystem through a Partner Program that connects customers with qualified technical specialists capable of strategically supporting their projects.

UPMEM announces the first processing in-memory chip accelerating Big Data applications

Fri, 9 Sep 2017
UPMEM, a fabless semiconductor startup company, announces UPMEM Processing In-Memory (PIM), the next generation hardware solution for data intensive applications in the datacenter, solving server-level efficiency and performance bottlenecks.

Fab equipment spending breaking industry records

Tue, 9 Sep 2017
2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion.

Understanding the impact of valve flow coefficient (Cv) in fluid systems

Tue, 9 Sep 2017
Understanding the impact of valve flow coefficient (Cv) in fluid systems for microelectronics manufacturing.

Wearable sensors reach their first billion-dollar year, with growth coming in three waves

Wed, 9 Sep 2017
IDTechEx predict that 2017 will be the first billion dollar year for wearable sensors.

TowerJazz and Crocus expand presence in magnetic sensors market

Wed, 9 Sep 2017
Crocus TMR sensors offer important advantages for multiple applications in IoT, consumer, automotive, industrial and medical sectors.

Robotics and chip industries in Japan

Mon, 10 Oct 2017
Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

Toshiba Memory Corp to invest in production equipment for Fab 6 at Yokkaichi operations

Wed, 10 Oct 2017
TMC will invest approximately 110 billion yen as a second investment in Fab 6 for the installation of additional manufacturing equipment in the Phase-1 clean room.

China IC industry outlook

Tue, 10 Oct 2017
With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

Piezoelectrics stretch their potential with a method for flexible sticking

Wed, 10 Oct 2017
Researchers see performance boost in novel method for connecting thin-film piezoelectric materials to flexible substrates, with potential applications for medical devices.

Number of connected IoT devices will surge to 125 billion by 2030

Fri, 10 Oct 2017
The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit.

SEMI FlexTech selects PARC to build ultrathin, flexible audio speaker

Mon, 10 Oct 2017
FlexTech, a SEMI Strategic Association Partner announced a new development project with PARC, a Xerox company, to develop a hybrid, highly bendable, paper-like smart tag, incorporating a thin audio speaker.

Global semiconductor industry posts highest-ever quarterly sales

Wed, 11 Nov 2017
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter.

MEMS & sensors safeguard autonomous cars, boost agricultural productivity and anticipate needs

Fri, 11 Nov 2017
MEMS & Sensors Executive Congress speakers feature smart sensing components in new industrial, automotive, biomedical, agricultural applications.

2017 sees advances in connected devices, memory

Tue, 11 Nov 2017
The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.

The intelligence that leads to artificial intelligence

Wed, 11 Nov 2017
Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.

Automotive electronic systems growth strongest through 2021

Thu, 11 Nov 2017
IC Market Drivers 2018 report ranks major end-use applications and their impact on IC market growth.

Advanced wireless-charging chip from STMicroelectronics enables faster charging of smartphones and tablets

Thu, 11 Nov 2017
STMicroelectronics is powering up wireless charging for mobile devices by introducing one of the world's first chips to support the latest industry standard for faster charging.

Leti joins DARPA-funded consortium to develop implantable device for restoring vision

Thu, 11 Nov 2017
Leti announced today that a team of its researchers is participating in a U.S.-funded project to develop a safe, implantable neural interface system to restore vision by stimulating the visual cortex.

Transfer technique produces wearable gallium nitride gas sensors

Fri, 11 Nov 2017
A transfer technique based on thin sacrificial layers of boron nitride could allow high-performance gallium nitride gas sensors to be grown on sapphire substrates and then transferred to metallic or flexible polymer support materials.

Improving sensor accuracy to prevent electrical grid overload

Mon, 11 Nov 2017
Engineers take note -- new current sensors need fine-tuning to accurately inform monitors of the electrical grid about incoming surges.

An interview with Bosch Sensortec CEO: IoT, environmental sensing and value chain

Fri, 11 Nov 2017
SEMI interviewed one of the four keynotes presenting on November 14 during the Opening Ceremony, Dr. Stefan Finkbeiner, CEO of Bosch Sensortec, about topics about developments and trends in IoT, Environmental Sensing, and Value Chain as well as the role of Europe.

Magnetic sensor industry is moving into a consolidation phase

Mon, 11 Nov 2017
With 7% CAGR between 2016 and 2022, the magnetic sensor market should reach almost US$ 2.5 billion in 2022.

Leti announces FED4SAE project to accelerate European cyber-physical system solutions to market

Tue, 11 Nov 2017
Leti, a research institute of CEA Tech and coordinator of the pan-European consortium FED4SAE, today announced that the 14 project partners have launched a three-year European Commission program to facilitate the acceleration of European cyber-physical-system (CPS) solutions to market.

Electronics industry conference to debut in Kuala Lumpur

Wed, 11 Nov 2017
SEMICON Southeast Asia 2018 to bolster growing semiconductor industry in the region.

TEL NEXX modernizes shop floor data collection and quality control with InfinityQS ProFicient

Thu, 11 Nov 2017
Quality Intelligence solution enables chip metallization provider to improve accuracy and timeliness of data capture, rapidly respond to issues, and identify opportunities for continuous improvement.

Google’s head of Quantum AI Lab to keynote at The ConFab 2018

Fri, 12 Dec 2017
The ConFab 2018, to be held at The Cosmopolitan of Las Vegas on May 21-23, is thrilled to announce the newest opening day Keynote speaker, Professor John M. Martinis.

Nambi Seshadri wins 2018 IEEE Alexander Graham Bell Medal

Tue, 12 Dec 2017
Awarded for exceptional contributions to communications and networking sciences and engineering.

$55.9B semiconductor equipment forecast: New record with Korea at top

Tue, 12 Dec 2017
Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition.

ProPlus and MPI Corporation establish strategic partnership

Tue, 12 Dec 2017
ProPlus Design Solutions Inc. and MPI Corporation today announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus' SPICE modeling and noise characterization solution with MPI's advanced probing technologies.

The world's 1st "7-axis" motion tracking devices: tiner package & better response time

Wed, 12 Dec 2017
Accelerometers and gyroscopes are fueling the robotic revolution, especially the drones’ market segment. However, these MEMS devices are not the only ones on the market place anymore, with environmental sensors penetrating this industry too.

Tessera reaches global settlement with Broadcom

Mon, 12 Dec 2017
Settlement includes multi-year license agreement.

The coldest chip in the world

Wed, 12 Dec 2017
Physicists at the University of Basel have succeeded in cooling a nanoelectronic chip to a temperature lower than 3 millikelvin.

SEMI data projects new highs in fab equipment spending

Wed, 1 Jan 2018
The year-end update to the SEMI World Fab Forecast report reveals 2017 spending on fab equipment investments will reach an all-time high of $57 billion.

Global semiconductor sales increase 21.5% year-to-year in November

Wed, 1 Jan 2018
Worldwide market notches highest-ever monthly sales of $37.7 billion; sales increase 1.6 percent compared to October.

Talent pipeline key to enabling industry growth: Takeaways from SEMI Member Forum

Wed, 1 Jan 2018
These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

Boston Semi Equipment receives multisystem order for Zeus pressure MEMS test handler

Thu, 1 Jan 2018
Boston Semi Equipment (BSE), a global semiconductor test handler manufacturer and provider of test automation technical services, announced today that it has received a multisystem order for its Zeus gravity feed systems for handling pressure MEMS devices.

Luc Van den hove to receive SEMI Sales and Marketing Excellence Award

Thu, 1 Jan 2018
SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

ASML announces appointment of new CFO to the Board of Management

Wed, 1 Jan 2018
ASML Holding N.V. (ASML) today announces that the Supervisory Board intends to appoint Roger Dassen as Executive Vice President and Chief Financial Officer (CFO) to the Board of Management.

Growth of IoT to drive the global reset IC market

Tue, 1 Jan 2018
Technavio market research analysts forecast the global reset IC market to grow at a CAGR of close to 12% during the forecast period, according to their latest report.

New sensor for measuring electric field strength

Fri, 1 Jan 2018
TU Wien has developed a sensor for measuring the strength of electric fields, which is much smaller, simpler and less prone to distortion than comparable devices.

Annual semiconductor sales increase 21.6%, top $400B for first time

Mon, 2 Feb 2018
Global industry posts highest-ever annual, quarterly, and monthly sales.

Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs

Tue, 2 Feb 2018
Texas Instruments (TI) today introduced the industry's smallest operational amplifier (op amp) and low-power comparators at 0.64 mm2.

MACOM and STMicroelectronics to bring GaN on silicon to mainstream RF markets and applications

Wed, 2 Feb 2018
MACOM Technology Solutions Holdings, Inc. and STMicroelectronics announced an agreement to develop GaN (Gallium Nitride) on Silicon wafers to be manufactured by ST for MACOM's use across an array of RF applications.

A billion devices from SiTime empower self-driving cars, mobile phones, and everything in between

Wed, 2 Feb 2018
SiTime Corporation, a developer of MEMS timing devices, announced today that it has shipped cumulatively over 1 billion timing devices.

Leti Chief Scientist Barbara De Salvo to deliver opening day talk on brain-inspired technologies at ISSCC 2018

Thu, 2 Feb 2018
Delivering a keynote talk during the Feb. 12 plenary session that formally opens the conference, De Salvo will note that the architecture will include human-brain inspired hardware coupled to new computing paradigms and algorithms that "will allow for distributed intelligence over the whole IoT network, all-the-way down to ultralow-power end-devices."

Frank Shemansky to lead SEMI's MEMS & Sensors Industry Group

Tue, 2 Feb 2018
SEMI today announced the appointment of Frank A. Shemansky, Jr., Ph.D., as executive director and chief technology officer (CTO) of the MEMS & Sensors Industry Group (SEMI-MSIG).

Entering 2018 on solid ground

Thu, 2 Feb 2018
2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

SEMI showcases achievements in flexible hybrid electronics, MEMS and sensors at 2018FLEX and MSTC conferences

Thu, 2 Feb 2018
Technology trail-blazers explore business insights, new technologies, integration strategies at co-located events, held February 12-15, 2018 in Monterey, CA.

Supermicro expands its Silicon Valley corporate headquarters

Fri, 2 Feb 2018
Super Micro Computer, Inc. today announced that it has expanded its Silicon Valley Headquarters to over two million square feet of facilities with the grand opening of its new Building 22.

A marriage of light-manipulation technologies

Thu, 3 Mar 2018
Researchers have, for the first time, integrated two technologies widely used in applications such as optical communications, bio-imaging and Light Detection and Ranging (LIDAR) systems that scan the surroundings of self-driving cars and trucks.

Work to do to keep the good times rolling

Fri, 3 Mar 2018
2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

Executive viewpoints: 2018 outlook

Mon, 3 Mar 2018
Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

New approach to measuring stickiness could aid micro-device design

Thu, 3 Mar 2018
Brown University engineers have devised a new method of measuring the stickiness of micro-scale surfaces. The technique, described in Proceedings of the Royal Society A, could be useful in designing and building micro-electro-mechanical systems (MEMS), devices with microscopic moving parts.

Flat gallium joins roster of new 2-D materials

Mon, 3 Mar 2018
Scientists at Rice University and the Indian Institute of Science, Bangalore, have discovered a method to make atomically flat gallium that shows promise for nanoscale electronics.

Micron appoints Raj Talluri as senior vice president and general manager of Mobile Business Unit

Tue, 3 Mar 2018
Micron Technology Inc. announced today that the company has appointed Raj Talluri as senior vice president and general manager of the Mobile Business Unit.

Researchers develop spectroscopic thermometer for nanomaterials

Tue, 3 Mar 2018
A scientific team led by the Department of Energy's Oak Ridge National Laboratory has found a new way to take the local temperature of a material from an area about a billionth of a meter wide, or approximately 100,000 times thinner than a human hair.

EV Group and IBM sign license agreement on laser debonding technology

Wed, 3 Mar 2018
IBM's Hybrid Laser Release Process technology complements EV Group's low-temperature laser debonding equipment and process portfolio designed to enable highly flexible, high-throughput solution.

Imec honors Qualcomm founder Irwin M. Jacobs with Lifetime of Innovation Award

Wed, 3 Mar 2018
Imec, a research and innovation hub in nanoelectronics and digital technologies, today presented its annual Lifetime of Innovation Award to Dr. Irwin Jacobs, Founding Chairman and CEO Emeritus of Qualcomm.

GLOBALFOUNDRIES launches RF ecosystem program to accelerate time-to-market for wireless connectivity, radar and 5G applications

Tue, 3 Mar 2018
GLOBALFOUNDRIES today announced a new ecosystem partner program, called RFWave, designed to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks.

U.S. trade tensions with China hit fever pitch

Wed, 3 Mar 2018
Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

The 2018 Symposia on VLSI Technology & Circuits covers converging trends in machine learning, artificial intelligence & the IoT

Mon, 4 Apr 2018
The 2018 Symposia on VLSI Technology & Circuits will deliver a unique perspective into the technological ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing – the emerging technologies needed for 'smart living.'

6 key takeaways from ISS Europe 2018

Wed, 4 Apr 2018
With its leading research and development hubs, materials and equipment companies and chipmakers, the EU is in a strategic position in the global electronics value chain to support the growth of emerging applications such as autonomous driving, internet of things, artificial intelligence and deep learning.

Worldwide PC shipments declined 1.4% in first quarter of 2018

Thu, 4 Apr 2018
Worldwide PC shipments totaled 61.7 million units in the first quarter of 2018, a 1.4 percent decline from the first quarter of 2017, according to preliminary results by Gartner, Inc.

Global MEMS market for mobile devices forecast to grow at a CAGR of 10.55%

Thu, 4 Apr 2018
Global MEMS market for mobile devices to grow at a CAGR of 10.55% during the period 2017-2021.

Semiconductor expert Johan Lodenius enters the Board of disruptive Swedish IR sensor developer JonDeTech

Mon, 4 Apr 2018
Johan Lodenius is joining the Board of JonDeTech, a Swedish company that develops and markets IR sensor technology based on nanotechnology aimed at consumer electronics and mobile phone mass markets.

MicroDevices expands fabrication capability with high rate etcher

Tue, 4 Apr 2018
Sensera Inc. (MicroDevices) has acquired and qualified a SPTS ASE-HRM etch platform. This etcher adds capability to the fab that was previously outsourced to partners.

Samsung begins mass production of 10nm-class 16Gb LPDDR4X DRAM for automobiles

Thu, 4 Apr 2018
The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments.

Analog Devices names four Fellows for outstanding technical achievement and leadership

Mon, 5 May 2018
Analog Devices, Inc. awarded Bob Reay, Leonard Shtargot, Jesper Steensgaard, and Sam Zhang the title of Analog Devices Fellow.

Expecting the unexpected: 5 takeaways from FLEX Japan and MEMS & Sensors Forum Japan 2018

Tue, 5 May 2018
Peel-and-stick simplicity isn’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.

Cohu to acquire Xcerra

Tue, 5 May 2018
Cohu, Inc. and Xcerra Corporation today announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.

SEMI position on EC's proposed framework for screening foreign direct investments in the European Union

Thu, 5 May 2018
In response to the European Commission’s (EC) proposed framework for screening foreign direct investments (FDI), SEMI, representing the global electronics manufacturing supply chain, offers three recommendations for consideration by EU policymakers.

Advanced materials: processing glass like a polymer

Thu, 5 May 2018
KIT materials scientists develop new forming technology -- publication in advanced materials.

SiTime opens new Center of Excellence in Michigan

Thu, 5 May 2018
SiTime Corporation announced it has expanded its global footprint to support its rapid growth with the opening of a new Center of Excellence in Michigan.

Global, U.S. electronics supply chains see healthy midyear business conditions

Fri, 5 May 2018
The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

SEMICON West adds WT | Wearable Technologies Conference co-location

Tue, 5 May 2018
U.S. electronics manufacturing event expands with wearables program.

Cloud computing: the power to optimize manufacturing

Tue, 5 May 2018
The cloud is an innovation fueled by advanced chip technology, but it has also been a model the industry hesitated to embrace.

Silicon breakthrough could make key microwave technology much cheaper and better

Thu, 5 May 2018
Researchers using powerful supercomputers have found a way to generate microwaves with inexpensive silicon, a breakthrough that could dramatically cut costs and improve devices such as sensors in self-driving vehicles.

Leti Innovation Days to explore presentations on how microelectronics is fueling innovation

Tue, 5 May 2018
Leti, a technology research institute of CEA Tech, today announced its annual flagship event, Leti Innovation Days, July 4-5 in Grenoble.

STMicroelectronics announces Executive Committee

Thu, 5 May 2018
New President & CEO Jean-Marc Chery to lead newly formed Executive Committee.

BISTel unveils first intelligent applications for smart manufacturing

Fri, 6 Jun 2018
New Dynamic Fault Detection (DFD) offers full trace analysis, overcomes limitations of legacy FDC systems to improve yield significantly.

The MEMS market is showing a 17.5% CAGR between 2018 and 2023

Mon, 6 Jun 2018
MEMS market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period.

Executive keynotes to identify MEMS, sensors, imaging innovations and megatrends at SEMI-MSIG European Summits

Tue, 6 Jun 2018
Industry leaders to share latest developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018, in Grenoble, France.

Closing the gap: On the road to terahertz electronics

Tue, 6 Jun 2018
Asymmetric plasmonic antennas deliver femtosecond pulses for fast optoelectronics.

SEMICON West: Exponential growth in data volumes drives change in system architecture

Thu, 6 Jun 2018
With artificial intelligence (AI) rapidly evolving, look for applications like voice recognition and image recognition to get more efficient, more affordable, and far more common in a variety of products over the next few years.

SEMICON West 2018 highlights smart technologies, workforce development, industry growth

Mon, 7 Jul 2018
Smart technologies take center stage tomorrow as SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, opens for three days of insights into leading technologies and applications that will power future industry expansion.

Generating electrical power from waste heat

Mon, 7 Jul 2018
New Sandia solid-state silicon device may one day power space missions.

Proving the benefits of data analysis

Tue, 7 Jul 2018
The semiconductor industry is collecting massive amounts of data from fab equipment and other sources. But is the trend toward using that data in a Smart Manufacturing or Industry 4.0 approach happening fast enough in what Mike Plisinski, CEO of Rudolph Technologies, calls a "very conservative" chip manufacturing sector?

The cobbler's children getting shoes?

Tue, 7 Jul 2018
There's an old proverb that the shoemaker's children always go barefoot, indicating how some professionals don't apply their skills for themselves. Until lately, that has seemed the case with the semiconductor manufacturing industry which has been good at collecting massive amounts of data, but no so good at analyzing that data and using it to improve efficiency, boost yield and reduce costs.

The outlook for new metrology approaches

Tue, 7 Jul 2018
To keep up with Moore's Law, the semiconductor industry continues to push the envelope in developing new device architectures containing novel materials.

Broadcom to acquire CA Technologies for $18.9B in cash

Fri, 7 Jul 2018
Broadcom Inc. and CA Technologies today announced that the companies have entered into a definitive agreement under which Broadcom has agreed to acquire CA to build one of the world's leading infrastructure technology companies.

Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication

Fri, 7 Jul 2018
Dr. LI Jiafang, from the Institute of Physics, Chinese Academy of Sciences, has recently formed an international team to apply kirigami techniques to advanced 3D nanofabrication.

Silicon Labs expands senior management team

Mon, 7 Jul 2018
Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

IBM, Nissan and Toshiba talk computing and smart car innovations: Key takeaways from SEMI Japan Members Day

Fri, 7 Jul 2018
The Japan semiconductor manufacturing supply chain is a global semiconductor industry workhorse, producing about one third of world's chip equipment and more than half of its semiconductor materials.

Future electronic components to be printed like newspapers

Fri, 7 Jul 2018
A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.

Park Systems announces Park Nanoscience Lab at Indian Institute of Science in India

Mon, 7 Jul 2018
Park Systems announced the opening of the Park Nanoscience Lab at the prestigious Indian Institute of Science (IISC) Bangalore India, which has been upgraded to the status of Institute of Eminence.

NIST chip lights up optical neural network demo

Fri, 7 Jul 2018
Researchers at the National Institute of Standards and Technology (NIST) have made a silicon chip that distributes optical signals precisely across a miniature brain-like grid, showcasing a potential new design for neural networks.

Memory-processing unit could bring memristors to the masses

Mon, 7 Jul 2018
A new way of arranging advanced computer components called memristors on a chip could enable them to be used for general computing, which could cut energy consumption by a factor of 100.

Keysight delivers the industry's smallest solder-in probe head for high performance oscilloscopes

Wed, 8 Aug 2018
Keysight MX0100A InfiniiMax micro probe head designed to access small geometry, high density target devices.

Average design cost for basic SoCs across all geometries was $1.7M in 2017, says Semico Research

Tue, 8 Aug 2018
The semiconductor industry today is faced with several substantial issues-not the least of which are the continuing rise in design costs for complex SoCs, the decrease in the incidence of first-time-right designs and the increase in the design cycle time against shrinking market windows and decreasing product life cycles.

European electronics industry CEOs call on European Commission to bolster sector's competitiveness

Wed, 8 Aug 2018
In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

SEMI integration of ESD Alliance underway

Tue, 8 Aug 2018
SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

NSF awards $1.2M to Rochester Institute of Technology, University of California-San Diego, University of Delaware

Tue, 8 Aug 2018
Academic institutions partner with AIM Photonics to realize advanced computing architecture using light; develop mobile probes for identifying specific materials; and enable improved manufacturing processes for photonic devices.

SiFive announces first open-source RISC-V-based SoC platform with NVIDIA Deep Learning Accelerator technology

Mon, 8 Aug 2018
SiFive, a provider of commercial RISC-V processor IP, today announced the first open-source RISC-V-based SoC platform for edge inference applications based on NVIDIA's Deep Learning Accelerator (NVDLA) technology.

Murata invests in MEMS sensor manufacturing in Finland

Tue, 8 Aug 2018
Murata Manufacturing Co., Ltd. expands its MEMS sensor manufacturing by building a new factory in Vantaa, Finland to increase the sensor production capacity.

Leti and Vsora demonstrate 3GPP new radio on multi-core digital signal processor

Tue, 9 Sep 2018
Leti, a research institute of CEA Tech, and VSORA, which specializes in multi-core digital signal processor (DSP) design, today announced they have demonstrated the implementation of 5G New Radio (5G NR) Release 15 on a new DSP architecture that can dramatically reduce time to market of digital modems.

Less price erosion will lift MEMS sensor/actuator growth

Wed, 9 Sep 2018
More intelligent and automated controls and specialized MEMS-built semiconductors will keep ASPs from falling as much as they did in the last 10 years, says O-S-D report.

The future of MEMS and sensors: Beyond human senses

Thu, 9 Sep 2018
2017 was a good year for the MEMS and sensors business, and that upward trend should continue.

More than mobility: Smart automotive innovations go beyond technology

Mon, 9 Sep 2018
Are you ready for a shared economy where your transportation needs are no longer met by an automaker, but rather a "mobility service provider"?

"Dreams Start Here" at SEMICON Japan 2018 in era of AI

Tue, 9 Sep 2018
Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in Japan's industry-leading event.

Sensors: From red hot chillies to patients

Thu, 9 Sep 2018
SEMI's Serena Brischetto caught up with Zimmer and Peacock Director Martin Peacock to discuss sensor opportunities and challenges ahead of the European MEMS & Sensors and Imaging & Sensors Summits.

The role of autonomous mobility in driving MEMS & sensors to $100B market

Thu, 9 Sep 2018
MEMS & Sensors Executive Congress speakers to provide insights into enabling connected devices for wearables, robotics, cars, and autonomous applications October 29-30 in Napa Valley, Calif.

Seven IC products to outpace total 16% IC market growth in 2018

Tue, 9 Sep 2018
13 IC products forecast to show double-digit growth, led by a 39% surge in DRAM sales.

Leti and EFI launch project to improve reliability and speed of low-cost electronic devices for autos

Tue, 9 Sep 2018
Leti, a research institute of CEA Tech, and EFI Automotive, an international supplier of sensors, actuators and embedded smart modules for the automotive industry, today announced a project to dramatically improve reliability and response time of low-cost automotive components by equipping the devices with sophisticated model predictive control techniques.

Smart devices could soon tap their owners as a battery source

Fri, 9 Sep 2018
The world is edging closer to a reality where smart devices are able to use their owners as an energy resource, say experts from the University of Surrey.

MSEC Tech Showcase to highlight MEMS & sensors innovations

Thu, 10 Oct 2018
MEMS & Sensors Industry Group announces Technology Showcase finalists for MEMS & Sensors Executive Congress.

Intel collaborates on new AI research center at Technion, Israel’s Technological Institute

Tue, 10 Oct 2018
Technion, Israel’s technological institute, announced this week that Intel is collaborating with the institute on its new artificial intelligence (AI) research center.

Micron Foundation announces $1M grant to advance curiosity in artificial intelligence

Thu, 10 Oct 2018
The grant was announced at the inaugural Micron Insight 2018 conference where the technology industry's top minds gathered in San Francisco to discuss the future of AI, machine learning and data science, and how memory technology is essential in bringing intelligence to life.

Dynamic Fault Detection: Utilizing AI and IoT to revolutionize manufacturing

Mon, 10 Oct 2018
A new approach in Fault Detection and Classification (FDC) allows engineers to uncover issues more thoroughly and accurately by taking advantage of full sensor traces.

Cybersecurity critical to success of MEMS and sensors suppliers

Thu, 10 Oct 2018
Cynthia Wright, a retired military officer with over 25 years of experience in national security and cyber strategy and policy, now Principal Cyber Security Engineer at The MITRE Corporation, will give the opening keynote at the upcoming MEMS & Sensors Executive Congress, October 29-30, 2018 in Napa, Calif.

ULVAC and the CIA: A sensing story about food and agriculture

Fri, 10 Oct 2018
ULVAC Technologies’ David Mount is working with The CIA. Is he the Jack Reacher of the MEMS and sensors industry, jetting around the world to secret meetings, you wonder?

Autonomy value: The next value for sensors suppliers

Tue, 10 Oct 2018
Nicolas Sauvage, senior director of Ecosystem at TDK InvenSense, will present at the fast-approaching MEMS & Sensors Executive Congress on October 29-30, 2018 in Napa, Calif. SEMI’s Nishita Rao spoke with Sauvage to offer MSEC attendees advance insights on Sauvage’s feature presentation.

Leti and Taiwanese National Applied Research Laboratories team up to strengthen microelectronics innovation in France and Taiwan

Tue, 10 Oct 2018
Two leading French and Taiwanese research institutes today announced their new collaboration to facilitate a scientific and technological exchange between France and Taiwan.

Inexpensive chip-based device may transform spectrometry

Tue, 10 Oct 2018
Tiny device could replace expensive lab-scale equipment for many applications.

Sensera further expands fabrication capabilities with dicing, wafer bonding and electroplating technologies

Thu, 10 Oct 2018
c. announced it has acquired and qualified additional thin-film processing equipment including a dicing saw, a wafer bonder and an electroplating cell to meet the growing customer demand in this segment.

Speeding MEMS innovation and production

Fri, 10 Oct 2018
SEMI’s Nishita Rao spoke with Ron Polcawich about the MEMS workshop on rapid innovation that he held earlier this year and his interest in continuing that conversation with a broad audience of MEMS and sensors suppliers attending MEMS & Sensors Executive Congress.

Highly efficient wet-processed solar cells with molecules in the same orientation

Fri, 10 Oct 2018
Researchers at Kanazawa University report in the journal Organic Electronics documents a new method for controlling the orientation of conducting molecules in organic solar cells that results in the enhanced light adsorption and performance of the cells.

Nanotubes may give the world better batteries

Fri, 10 Oct 2018
Rice U. scientists' method quenches lithium metal dendrites in batteries that charge faster, last longer.

MEMS and sensors in autonomous and electric vehicles: Key takeaways from IHS Markit at MSEC

Thu, 11 Nov 2018
IHS Markit’s Jérémie Bouchaud provided a closer look at and outlook for this key market at the MEMS and Sensors Executive Congress in late October in Napa. Following are key takeaways from his presentation.

SEMICON Korea to showcase AI, smart manufacturing, talent

Tue, 11 Nov 2018
With Korea expected to remain the world's largest consumer of semiconductor equipment, building on its 18 percent share in 2018, SEMICON Korea 2019 is poised to connect global electronics manufacturing companies to new opportunities.

SUNY Poly professors awarded $330,000 for two distinct cutting-edge nanotechnology-centered research projects

Tue, 11 Nov 2018
Dr. Serge Oktyabrsky received $200,000 from the U.S. Department of Energy to develop next-gen scintillation detectors based on quantum dots to enable a better understanding of basic particles.

Altair Semiconductor and JIG-SAW partner on LTE-enabled sensors for industrial IoT

Wed, 11 Nov 2018
Altair Semiconductor announced today it has partnered with JIG-SAW Inc. to develop LTE-enabled sensors for a wide variety of global industrial IoT applications.

Three CEA projects awarded European Research Council Synergy Grants

Mon, 11 Nov 2018
The European Research Council (ERC) has just published the list of 27 projects it selected out of the 299 submitted to the ERC Synergy 2018 call for projects.

Vertiv completes acquisition of MEMS maintenance business

Thu, 12 Dec 2018
Vertiv announced today that it has completed the purchase of the maintenance business of MEMS Power Generation (MEMS), a privately-owned company headquartered in the United Kingdom that specializes in temporary power solutions.

Development of MEMS sensor chip equipped with ultra-high quality diamond cantilevers

Thu, 12 Dec 2018
Progress in the development of highly reliable and sensitive diamond MEMS sensors.

It’s chilly!

Wed, 1 Jan 2019
4Q'18 world electronic supply chain: Slowing electronic equipment growth

CEA-Leti builds prototype of next-generation mid-infrared optical sensors for portable device

Tue, 2 Feb 2019
CEA-Leti today announced it has prototyped a next-generation optical chemical sensor using mid-infrared silicon photonics that can be integrated in smartphones and other portable devices.

Researchers report advances in stretchable semiconductors, integrated electronics

Tue, 2 Feb 2019
Researchers from the University of Houston have reported significant advances in stretchable electronics, moving the field closer to commercialization.

MEMS & Sensors Technical Congress highlights automotive market, emerging MEMS technologies

Wed, 2 Feb 2019
This year’s MEMS & Sensors Technical Congress(MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards.

John Chong of Kionix named Chair of MEMS & Sensors Industry Group governing council

Wed, 2 Feb 2019
SEMI today announced the appointment of John Chong, vice president of product and business development at MEMS manufacturer Kionix, as Governing Council chair of the SEMI-MEMS & Sensors Industry Group.

IDT and Telink Semiconductor announce partnership on integrated sensor platforms

Fri, 2 Feb 2019
Leveraging respective leadership technologies in sensors and IoT connectivity, Integrated Device Technology, Inc. (IDT) and Telink Semiconductor are announcing a partnership to create connected and integrated sensor platforms for IoT applications.

Sensor accuracy: Critical metric in automotive, industrial, consumer markets

Wed, 2 Feb 2019
As group vice president of the Analog & MEMS Group and general manager of the MEMS Sensor division at STMicroelectronics, Andrea Onetti brings nearly three decades of experience in MEMS, sensors and audio systems to his leadership role at one of the world’s most successful electronics and semiconductor manufacturers.

Introducing Semiconductor Digest

Tue, 4 Apr 2019
Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry