Topic Index

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ISSYS Receives NSF Grant to Develop Wafer-level, Hermetic, Hybrid Integration of MEMS and Electronics

Thu, 10 Oct 2007
(October 4, 2007) YPSILANTI, MI— Integrated Sensing Systems, Inc. (ISSYS) was awarded a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The 2-year project, "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems," is aimed towards development of a novel packaging method to simplify the packaging of MEMS and their associated electronics.

Lasers package ultrathin semiconductors at low cost, high volume

Wed, 10 Oct 2011

North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.

TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials

Wed, 10 Oct 2011

Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.

Thin wafers win majority in electronics by 2016

Thu, 10 Oct 2011

Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D

Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

Wed, 1 Jan 2012

Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging

Present at ESTC 2012 in Amsterdam

Tue, 2 Feb 2012

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.

X-FAB Silicon Foundries adopts SFT software

Fri, 2 Feb 2012

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18

3M debuts high-capacitance ECM for IC packaging, RF, other apps

Thu, 2 Feb 2012

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).

3D MID sensor fabricated with Ticona laser-activated LCP circuits

Wed, 1 Jan 2012

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.

AMEC debuts TSV etch tool with Chinese installations

Wed, 3 Mar 2012

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.

EVG enhances fusion wafer bonder throughput, accuracy

Wed, 9 Sep 2011

EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.

SUSS MicroTec sends equipment to SVTC in MEMS, 3D IC dev partnership

Tue, 11 Nov 2011

Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging for MEMS, and 3D IC bonding technology development.

SEMATECH creates 3D packaging standards development forum

Mon, 11 Nov 2011

SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information.

Silicon interposer partnership sets roadmap

Tue, 12 Dec 2011

Singapore's A*STAR IME and 3D IC developer Tezzaron Semiconductor signed a research collaboration agreement to develop and exploit advanced through silicon interposer (TSI) technology.

inTEST to acquire Thermonics division of Test Enterprises

Tue, 12 Dec 2011

inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.

2012 ITRS update: Back-end packaging and MEMS

Fri, 7 Jul 2012

At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.


Tue, 12 Dec 2010

Micross Components, Inc. and SemiSouth Laboratories, Inc. announced a collaborative effort to expand SemiSouth's line of Silicon Carbide (SiC) Power JFETs and Schottky Diodes. SemiSouth will provide select JFET and diode die to Micross for packaging and test in metal hermetic packages

Gyroscope integrates MEMS/ASIC in custom package

Mon, 8 Aug 2010

Sensonor Technologies is developing SAR500, a novel high-precision, low-noise, high-stability, calibrated and compensated digital oscillatory gyroscope with SPI interface housed in a custom-made ceramic package.

Roadmapping More than Moore: When the application matters

Fri, 7 Jul 2012

At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.

Tessera: Adding Vista Point Technologies, losing Powertech Technology?

Mon, 7 Jul 2012

Tessera received notice from Powertech Technology Inc. (PTI) that it will terminate its license agreement with the semiconductor packaging and optics technology company. Tessera also completed phase 1 of its acquisition of camera module technologies from Flextronics.

Mold packaging meets metal TSV for 5-10x density of conventional substrates

Thu, 4 Apr 2012

Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.

Conference Report: MEMS Executive Congress Europe

Mon, 4 Apr 2012

Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.


Field Report: Sensors in Design 2012

Thu, 3 Mar 2012

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.

2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

Wed, 2 Feb 2012

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.

Metrology tool offers economical price point with high accuracy

Mon, 4 Apr 2012

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.

Conference Report: MRS Spring 2012, Day 4

Fri, 4 Apr 2012

Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta2O5 memristors, redox flow batteries, graphene, and more.

Conference Report: MRS Spring 2012, Day 3

Thu, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

Chip substrate factory begins producing thermal-control substrates in Russia

Wed, 2 Feb 2012

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.

MEMS Symposium Report: Chasing 1 Trillion

Thu, 5 May 2012

The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”

SST Book Review: Energy Harvesting for Autonomous Systems

Mon, 4 Apr 2012

Contributing editor Steve Groothuis reviews a book titled “Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).” The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices. 

Confovis taps Digital Surf for metrology tool imaging software

Fri, 3 Mar 2012

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.

SEMI adds session, extends abstract deadline for China chip conference

Tue, 10 Oct 2012

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.

KLA-Tencor's updated LED wafer inspection tool boosts throughput, efficiency

Thu, 12 Dec 2012

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.

MIPI Alliance forms group to study sensor integration in mobile systems

Mon, 11 Nov 2012

MIPI Alliance has formed an open "Birds of a Feather" (BoF) group that will investigate the requirements related to integrating sensors into mobile systems. The group will address challenges facing the sensor and wireless markets.

Conference report: MEMS Business Forum

Fri, 5 May 2012

The first MEMS Business Forum, sponsored by MEMS Journal and MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 24 at the Santa Clara Biltmore Hotel. Ten speakers presented on topics ranging from near- and mid-term business opportunities to roles of MEMS in broad visions for the future.

ITF: New approaches in the battle against cancer

Fri, 5 May 2012

At imec's International Technology Forum, Denis Wirtz, co-director of the John Hopkins Institute for NanoBio Technology, described the latest efforts to fight cancer.

ITF: Healthcare applications of silicon photonics

Fri, 5 May 2012

At imec's International Technology Forum, Roel Baets, director of the Centre for Nano- and Biophotonics Ghent University, Belgium, said silicon photonics will drastically change the way bio research is conducted.

ITF: Connecting biology with microsystems

Fri, 5 May 2012

At imec’s International Technology Forum, Peter Peumans, department director bio-nano electronics of imec, described promising examples of : technologies that connect biology and Microsystems: Biotechnology: bioreactors, neuroprobes, high speed cell inspection, and high-throughput molecular analysis.

Metrology merger: MicroSense acquires SigmaTech

Wed, 6 Jun 2012

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.

Europe to unite research efforts in Silicon Europe cluster alliance

Mon, 10 Oct 2012

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”

IEDM unveils 2012 program highlights

Mon, 9 Sep 2012

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

MEMS for mobile industry will reach $6.4B by 2018

Thu, 6 Jun 2013

Market demand for new sensors will lead to a $6.4B market by 2018.

Necessary attributes of a MEMS engineer for new product development

Mon, 6 Jun 2013

In the development of new MEMS products, the team is the most important factor.

Bosch reaches 3 billion sensor milestone

Tue, 6 Jun 2013

Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.

Leti Innovation Days to present preview of future developments in nanotechnologies

Thu, 6 Jun 2013

CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.

Fab equipment spending: 23% growth for 2014

Tue, 6 Jun 2013

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

Leti to present latest R&D results in MEMS at Transducers’ 2013 in Barcelona

Wed, 5 May 2013

CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.

OMRON develops MEMS non-contact thermal sensor utilizing wafer-level vacuum packaging

Wed, 5 May 2013

OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.

M2M Forum 2013 explores MEMS and the future of medical devices

Tue, 4 Apr 2013

MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.

Leading MEMS microphone suppliers ride Apple’s gravy train to the top

Wed, 5 May 2013

Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.

Kurt Petersen, MEMS industry pioneer and technology vision, joins IMT board of directors

Tue, 4 Apr 2013

IMT, the largest pure-play MEMS foundry in the US, announced today the appointment of MEMS industry pioneer and technology visionary Dr. Kurt Petersen to the IMT board of directors.


Fri, 4 Apr 2013


Health awareness spurs quadrupling in MEMS sensor market for wearable electronics

Tue, 4 Apr 2013

From smart wristwatches that record heart rates, to intelligent armbands that track physical activities, wearable electronics and fitness monitoring devices are attracting increased attention from health-conscious consumers, causing shipments of MEMS sensors used in these products to more than quadruple in just five years.

Combo MEMS inertial sensors report brisk growth in automotive market

Mon, 5 May 2013

Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems.

Top 30 MEMS companies of 2012

Fri, 4 Apr 2013

The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on Yole Développement’s annual ranking of the Top 30 MEMS companies.

Examining the MEMS gyroscope patent landscape

Wed, 4 Apr 2013

The gyroscope market is driven by mobile applications, where until recently only two players, STMicroelectronics (ST) and InvenSense, were competing.

Corporate partnership produces next generation MEMS handler

Fri, 2 Feb 2013

TESEC Corporation today announced the development and sales of the ULTRA MEMS Handler, targeting Inertial (Accelerometer, Gyroscope and Magnetometer) MEMS devices.

Report delivers latest analysis on nanobiotechnology applications, markets and companies

Thu, 2 Feb 2013

Nanobiotechnology, an integration of physical sciences, molecular engineering, biology, chemistry and biotechnology holds considerable promise of advances in pharmaceuticals and healthcare.

2013: Beyond CMOS, steady growth and accelerating change across non-mainstream chip markets

Thu, 1 Jan 2013

Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes in technology and  market structures.

Global market for MEMS microphone to more than double in five years

Wed, 2 Feb 2013

The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.

MEMS devices shape medical industry, microsystem devices to reach $6.6 billion in 2018

Wed, 2 Feb 2013

Microelectromechanical (MEMS) devices are shaping the competitive landscape in the global medical device industry.

Tronics to produce submicron MEMS technology of CEA-LETI

Mon, 2 Feb 2013

Tronics kicks-off the industrialization of a unique piezoresistive nanowire MEMS technology that can take 9 DOF motion sensors to a new level of competitiveness.

Opinion: MEMS new product development: The first prototype

Mon, 2 Feb 2013

In the second article of the MEMS new product development blog, the importance of the first prototype will be discussed.

STMicroelectronics and University of Amsterdam Faculty of Science use advanced MEMS to soar with birds

Thu, 2 Feb 2013

STMicroelectronics and the University of Amsterdam Faculty of Science have announced that a sophisticated bird-tracking system developed by the university is using advanced MEMS sensing technology from ST.

MEMS revenue to climb a healthy 8 percent this year

Thu, 2 Feb 2013

A strong uptake in consumer and mobile devices will power the market for microelectromechanical systems (MEMS) to solid revenue growth in 2013, with breakthroughs in new sensor applications also expected this year, according to insights from the IHS iSuppli MEMS service at information and analytics provider IHS.

Institute of Microelectronics and Stanford University to develop switch technology for efficiency in mobile devices

Fri, 2 Feb 2013

A*STAR’s Institute of Microelectronics, or IME, and Stanford University will collaborate to advance innovations in nano-electromechanical systems (NEMS) switch technology for ultra-low power digital systems.

APIX Technology introduces gas chromatography device based on silicon nano-scale components

Thu, 2 Feb 2013

GCAP targets a range of industrial applications as well as research labs, advanced gas analysis and biomedical screening.

Smartphones and tablets drive continued double-digit growth in MEMS motion sensor market

Thu, 2 Feb 2013

Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.

MEMS Industry Group announces MEMS Executive Congress Europe 2013

Mon, 1 Jan 2013

MEMS Industry Group (MIG) will host its second annual MEMS Executive Congress® Europe, March 12, 2013 in Amsterdam.

Researchers create semiconductor 'nano-shish-kebabs' with potential for 3-D technologies

Wed, 2 Feb 2013

Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.

Manufacturing innovations to drive MEMS equipment market to a >5% CAGR over 2012-2018

Tue, 2 Feb 2013

In its new report MEMS Front-End Manufacturing Trends, Yole Développement goes further in the equipment and materials market forecasts and in the manufacturing trends for MEMS. The report gives detailed analyses about MEMS device technology process flow, manufacturing trends and manufacturing cost breakdown.

UCLA researchers refine 'NanoVelcro' device to grab single cancer cells from blood

Mon, 2 Feb 2013

Improvement in nanotechnology enables 'liquid biopsies' for metastatic melanoma.

JEDEC elects two new members to its Board of Directors

Mon, 2 Feb 2013

JEDEC Solid State Technology Association, a developer of standards for the microelectronics industry, announced today that its Board of Directors has appointed two new members: Mr. Jong H. Oh, Vice President, SK hynix and Mr. Hung Vuong, Qualcomm. 

NIST quantum refrigerator offers extreme cooling and convenience

Wed, 3 Mar 2013

Researchers at the National Institute of Standards and Technology (NIST) have demonstrated a solid-state refrigerator that uses quantum physics in micro- and nanostructures to cool a much larger object to extremely low temperatures.

Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Wed, 3 Mar 2013

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.

Smart new sensor fusion chip enables mobile devices to operate multiple sensors

Tue, 3 Mar 2013

PNI Sensor Corporation and EM Microelectronic -Marin SA announce the introduction of the Sentral sensor fusion hub: a new, highly effective way to integrate complex motion sensors on mobile devices.

EV Group to develop equipment to enable covalent bonds at room temperature

Tue, 3 Mar 2013

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.

Avnet Memec signs agreement with MEMS sensor line

Fri, 3 Mar 2013

InvenSense, Inc. and Avnet Memec this week announced the formation of a pan-European distribution agreement. With the new partnership, Avnet Memec is chartered with sales and support for InvenSense’s MotionTracking devices throughout Europe and Israel.

Avago MEMS Filter: The highest volume production MEMS using TSV

Wed, 3 Mar 2013

System Plus Consulting analyzed a BAW MEMS Filter manufactured by Avago Technologies, assessing its manufacturing process, costing results and breakdown. With more than 1 billion units produced per year and a market share of 65%, System Plus Consulting found that Avago Technologies clearly dominates the BAW filter market. Avago BAW filters are all-silicon MEMS devices manufactured with Avago's FBAR and Microcap technologies.

MEMS microphone shipments to climb 30% this year

Thu, 2 Feb 2013

Shipments of MEMS microphones in 2012 amounted to 2.05 billion units, up 57% from 1.30 billion in 2011, according to IHS iSuppli. Shipments will climb by another 30% to 2.66 billion units in 2013, to be followed by at least three more years of notable double-digit-rate increases.

STMicroelectronics is first $1 billion MEMS company

Wed, 2 Feb 2013

Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.

IDT announces world’s lowest jitter MEMS oscillators with integrated frequency margining capability

Tue, 3 Mar 2013

Integrated Device Technology, Inc. yesterday announced the industry’s first differential MEMS oscillators with 100 femtosecond (fs) typical phase jitter performance and integrated frequency margining capability.

“State of the MEMS Industry” market study to be presented at Smart Systems Integration Conference

Mon, 3 Mar 2013

Roger Grace to present MEMS Commercialization Report Card at annual international technical forum.

Nanoelectronics Conference will focus on semiconductor industry’s future

Fri, 3 Mar 2013

How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25-28, 2013, at its campus in Gaithersburg, Md.

MEMS pressure sensors in cellphones set to rise to 681M units in 2016

Wed, 3 Mar 2013

Shipments this year are expected to double to 162 million units, as presented in the attached figure, primarily due to Samsung’s usage of pressure sensors in the Galaxy S4 and other smartphone models.

STMicroelectronics and CMP’s MEMS manufacturing process available for prototyping

Tue, 3 Mar 2013

STMicroelectronics and CMP today announced that ST's THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.

New miniaturization record by STMicroelectronics makes more room for mobile functionality

Mon, 4 Apr 2013

STMicroelectronics has introduced the world's smallest TVS diode for protecting sensitive electronics in consumer products and handhelds.

STMicroelectronics heads European research team in advanced MEMS devices development

Thu, 4 Apr 2013

STMicroelectronics has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU), a public-private partnership in nanoelectronics.

Brewer Science installs scale-up reactor to support electronics-grade carbon nanotube materials

Mon, 3 Mar 2013

Brewer Science, a developer of lithography enhancement materials for semiconductor manufacturing, announces the installation of a scale-up reactor to increase production of its CNTRENE C100 family of electronics-grade CNT materials by tenfold.

Freescale Semiconductor installs Advantest's production platform for testing MEMS-based sensors

Thu, 3 Mar 2013

Semiconductor test equipment supplier Advantest Corporation entered the high-growth market for testing MEMS-based sensors by installing V93000 Smart Scale systems at several of Freescale Semiconductor's facilities around the world.

Chinese cellphone and tablet makers gain share in MEMS sensor purchasing in 2012

Thu, 3 Mar 2013

China-based manufacturers of cellphones and tablets in 2012 more than doubled their share of purchases of MEMS motion sensors, reflecting the rising prominence of the companies in the global market, according to an IHS iSuppli MEMS Topical Report from information and analytics provider IHS.

SiTime enters smartphone market with first MEMS oscillator

Wed, 3 Mar 2013

SiTime Corporation, one of the fastest growing semiconductor companies, today introduced the SiT15xx family of 32 kHz MEMS oscillators that are intended to replace legacy quartz crystal resonators.

New energy-efficient interface IC to provide voltage regulation for piezoelectric energy harvesters

Tue, 3 Mar 2013

Holst Centre and imec have developed an integrated piezoelectric energy interface IC with zero bias rectifier circuit and energy-aware supply regulator.

Emerging consumer applications are boosting the growth of the MEMS pressure sensor market

Tue, 3 Mar 2013

MEMS pressure sensor is one of the very first MEMS components appearing in the microsystem world. The technologies are quite mature and the market is big and expected to grow from $1.9B in 2012 to $3B in 2018.

Smallest MEMS microphone designed for hearing aid applications features low EIN and power consumption

Tue, 3 Mar 2013

Analog Devices ADMP801 MEMS microphone delivers 27 dBA EIN, consumes only 17 µA at 1 V supply, and is available in a 7.3 mm³ package.

SUNY’s CNSE undergrad to receive the nation’s most prestigious award for science and engineering

Tue, 4 Apr 2013

Zachary Olmsted, a junior Nanoscale Engineering major at SUNY’s College of Nanoscale Science and Engineering (CNSE), has been chosen to receive the prestigious Barry M. Goldwater Scholarship, the second consecutive year that a CNSE student has been honored with the nation’s premier undergraduate award designed to foster and encourage outstanding students to pursue careers in the fields of mathematics, the natural sciences, and engineering.

High-value MEMS market growth slows due to weak medical electronics and industrial sectors

Tue, 4 Apr 2013

The high-value microelectromechanical system (MEMS) market experienced soft growth last year, mainly due to weakness in the mainstay medical electronics and industrial sectors, according to an IHS iSuppli MEMS High-Value MEMS Market Tracker Report from information and analytics provider IHS.

Unsettled economic situation leaves mark on microtechnology industry

Tue, 4 Apr 2013

A year ago, the microtechnology, nanotechnology, and advanced materials industry looked out on the year 2012 with quite positive expectations. As it turned out, the unstable economic situation has left its mark on these industries, too. For 2013, at least, the companies expect a slight upwards trend.

Imec IEDM presentations to cover More than Moore, ITRS

Thu, 8 Aug 2010

16 papers with imec authors were accepted for IEEE International Electron Devices Meeting (IEDM), December 6-8, 2010, in San Francisco. Both ITRS-related as well as More-than-Moore-related research papers have been accepted, rewarding imec’s multidisciplinary R&D platform (featuring two state-of-the-art R&D fabs).

SEMICON Taiwan preview: Forums span key technology, markets

Tue, 8 Aug 2011

SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.

Analyst: MEMS test equipment priorities: low-cost, standardized

Fri, 3 Mar 2008
Mar. 28, 2008 - In a sector dominated by expensive customized products, the best opportunities in the MEMS test equipment market are to develop cost-effective standardized technologies, according to a new report from Frost & Sullivan.

MEMS, packaging groups to support others' efforts

Mon, 11 Nov 2007
November 19, 2007 - The MEMS Industry Group, a trade association representing MEMS and microstructure industries, and the MicroElectronics Packaging and Test Engineering Council (MEPTEC) have formed a strategic alliance to support each other's goals and industry events, through a variety of marketing programs.

AlSiC Metal Matrix Composite Assemblies

Mon, 12 Dec 2008
AlSiC hermetic packaging assemblies from CPS Technologies offer an alternative to traditional thermal management hermetic packaging materials such as CuMo and CuW. The combinations of lightweight, high thermal conductivity, CTE matching, and low cost make it appropriate for applications in which thermal management and/or weight are important.

Lee to Deliver Keynote at MEPTEC MEMS Packaging Symposium

Fri, 4 Apr 2008
(April 18, 2008) Medicine Park, OK — Luke P. Lee, Ph.D., from the Department of Bioengineering at UC Berkeley has been selected as keynote speaker for MEPTEC's 6th Annual MEMS Packaging symposium titled "MEMS Market Evolution: From Technology Push to Market Pull" on May 22, 2008. This one-day event will take place at the Wyndham Hotel, San Jose, CA.

New Analysis Estimates MEMS Market to Reach $120.2M in 2014

Thu, 3 Mar 2008
(March 27, 2008) PALO ALTO, CA — If the MEMS test equipment market is to match the pace of the overall MEMS market, it has to develop cost-effective, standardized solutions. This is especially pertinent in a market where expensive customized products vastly outnumber off-the-shelf products. New analysis from Frost & Sullivan "World MEMS Test Equipment Markets," finds that the market earned revenues of $56.5M in 2007 and estimates this to reach $120.2M in 2014.

MEMUNITY Announces 8th Workshop on Wafer-Level MEMS Testing

Fri, 2 Feb 2008
(February 1, 2008) Dresden, GERMANY — Following a successful series of events held in Europe, MEMUNITY has announced its eighth workshop under the title "Critical Success Factors for Commercialization: Production Test of MEMS at Wafer Level". The workshop will be held on March 13 at the Institute for Microelectronic and Micromechanical Systems (IMMS) in Ilmenau, Germany.

IIT Bombay Selects EV Group Bonders for Micro-Fabricated Sensor R&D Project

Tue, 2 Feb 2008
(February 5, 2008) St Florian, Austria — EV Group (EVG) has announced it has received an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG's MEMS-focused systems. The systems will be for a new Indian government-supported automotive MEMS R&D project and are slated for installation this month in IIT Bombay's Mumbai facility.

Another Word on Nano

Tue, 6 Jun 2006
The day after I wrote my last editorial entitled Nano-inspiration, I attended the MEMS and Nanotechnology session at the IMAPS New England Symposium, May 16, in Boxborough, MA. There was so much discussion about nano-hype, multiple definitions of nano, how nanomaterials are made, and what you can do with them that I wished the session had occurred a few days earlier.

SEMI Holds Meeting on MEMS Packaging Standards

Tue, 6 Jun 2006
(June 6, 2006) SAN JOSE, CA — If you're like most people who responded to SEMI's survey on MEMS packaging standards, you're not aware that SEMI has published three MEMS-related standards. Existing standards cover microscale fluidic systems, terminology, and wafer bonding. SEMI's MEMS technical committee has identified MEMS packaging as a task force area, and standardization efforts are just beginning.

SEMI Announces Competition

Wed, 12 Dec 2006
(December 13, 2006) SAN JOSE, CA — SEMI put out a call for innovations for the fifth annual Technology Innovation Showcase (TIS) to be held in conjunction with SEMICON West 2007, July 17 – 19, 2007, in San Francisco. Nanotechnology, MEMS, test, assembly, packaging, and wafer processing submissions are sought by February 2, 2007.

MEMS drive supply chain changes with new applications

Thu, 9 Sep 2011

Yole Développement shares highlights from its latest "Status of the MEMS Industry" report, noting changes in the MEMS supply chain as companies add foundries or go fab-lite, and multi-chip MEMS packages create new relationships between companies.

MEMS die size grows, test evolves, and other trends

Mon, 12 Dec 2011

Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.

STMicroelectronics uses TSV in high-volume MEMS devices

Tue, 10 Oct 2011

STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.

Imec wafer-level MEMS packaging relies on nanoporous alumina membrane

Fri, 10 Oct 2011

Imec engineers have simplified the thin-film wafer-level MEMS packaging process with nanopores that prevent leaks into the package and a low-temperature processing approach.

SUSS MicroTec partners for health research

Fri, 11 Nov 2011

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH).

IDT MEMS oscillator commercializes piezoelectric resonators

Wed, 11 Nov 2011

Integrated Device Technology, Inc. (IDT, NASDAQ:IDTI) developed and demonstrated commercially available oscillators incorporating piezoelectric micro electro mechanical system (pMEMS) resonators.

Cornell, SRC develop RF MEMS technologies

Wed, 12 Dec 2011

Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.

AFM images MEMS structures with quantitative measurements

Thu, 12 Dec 2011

JPK Instruments introduced QI, or quantitative imaging mode, for the recently launched NanoWizard3 AFM analytical system. QI enables full control of tip-sample force at every pixel.

imec presents MEMS energy harvester at IEDM

Thu, 12 Dec 2011

Imec and Holst Centre micromachined a vibration-energy harvester with 489µW output power, using piezoelectric material in a MEMS cantilever. The team presented results at IEEE's International Electron Devices Meeting (IEDM) this week in Washington DC.

Tronics wins MEMS fab contract from DelfMEMS

Tue, 12 Dec 2011

DelfMEMS SA named Tronics as its micro electro mechanical systems (MEMS) foundry partner. Tronics will manufacture RF MEMS switches for DelfMEMS, with high-capacity runs starting in 2012.

AFM attachment uses rare-earth magnets for conductive and magnetic microscopy

Tue, 11 Nov 2011

Asylum Research introduced the Variable Field Module2 (VFM2) for the MFP-3D AFM. It allows researchers to apply magnetic fields in conductive AFM experiments, magnetic force microscopy, and other applications.

Silex MEMS TSV tech licensed to Nanoshift

Wed, 11 Nov 2011

Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.

BSI image sensors avoid distortion with Ziptronix bonding process

Thu, 11 Nov 2011

Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature processing and high bond strength, the company reports.

Sensor fusion opens MEMS supply chain to sensor management players

Fri, 11 Nov 2011

Yole Développement's new report, "Inertial Combo Sensors for Consumer & Automotive" shows that supply chains need to adapt to the "very large market opportunity" for inertial combo sensors.

Silex, AMFitzgerald accelerate MEMS ramp with DfM

Mon, 11 Nov 2011

MEMS foundry Silex Microsystems and MEMS development firm A.M. Fitzgerald & Associates completed a multi-year collaboration on medical and biotech MEMS development, halving device development time.

Micralyne brings MEMS design, prototyping partner into foundry model

Mon, 11 Nov 2011

MEMS foundry Micralyne Inc. brought Nanoshift LLC, a product development firm specializing in emerging technologies, on board for design, process development, fabrication and packaging partnerships.

MEMS packaging and test project aims for space

Tue, 11 Nov 2011

The Heterogeneous Technology Alliance in Europe is developing new packaging and test methods for MEMS targeting space missions.

EVG moves Chinese SOI bonder customer to full automation

Thu, 11 Nov 2011

Shanghai Simgui Technology Co. Ltd., a Chinese wafer manufacturer, placed a follow-on order for an EVG850 automated production bonding system for SOI wafer bonding. Simgui is moving from EVG's semi-automated wafer bonder to advance high-volume SOI production.

Multitest launches MEMS microphone tester with European order

Thu, 9 Sep 2011

The InPhone microphone test system can be combined with the Multitest InStrip test handler for highly parallel MEMS test and the calibration of MEMS microphones.

MEMS oscillator maker taps Multitest for test handling

Wed, 9 Sep 2011

A MEMS oscillator maker chose the MT9928 xm tri-temp test handler from Multitest for a novel oscillator application. The MEMS device required extremely accurate temperature calibration.

Agilent NanoSuite software improves nano indentation, tensile testing

Thu, 4 Apr 2011

NanoSuite 6.0 promises speed, flexibility, ease of use and new application methods for nanomechanical properties measurements involving polymers, composites, thin film materials, MEMS, surface topology, stiffness mapping, and scratch testing.

Optical systems capture microfluidic experiment data

Wed, 4 Apr 2011

Optical systems that capture high-quality still and moving images of microfluidic experiments from DolomiteDolomite launched a range of optical systems that capture high-quality still and moving images of microfluidic experiments. Applications include testing various microfluidic chips for droplet generation and particle imaging, etc.

Helios Crew SemiLEDs intros LED packaged with MEMS

Wed, 2 Feb 2011

MEMS packaged LED from HCCHelios Crew Corporation (HCC) Taiwan released its LED product S35, a packaged component LED that integrates MEMS with semiconductor processing to produce a unique silicon packaging technology.

Dolomite chip holder allows microfluidic temperature control

Mon, 2 Feb 2011

Dolomite's Hotplate Adaptor - Chip Holder HDolomite, microfluidic designer and manufacturer, expanded its range of temperature control systems with the Hotplate Adaptor - Chip Holder H, which allows control over internal temperatures of microfluidic chips without any disruptions to the fluid flow.

Hermetic wafer-level packaging lowers cost with IMT Au-Au bond

Tue, 3 Mar 2011

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.

MEMS wafers characterized by Zebraoptical integrated metrology tool

Tue, 5 May 2011

Zebraoptical Integrated Metrology Tool (ZIMT)Sunrise Optical LLC debuted the Zebraoptical low coherence fiber optic interferometer with microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on micro electromechanical system (MEMS) wafers.

Wafer bonding: Many options for many devices

Tue, 5 May 2011

Wafer bonding. SOURCE: Yole May 2011. Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.

MEMS packaging conference planned for 2011

Tue, 12 Dec 2010

The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.

From the 2004 archives: Michigan researchers, companies continue to engineer growth

Fri, 2 Feb 2005
Each year, Small Times ranks the U.S. states for their research, development and commercialization proficiency in the areas of nanotechnology, MEMS and microsystems. Last year, Michigan ranked eighth. Its 2004 report card follows.

Apogee begins testing MEMS medical device

Fri, 3 Mar 2005

ASM service to facilitate successful MEMS packaging

Thu, 6 Jun 2007
Recognizing that packaging and manufacturing are among the most crucial challenges facing MEMS engineers, ASM International has announced its MEMS Materials Database: Packaging Module to facilitate materials selection for MEMS packages.

Micralyne signs MEMS manufacturing deal

Mon, 2 Feb 2004
Micralyne Inc., an Edmonton, Alberta, based MEMS manufacturer, has signed a contract worth more than $2 million to make components for chemical analysis instrumentation, according to a news release.

Rainier adds MEMS PR practice

Tue, 6 Jun 2003
Rainier Corp., a Princeton, Mass.-based public relations and advertising agency, has launched a MEMS practice, according to a news release.

For MEMS, the key to lowering cost is all in the packaging

Thu, 11 Nov 2002
Carsten Bahle of Wicht Technologie Consulting doesn’t mince words when it comes to the need to rethink MEMS packaging. “The biggest stumbling block to commercial success is the lack of general, simple and effective packaging techniques,” he said. The reason is simple: cost. Although these microsystems are getting smaller all the time, that doesn’t mean packaging costs are shrinking as well.

IEDM Preview: CMOS imager works from light to night

Fri, 10 Oct 2010

At the upcoming IEDM conference in December, researchers from NoblePeak Vision will explain how they achieved the first large-scale integration of a single-crystal germanium photodiode into a silicon imager, creating a CMOS sensor that offers high-resolution night imaging under moonless conditions.


Mon, 4 Apr 2002

Measurement Specialties delays report, sells fab

Mon, 7 Jul 2002


Tue, 5 May 2001

Engineering Research Center is developing a large-scale treatment for deafness.

Cellucci named Zyvex COO

Mon, 1 Jan 2003
Thomas Cellucci has been promoted to chief operating officer at Zyvex Corp.

Wafer level packaging of image sensors

Sat, 1 Jan 2011
Wafer-level packages that use a glass cover over the package cavity and through-silicon vias to interconnect the die bond pads satisfy the packaging requirements for CMOS image sensors: compact, reliable, low cost, and accommodate both front- and back-illuminated image sensors with no external changes. Giles Humpston, Tessera Inc., San Jose, California, USA

3D MEMS profiler from E M Optomechanical

Mon, 1 Jan 2011

E M Optomechanical Inc. (EMOpto) developed a new low-cost version of its OPTOPro line of 3D MEMS Optical Profilers for use in testing and characterizing MEMS devices. The OPTOPro Model 622-Xe enables capital equipment purchase at less than $20K.

MEMS packaging conference planned for 2011

Tue, 12 Dec 2010

The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.

Palomar unveils MEMS packaging system

Thu, 8 Aug 2002
Palomar Technologies, a California-based maker of precision assembly equipment, said it has launched an automated MEMS packaging system.

EPCOS's tiny sensor comes with MEMS packaging

Sat, 2 Feb 2009
February 20, 2009: EPCOS AG is introducing what the Munich-based company is calling the world's most compact packaged sensors for barometric pressure measurement, and it comes with the firm's chip-sized MEMS packaging.

New book covers MEMS reliability

Mon, 1 Jan 2008
Research and Markets has announced the availability of a new book, Reliability of MEMS.

ISSYS gets grant for MEMS, electronics integration

Thu, 10 Oct 2007
Integrated Sensing Systems Inc. (ISSYS) has received a Phase II Small Business Innovation Research contract from the National Science Foundation. The two-year project, Wafer-Scale, Hermetic Packaging of MEMS-Based Systems," is aimed toward development of a novel packaging method that will greatly simplify the packaging of MEMS and their associated electronics

Quantum Leap's "industry breakthrough" in hermetic packaging targets MEMS

Mon, 3 Mar 2007
Quantum Leap boasts "industry breakthrough" in hermetic packaging

Toshiba develops cost-reducing MEMS packaging

Wed, 6 Jun 2008
June 3, 2008 -- Toshiba has optimized for MEMS two packaging technologies that promise significant cost reductions. The company says it will further develop them for practical use.

Centipede tool to streamline SMI's MEMS testing

Wed, 9 Sep 2008
September 10, 2008: Centipede Systems, an emerging supplier of advanced connectors for electronics, announced that Silicon Microstructures Inc. (SMI), has ordered a Centipede Systems tester to speed micro-electromechanical systems (MEMS) and improve quality at its Milpitas, CA fabrication facility.

MEMS packaging lab augments Infotonics' design and fabrication services

Wed, 2 Feb 2008
With the recent investment of $5 million in MEMS packaging capabilities, Infotonics Technology Center (ITC) is positioning itself as a full-service partner for customers seeking to create new MEMS-based devices and microsystems.

Bosch Sensortec debuts 6DoF MEMS IMU with sensor fusion software

Thu, 5 May 2012

Bosch Sensortec has integrated two triaxial MEMS sensors in 1 package, claiming the smallest IMU to date. Solid State Technology spoke with Leopold Beer at Bosch about MEMS integration and the sensor fusion software element of sensing.

ST packages MEMS in plastic for reliability and form factor upgrade

Tue, 6 Jun 2012

Tohoku University and imec partner to advance research

Mon, 6 Jun 2012

Tohoku University of Sendai, Japan and imec signed a collaboration agreement during the Belgian economic mission to Japan, expanding their R&D into areas such as MRAM and 3D semiconductor packaging.

SEMICON West preview: Maturing MEMS sector looks at ways to work together

Tue, 6 Jun 2012

Driven by the volume consumer business, the maturing MEMS sector starts to look at ways to reduce costs and speed time to market by coming together on things like easing integration, common test methods, and tool replacement parts, reports Paula Doe, SEMI. Fast-moving high-volume markets may also drive MEMS makers toward paring down the vast diversity of processes and packages used, and into more collaboration on a mature ecosystem.

High-volume MEMS manufacturer adds FOGALE metrology tool

Wed, 6 Jun 2012

A major high-volume MEMS maker has purchased a FOGALE nanotech T-MAP DUAL 3D 200A for its US manufacturing facility. The tool will be equipped with 2 load ports and will be fully automated.

SPTS Technologies joins MEMS consortium

Thu, 6 Jun 2012

SPTS Technologies joined the MEMS Consortium, led by the Institute of Microelectronics (IME), a member of the Agency for Science, Technology and Research (A*STAR) in Singapore.

SEMICON West preview: MEMS manufacturing changes with HV consumer apps

Wed, 6 Jun 2012

Paula Doe, SEMI Emerging Markets, covers developments at Applied Materials, Coventor, and other members of the MEMS equipment supply chain that will make MEMS less expensive, smaller, and easier to manufacture.

X-Fab takes majority stake in MFI, widens MEMS portfolio to support growth push

Thu, 11 Nov 2012

X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.

MEMS seeing strong growth in military sector

Mon, 12 Dec 2012

Demand for microelectromechanical systems (MEMS) devices, particularly pressure sensors for harsh environments, will grow 20% in 2012 on the way to a 9% CAGR for the next several years.

Attend MEMS Executive Congress: Keynotes on MEMS in our world

Mon, 8 Aug 2012

MEMS Executive Congress 2012 in Scottsdale, AZ, will host keynotes from Ajith Amerasekera, TI Fellow, IEEE Fellow, in Texas Instruments’ Kilby Labs, who will discuss how immersive intelligent systems will change the management of our cities, buildings, personal life, health, transportation, safety and security; and Robert Brunner, founder, creative director and partner, Ammunition, who will explore the critical connection between brand identity and connection to consumers.

MEMS Industry Group plans webinars on fab challenges, applications, more

Wed, 8 Aug 2012

The MEMS Industry Group (MIG) is planning webinars on micro electro mechanical systems (MEMS) from packaging challenges to how MEMS can benefit healthcare.

Focus on MEMS at SEMICON Taiwan

Mon, 8 Aug 2012

SEMICON Taiwan 2012, held September 5-7, will feature both Taiwan MEMS suppliers and global MEMS elites -- including Asia Pacific Microsystems, Freescale, InvenSense, and STMicroelectronics -- who will discuss innovation in MEMS design, manufacture, packaging, testing and equipment.

How to participate in SensorsCon 2013

Mon, 8 Aug 2012

The second annual SensorsCon 2013, the conference for Sensors Technology, Design and Applications, March 6, 2013, Techmart Center, Santa Clara, CA, is accepting applications for exhibitors, sponsors and speakers.

Wafer-level optics maker orders Heidelberg Instruments lithography tool

Tue, 8 Aug 2012

Heptagon, wafer-level optics maker, ordered an advanced DWL 2000 maskless lithography system from Heidelberg Instruments. The tool has sophisticated Gray Scale Exposure capability.

Micro-rheometer, microdevice adsorbtion get nods in Sandia student MEMS design contest

Thu, 9 Sep 2012

A device that measures very thin quantities of liquid, such as the synovial fluid in knee joints, and a device that measures change in mass when a microdevice adsorbs small amounts of material, earned top honors in Sandia National Labs' annual student MEMS design contest.

GlobalFoundries to fab Sand 9's MEMS timing products

Tue, 10 Oct 2012

Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).

Sensirion debuting tiniest humidity/temperature sensor

Mon, 10 Oct 2012

Sensirion AG says it will debut at Electronica 2012 (Nov. 13-16, Munich, Germany) what it says is the world's smallest humidity and temperature sensor: a 2mm × 2mm × 0.8mm in size, based on its CMOSens technology that combines the sensor and signal processing on a single chip.

Smallest 3-axis MEMS gyroscope: Teardown report released

Wed, 4 Apr 2012

Research and Markets released the "ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis" report, providing a teardown of STMicroelectronics’ MEMS gyroscope in an LGA package.

MEMS and microelectronics undergo contactless delamination tests at Georgia Tech

Fri, 4 Apr 2012

CNSE STC designated trusted foundry for DOD Defense Microelectronics Agency

Thu, 4 Apr 2012

The College of Nanoscale Science and Engineering's (CNSE) Smart System Technology and Commercialization Center of Excellence (STC), Canandaigua, NY, was designated as a Trusted Foundry by the US Department of Defense's Defense Microelectronics Agency.

Audio Precision uncrates PDM interface for MEMS microphone test

Wed, 5 May 2012

Audio Precision released a pulse density modulation (PDM) audio interface option on its APx500 for direct I/O, modulation, and decimation on MEMS microphones and other PDM devices.

SWS Inertial Sensor Development Platform evaluates MEMS behavior, performance

Tue, 5 May 2012

Si-Ware Systems (SWS) launched its Inertial Sensor Development Platform, the SWS61111, a tool that can be used to evaluate an inertial sensor, such as a gyroscope or accelerometer, to understand sensor behavior and performance with complete interface electronics.

Sensory Swarms and MEMS roadmaps on docket at MEPTEC MEMS Technology Symposium

Thu, 5 May 2012

MEPTEC will host its 10th Annual MEMS Technology Symposium in San Jose, CA. Keynotes cover “sensory swarms” and motion interfaces, and sessions will cover MEMS roadmaps; design, manufacturing, and test of MEMS; MEMS architectures and uses, and more.

Guide to MEMS at SEMICON West 2012

Thu, 6 Jun 2012

Paula Doe, SEMI Emerging Markets, shares the annual guide for navigating the MEMS events at SEMICON West, July 10-12 at Moscone Center in San Francisco, CA.

InvenSense claims smallest 6-axis MEMS combo sensor

Tue, 7 Jul 2012

InvenSense (NYSE: INVN), MEMS-based sensor maker, introduced its second-generation MPU-6500 6-axis MotionTracking device for smartphones, tablets, wearable sensors, and other consumer markets.

Spirent MEMS sensor simulator tests sensor fusion algorithms

Tue, 7 Jul 2012

Spirent Communications launched its new SimSENSOR sensor simulation software, enabling R&D technicians to test sensor fusion algorithms in navigation systems that include MEMS inertial sensors and multi-GNSS.

Self-calibrating MEMS override manufacturing variations

Wed, 7 Jul 2012

Purdue researchers have demonstrated self-calibrating MEMS, which enable higher accuracy for existing and new MEMS applications and could eliminate 30% of manufacturing costs by skipping test processes.

MEMS characterization with optical measurement: Polytec presents characterization studies

Fri, 7 Jul 2012

MEMS must be characterized during device development. Polytec asserts that advanced optical measurement techniques are necessary for characterization, as electrical tests can check functionality, but not all physical properties.

Aerotech launches sensor fusion data acquisition device

Fri, 7 Jul 2012

Aerotech’s Sensor Fusion is a 3U data acquisition device integrated with the company’s A3200 motion controller to provide precise time alignment of motion and data acquisition functions.

Yole updates World MEMS Players database for 2012

Tue, 7 Jul 2012

Yole updated its MEMS industry database, World MEMS Players 2012. The product includes contact information for MEMS players, geographical breakdown of the industry, and various MEMS device categories.

Intel Capital increases MEMS focus, leads Movea funding round

Thu, 8 Aug 2012

Movea, motion processing and data fusion technology developer, raised EUR6.5m in a funding round led by Intel Capital, with existing investors iSource and GIMV. We are increasing our involvement in the MEMS sector in general, said Erik Jorgensen, Intel Capital.

NIST promotes lab-on-chip testing standard dev

Wed, 8 Aug 2012

Standardized testing and measurement methods, NIST argues, will enable MEMS lab-on-chip manufacturers to accurately determine important physical characteristics of LOC devices such as dimensions, electrical surface properties, and fluid flow rates and temperatures. These must be calculable at all stages of production, from processing of raw materials to final rollout of products.

JCAP, Enpirion partner on MEMS manufacturing

Tue, 1 Jan 2012

Enpirion, Inc. entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) for the manufacturing of silicon-based magnetics utilizing Enpirion's proprietary micro electronic magnetic silicon (MEMS) technology.

MEMS sensors in integrated smart systems

Wed, 1 Jan 2012

Embedded features and sensor integration will determine the future applications of MEMS sensors. Jay Esfandyari et al, STMicroelectronics, share an overview of future trends of sensor integration -- sensor fusion -- and some of the features available today in digital MEMS inertial sensors.

Fraunhofer micro-scanner MEMS eval kit now configurable online

Fri, 1 Jan 2012

Fraunhofer Institute for Photonic Microsystems IPMS has placed its Light Deflection Cube evaluation kit custom-configuration and ordering on the Internet. The LDC is used to evaluate single-axis MEMS scanning mirrors.

NXP MEMS frequency synthesizer debuts at CES

Tue, 1 Jan 2012

NXP Semiconductors unveiled an ultra-compact, high-precision MEMS-based frequency synthesizer, which challenges quartz-crystal-based devices for the timing market. The die is packaged with IC components in a standard, low-cost plastic package.

Multitest ships first MEMS MT9510 test tool to US IDM

Thu, 1 Jan 2012

Multitest shipped the first Multitest MEMS equipment for the MT9510 pick-and-place test handler to an IDM in the US. The IDM will perform MEMS gyroscope test on the newly installed tool.

Baolab intros eval kits for CMOS-integrated MEMS tech

Mon, 1 Jan 2012

Baolab Microsystems is launching evaluation kits of its 3D CMOS MEMS NanoCompass technology. Baolab's NanoEMS technology creates nanoscale MEMS within the standard metal structure of a high-volume-manufactured CMOS wafer.

Norcada microporous silicon nitride sample holders suit thin film study

Tue, 1 Jan 2012

Norcada launched 2 microporous silicon nitride TEM sample holders, suiting ALD analysis, thin film growth, and other applications under TEM, SEM, or STXM tools.

MEMS panel, tablet teardown, smart grid talk highlights of upcoming Sensors in Design

Thu, 1 Jan 2012

Sensors in Design 2012 takes place March 28-29 in San Jose, CA. With speakers from Texas Instruments and Intel, InvenSense, Analog Devices, and more, the event is designed for attendees to better understand sensor technologies and their applications.

Present at MEMS and nano manufacturing conferences in the UK

Fri, 1 Jan 2012

MM, MEMS & NANO Live UK 2012 will take place at NEC Birmingham, UK, September 25-26, co-located with TCT Live, Mediplas, and Sensing Technology 2012.. Submit an abstract by February 28.

Silex devs wafer-level MEMS fab technologies for mobile devices

Mon, 1 Jan 2012

Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.

Si-Ware platform creates MOEMS on-wafer with lithographic alignment

Tue, 1 Jan 2012

Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.

SCHOTT launches MEMS-wafer borosilicate glass as thin as 0.1mm

Wed, 1 Jan 2012

SCHOTT North America Inc. introduced MEMpax borosilicate glass for use in MEMS manufacturing, available in thicknesses from 1.1 to 0.1mm and with a CTE corresponding to Si.

CNSE MEMS center earns ISO 9001:2008 registration

Mon, 3 Mar 2012

The CNSE STC, which performs micro electromechanical system (MEMS) and nanotechnology-enabled manufacturing and packaging, successfully completed ISO 9001:2008 registration.

Multitest delivers MEMS testing for pick-and-place set ups

Mon, 3 Mar 2012

Multitest expanded its MEMS portfolio to pick-and-place test applications with the introduction of its test and calibration cart for the MT9510.

MEMS at heart of new iNEMI efforts, starting with test/reliability

Tue, 3 Mar 2012

iNEMI began 2 collaborative efforts related to micro electro mechanical system (MEMS) technology, specifically reliability and test, and will host a workshop on MEMS in May.

ACUTRONIC MEMS testers enable economical test at the fab

Mon, 3 Mar 2012

ACUTRONIC released standard, off-the-shelf 2-axis rate tables to test several MEMS devices simultaneously. The 21-series is primarily made for MEMS manufacturers.

Bosch's Akustica enters analog MEMS sector with 2-chip offering

Wed, 3 Mar 2012

Akustica, known for its monolithic single-chip digital MEMS devices, introduced its first analog 2-chip MEMS microphone for mobile handsets, the AKU340.

Microfluidic surface coating agent improves droplet performance

Thu, 3 Mar 2012

Microfluidic systems designer and maker Dolomite released Pico-Glide, a surface coating agent that facilitates advanced droplet microfluidics developed by Sphere Fluidics.

MEMS packaging growth, trends, and special requirements

Tue, 4 Apr 2012

The MEMS packaging sector is growing 2x faster (~20% CAGR) by unit shipments than the larger IC packaging industry, shows Yole Développement in its report “MEMS Packaging.”

Audio Precision launches digital MEMS microphone test option

Tue, 1 Jan 2012

Audio test tool supplier Audio Precision launched the PDM I/O option for its APx500 series audio analyzers, used to test digital micro electro mechanical system (MEMS) microphones.

Inertial MEMS sensor maker Qualtre names engineering leader

Thu, 2 Feb 2012

Qualtré, silicon MEMS inertial sensors developer, appointed Dr. Ijaz Jafri as VP of engineering, responsible for all aspects of product development and commercialization. Jafri has 16+ years of experience in MEMS and semiconductors.

Nextreme brings thin-film on-par with bulk thermoelectrics

Mon, 2 Feb 2012

Nextreme Thermal Solutions announced that its thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.

MEMS supplier Si-Ware Systems launches US subsidiary

Wed, 2 Feb 2012

Si-Ware Systems (SWS) launched a US subsidiary, Si-Ware Systems Inc. Scott Smyser, a new EVP for worldwide marketing and business development, will manage the US business.

Colibrys relocates to new premises with $10M investment

Thu, 2 Feb 2012

MEMS maker Colibrys SA will relocate locally, to the Y-Parc at Yverdon-les-Bains, Canton Vaud, Switzerland. The new location will enable Colibrys to branch out into new application sectors.

Attend "MEMS Commercialization" at MM/MEMS/NANO Live USA

Fri, 2 Feb 2012

At MM/MEMS/NANO Live USA, Professor Yogesh Gianchandani, University of Michigan Wireless Integrated Microsystems and Sensors Center, will keynote the MEMS Commercialization: From Lab to Fab to the Market session.

Nanolab Technologies doubles space for IC analysis services

Wed, 2 Feb 2012

Nanolab Technologies Incorporated inaugurated its 47,000sq.ft. state-of-the-art facility in Milpitas, CA, more than doubling Nanolab Technologies' space.

MEMSIC (MEMS) shares 2012 goals

Thu, 3 Mar 2012

After reporting Q4 2011 results, MEMS supplier MEMSIC Inc. (NasdaqGM: MEMS) discussed its 2 main goals for 2012.

3D-IC: Two for one

Wed, 9 Sep 2013
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about upcoming events related to 3D ICs.

All ST’s front-end manufacturing sites achieves ISO 50001 energy-management certification

Tue, 10 Oct 2013
STMicroelectronics this week has announced that all six of its front-end manufacturing sites have achieved certification to the latest, most stringent ISO 50001 energy-management standard.

From smart cars to smart cities: Shaping the future of microelectronics at ITPC 2013

Wed, 10 Oct 2013
Experts in aerospace, automotive, mobile communications, Smart Cities and more join semiconductor leaders to shape the future of microelectronics at the International Technology Partners Conference (ITPC), to be held in Maui, Hawaii, on November 10-13.

STMicroelectronics receives Innovation Management Award for chip manufacturing tech

Wed, 10 Oct 2013
STMicroelectronics announced on Tuesday it has won a prestigious BearingPoint Innovation Management Award for its FD-SOI technology in the "Innovation Ecosystem" category.

InvenSense opens Korean design center

Wed, 10 Oct 2013
InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the opening of a new design center in Seoul, Korea.

MEMS is still on a dynamic growth path, targeting USD 22.5 billion in 2018

Tue, 8 Aug 2013

In 2012, the IC industry saw a two percent decline, but Yole Développement's research reveals the MEMS sector managed another 10 percent growth to become an $11B business.

InvenSense announces headquarters relocation

Fri, 8 Aug 2013

InvenSense, Inc., a provider of MotionTracking system on chip devices, is relocating its headquarters to 1745 Technology Drive, San Jose, California.

Sono-Tek expands in-house laboratory testing facilities

Tue, 8 Aug 2013

Sono-Tek Corporation, a global ultrasonic spray technology company, announces a just completed expansion of their laboratory testing facility, located at their corporate headquarters in Milton, NY.

Micralyne and Adament to develop MEMS-based fiber-optic subsystems

Wed, 7 Jul 2013

Companies announce alliance to bring high-performance sensors to market.

EU FP7 continues to support Europractice IC services

Thu, 7 Jul 2013

Together with its partners STFC and Fraunhofer IIS, imec announced today that the European Commission has pledged to continue funding the Europractice IC services for another three years under the Seventh Framework Programme (FP7).

Driven by Apple and Samsung, light sensors achieve double-digit revenue growth

Tue, 7 Jul 2013

Light and proximity sensors in mobile handsets and tablets are set for expansive double-digit growth within a five-year period, thanks to increasing usage by electronic giants Samsung and Apple.

MEMS New Product Development: The importance of product validation

Wed, 7 Jul 2013

Product validation is an essential part of all successful MEMS new product developments. It is the process of testing products under various environmental, mechanical or electrical conditions to simulate life in an accelerated manner.

New NIST nanoscale indenter takes novel approach to measuring surface properties

Thu, 7 Jul 2013

Researchers from the National Institute of Standards and Technology (NIST) and the University of North Carolina have demonstrated a new design for an instrument, a "instrumented nanoscale indenter," that makes sensitive measurements of the mechanical properties of thin films -- ranging from auto body coatings to microelectronic devices -- and biomaterials.

MediaTek introduces tablet SoC

Mon, 7 Jul 2013

MediaTek Inc., a  fabless semiconductor company for wireless communications and digital multimedia solutions, today announced its breakthrough MT8135 system-on-chip (SoC) for high-end tablets.

Advancing graphene for post-silicon computer logic

Tue, 9 Sep 2013
Team of UC Riverside researchers pioneer new approach for graphene logic circuits.

Sand 9 launches new MEMS timing products

Tue, 9 Sep 2013
Sand 9, Inc. today announced the first MEMS timing products specifically designed to meet the stringent performance, cost, size and reliability requirements of high-volume mobile applications

Next level of MEMS industry development to be examined at SEMICON Europa

Thu, 9 Sep 2013
Driven by value-creating applications in mobile phones, automotive, displays and other systems, the global MEMS industry has grown to over $11 billion in 2012, a 10 percent compound annual average growth rate since 2008.

Tailored gyroscopes from STMicroelectronics target shake-free images on mobiles and cameras

Tue, 9 Sep 2013
STMicroelectronics has introduced a new family of gyroscopes specifically optimized for optical image stabilization in smartphones and digital still cameras.

The advantages of a hybrid scan test solution

Thu, 9 Sep 2013
Scan testing is the standard practice for test of integrated circuits. The vast majority of IC production test is based on automatic test pattern generation (ATPG) using the scan logic.

STMicroelectronics chip controls Pebble Smartwatch

Wed, 9 Sep 2013
STMicroelectronics announced this week that its STM32 microcontroller is the brain controlling the innovative Pebble Smartwatch for iPhone and Android.

EU project to industrialize world record high-density capacitors

Wed, 10 Oct 2013
CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

MIG honors STMicroelectronics with three different awards

Mon, 11 Nov 2013
STMicroelectronics has been selected by MEMS Industry Group and affiliated voters as the Company of the Year for its continuing success in growing its MEMS business, expanding its product line, and demonstrating industry leadership and vision.

Annual MEMS Executive Conference shows why MEMS is growing 2x faster than semiconductors

Fri, 11 Nov 2013
MEMS Industry Group (MIG)'s MEMS Executive Congress -- held November 7-8, 2013 in Napa, CA -- showed why the MEMS industry is outpacing the semiconductor industry, in both growth and innovation.

Will MEMS applications be the driver for future growth of thin film PZT?

Thu, 11 Nov 2013
In September 2013, EPSON announced its next generation inkjet technology, PrecisionCore, introducing for the first time MEMS inkjet heads manufactured with thin film PZT technology. This announcement has been highly publicized: first, thin film PZT MEMS applications are now on the market, proving the reliability and maturity of this technology. Second, more inkjet head players will soon follow.

STMicroelectronics boosts safety, reliability and efficiency of industrial-automation systems

Thu, 11 Nov 2013
STMicroelectronics announced that it is launching its new ISO8200B, an innovative isolated power switch that enables smaller, more robust and energy-efficient controllers for industrial automation equipment.

Leti announces MEMS research collaboration with OMRON

Wed, 11 Nov 2013
CEA-Leti today announced a development agreement that will utilize Leti’s deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, healthcare and consumer-goods industries.

STMicroelectronics reveals advanced MEMS accelerometers

Tue, 12 Dec 2013
Innovative design boosts the sensor's thermal and mechanical stability to deliver robust high performance in ultra space-saving footprint.

STMicroelectronics imaging technology helps visually impaired

Wed, 12 Dec 2013
STMicroelectronics announced that its 5.1 mega-pixel camera module and low-power digital image processor are being used in the revolutionary OrCam camera, a small device that clips on to eyeglasses and dramatically improves the mobility and ability of visually-impaired people to "read" signs, packaging and publications.

SPTS named Supplier of the Year at the Annual MEMS Executive Congress

Mon, 12 Dec 2013
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, was named MEMS Supplier of the Year at the MEMS Executive Congress U.S. 2013 held in Napa last month

STMicroelectronics reveals 9-axis movement/position sensor

Tue, 1 Jan 2014
STMicroelectronics has revealed its most advanced module for 9-axis movement and position sensing in next-generation mobiles and tiny wearable devices.

Oxford Instruments shares expertise with nanotechnology researchers in India

Tue, 1 Jan 2014
Oxford Instruments has just completed its second series of successful and well attended seminars in India following its first in Bangalore in 2012.

Yole Développement addresses MEMS sensor challenges at January technology seminar

Thu, 1 Jan 2014
Yole Développement will host a MEMS & Imaging Technology Seminar in Korea on January 16, 2014.

7) MEMSIC announces wearable connected watch kit

Sun, 1 Jan 2010

8) Entropic and NAGRA to integrate SoC for set-top boxes

Sun, 1 Jan 2010

2014 Outlook: An era of unprecedented change

Fri, 1 Jan 2014
We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

2014 outlook: MEMS on the rise

Thu, 1 Jan 2013
Looking at the global MEMS market, industry experts are predicting double-digit device growth in the next three to five years.

MEMS Industry Group explores the “MEMS-enabled Life” at MEMS Executive Congress Europe 2014

Tue, 1 Jan 2014
MEMS Industry Group (MIG) will host its third annual MEMS Executive Congress® Europe, 11 March, 2014 in Munich, Germany.

Presto and DelfMEMS collaborate to design ultra fast RF MEMS test solution

Thu, 1 Jan 2014
Presto Engineering, Inc. and DelfMEMS announced today that they have worked together to design, from specification to integration, the first full PXI-based test system for ultra-fast characterization testing of radio frequency (RF) micro-electro-mechanical-systems (MEMS).

"MEMS and NEMS processing advances" discussed at IEMN, Lille, France workshop on 8th April 2014

Mon, 2 Feb 2014
"Nanoscale Processing for NEMS and MEMS" is the topic for the next Oxford Instruments technical workshop, being hosted in conjunction with the Institute of Electronics Micro-electronics and Nanotechnology (IEMN) in Lille, France on 8th April 2014.

Samsung and UCSF partner to accelerate new innovations in preventive health technology

Fri, 2 Feb 2014
Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.

Multitest ships fully integrated test cell for pressure sensor application

Wed, 3 Mar 2014
Early this year, Multitest shipped the first fully integrated test cell for a pressure sensor application consisting of handling systems, ATE and contactors including the pressure unit.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

Wed, 3 Mar 2014
Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

Akustica's newest MEMS microphone targets smartphones and wearables

Tue, 3 Mar 2014
Akustica, Inc., a Bosch Group company and provider of MEMS microphones, has added four new high-performance analog microphones to its high definition (HD) voice product line, including the AKU346, the industry’'s smallest MEMS microphone to achieve 64dB SNR.

Eveon and Leti mark milestone in fabrication of smart bolus-type micro-pump for drug delivery

Thu, 3 Mar 2014
Eveon and CEA-Leti today announced the demonstration of liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process.

MEMS microphones broadcast strong growth

Fri, 4 Apr 2014
Global revenue for MEMS microphones is forecast to reach $1.04 billion this year, up a robust 24 percent from $836.9 million in 2013.

Memory design challenges require giga-scale SPICE simulation

Thu, 5 May 2014
Embedded memory is now consuming most of the area on an SoC chip. Complexity and circuit size are only growing, which means smaller process geometries, larger designs, and tighter design margins.

ANSYS and Intel collaborate on reference flow for power, EM and reliability sign-off

Wed, 6 Jun 2014
ANSYS, Inc., and Intel Corporation announced the availability of a production-proven reference flow for power, EM and reliability sign-off using ANSYS simulation solutions for Intel's 14nm Tri-Gate process, showcasing it at last week's Design Automation Conference.

Imaging without limits: Phones lead growth but innovative applications expanding the market

Fri, 7 Jul 2014
To address the rising demands of imaging systems in mobile, medical, automotive and other technology applications, the Imaging Without Limits Conference (7-8 October) will be introduced at SEMICON Europa 2014 this year to address this surging market.

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

Tue, 7 Jul 2014
Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

Materials matter — Enabling the future of IC fabrication and packaging

Thu, 7 Jul 2014
The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

NJR and UMC extend collaboration on MEMS microphone manufacturing

Thu, 8 Aug 2014
New Japan Radio Co., Ltd. and United Microelectronics Corporation, a global semiconductor foundry, today announced that the two companies have successfully collaborated to achieve high-volume manufacturing for NJR's MEMS microphone products.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

Tue, 8 Aug 2014
University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer

Fri, 8 Aug 2014
MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

S2C opens Korean office and appoints country manager

Tue, 8 Aug 2014
S2C, Inc. announced today the opening of a direct sales and support office in Seoul, Korea, appointing Suk-Ha Lee (SH Lee) as country manager.

Intel releases new packaging, test technologies for 14nm foundries

Wed, 8 Aug 2014
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

MEMS Industry Group hosts 10th annual MEMS Executive Congress US

Thu, 8 Aug 2014
MEMS Industry Group (MIG) will host MEMS Executive Congress US 2014, an annual business conference and networking event for the MEMS and sensors industry, November 5-7, 2014 in Scottsdale, AZ.

SEMICON Taiwan 2014 opens today with spotlight on 3D-IC, sustainable manufacturing, and MEMS

Wed, 9 Sep 2014
Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $24 billion in the next two years on equipment and materials, powering excitement for SEMICON Taiwan 2014, which opened today in Taipei.

Oxford Instruments launches 3rd annual Indian nanotechnology seminars in Kolkata and Delhi

Thu, 9 Sep 2014
Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

Rudolph introduces new acoustic metrology and defect inspection technology

Thu, 9 Sep 2014
Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

Boston Semi Equipment creates industry's largest independent ATE organization

Wed, 10 Oct 2014
Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

EV Group unveils room-temperature covalent bonder

Mon, 10 Oct 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 580 ComBond.

Adoption of SiC & GaN to directly impact the power electronics industry

Mon, 10 Oct 2014
Emergence of new wide bandgap (WBG) technologies such as SiC and GaN materials will definitely reshape part of the established power electronics industry, according to Yole Développement (Yole).

Wearable sensor market to expand sevenfold in five years

Thu, 10 Oct 2014
Driven by rising demand for fitness and health monitoring features as well as by improved user interfaces, shipments of sensors used in wearable electronic devices will rise by a factor of seven from 2013 through 2019

MEMS Industry Group goes to the 'Shark Tank' for MEMS and sensor-based products

Mon, 10 Oct 2014
MIG announces finalists for Elevator Pitch Session at MEMS Executive Congress US 2014.

Finalists announced for MEMS Executive Congress US 2014

Thu, 10 Oct 2014
Six companies selected from a pool of applicants will compete in MEMS Industry Group's (MIG)'s MEMS & Sensors Technology Showcase at MEMS Executive Congress.

STMicroelectronics tops five billion MEMS sensors shipped

Thu, 10 Oct 2014
Beyond gaming systems, smartphones, tablets, navigation systems, and other widely adopted applications, ST’s sensors have also been used in thousands of other useful, fun, and valuable applications.

IMAPS Award Winners for 2014

Fri, 10 Oct 2014
At the IMAPS (International Microelecronics & Packaging Society) meeting last week, several of their key annual awards were given out.

MegaChips to acquire SiTime for $200M

Wed, 10 Oct 2014
SiTime Corporation, a MEMS and analog semiconductor company, today announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.

Apple and Samsung drive adoption of next-generation sensors

Mon, 11 Nov 2014
Propelled by the race between Apple and Samsung to enhance their mobile products with cutting-edge sensor technology, the market for sensors in cellphones and tablets is set to nearly triple from 2012 through 2018, according to IHS Technology.

MEMS Industry Group announces first open-source Algorithm Community

Thu, 11 Nov 2014
MEMS Executive Congress -- Karen Lightman, executive director of MEMS Industry Group (MIG), today announced the first open-source algorithm cooperative, Accelerated Innovation Community (AIC), during her opening remarks at MEMS Executive Congress US 2014.

Sand 9 granted core patent for piezoelectric MEMS microphones

Mon, 11 Nov 2014
Sand 9, Inc., a developer of piezoelectric MEMS timing products for wireless and wired applications, today announced that the United States Patent and Trademark Office has granted the company a core patent based on the use of piezoelectric MEMS for a wafer-level, chip-scale packaged microphone.

Cavendish Kinetics secures funding to accelerate the growth of the RF MEMS market

Tue, 11 Nov 2014
Cavendish Kinetics, the provider of high-performance RF MEMS tuning solutions for mobile and wearable devices, today announced the closing of a $7 million funding round as well as the appointment of Gilles Delfassy to its board of directors.

mCube named MEMS Start-Up of the Year at MEMS Executive Congress

Thu, 11 Nov 2014
mCube, provider of the world’s smallest MEMS motion sensors, today announced the company secured three awards at last week’s MEMS Executive Congress for its significant innovations in MEMS and sensors

Holst Centre, imec and CARTAMUNDI join forces to create the near field communication chip of the future

Wed, 11 Nov 2014
Holst Centre, set up by the Belgian nanoelectronics research center imec and the Dutch research institute TNO, and Cartamundi NV have announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags.

SCHOTT advances MEMS technology by using HermeS glass wafers with through glass vias

Wed, 11 Nov 2014
The international technology group SCHOTT is expanding its HermeS wafers with hermetically sealed, solid through glass vias (TGV) into MEMS applications.

X-FAB MEMS Foundry wins “Foundry of the Year” Award at MEMS Executive Congress

Thu, 11 Nov 2014
X-FAB MEMS Foundry today announced it received the “MEMS Foundry of the Year” award at the Best in MEMS & Sensors Innovation Awards ceremony, as part of the MEMS Industry Group’s 10th annual MEMS Executive Congress held in Scottsdale, Arizona last week.

11) 3D Integration of Diverse Technologies for Self-Driving Vehicles

Tue, 11 Nov 2013

13) Combating Alzheimer’s Disease with MEMS Technology

Tue, 11 Nov 2013

AXSEM and SIGFOX announce ‘ultra-low-power’ System-on-Chip solution

Wed, 12 Dec 2014
AXSEM, a developer of lowest-power radio microcontrollers, and SIGFOX, a developer of cost-effective, energy-efficient Internet of Things connectivity, today announced that AXSEM’s system-on-chip (SoC) with an AX8052 microcontroller has been certified SIGFOX Ready for two-way connectivity.

What to expect from the 3rd Edition of the European 3D TSV Summit

Thu, 12 Dec 2014
Interview with SEMI Europe’s Yann Guillou gives attendees a preview of the event.

OCEASOFT harnesses SIGFOX IoT network in Cobalt S3 sensor family for cloud connectivity

Tue, 12 Dec 2014
Industrial Internet of Things sensor-monitoring solution opens new vistas in pollution and environmental applications, other remote-sensing sectors.

3D TSV begins

Wed, 12 Dec 2014
“Engineering samples have already started to ship and preparation is on-going for entering volume manufacturing,” announces Yole.

System Plus analyzes the world's smallest microbolometer-based thermal imaging camera core released by FLIR

Thu, 12 Dec 2014
Initially focused on the military, uncooled thermal camera sales have grown significantly due to substantial cost reduction of micro bolometers and growing adoption in commercial markets, including thermography, automotive and surveillance applications.

What’s next for MEMS?

Tue, 12 Dec 2014
The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ease use and grow applications. But it is also bringing plenty of demands for new technologies, and changes in how companies will compete.

Internet of Things stimulates MEMS market

Tue, 12 Dec 2014
The explosive expansion of the Internet of things (IoT) is driving rapid demand growth for microelectromechanical systems (MEMS) devices in areas including asset-tracking systems, smart grids and building automation.

MEMSensing launches the world's smallest commercial 3-axis accelerometer with SMIC

Mon, 1 Jan 2015
MEMSensing Microsystems Co. and Semiconductor Manufacturing International Corporation jointly announced the launch of the world's smallest 3-axis accelerometer MSA330, which utilizes SMIC's CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies.

InvenSense to ship over 1B MEMS sensors worldwide

Tue, 1 Jan 2015
InvenSense, Inc., a provider of intelligent sensor solutions, announced that since starting shipment of MEMS-based sensors in late 2006, it will reach 1 billion devices shipped in Q1 of calendar 2015.

European 3D TSV Summit 2015: What business for 3D smart systems?

Tue, 1 Jan 2015
SEMI Europe will ring in the New Year by holding the first major, international 3D TSV event of 2015. On January 19-21, members of the 3D TSV industry will convene in Grenoble, France for the 3rd edition of the European 3D TSV Summit.

Spotlight on MEMS: SEMI launches new European MEMS Summit

Wed, 1 Jan 2015
SEMI today announced the launch of the European MEMS Summit, to be held on 17-18 September 2015 in Milan, Italy.

2015 outlook: Tech trends and drivers

Tue, 1 Jan 2015
Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Fabrication of patterns with linewidths down to 1.5nm

Tue, 2 Feb 2015
Researchers at aBeam Technologies, Lawrence Berkeley National Laboratory and Argonne National Laboratory have developed a technology to fabricate test patterns with a minimum linewidth down to 1.5nm.

Imec introduces new snapshot hyperspectral image sensors with mosaic filter architecture

Wed, 2 Feb 2015
At next week’s SPIE Photonics West 2015, imec will present a new set of snapshot hyperspectral CMOS image sensors featuring spectral filter structures in a mosaic layout, processed per-pixel on 4x4 and 5x5 ‘Bayer-like’ arrays.

GLOBALFOUNDRIES joins imec to develop innovative RF solutions for Internet of Things applications

Tue, 2 Feb 2015
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced a partnership with imec, a nanoelectronics research center, for joint research on future radio architectures and designs for highly integrated mobile devices and IoT applications.

MIG announces finalists for MEMS & Sensors Technology Showcase

Thu, 2 Feb 2015
Selected from a pool of applicants, finalist companies will demo their MEMS/sensors-based applications as they vie for attendees’ votes.

Imec and Panasonic present breakthrough in CMOS-based transceivers for mm-wave radar systems

Wed, 2 Feb 2015
Today, at the 2015 International Solid State Circuits Conference (ISSCC), imec and Panasonic presented a transceiver chip for phase-modulated continuous-wave radar at 79GHz.

Semiconductor unit shipments to exceed one trillion devices in 2017

Thu, 2 Feb 2015
Updated forecast expects robust 8.2% average annual unit shipment growth through 2019.

IRT Nanoelec and CMP team up to offer world’s first service for post-process 3D technologies on multi-project-wafer

Thu, 3 Mar 2015
IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW).

New technology may double radio frequency data capacity

Fri, 3 Mar 2015
Columbia engineers invent nanoscale IC that enables simultaneous transmission and reception at the same frequency in a wireless radio.

Light sensors market to grow 16 percent between 2013 and 2016

Fri, 3 Mar 2015
Samsung, Apple and Chinese OEMs will drive revenue in the light sensor market to grow 16 percent between 2013 and 2016, according to a new report released today from IHS Inc.

Silicon Labs and Digi-Key challenge developer innovation with "Your IoT" design competition

Tue, 3 Mar 2015
Silicon Labs and Digi-Key today announced an IoT design contest for pioneering developers who want to create connected "things" that will help make the world a smarter, more connected and energy-friendly place.

2014 top MEMS players ranking: Rising of the first MEMS titan

Tue, 3 Mar 2015
With an impressive 20 percent growth in MEMS revenue compared to 2013, and sales revenues of more than $1.2B, Robert Bosch GmbH is the clear #1.

Apple dictates the ranking of top 10 MEMS manufacturers in 2014

Wed, 3 Mar 2015
Apple boosted Bosch’s MEMS revenue in 2014 again as Bosch is the sole supplier of the pressure sensors added to the iPhone 6 and 6+.

Consider packaging requirements at the beginning, not the end, of the design cycle

Thu, 4 Apr 2015
Consider these eight issues where the packaging team should be closely involved with the circuit design team.

MEMS shipments to reach 43.3B units by 2018, says Semico Research

Thu, 4 Apr 2015
The market for MEMS has been growing at a fast rate. But growth will come as a result of a wide variety of emerging MEMS and will be driven by the growth of the Internet of Things (IoT), where MEMS devices will replace conventional sensors, and by the introduction of new sensor technologies.

Cavendish Kinetics adopts STATS ChipPAC's wafer level technology for its SmarTune RF MEMS tuners

Tue, 4 Apr 2015
STATS ChipPAC Ltd. announced that Cavendish Kinetics, a provider of high performance RF MEMS tuning solutions for LTE smartphones and wearable devices, has adopted its advanced wafer level packaging technology

Sensor shipments strengthen but falling prices cut sales growth

Fri, 4 Apr 2015
Sensor shipments are getting a big boost from the spread of embedded measurement functions for automated intelligent controls in systems and new high-volume applications, but sales growth is being pulled down significantly by price erosion in this once high-flying semiconductor marketplace.

ClassOne enters ECD lab partnership with Shanghai Sinyang

Tue, 4 Apr 2015
Semiconductor equipment manufacturer ClassOne Technology announced today that it has signed a joint electrochemical deposition (ECD) applications lab agreement with Shanghai Sinyang Semiconductor Materials Co., Ltd.

SIGFOX and TI collaborate to deliver cost-effective, long-range, low-power Internet of Things connectivity

Tue, 4 Apr 2015
SIGFOX and Texas Instruments (TI) announced the two companies are working together to increase IoT deployments using the Sub-1 GHz spectrum.

ITRS 2.0: Heterogeneous integration

Wed, 5 May 2015
Interconnecting transistors and other components in the IC, in the package, on the printed circuit board and at the system and global network level, are where the future limitations in performance, power, latency and cost reside.

MEMS industry influencers to present at SEMI European MEMS Summit

Thu, 5 May 2015
SEMI has announced that executives from MEMS giants Bosch and STMicroelectronics, MEMS largest fabless Invensense and dominating IC foundry TSMC will be delivering the keynote talks at the European MEMS Summit.

Intel, eASIC collaborate on customized Intel-based solutions for the cloud

Tue, 5 May 2015
Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the "cloud."

Janusz Bryzek joins MEMS Industry Group to lead new TSensors division

Thu, 5 May 2015
MEMS Industry Group (MIG), the trade association advancing micro-electromechanical systems (MEMS) and sensors across global markets, today announced the creation of a new TSensors division headed by TSensors Summit, Inc.

Growing in maturity, the MEMS industry is getting its second wind

Tue, 5 May 2015
In 2014, the MEMS sector represented an $11.1B business for Si-based devices. According to Yole Développement (Yole) latest MEMS report “Status of the MEMS Industry”, the MEMS industry is preparing to exceed $20B by 2020.

Xcerra announces Nordic Semiconductor selects the Diamondx for IoT device testing

Tue, 5 May 2015
Xcerra Corporation today announced that Nordic Semiconductor, a company that specializes in ultra-low power (ULP) 2.4GHz transceivers, notably for the Bluetooth Smart and wearables segments, has selected the Diamondx from Xcerra's semiconductor tester group, LTX-Credence, for high volume production test of their Internet of Things (IoT) products.

Technology for tomorrow’s market opportunities and challenges at LetiDays Grenoble

Fri, 5 May 2015
The 17th annual LetiDays Grenoble on June 24-25 will expand the conversation with presentations about Internet of Things-augmented mobility, which is revolutionizing the way we interact with appliances, infrastructure and countless common objects that are part of our daily lives.

MEMS suppliers ride automotive safety wave

Tue, 6 Jun 2015
Suppliers of MEMS-based devices rode a safety sensing wave in 2014 to reach record turnover in automotive applications, according to analysis from IHS.

MEMSIC's SmartSensing tech delivers highest performance in inertial measurement systems

Thu, 6 Jun 2015
MEMSIC announced the launch of its latest addition, the INS380, to its portfolio of Inertial Systems enabled with SmartSensing technology targeted to a broad range of precision motion sensing applications.

Fairchild launches MEMS product line

Tue, 6 Jun 2015
Fairchild, a supplier of high-performance semiconductor solutions, today launched the FIS1100 6-axis MEMS Inertial Measurement Unit (IMU), the company’s first MEMS product stemming from its strategic investments in MEMS and motion tracking.

Bosch selects Rudolph for semiconductor inspection solutions

Mon, 6 Jun 2015
Rudolph Technologies, Inc. announced today that the MEMS company, Robert Bosch GmbH, has selected Rudolph to supply several different configurations of its F30 Inspection System for various steps in the front- and back-end fabrication processes of micro electrical mechanical systems (MEMS) devices.

MEMS applications take the stage in the first edition of the European MEMS Summit

Mon, 6 Jun 2015
The first edition of this Summit will take place on September 17-18, 2015 in Milan, Italy and its theme will be “Sensing the Planet, MEMS for Life.”

Technology innovation is driving fan-in wafer level packaging adoption with more and more applications

Mon, 6 Jun 2015
Fan-in WLP is experiencing continuous growth and attracting new applications, according to Yole Développement's latest report “Fan-in Wafer Level Packaging: Market & Technology Trends."

UMC collaborates with ARM to validate UMC 14nm finFET process

Mon, 6 Jun 2015
United Microelectronics Corporation, a global semiconductor foundry, today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC's 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node.

imec and Holst Centre present a gas sensing platform for intuitive IoT applications

Tue, 6 Jun 2015
Imec and Holst Centre have developed a small NO2 sensor featuring a low power consumption in the mW range.

MEMS foundry X-FAB selects ClassOne Solstice for electroplating

Wed, 7 Jul 2015
Semiconductor equipment manufacturer ClassOne Technology announced that X-FAB — recently named “MEMS Foundry of the Year” — has just purchased a new Solstice S8 Electroplating System.

Surging phablets to shoot past stalled tablet market in 2015

Wed, 7 Jul 2015
Updated forecast shows large-screen smartphone shipments climbing 66% this year to 252 million units while the lack of replacement purchases stymies tablets.

Wearable systems give major boost to total IoT sales in 2015

Thu, 7 Jul 2015
Market revenues associated with network communications, sensing, and control functions in subsystems and objects attached to the Internet of Things (IoT) are forecast to grow 29% in 2015 to $62.4 billion after increasing 21% in 2014 to about $48.4 billion.

Opportunities in packaging are driving photolithography equipment demand

Mon, 7 Jul 2015
Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest growth.

MEMS Industry Group Conference Asia explores MEMS and sensors opportunities in global IoT

Tue, 8 Aug 2015
MEMS Industry Group (MIG) will gather the world’s leading providers of micro-electromechanical systems (MEMS) and sensors technology for its second annual MEMS Industry Group Conference Asia in Shanghai, China on September 8-11, 2015.

Challenges for MEMS, sensors, and semiconductors

Tue, 8 Aug 2015
Leading industry experts participated in the joint SEMI-MEMS Industry Group (MIG) workshop during SEMICON West 2015 to discuss industry challenges – and potential solutions and collaborative approaches – in the MEMS, sensors and semiconductor industries.

MEMS Executive Congress US 2015 examines commercial forces driving MEMS & sensors to $20B by 2020

Tue, 8 Aug 2015
MEMS Industry Group (MIG)'s next MEMS Executive Congress US 2015 will explore the market drivers behind the double-digit growth propelling MEMS and sensors to more than $20+ billion by 2020.

What to expect from the European MEMS Summit Conference

Tue, 8 Aug 2015
As Bosch, InvenSense and STMicroelectronics continue to go head-to-head in an attempt to capture the biggest shares of the growing MEMS market, SEMI has announced that it will bring these MEMS giants together in an unprecedented European conference & exhibition to discuss the future of MEMS and Sensors.

EV Group organizes Photonics Workshop in conjunction with MNE Conference

Tue, 8 Aug 2015
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, will host a special session at the 41st Micro and Nano Engineering (MNE 2015) conference.

Knowm first to deliver memristors capable of bi-directional learning

Wed, 9 Sep 2015
Milestone confirmed by groundbreaking new data; bi-directional incremental capability allows startup to leapfrog IBM and other established competitors in emerging computing fields.

The future of MEMS in the IoT

Thu, 9 Sep 2015
SEMI’s European MEMS Summit will be held on 17-18 September 2015 in Milan, Italy. Over the course of the two-day event, more than 20 keynote and invited speakers from the entire supply chain will share their perspectives and latest updates, including participation by European MEMS leaders. In addition, a focused industry exhibition will complement the conferences offering with additional networking opportunities.

Process Watch: Risky business

Fri, 9 Sep 2015
This is the ninth in a series of 10 installments that explore certain fundamental truths about process control--defect inspection and metrology--for the semiconductor industry.

Tektronix expands DPO70000SX ATI high performance oscilloscope family

Mon, 9 Sep 2015
Tektronix, Inc. today announced the expansion of its DPO70000SX Performance Oscilloscope Series to include 50 GHz and 23 GHz models.

2016 Symposia on VLSI Technology and Circuits announces call for papers

Mon, 9 Sep 2015
The official Call for Papers has been issued for the 2016 Symposia on VLSI Technology and Circuits, to be held at the Hilton Hawaiian Village June 13-16, 2016 (Technology) and June 15-17, 2016 (Circuits).

Advantest and D2S partner to tackle CD uniformity errors for advanced photomasks

Tue, 9 Sep 2015
D2S announced that it has partnered with Advantest to integrate D2S' Wafer Plane Analysis engine into Advantest's Mask MVM-SEM (Multi Vision Metrology Scanning Electron Microscope) systems.

Yamaichi Electronics 0.35mm pitch test contactor for semiconductor evaluation

Fri, 10 Oct 2015
Yamaichi Electronics presents Test Contactors for lab and reliability applications and ultra fine pitch semiconductor devices.

Applied Materials and A*STAR announce new R&D joint lab in Singapore for advanced semiconductor technology

Mon, 10 Oct 2015
Applied Materials, Inc. announced it plans to establish a new R&D laboratory in Singapore in collaboration with the Agency for Science, Technology and Research (A*STAR).

Siborg Systems introduces educational version of MicroTec semiconductor process and device simulator

Mon, 10 Oct 2015
Siborg has recently made a new MicroTec version available particularly targeting educational use of the software.

Slideshow: 2015 IEDM Preview

Tue, 10 Oct 2015
An advance look at some of the most newsworthy topics and papers that will be presented at this year's IEEE International Electron Devices Meeting.

New NSF-SRC report on energy efficient computing

Thu, 10 Oct 2015
A report that resulted from a workshop funded by Semiconductor Research Corporation and National Science Foundation outlines key factors limiting progress in computing and novel device and architecture research that can overcome these barriers.

Plasma-Therm acquires plasma processing technology from Nanoplas France

Tue, 11 Nov 2015
Plasma-Therm announced that it has acquired a High Density Radical Flux plasma technology that enables low-temperature Bosch polymer removal.

DCG Systems addresses localization of electrical shorts with EBIRCH technology

Tue, 11 Nov 2015
DCG Systems announced the release of EBIRCH, a technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits.

FEI announces agreement to acquire DCG Systems

Tue, 11 Nov 2015
FEI Company and DCG Systems, Inc. announced an agreement where FEI willacquire DCG for $160 million in an all cash transaction.

It's all about packaging - in this material world, who is your partner?

Thu, 11 Nov 2015
With the emergence of the IoT (Internet of Things), advanced packaging is clearly the enabling technology providing solutions for mobile applications and for semiconductor devices fabricated at 16 nm and below process nodes.

Bosch Sensortec CEO recognized with Lifetime Achievement Award

Fri, 11 Nov 2015
Bosch Sensortec announced that its CEO, Dr. Stefan Finkbeiner, has been chosen by the MEMS & Sensors Industry Group to receive its prestigious MEMS/Sensors Lifetime Achievement Award.

Wafer bonding for high performance MEMS, power devices, and RF components

Tue, 11 Nov 2015
Recent trends and future directions for wafer bonding are reviewed, with a focus on MEMS.

Europe’s secondary industry in the spotlight

Tue, 11 Nov 2015
The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

The inertial MEMS device market keeps on growing. What's next?

Mon, 11 Nov 2015
Gyroscope and accelerometer production volumes are also growing, with the following CAGR: 7.9% and 1.6% respectively over the same period. Every sector will keep growing. So, what’s next?

SITRI and Bosch announce IoT technology collaboration

Wed, 12 Dec 2015
The agreement covers IoT applications such as smart home, wearable devices, smart city, Industry 4.0 and robotics.

SPTS Technologies installs a 300mm MEMS vapor HF etch release solution at CEA-Leti

Fri, 12 Dec 2015
SPTS Technologies has supplied CEA-Leti, one of Europe’s largest micro- and nanotechnologies research institutes, with its vapor HF etch release systems for 300mm microelectromechanical systems (MEMS) on CMOS development.

Vesper collaborates with GLOBALFOUNDRIES to deliver first piezoelectric MEMS microphones

Wed, 1 Jan 2016
Acoustic sensing company works with top foundry to support mass-market consumer products.

Technavio: Top two emerging trends impacting the global MEMS microphone market through 2020

Fri, 1 Jan 2016
According to the report, the global MEMS microphone market is expected to reach close to USD 2 billion by 2020, posting a CAGR of over 12%.

Led by iPhone 6S, sensor hubs market is growing fast

Mon, 1 Jan 2016
The demand for sensor hubs, dedicated processing elements used for low-power sensor processing tasks, is booming.

SEMI launches new integrated packaging assembly and test group

Wed, 2 Feb 2016
SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.

Vesper partners with AAC Technologies on piezoelectric MEMS microphones

Mon, 2 Feb 2016
Vesper today announced a partnership with AAC Technologies Holdings Inc. for the commercialization of the world’s first piezoelectric MEMS microphones for consumer electronic devices.

imec and iMinds to merge and create high-tech research center

Mon, 2 Feb 2016
Nanoelectronics research center, imec, and digital research and incubation center, iMinds, announced that its respective board of directors have approved the intention to merge the research centers.

New NTU microchip shrinks radar cameras to fit into a palm

Tue, 2 Feb 2016
NTU's new radar chip was presented and published at the prestigious International Solid-State Circuits Conference (ISSCC) 2016.

STATS ChipPAC honored with Supplier of the Year Award from Inphi

Tue, 3 Mar 2016
STATS ChipPAC Ltd. today announced that it has been honored with the “Supplier of the Year” award from Inphi Corporation.

Gartner identifies the top 10 Internet of Things technologies for 2017 and 2018

Thu, 3 Mar 2016
Gartner, Inc. has highlighted the top 10 Internet of Things (IoT) technologies that should be on every organization's radar through the next two years.

CyberOptics and Nordson ink a strategic OEM supplier agreement for 3D MRS sensors

Wed, 3 Mar 2016
CyberOptics today announced an OEM supplier agreement with Nordson YESTECH to supply its proprietary 3D Multi-Reflection Suppression (MRS) sensors.

IoT Planet to co-locate with SEMICON Europa in 2016

Wed, 3 Mar 2016
IoT Planet, a new European event dedicated to the Internet of Things (IoT), will co-locate this year with SEMICON Europa (25-27 October) in Grenoble, France.

Entrepreneurs to compete in MEMS Shark Tank at Hilton Head 2016

Thu, 3 Mar 2016
Teams vie for expert consulting services, MEMS foundry package, specialized software tools, industry group membership.

A new virtuous cycle for the MEMS industry

Thu, 3 Mar 2016
Since 2000, we have entered the age of sensing and interacting with the wide diffusion of MEMS and sensors that give us a better, safer perception of our environment. MEMS have grown in volume to be almost a 15 billion units market today.

Heat and light get larger at the nanoscale

Fri, 4 Apr 2016
In a new study recently published in Nature Nanotechnology, researchers from Columbia Engineering, Cornell, and Stanford have demonstrated heat transfer can be made 100 times stronger than has been predicted, simply by bringing two objects extremely close--at nanoscale distances--without touching.

Latest advancements in sensor technology examined at SEMI European MEMS Summit

Mon, 4 Apr 2016
SEMI today announced the second annual edition of the SEMI European MEMS Summit, dedicated to MEMS and sensors, to be held on September 15-16.

STMicroelectronics reveals advanced silicon-carbide power devices

Mon, 5 May 2016
STMicroelectronics announced advanced high-efficiency power semiconductors for Hybrid and Electric Vehicles (EVs) with a timetable for qualification to the automotive quality standard AEC-Q101.

North American semiconductor equipment industry posts April 2016 book-to-bill ratio of 1.10

Tue, 5 May 2016
North America-based manufacturers of semiconductor equipment posted $1.59 billion in orders worldwide in April 2016 (three-month average basis) and a book-to-bill ratio of 1.10.

MEMS technology is contributing to the inkjet printing industry revolution

Wed, 5 May 2016
With a market reaching US$ 1 billion in 2021, the MEMS printhead is one of the most mature MEMS devices.

An increasing number of healthcare applications is using bioMEMS components

Fri, 5 May 2016
According to Yole Développement (Yole) analysts, this market will triple from US$2.7 billion in 2015 to US$7.6 billion in 2021.

Amkor opens MEMS packaging line in China

Wed, 6 Jun 2016
Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. today announced it is ramping up a new MEMS and sensor packaging line at its facility in Shanghai.

200mm fabs reawakening

Wed, 7 Jul 2016
Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

Unisem ships 1 billion packaged MEMS devices

Tue, 7 Jul 2016
Unisem reported it recently shipped its one billionth packaged MEMS device and continues to invest capex in both MEMS assembly equipment and the development of additional factory floor space for this expanding market.

Research team led by NUS scientists develop plastic flexible magnetic memory device

Wed, 7 Jul 2016
Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance.

Automotive MEMS sensor unit-shipments rose in 2015, even as revenue stalled

Thu, 7 Jul 2016
Although shipments of microelectromechanical systems (MEMS) sensors used in automotive applications grew 8.4 percent in 2015, revenues were flat compared to the previous year, reaching $2.7 billion.

Sensor sales keep hitting new records but price erosion curbs growth

Fri, 7 Jul 2016
Double-digit unit shipment increases continue with demand being strong for low-cost sensors in wearable systems, Internet of Things, and automated embedded control.

A*STAR'S IME kicks off consortia to develop packaging solutions for IoT applications

Tue, 7 Jul 2016
Innovative capabilities developed will lead to higher power efficiency and lower costs for MEMS and silicon photonics devices.

Why are some MEMS devices successful while others are not?

Thu, 7 Jul 2016
Beyond its gloom, the MEMS industry is showing numerous emerging devices that hold promise for future growth.

STMicroelectronics earns MEMS Manufacturer of the Year Award

Mon, 8 Aug 2016
STMicroelectronics has been named the MEMS Manufacturer of the Year at the MEMS World Summit, the MEMS Manufacturing Conference gathering the top executives in the Worldwide MEMS Manufacturing Industry.

Top MEMS sensor suppliers of 2015

Tue, 8 Aug 2016
Micro-electrical mechanical systems (MEMS) sensor revenue declined by 3.4% in 2015 with slow growth expected to start from 2017. While microphones and other MEMS categories grew, other categories declined -- most notably, motion sensors.

MEMS & Sensors Industry Group Conference Asia explores MEMS, sensors in IoT of today and tomorrow

Mon, 8 Aug 2016
MEMS & Sensors Industry Group (MSIG) will hold its third annual MEMS & Sensors Industry Group Conference Asia in Shanghai, China on September 13-14, 2016.

Full program for SEMI European MEMS Summit announced

Wed, 8 Aug 2016
Leading companies will present the latest and most impactful trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September, 2016.

Global MEMS market to grow at a CAGR of close to 12% until 2020

Fri, 8 Aug 2016
According to the latest market study released by Technavio, the global micro-electro-mechanical-systems (MEMS) market is expected to reach USD 20.26 billion by 2020, growing at a CAGR of nearly 12%.

SEMI European MEMS Summit brings industry leaders to Stuttgart

Tue, 9 Sep 2016
Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016.

SEMI and MSIG join together in strategic association partnership

Thu, 9 Sep 2016
SEMI announced that MEMS & Sensors Industry Group (MSIG) will become a SEMI Strategic Association Partner effective January 1, 2017.

Moore's Law did indeed stop at 28nm

Mon, 9 Sep 2016
As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

Solid State Technology announces expanded conference for The ConFab 2017

Wed, 9 Sep 2016
The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

MEMS & Sensors Industry Group highlights near-term and future connected tech at annual Executive Conference

Mon, 9 Sep 2016
MEMS & Sensors Industry Group (MSIG) today announced highlights of its twelfth annual business conference, MEMS & Sensors Executive Congress 2016 in Scottsdale, AZ on November 9-11, 2016.

SiTime introduces high-precision MEMS oscillators

Tue, 9 Sep 2016
SiTime Corporation today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators.

imec and Holst Centre present the world's most energy-efficient biomedical sensor hub

Tue, 10 Oct 2016
imec and Holst Centre (established by imec and TNO), today announced a new sensor hub integrated as a system-on-chip (SoC) intended for a broad range of wearable health devices and applications.

First demonstration of brain-inspired device to power artificial systems

Fri, 10 Oct 2016
New research, led by the University of Southampton, has demonstrated that a nanoscale device, called a memristor, could be used to power artificial systems that can mimic the human brain.

MEMS & Sensors Industry Group reveals Tech Showcase finalists

Tue, 10 Oct 2016
MSIG today announced the shortlist of finalists who will compete for the title of winner at this year's event.

Revenue growth sounding strong for suppliers of packaged MEMS microphones

Fri, 10 Oct 2016
Knowles, Goertek and AAC ranked as the top three global suppliers of packaged MEMS microphones for 2015.

A tiny machine

Mon, 10 Oct 2016
UCSB electrical and computer engineers design an infinitesimal computing device.

WORLD OF IOT grows with 30 new exhibitors at SEMICON Japan

Thu, 11 Nov 2016
Today, SEMI announced that WORLD OF IOT, a show-within-a-show at SEMICON Japan 2016, will expand with the addition of 30 new exhibitors.

Automotive systems forecast to show strongest growth through 2020

Thu, 11 Nov 2016
Newly updated report reviews many of the end-use system applications that are presently impacting and that are forecast to help propel the IC market through 2020.

MicroVision and STMicroelectronics to co-market MEMS mirror-based laser beam scanning solutions

Thu, 11 Nov 2016
MicroVision, Inc. and STMicroelectronics today announced that they plan to work together to develop, sell, and market Laser Beam Scanning (LBS) technology.

SMIC and IMECAS sign an agreement for MEMS R&D and foundry platform

Tue, 11 Nov 2016
Semiconductor Manufacturing International Corporation and The Institute of Microelectronics of the Chinese Academy of Sciences announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.

SATS market driven by increasing demand for high-end packaging solutions

Tue, 11 Nov 2016
The SATS market is anticipated to have substantial growth mainly driven by the increasing costs for advanced packaging solutions, according to a report by Persistence Market Research.

Lab4MEMS project recognized with European Innovation Award

Mon, 11 Nov 2016
Project developed pilot line for next-generation MEMS devices.

A year in review: Top 10 stories of 2016

Fri, 12 Dec 2016
From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

Microsemi honored as M2M Network Equipment Technology Company of the Year by IoT Breakthrough Awards

Fri, 1 Jan 2017
Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it was named M2M Network Equipment Technology Company of the Year by the inaugural IoT Breakthrough Awards.

New report from IHS Markit names top four trends driving the IoT in 2017 and beyond

Tue, 1 Jan 2017
Fueled by lightning-fast demand for ubiquitous connectivity, the number of connected Internet of Things (IoT) devices globally will jump by 15 percent year-over-year to 20 billion in 2017, according to new analysis from IHS Markit.

ISS Europe 2017: European innovation leadership

Tue, 1 Jan 2017
Electronics manufacturing solutions for Automotive, Smart Manufacturing and Healthcare enabling the future of European technology.

ams announces completion of transaction to acquire Heptagon

Wed, 1 Jan 2017
ams, a worldwide supplier of high-performance sensor and analog solutions, announces the completion of the transaction to acquire 100% of the shares in Heptagon and related capital.

Executive viewpoints: 2017 outlook

Wed, 1 Jan 2017
Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

Do not go where the path may lead

Fri, 1 Jan 2017
What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

Qualcomm and TDK announce launch of joint venture

Fri, 2 Feb 2017
Qualcomm Incorporated and TDK Corporation today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd.

Intel announces $7B investment in next-gen semiconductor fab in Arizona

Thu, 2 Feb 2017
The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

Invensas announces Teledyne DALSA sign DBI technology transfer and license agreement

Fri, 2 Feb 2017
Wafer bonding and 3D interconnect technology to enable delivery of next-generation MEMS and image sensor solutions.

SEMI appoints Ajit Manocha as president and CEO

Tue, 2 Feb 2017
SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Flemish government increases financial support of imec

Tue, 2 Feb 2017
Today, the research and innovation hub in nanoelectronics and digital technology imec, and the Flemish Government announced a new, 5-year strategic commitment that aims at strengthening the pioneering role of Flanders' renowned research hub.

Global MEMS manufacturer selects ULVAC Technologies' plasma ashing system

Wed, 3 Mar 2017
ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

SEMICON China 2017 opens tomorrow in Shanghai

Mon, 3 Mar 2017
Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

A novel method for the fabrication of active-matrix 3-D pressure sensors

Wed, 4 Apr 2017
A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

STMicroelectronics appoints Jean-Marc Chery as Deputy CEO and names new executive team

Thu, 4 Apr 2017
STMicroelectronics announced today the appointment of Jean-Marc Chery as Deputy CEO, effective July 1, 2017.

Sensor/actuator sales take off as price erosion eases

Mon, 5 May 2017
Strong unit growth continues to be driven by the spread of automated embedded controls, wearable systems, and the Internet of Things, says new O-S-D Report.

The automotive electronics market: A view from a material supplier

Fri, 6 Jun 2017
With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

Exploring smart sensor explosive growth at SEMICON West 2017

Tue, 6 Jun 2017
MEMS & Sensors Industry Group announces programs and speakers for SEMICON West 2017 (July 11-13).

How SEMI Standard E175 is saving energy and cutting costs

Tue, 6 Jun 2017
Industry experts answer questions about the new standard in a virtual roundtable.

Nonstop CMOS image sensor sales records seen through 2021

Wed, 6 Jun 2017
Embedded imaging applications in cars, security, machine vision, medical, virtual reality, wearable systems, and other new uses will offset slow growth in camera phones, says O-S-D Report.

Boston Semi Equipment receives repeat order for Zeus pressure MEMS test handler

Mon, 7 Jul 2017
Boston Semi Equipment (BSE), a global semiconductor test handler company, announced today it has received a follow on order for multiple Zeus gravity test handling systems for pressure MEMS.

The pervasiveness of ASICs in the IoT era

Fri, 7 Jul 2017
For an increasing number of designs, companies are finding it beneficial to design their own ASICs with system-on-a- chip (SoC) complexity. For reasons of cost reduction, quality improvement, IP protection and security, a full turn-key ASIC can be achieved for $1-5 million, particularly if the design can be built using mature technology nodes.

Universities obtain new funding from nano-bio manufacturing consortium

Fri, 7 Jul 2017
Three leading U.S. universities are the latest recipients of funding from the Nano-Bio Manufacturing Consortium (NBMC), operated by SEMI.

NXP announces production of security chips in its US manufacturing facilities

Fri, 8 Aug 2017
NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the United States.

Large wafers, complex IC designs among advanced packaging trends

Tue, 8 Aug 2017
The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.

Automotive sensing: A mature yet highly dynamic market

Tue, 8 Aug 2017
Despite its age and maturity, the automotive market has witnessed many unexpected developments over the past two years. And as has always been the case, safety drives the market.

Technology Showcase finalists revealed for European MEMS & Sensors Summit

Tue, 8 Aug 2017
Five companies compete for attendee votes at SEMI European MEMS & Sensors Summit, September 20-22, 2017, Grenoble, France.

MEMS & Sensors Executive Congress answers "What's driving $66B industry?"

Wed, 9 Sep 2017
Speakers to explore biomedical, automotive, agriculture and smart home, November 1-2 in Napa Valley, Calif.

Leti develops proof of concept to test wireless systems in aircraft

Wed, 9 Sep 2017
Leti, a technology research institute of CEA Tech, announced today it has developed a methodology for testing high-speed wireless communications on airplanes that allows different system deployments in cabins, and assesses wireless devices before they are installed.

North American semiconductor equipment industry posts August 2017 billings 

Fri, 9 Sep 2017
Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

Wearable sensors reach their first billion-dollar year, with growth coming in three waves

Wed, 9 Sep 2017
IDTechEx predict that 2017 will be the first billion dollar year for wearable sensors.

TowerJazz and Crocus expand presence in magnetic sensors market

Wed, 9 Sep 2017
Crocus TMR sensors offer important advantages for multiple applications in IoT, consumer, automotive, industrial and medical sectors.

Robotics and chip industries in Japan

Mon, 10 Oct 2017
Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

Comet Group to open Silicon Valley office

Tue, 10 Oct 2017
COMET Group today announced the opening of Lab One, its customer-centric technology and application center in San Jose, CA.

MEMS & sensors companies compete for tech showcase "crown"

Thu, 10 Oct 2017
MSIG announces five finalists for Technology Showcase at MEMS & Sensors Executive Congress, November 1-2, in Napa Valley, Calif.

2017 IEDM features rich technical program, focus sessions

Tue, 10 Oct 2017
Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

Number of connected IoT devices will surge to 125 billion by 2030

Fri, 10 Oct 2017
The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit.

Optoelectronics, sensors/actuators and discretes climb

Mon, 10 Oct 2017
The O-S-D market segments are growing at above average rates in 2017 and all three are expected to reach new record highs for the first time in six years, says new update.

The MEMS packaging market is growing faster than the devices market itself

Mon, 10 Oct 2017
The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1% for devices, during the period 2016 - 2022.

MEMS & sensors safeguard autonomous cars, boost agricultural productivity and anticipate needs

Fri, 11 Nov 2017
MEMS & Sensors Executive Congress speakers feature smart sensing components in new industrial, automotive, biomedical, agricultural applications.

2017 sees advances in connected devices, memory

Tue, 11 Nov 2017
The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.

The intelligence that leads to artificial intelligence

Wed, 11 Nov 2017
Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.

Leti joins DARPA-funded consortium to develop implantable device for restoring vision

Thu, 11 Nov 2017
Leti announced today that a team of its researchers is participating in a U.S.-funded project to develop a safe, implantable neural interface system to restore vision by stimulating the visual cortex.

Magnetic sensor industry is moving into a consolidation phase

Mon, 11 Nov 2017
With 7% CAGR between 2016 and 2022, the magnetic sensor market should reach almost US$ 2.5 billion in 2022.

Leti announces FED4SAE project to accelerate European cyber-physical system solutions to market

Tue, 11 Nov 2017
Leti, a research institute of CEA Tech and coordinator of the pan-European consortium FED4SAE, today announced that the 14 project partners have launched a three-year European Commission program to facilitate the acceleration of European cyber-physical-system (CPS) solutions to market.

SkyWater significantly expands pure-play technology foundry customer base

Thu, 11 Nov 2017
SkyWater Technology Foundry announces that it has been assigned the Specialty Foundry customer relationships from Cypress Semiconductor Corporation.

TEL NEXX modernizes shop floor data collection and quality control with InfinityQS ProFicient

Thu, 11 Nov 2017
Quality Intelligence solution enables chip metallization provider to improve accuracy and timeliness of data capture, rapidly respond to issues, and identify opportunities for continuous improvement.

Advantest launches automated IC handler with thermal control for use in semiconductor engineering labs

Wed, 11 Nov 2017
Semiconductor test equipment supplier Advantest Corporation has developed the M4171 handler to meet the mobile electronics market's needs for cost-efficient thermal control testing of ICs with high power dissipation during device characterization and pre-production bring up.

The world's 1st "7-axis" motion tracking devices: tiner package & better response time

Wed, 12 Dec 2017
Accelerometers and gyroscopes are fueling the robotic revolution, especially the drones’ market segment. However, these MEMS devices are not the only ones on the market place anymore, with environmental sensors penetrating this industry too.

Invensas completes DBI technology transfer to Teledyne DALSA

Fri, 12 Dec 2017
One of the world's largest independent MEMS foundries ready to manufacture MEMS and image sensor products utilizing Invensas wafer bonding and 3D interconnect technology.

Tessera reaches global settlement with Broadcom

Mon, 12 Dec 2017
Settlement includes multi-year license agreement.

The coldest chip in the world

Wed, 12 Dec 2017
Physicists at the University of Basel have succeeded in cooling a nanoelectronic chip to a temperature lower than 3 millikelvin.

Global semiconductor sales increase 21.5% year-to-year in November

Wed, 1 Jan 2018
Worldwide market notches highest-ever monthly sales of $37.7 billion; sales increase 1.6 percent compared to October.

Fabless IC company sales top $100B for first time ever

Thu, 1 Jan 2018
Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

UMC files patent infringement lawsuit against Micron

Fri, 1 Jan 2018
The lawsuit covers three areas that allegedly infringe upon UMC’s patent rights in China, including specific memory applications that relate to DDR4, SSD and memory used in graphics cards.

Worldwide PC shipments declined 2% in 4Q17 and 2.8% for the year

Fri, 1 Jan 2018
Amid market consolidation, the top four PC vendors accounted for 64% of shipments in 2017.

Growth of IoT to drive the global reset IC market

Tue, 1 Jan 2018
Technavio market research analysts forecast the global reset IC market to grow at a CAGR of close to 12% during the forecast period, according to their latest report.

Year End Wow!

Wed, 1 Jan 2018
2017 ended on a high note from an end market perspective.

Turbulent times ahead for trade

Thu, 1 Jan 2018
International trade is one of the best tools to spur growth and create high-skill and high-paying jobs. Over 40 million American jobs rely on trade, and this is particularly true in the semiconductor supply chain. Over the past three decades, the semiconductor industry has averaged nearly double-digit growth rates in revenue and, by 2030, the semiconductor supply chain is forecast to reach $1 trillion.

Lam Research and Tokyo Electron gained in full year 2017 semiconductor equipment market shares

Tue, 2 Feb 2018
Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.

MagnaChip offers 2nd-generation 0.13 micron BCD process technology with high-density embedded flash memory

Mon, 2 Feb 2018
MagnaChip Semiconductor Corporation announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory.

Frank Shemansky to lead SEMI's MEMS & Sensors Industry Group

Tue, 2 Feb 2018
SEMI today announced the appointment of Frank A. Shemansky, Jr., Ph.D., as executive director and chief technology officer (CTO) of the MEMS & Sensors Industry Group (SEMI-MSIG).

Siemens continues to invest in IC industry with planned acquisition of Sarokal Test Systems

Thu, 2 Feb 2018
Siemens announced it has entered into an agreement to acquire Oulu, Finland-based Sarokal Test Systems Oy.

Integrated circuit technology advances continue to amaze

Wed, 2 Feb 2018
Despite increasing costs of development, IC manufacturers are still making great strides.

Entering 2018 on solid ground

Thu, 2 Feb 2018
2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

SEMI showcases achievements in flexible hybrid electronics, MEMS and sensors at 2018FLEX and MSTC conferences

Thu, 2 Feb 2018
Technology trail-blazers explore business insights, new technologies, integration strategies at co-located events, held February 12-15, 2018 in Monterey, CA.

A marriage of light-manipulation technologies

Thu, 3 Mar 2018
Researchers have, for the first time, integrated two technologies widely used in applications such as optical communications, bio-imaging and Light Detection and Ranging (LIDAR) systems that scan the surroundings of self-driving cars and trucks.

Work to do to keep the good times rolling

Fri, 3 Mar 2018
2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

Executive viewpoints: 2018 outlook

Mon, 3 Mar 2018
Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Are the major DRAM suppliers stunting DRAM demand?

Wed, 3 Mar 2018
Skyrocketing DRAM prices potentially open the door for startup Chinese competitors.

Synopsys and industry technologists to address the path to 2nm SoC design

Fri, 3 Mar 2018
Synopsys, Inc. today announced it is hosting an advanced-technology panel on "EUV, High-NA, Metallurgy and FinFET++ - Where We Go from Here for Next-Generation Design" at the Synopsys Users Group (SNUG) Silicon Valley event on Thursday, March 22.

The ConFab 2018 announces conference agenda and speakers

Fri, 3 Mar 2018
Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

SEMICON West 2018 to spotlight smart technologies, workforce development

Tue, 3 Mar 2018
SEMICON West has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California.

U.S. trade tensions with China hit fever pitch

Wed, 3 Mar 2018
Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

Global MEMS market for mobile devices forecast to grow at a CAGR of 10.55%

Thu, 4 Apr 2018
Global MEMS market for mobile devices to grow at a CAGR of 10.55% during the period 2017-2021.

Amkor factories receive key automotive certification

Mon, 4 Apr 2018
Amkor Technology, Inc. today announced that multiple factories have passed certification audits for IATF 16949:2016, a key certification required for manufacturers who supply products to the automotive market

Expecting the unexpected: 5 takeaways from FLEX Japan and MEMS & Sensors Forum Japan 2018

Tue, 5 May 2018
Peel-and-stick simplicity isn’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.

Cohu to acquire Xcerra

Tue, 5 May 2018
Cohu, Inc. and Xcerra Corporation today announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.

SiTime opens new Center of Excellence in Michigan

Thu, 5 May 2018
SiTime Corporation announced it has expanded its global footprint to support its rapid growth with the opening of a new Center of Excellence in Michigan.

Leti Innovation Days to explore presentations on how microelectronics is fueling innovation

Tue, 5 May 2018
Leti, a technology research institute of CEA Tech, today announced its annual flagship event, Leti Innovation Days, July 4-5 in Grenoble.

The MEMS market is showing a 17.5% CAGR between 2018 and 2023

Mon, 6 Jun 2018
MEMS market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period.

Executive keynotes to identify MEMS, sensors, imaging innovations and megatrends at SEMI-MSIG European Summits

Tue, 6 Jun 2018
Industry leaders to share latest developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018, in Grenoble, France.

9 of the Top 12 smartphone suppliers headquartered in China​

Fri, 6 Jun 2018
China accounted for 7 of top 10 leading smartphone suppliers in 2017, share grows to 42%.

Imec demonstrates hybrid finFET-silicon photonics technology for ultra-low power optical I/O

Mon, 7 Jul 2018
Today at its Imec Technology Forum USA in San Francisco, imec, the research and innovation hub in nano-electronics and digital technology, announced that it has demonstrated ultra-low power, high-bandwidth optical transceivers through hybrid integration of Silicon Photonics and FinFET CMOS technologies.

Bruker announces acquisition of JPK Instruments

Fri, 7 Jul 2018
Bruker Corporation today announced that it has acquired JPK Instruments AG (JPK), located in Berlin, Germany.

Boston Semi Equipment enhances MEMS sensor testing

Mon, 7 Jul 2018
Boston Semi Equipment (BSE) introduced today its Zeus gravity feed solution for handling pressure MEMS devices that require pressure and vacuum stimulus during testing.

Park Systems announces Park Nanoscience Lab at Indian Institute of Science in India

Mon, 7 Jul 2018
Park Systems announced the opening of the Park Nanoscience Lab at the prestigious Indian Institute of Science (IISC) Bangalore India, which has been upgraded to the status of Institute of Eminence.

Testing modules and multi-chip packages in the full temperature range

Wed, 7 Jul 2018
TheXcerra MT2168 XT pick-and-place handler was installed for a tri-temp module test application at a major player in global semiconductor manufacturing.

Xperi partners with UMC to support production of direct and hybrid bonding 3D semiconductor technologies

Thu, 8 Aug 2018
Partnership enables UMC to develop and manufacture products utilizing Invensas DBI and ZiBond technologies.

SEMI integration of ESD Alliance underway

Tue, 8 Aug 2018
SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

Worldwide semiconductor revenue hit record $120.8B in Q2 2018

Wed, 8 Aug 2018
Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018.

Gartner identifies five emerging technology trends that will blur the lines between human and machine

Thu, 8 Aug 2018
The 35 must-watch technologies represented on the Gartner Inc. Hype Cycle for Emerging Technologies, 2018 revealed five distinct emerging technology trends that will blur the lines between humans and machines.

The role of autonomous mobility in driving MEMS & sensors to $100B market

Thu, 9 Sep 2018
MEMS & Sensors Executive Congress speakers to provide insights into enabling connected devices for wearables, robotics, cars, and autonomous applications October 29-30 in Napa Valley, Calif.

Seven IC products to outpace total 16% IC market growth in 2018

Tue, 9 Sep 2018
13 IC products forecast to show double-digit growth, led by a 39% surge in DRAM sales.

Leti and EFI launch project to improve reliability and speed of low-cost electronic devices for autos

Tue, 9 Sep 2018
Leti, a research institute of CEA Tech, and EFI Automotive, an international supplier of sensors, actuators and embedded smart modules for the automotive industry, today announced a project to dramatically improve reliability and response time of low-cost automotive components by equipping the devices with sophisticated model predictive control techniques.

CMOS image sensors: Yole Développement is increasing its forecasts again

Thu, 10 Oct 2018
2017 saw aggregated CIS industry revenue of US$13.9 billion. And 5 years later, the consulting company Yole announces more than US$ 23 billion.

Cybersecurity critical to success of MEMS and sensors suppliers

Thu, 10 Oct 2018
Cynthia Wright, a retired military officer with over 25 years of experience in national security and cyber strategy and policy, now Principal Cyber Security Engineer at The MITRE Corporation, will give the opening keynote at the upcoming MEMS & Sensors Executive Congress, October 29-30, 2018 in Napa, Calif.

Autonomy value: The next value for sensors suppliers

Tue, 10 Oct 2018
Nicolas Sauvage, senior director of Ecosystem at TDK InvenSense, will present at the fast-approaching MEMS & Sensors Executive Congress on October 29-30, 2018 in Napa, Calif. SEMI’s Nishita Rao spoke with Sauvage to offer MSEC attendees advance insights on Sauvage’s feature presentation.

Global semiconductor sales in September up 13.8% year-to-year

Mon, 10 Oct 2018
Q3 sales are highest on record, 4.1 percent more than previous quarter, 13.8 percent higher than Q3 of last year.

MIRPHAB offering design, production and business planning for companies developing mid-infrared devices for chemical sensing and spectroscopic applications

Wed, 11 Nov 2018
MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

SEMICON Korea to showcase AI, smart manufacturing, talent

Tue, 11 Nov 2018
With Korea expected to remain the world's largest consumer of semiconductor equipment, building on its 18 percent share in 2018, SEMICON Korea 2019 is poised to connect global electronics manufacturing companies to new opportunities.

MEMS & Sensors Technical Congress highlights automotive market, emerging MEMS technologies

Wed, 2 Feb 2019
This year’s MEMS & Sensors Technical Congress(MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards.

John Chong of Kionix named Chair of MEMS & Sensors Industry Group governing council

Wed, 2 Feb 2019
SEMI today announced the appointment of John Chong, vice president of product and business development at MEMS manufacturer Kionix, as Governing Council chair of the SEMI-MEMS & Sensors Industry Group.

Sensor accuracy: Critical metric in automotive, industrial, consumer markets

Wed, 2 Feb 2019
As group vice president of the Analog & MEMS Group and general manager of the MEMS Sensor division at STMicroelectronics, Andrea Onetti brings nearly three decades of experience in MEMS, sensors and audio systems to his leadership role at one of the world’s most successful electronics and semiconductor manufacturers.