Topic Index

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Ziptronix low-temp direct oxide bonding scales pixels to 0.7

Tue, 9 Sep 2011

In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the Ziptronix wafer bonding technology and their partnership with Sony.

Leti on 3D CMOS and photonics interconnect

Mon, 11 Nov 2011


Progress in Printed Electronics: An Interview with PARC’s Janos Veres

Tue, 1 Jan 2012

Solid State Technology editor Pete Singer caught up with Janos Veres, area manager for printed electronics in the electronic materials and devices laboratory at PARC.

Silicon wafer revenues decline in 2012

Tue, 2 Feb 2013

Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

Applied Materials' Onyx treatment restores lost carbon, strengthens film structure

Tue, 11 Nov 2011

Applied Materials released a new film treatment, Applied Producer Onyx, that reduces the power consumption in semiconductor chips while increasing mechanical strength. The product targets the challenges associated with 3D packaging applications and technologies.

Diamond films no longer in the rough with AKHAN Technologies launch

Mon, 11 Nov 2011

AKHAN Technologies has developed a shallow n-type diamond material over silicon that has characteristics such as a shallow ionization energy, high carrier mobility, and no graphitic phases. Adam Khan, president of AKHAN Technologies, says that the bottleneck in development of diamond films has always been the fabrication of n-type diamond.

imec advances CMOS beyond silicon to Ge, III-V

Wed, 12 Dec 2011

Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in "Advancing CMOS beyond the silicon roadmap with germanium and III-V devices" at IEDM.

Self-powered electronics: Achievements and challenges @ IEDM

Mon, 12 Dec 2011

Dennis Buss, a visiting scientist at the Massachusetts Institute of Technology (MIT) and consultant at Texas Instruments (TI), presented "Research in self-powered electronic systems (#10.4)" at IEEE's International Electron Devices Meeting (IEDM) recently. He shares key results here.

Applied Materials EUVL mask etch system debuts with multiple installs

Mon, 9 Sep 2011

Applied Materials (AMAT) unveiled its Centura Tetra EUV advanced reticle etch system at the SPIE BACUS conference. Amitabh Sabharwal, GM, mask etch products, talks about the product's technical specs, and how it overcame EUV challenges.

Negative 2011 semiconductor industry growth is possible, warns Gartner

Thu, 9 Sep 2011

Jim Walker, VP, Research of Semiconductor Manufacturing and Emerging Technologies, at Gartner, speaks with Solid State Technology about revising Gartner

Litho tool explores tradeoffs at 20nm and below

Tue, 9 Sep 2011

D2S announced a mask-wafer double simulation accelerated workstation, TrueMask DS, for R&D exploration, bit-cell design, hot-spot analysis and mask defect categorization. Aki Fujimura, CEO, D2S, speaks with ElectroIQ's Debra Vogler about the technology, and what makes 20nm different.

IC Insights updates semi forecast, discusses China's stimulus success

Tue, 9 Sep 2011

IC Insights' Bill McClean discusses his fall forecast update for the semiconductor industry, why he sees 8%-9% long-term growth, and the impact of stimulus programs on worldwide GDP and how that ties into semiconductor growth.