Fri, 12 Dec 2015
ALD is a technique capable of depositing a variety of thin film materials from the vapor phase.
Thu, 12 Dec 2015
Reaction materials for chemical vapor deposition are typically delivered into the chamber in a gaseous form. The source materials can be gases or liquids.
Fri, 12 Dec 2015
Chemical vapor deposition (CVD) is used to produce high-purity thin films.
Mon, 11 Nov 2010
Cost-of-ownership (COO) will be a main driver for ALD equipment selection in cost-sensitive markets; and in foundry or other logic applications, equipment choice is more a mix between COO, turn-around time and process performance considerations. M. Verghese, ASM, Phoenix, AZ USA; J. W. Maes, ASM, Leuven, Belgium; N. Kobayashi, ASM, Tokyo, Japan
Thu, 4 Apr 2011
ASM International N.V. (NASDAQ: ASMI) received multiple system orders for its plasma enhanced atomic layer deposition (PEALD) reactor from a leading memory customer in Asia. The company also qualified a new PEALD oxide application with a memory manufacturer for the 2X nm node.
Tue, 2 Feb 2015
Design features that contributed most to the improved performance include increased rotational speed, integrated rotor sleeves, and increased purge injection temperature.
Tue, 1 Jan 2016
Stanford University researchers sponsored by Semiconductor Research Corporation (SRC) have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors.
Thu, 3 Mar 2016
In the world of nano-scale technology, where work is conducted at the atomic level, even the smallest changes can have an enormous impact. And a new discovery by a University of Alberta materials engineering researchers has caught the attention of electronics industry leaders looking for more efficient manufacturing processes.
Thu, 4 Apr 2016
Samco, a Japan-based semiconductor process equipment developer and manufacturer, is employing around 20 more people at its locations in North America, China, Taiwan and Singapore, as well as its subsidiary Samco-UCP in Liechtenstein.
Tue, 5 May 2016
Ultratech, Inc. announced the formation of a research collaboration with Professor Thomas J. Webster, Ph.D. at Northeastern University, to study the use of nano-materials produced via ALD for medical applications.
Lam Research enables next-generation memory with industry's first ALD process for low-fluorine tungsten fillTue, 8 Aug 2016
Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its ALTUS family of products.
Wed, 9 Sep 2016
Lam Research Corp., an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex dielectric etch systems.
Fri, 6 Jun 2017
Thin films created at MIPT could be the basis for future development of ReRAM.
Thu, 7 Jul 2017
Veeco Instruments (Veeco) recently announced that Veeco CNT -- formerly known as Ultratech/Cambridge Nanotech -- shipped its 500th Atomic Layer Deposition (ALD) system to the North Carolina State University.
Thu, 3 Mar 2018
As the world of advanced manufacturing enters the sub-nanometer scale era, it is clear that ALD, MLD and SAM represent viable options for delivering the required few-atoms-thick layers required with uniformity, conformality, and purity.