Topic Index

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Brewer Science announces RDL-first fan-out packaging material

Tue, 9 Sep 2018
Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials.

Biodegradable, flexible silicon transistors

Tue, 6 Jun 2015
Wisconsin researchers have developed a new biodegradable silicon transistor based on a material derived from wood, opening the door for green, flexible, low-cost portable electronics in future.

Subatmospheric gas storage and delivery: Past, present and future

Thu, 6 Jun 2014
Storing gas on a sorbent provides an innovative, yet simple and lasting solution.

Flexible glass firms branch into new applications

Sun, 6 Jun 2014
Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.

Noise cancellation: The new failure and yield analysis superpower

Sun, 6 Jun 2014
Root cause deconvolution is a quick and cost effective way to determine the underlying root causes represented in a population of failing devices from test data alone.

UC Riverside to lead new energy frontier research center project

Wed, 6 Jun 2014
SHINES will investigate several aspects of basic research: new ultrathin films, nanostructured composites, high resolution imaging, the transport of electrical signals, heat and light.

ConFab panelists discuss optimizing R&D in the changing semi landscape

Tue, 6 Jun 2014
Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

Breakthrough research in the semiconductor industry

Mon, 6 Jun 2014
Research forms the DNA of the semiconductor industry — few other industries invest as much as a percentage of revenue.

EVG clears key barriers to 3DIC/TSV HVM with fusion wafer bonding solution

Mon, 6 Jun 2014
EV Group today unveiled the GEMINI FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

Tue, 7 Jul 2014
Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

Compact vibration harvester power supply with highest efficiency opens door to “Fix-and-Forget” sensor nodes

Wed, 7 Jul 2014
OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency.

A new multi-bit 'spin' for MRAM storage

Wed, 7 Jul 2014
Interest in magnetic random access memory (MRAM) is escalating, thanks to demand for fast, low-cost, nonvolatile, low-consumption, secure memory devices. MRAM, which relies on manipulating the magnetization of materials for data storage rather than electronic charges, boasts all of these advantages as an emerging technology, but so far it hasn't been able to match flash memory in terms of storage density.

Superfast stress inspection for overlay control

Mon, 7 Jul 2014
Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.

Taking great ideas from the lab to the fab

Tue, 8 Aug 2014
NSF and Intel support the development of domain-specific hardware to address health care needs.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

Tue, 8 Aug 2014
University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer

Fri, 8 Aug 2014
MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

Renesas Electronics expands portfolio of Simple Power Supply ICs

Wed, 8 Aug 2014
Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today expands its portfolio of Simple Power Supply ICs, with innovative 16V input capable synchronous buck regulators that deliver up to 3A continuous current to loads at voltages as low as 0.8V.

Renasas introduces new package for safety systems for industrial equipment

Tue, 8 Aug 2014
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has obtained IEC 61508 (Functional Safety) certification for the RX631, RX63N Safety Package.

Scientists craft a semiconductor only three atoms thick

Wed, 8 Aug 2014
Scientists have developed what they believe is the thinnest-possible semiconductor, a new class of nanoscale materials made in sheets only three atoms thick.

Samsung adopts ProPlus Designs' 14nm finFET process

Wed, 9 Sep 2014
ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.

Contour Semiconductor awarded three new U.S. patents

Thu, 9 Sep 2014
Contour Semiconductor, Inc., a developer of non-volatile memory technologies, today announced it has been awarded three new patents to back its Diode Transistor Memory (DTM) technology, the world's lowest production-cost, non-volatile memory technology.

UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor

Thu, 9 Sep 2014
Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.

Cree SiC MOSFETs help power Japan’s growing solar energy infrastructure

Mon, 9 Sep 2014
Cree, Inc. has announced that its C2M, 1200V, 80mOhm SiC MOSFETs have been selected by Sanix Corporation, Japan, to be designed into their new 9.9kW three-phase solar inverters for use in the construction of commercial photovoltaic systems in the fast-growing Japanese solar energy market.

Doped graphene nanoribbons with potential

Mon, 9 Sep 2014
Researchers from Empa and the Max Planck Institute for Polymer Research have now developed a new method to selectively dope graphene molecules with nitrogen atoms.

GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students

Tue, 9 Sep 2014
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.

Fermilab implements Ziptronix's DBI hybrid bonding in high-end 3D image sensors

Tue, 9 Sep 2014
Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

A fundamental truth of process control

Tue, 9 Sep 2014
You can’t fix what you can’t find. You can’t control what you can’t measure.

Samsung now mass producing industry’s first 20nm 6Gb LPDDR3 mobile DRAM

Thu, 9 Sep 2014
The new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.

For electronics beyond silicon, a new contender emerges

Thu, 9 Sep 2014
Silicon has few serious competitors as the material of choice in the electronics industry. Yet transistors, the switchable valves that control the flow of electrons in a circuit, cannot simply keep shrinking to meet the needs of powerful, compact devices; physical limitations like energy consumption and heat dissipation are too significant.

NSF and SRC announce research awards to 10 universities

Tue, 9 Sep 2014
The National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) today announced nine research awards to 10 universities totaling nearly $4 million under a joint program focused on Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS).

Future flexible electronics based on carbon nanotubes

Wed, 9 Sep 2014
Study in Applied Physics Letters show how to improve nanotube transistor and circuit performance with fluoropolymers

TSMC delivers first fully functional 16 finFET networking processor

Mon, 9 Sep 2014
TSMC today announced that its has successfully produced the foundry segment's first fully functional ARM-based networking processor with FinFET technology, through its collaboration with HiSilicon Technologies Co, Ltd.

A new dimension for integrated circuits: 3D nanomagnetic logic

Tue, 9 Sep 2014
Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits.

New technology may lead to prolonged power in mobile devices

Tue, 9 Sep 2014
Researchers from The University of Texas at Dallas have created technology that could be the first step toward wearable computers with self-contained power sources or, more immediately, a smartphone that doesn’t die after a few hours of heavy use.

FlipChip International creates 250 multi-product wafer bump designs

Wed, 10 Oct 2014
FlipChip International (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.

Albert Theuwissen of Harvest Imaging honored with European SEMI Award 2014

Wed, 10 Oct 2014
Albert Theuwissen, CEO of Harvest Imaging and professor at Delft University of Technology, is the recipient of the European SEMI Award 2014.

Managing oxide growth on in-process storage wafers for cost and yield impact

Mon, 10 Oct 2014
A system is described that mitigates unintended oxide growth for bare wafers while in-process storage and potentially post process at tools using nitrogen purge.

Element Six introduces new thermal grade of CVD diamond

Wed, 10 Oct 2014
Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.

Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

Thu, 10 Oct 2014
The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

Samsung starts mass production of 8Gb DDR4 based on 20nm process technology

Wed, 10 Oct 2014
Samsung today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

Imec, Coventor partner to advance CMOS process development

Tue, 10 Oct 2014
Imec researchers using Coventor’s SEMulator3D platform to model and optimize 7nm manufacturing technology.

'Nanomotor lithography' answers call for affordable, simpler device manufacturing

Tue, 11 Nov 2014
Nanoengineers at the University of California, San Diego recently invented a new method of lithography in which nanoscale robots swim over the surface of light-sensitive material to create complex surface patterns that form the sensors and electronics components on nanoscale devices.

Kandou introduces in-package chip interconnect enabling lower cost semiconductor solutions

Tue, 11 Nov 2014
Kandou Bus has announced the Glasswing family of chip interconnects targeted for in-package chip-to-chip links.

Applied Materials develops advanced patterning solution for memory devices

Mon, 11 Nov 2014
Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

Hybrid Memory Cube Consortium releases new specification

Mon, 11 Nov 2014
The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

Soitec announces new world record for solar cell efficiency at 46%

Wed, 12 Dec 2014
The record multi-junction solar cell converts 46 % of the solar light into electrical energy.

Intel announces IoT platform

Thu, 12 Dec 2014
Intel Corporation today announced the Intel IoT Platform, an end-to-end reference model designed to unify and simplify connectivity and security for the Internet of Things (IoT).

Leti will discuss CoolCube technology for 3D transistor stacking at workshop preceding IEDM 2014

Thu, 12 Dec 2014
CEA-Leti will present its latest results on CoolCube, the technique for stacking transistors sequentially in the same process flow for 3D-VLSI, at a Dec. 14 workshop in San Francisco, Calif.

Laser spike annealing resolves sub-20nm logic device manufacturing challenges

Thu, 12 Dec 2014
LSA technology plays an enabling role to overcoming manufacturing challenges for sub-20nm logic devices.

From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

Thu, 12 Dec 2014
Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.

ON Semiconductor demonstrates high efficiency 3D sensor stacking technology

Tue, 1 Jan 2015
ON Semiconductor has successfully characterized and demonstrated its first fully-functional stacked CMOS imaging sensor featuring a smaller die footprint, higher pixel performance and better power consumption compared to traditional monolithic non-stacked designs.

Silicon Space Technology partners with GLOBALFOUNDRIES to deliver processors and memory solutions

Fri, 1 Jan 2015
Silicon Space Technology, an industry innovator in high-temp and rad-hard embedded system solutions, announced today the company has partnered with GLOBALFOUNDRIES to build commercial-ready products for extreme environments and applications.

Samsung Electronics starts mass producing industry’s first 8-gigabit graphics DRAM

Thu, 1 Jan 2015
Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 8 gigabit (Gb) GDDR5 DRAM, based on the company’s leading-edge 20-nanometer (nm) process technology.

Imec introduces new snapshot hyperspectral image sensors with mosaic filter architecture

Wed, 2 Feb 2015
At next week’s SPIE Photonics West 2015, imec will present a new set of snapshot hyperspectral CMOS image sensors featuring spectral filter structures in a mosaic layout, processed per-pixel on 4x4 and 5x5 ‘Bayer-like’ arrays.

Entegris launches Dispense System optimized for 3D and MEMS applications

Tue, 2 Feb 2015
Entegris, Inc. announced the latest addition to its IntelliGen family of two-stage dispense technologies used in microelectronics manufacturing processes.

Status of the power electronics industry: It is now a question of integration

Mon, 2 Feb 2015
According to Yole Développement’s team, wide band gap (WBG) technologies are almost ready to be used by power electronics integrators. The question is now: How?

New method allows for greater variation in band gap tunability

Fri, 1 Jan 2015
If you can't find the ideal material, then design a new one.

ROHM Semiconductor announces monolithic EDLC cell balancing IC

Thu, 2 Feb 2015
ROHM recently announced the development of a cell balancing IC that contributes to increased miniaturization, greater stability, and longer life for EDLCs.

Breakthrough may lead to industrial production of graphene devices

Mon, 2 Feb 2015
With properties that promise faster computers, better sensors and much more, graphene has been dubbed the 'miracle material'. But progress in producing it on an industrial scale without compromising its properties has proved elusive.

One-atom-thin silicon transistors hold promise for super-fast computing

Mon, 2 Feb 2015
Researchers at The University of Texas at Austin's Cockrell School of Engineering have created the first transistors made of silicene, the world's thinnest silicon material.

Improving the reliability of dry vacuum pumps in high-k ALD processes

Tue, 2 Feb 2015
Design features that contributed most to the improved performance include increased rotational speed, integrated rotor sleeves, and increased purge injection temperature.

Thermal performance of 3DICs

Fri, 2 Feb 2015
3DICs are assumed to suffer from stronger thermal issues when compared to equivalent implementations in traditional single-die integration technologies.

Cymer announces shipment of its first XLR 700ix DUV light source and introduces DynaPulse

Mon, 2 Feb 2015
Cymer, an ASML company, a developer of lithography light sources used by chipmakers to pattern advanced semiconductor chips, today announced the shipment of its first XLR 700ix light source.

Applied Materials unveils breakthrough e-beam metrology tool for finFET transistors and 3D NAND devices

Mon, 2 Feb 2015
At the SPIE Advanced Lithography conference in San Jose, Calif., Applied Materials, Inc., today announced the industry's first in-line 3D CD SEM metrology tool for solving the challenges of measuring the high aspect ratio and complex features of 3D NAND and FinFET devices.

Imec demonstrates compact wavelength-division multiplexing CMOS silicon photonics transceiver

Thu, 2 Feb 2015
This week, at the 2015 International Solid State Circuits Conference (ISSCC), imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid CMOS silicon photonics transceive

UT Dallas technology could make night vision, thermal imaging affordable

Wed, 3 Mar 2015
Semiconductors made in CMOS technology reach nearly 10 terahertz.

IRT Nanoelec and CMP team up to offer world’s first service for post-process 3D technologies on multi-project-wafer

Thu, 3 Mar 2015
IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW).

CEA-Leti announces launch of Silicon Impulse IC design competence center

Tue, 3 Mar 2015
CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

Microsemi introduces second generation 64GB solid state drive

Tue, 3 Mar 2015
Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced its second generation highly secure 64 gigabyte (GB) solid state drive (SSD).

MACOM announces new 650 W GaN on SiC HEMT pulsed power transistor

Wed, 3 Mar 2015
M/A-COM Technology Solutions Inc. today announced a 650 W gallium nitride (GaN) on silicon carbide (SiC) HEMT pulsed power transistor for L-band pulsed avionics applications.

Micron and Intel unveil new 3D NAND flash memory

Thu, 3 Mar 2015
Micron Technology, Inc. and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory.

TSMC certifies Synopsys design tools for 16nm finFET plus production and for 10nm early design starts

Mon, 4 Apr 2015
This certification enables mutual customers to deploy tools in Synopsys' Galaxy Design Platform for 16nm production designs and 10nm early engagements.

Duke University research advances testing of 3D integrated circuits for cost-effective development of electronics

Tue, 4 Apr 2015
Duke University researchers are working to advance the tools and methodologies used to test 3D integrated circuits (ICs), which promise to help ensure the ongoing development of higher performance, lower power semiconductor chips.

KLA-Tencor introduces new portfolio for advanced semiconductor packaging

Thu, 4 Apr 2015
Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

MagnaChip to offer diversified products for Internet of Things applications

Mon, 4 Apr 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has kicked-off an Internet of Things (IoT) task force and will offer diversified products with ultra-low power technology in anticipation of the fast growing IoT market.

Synopsys' modeling of 10nm parasitic variation effects ratified by open-source standards board

Tue, 4 Apr 2015
Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node.

Surface matters: Huge reduction of heat conduction observed in flat silicon channels

Thu, 4 Apr 2015
A paper published in ACS Nano describes how the nanometre-scale topology and the chemical composition of the surface control the thermal conductivity of ultrathin silicon membranes.

Two-dimensional semiconductor comes clean

Tue, 4 Apr 2015
Researchers at Columbia Engineering, Harvard, Cornell, University of Minnesota, Yonsei University in Korea, Danish Technical University, and the Japanese National Institute of Materials Science have shown that the performance of another 2D material--molybdenum disulfide (MoS2)--can be similarly improved by BN-encapsulation.

Co-design of chips, packages and boards

Wed, 5 May 2015
A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools.

Enhanced thermal management solutions for RF power amplifiers

Wed, 5 May 2015
Synthetic diamond heat spreaders and GaN-on-Diamond wafers have emerged as a leading thermal- management technology for RF Power Amplifiers.

Visualizing formation in BEOL

Thu, 5 May 2015
New tests show in real-time that cracks can run on top of and through metal layers.

Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm embedded flash tech

Fri, 5 May 2015
Microchip Technology Inc. and GLOBALFOUNDRIES today announced the full qualification and availability of SST's 55nm embedded SuperFlash non-volatile memory (NVM) on GLOBALFOUNDRIES' 55nm Low Power Extended (LPx)/ RF enabled platform.

Applied Materials' breakthrough patterning hard mask enables copper interconnect scaling

Tue, 5 May 2015
Applied Materials, Inc. today announced its Applied Endura Cirrus HTX PVD system with breakthrough technology for patterning copper interconnects at 10nm and beyond.

imec and Lam Research develop novel metallization method

Tue, 5 May 2015
During the IEEE IITC conference in Grenoble, the nanoelectronics research center imec and Lam Research Corporation today presented a novel bottom-up prefill technique for vias and contacts.

GLOBALFOUNDRIES offers new low-power 28nm solution for high-performance mobile and IoT applications

Wed, 5 May 2015
Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs.

imec and Tokyo Electron demonstrate electrical advantages of direct Cu etch scheme for advanced interconnects

Wed, 5 May 2015
Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects.

Advantest develops semiconductor circuit analysis terahertz technology

Thu, 5 May 2015
Semiconductor test equipment supplier Advantest Corporation announced today that it has developed a technology utilizing short-pulse terahertz waves for analysis of electrical circuits.

Dow Corning introduces next-generation thermal interface material

Tue, 5 May 2015
Dow Corning, a developer of silicones, silicon-based technology and innovation, today unveiled new Dow Corning TC-3040 Thermally Conductive Gel, a next-generation thermal interface material.

GaN Systems power transistors are 50% smaller

Tue, 5 May 2015
GaN Systems, a developer of gallium nitride power switching semiconductors, today confirmed the world’s smallest 650V, 15A gallium nitride transistor.

UMC unveils UMC Auto Platform to enable automotive IC designs

Tue, 5 May 2015
United Microelectronics Corporation, a global semiconductor foundry, today unveiled its UMC Auto technology platform to target IC companies designing chips for automotive applications.

Collaboration could lead to biodegradable computer chips

Fri, 5 May 2015
Portable electronics - typically made of non-renewable, non-biodegradable and potentially toxic materials - are discarded at an alarming rate in consumers' pursuit of the next best electronic gadget.

Diverse packaging and test issues up for debate at SEMICON West 2015

Fri, 5 May 2015
SEMI this week announced the SEMICON West 2015 test and packaging program agendas.

A novel characterization technique unveils the 3D structure of conductive filaments in resistive switching memories

Fri, 6 Jun 2015
Imec researchers have developed a novel technique – termed conductive atomic force microscopy tomography (or scalpel C-AFM) – that enables a three-dimensional characterization of emerging logic and memory devices.

FOWLP and embedded packaging

Wed, 6 Jun 2015
At the recent IMAPS conference, Yole’s Jerome Alzemer updated the audience on the Fan Out and Embedded die marketplace, based on his new report “Fan out and Embedded Die: Technology and Market Trends.”

Leti workshop covers major trends in FD-SOI technologies

Tue, 6 Jun 2015
CEA-Leti will host a workshop on major trends in Fully Depleted Silicon-on-Insulator process and design technologies in connection with the 17th annual LetiDays Grenoble, June 24-25.

ASCENT project offers unparalleled access to European nanoelectronics infrastructure

Thu, 6 Jun 2015
Europe’s leading nanoelectronics institutes, Tyndall National Institute in Ireland, CEA-Leti in France and imec in Belgium, have entered a €4.7 million collaborative open-access project called ASCENT (Access to European Nanoelectronics Network).

Freescale takes its next generation QorIQ multicore platform to 16nm FinFET technology

Wed, 6 Jun 2015
Freescale Semiconductor has disclosed initial details regarding the next generation of its successful QorIQ multicore processor portfolio, today announcing it will drive innovation for the secure Internet of Tomorrow (IoT) on highly advanced 16nm FinFET process technology.

“What’s next?” ─ Advances in technology at SEMICON West 2015

Thu, 6 Jun 2015
The latest manufacturing, materials and production developments in semiconductor and related technologies will be featured at SEMICON West 2015 on July 14-16 at Moscone Center in San Francisco, Calif.

The peaks and valleys of silicon

Mon, 6 Jun 2015
When the new iPhone came out, customers complained that it could be bent -- but what if you could roll up your too big 6 Plus to actually fit in your pocket? That technology might be available sooner than you think, based on the work of USC Viterbi engineers.

Peregrine Semiconductor introduces first RF SOI 300mm technology platform

Mon, 7 Jul 2015
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS 11 platform.

IRT Nanoelec partners achieve 3D chip-stacking technology & 3D network-on-chip framework

Thu, 7 Jul 2015
IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).

Applied Materials' new etch system provides atomic-level precision

Mon, 7 Jul 2015
Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.

A new sensor from Golden Valley-based CyberOptics will advance digital gadgets

Wed, 7 Jul 2015
CyberOptics’ latest product ultimately will make digital gadgets better, cheaper.

Intel and Micron produce breakthrough memory technology

Tue, 7 Jul 2015
Intel and Micron begin production on new class of non-volatile memory, creating the first new memory category in more than 25 years.

ON Semiconductor introduces new ICs for next generation auto designs

Mon, 8 Aug 2015
ON Semiconductor has introduced an array of new AEC-Q100-compliant integrated circuits (ICs) optimized for implementation into next generation automobile designs.

A*STAR's IME Consortium announces development of innovative advanced packaging solutions

Tue, 8 Aug 2015
Following the launch of the 12th Electronics Packaging Research Consortium (EPRC12) in 2013, A*STAR’s Institute of Microelectronics (IME) and 11 of its consortium partners across the semiconductor supply chain have developed novel solutions in integrated circuit (IC) packaging.

Toshiba develops world's first 16-die stacked NAND flash memory with TSV tech

Thu, 8 Aug 2015
Toshiba Corporation today announced the development of the world’s first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology.

Rice U. discovery may boost memory technology

Tue, 8 Aug 2015
Scientists at Rice University have created a solid-state memory technology that allows for high-density storage with a minimum incidence of computer errors.

Cypress introduces the world's lowest-power energy harvesting power management ICs

Fri, 8 Aug 2015
Cypress Semiconductor Corp. today announced a new family of Energy Harvesting Power Management Integrated Circuits (PMICs) that enable tiny, solar-powered wireless sensors for Internet of Things (IoT) applications.

GaN nanoelectronics-transistor blocking voltage exceeds 1kV

Mon, 8 Aug 2015
Research reported in Applied Physics Express (APEX) by Tohru Oka and colleagues at the Research and Development Headquarters for TOYODA GOSEI Co., Ltd in Japan describe the development of ‘vertically orientated’ GaN-based transistors with blocking voltages exceeding 1kV.

Toshiba launches 16MP CMOS image sensors targeting smartphones and tablets

Mon, 8 Aug 2015
Designed for use in smartphones and tablets, the backside-illuminated (BSI) chips are among the world's smallest class of CMOS image sensors, and achieve both high-performance image capture and low power consumption.

DCG Systems extends circuit edit capability to the 10nm node with the introduction of OptiFIB Taipan

Wed, 9 Sep 2015
DCG Systems today announces the release of the OptiFIB Taipan circuit edit solution for the most advanced integrated circuit (IC) nodes.

QEOS and GLOBALFOUNDRIES to offer industry’s first CMOS platform for millimeter-wave markets

Fri, 9 Sep 2015
QEOS, Inc., a designer of connectivity and sensing CMOS millimeter-wave (mmWave) solutions, and GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced they are partnering to co-develop the industry’s first mmW CMOS platform.

Realizing carbon nanotube integrated circuits

Wed, 9 Sep 2015
Encapsulation layers keep carbon nanotube transistors stable in open air.

OEM Group Announces New Cintillio-S (TM) Automated Batch Wet Chemical Processing System

Mon, 9 Sep 2015
Global semiconductor capital equipment manufacturer OEM Group announced today that it has launched its new Cintillio-S (TM) automated batch wet chemical processing system.

Silicone shines new light on optical applications

Tue, 9 Sep 2015
As a response to meet the increasing demands of cutting-edge LED technologies, Shin-Etsu Silicones of America has recently introduced its new optically clear LIMS (Liquid Injection Molding System) X-34-1972-3 material.

UMC enters high volume touch IC production using foundry industry's first 0.11um eFlash process

Thu, 9 Sep 2015
United Microelectronics Corporation (UMC), a global semiconductor foundry, today announced that it has entered high volume production for touch IC applications manufactured on UMC's 0.11um eFlash process.

X-FAB sets benchmark for low-noise CMOS

Fri, 9 Sep 2015
Enhanced XH035 and XH018 CMOS transistors deliver industry-leading performance for highly noise-sensitive applications.

LG Innotek announces high power LED packages

Thu, 10 Oct 2015
LG Innotek announced that the company started to produce high-power LED packages (H35C4 Series) featuring 180lm/W.

Yamaichi Electronics 0.35mm pitch test contactor for semiconductor evaluation

Fri, 10 Oct 2015
Yamaichi Electronics presents Test Contactors for lab and reliability applications and ultra fine pitch semiconductor devices.

Silver: The promising electrode winner for low-cost perovskite solar cells

Fri, 10 Oct 2015
A study published in Advanced Materials Interfaces by the Energy Materials and Surface Sciences Unit at the Okinawa Institute of Science and Technology Graduate University (OIST) reveals a cause for the short lifetime of perovskite solar cells with silver electrodes.

MOSFETs automatically balance supercapacitors in industrial applications

Wed, 10 Oct 2015
Advanced Linear Devices, Inc. (ALD) announced a family of Supercapacitor Auto Balancing (SAB) Metal Oxide Semiconductor Field Effect Transistors (MOSFET) designed for industrial applications.

Successful industrialization of high-density 3D integrated silicon capacitors for ultra-miniaturized electronic components

Thu, 10 Oct 2015
Two years after the launch of the PICS project , three European SMEs, IPDiA, Picosun, and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved.

mCube unveils the world's smallest 1x1mm accelerometer

Tue, 10 Oct 2015
mCube announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size.

DCG Systems addresses localization of electrical shorts with EBIRCH technology

Tue, 11 Nov 2015
DCG Systems announced the release of EBIRCH, a technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits.

GLOBALFOUNDRIES achieves 14nm finFET technology success for next-generation AMD products

Fri, 11 Nov 2015
GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD products using its most advanced 14nm FinFET process technology.

Advance could bring commercial applications for silver nanowires

Tue, 11 Nov 2015
New research suggests wrapping silver nanowires with an ultrathin layer of graphene protects the structures from damage and could represent a key to realizing their commercial potential.

A new slant on semiconductor characterization

Thu, 11 Nov 2015
Method analyzes non-uniform conductors with a magnetic field.

Security by design

Fri, 11 Nov 2015
The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.

Micron introduces persistent memory tech that combines DRAM performance with NAND flash reliability

Fri, 11 Nov 2015
Micron Technology, Inc. this week announced the production of 8GB DDR4 NVDIMM, the company's first commercially available solution in the persistent memory category.

Photons on a chip set new paths for secure communications

Mon, 11 Nov 2015
Researchers from RMIT University in Melbourne have helped crack the code to ultra-secure telecommunications of the future in an international research project that could also expedite the advent of quantum computing.

Wafer bonding for high performance MEMS, power devices, and RF components

Tue, 11 Nov 2015
Recent trends and future directions for wafer bonding are reviewed, with a focus on MEMS.

What lies beneath? 50 years of enabling Moore’s Law

Tue, 11 Nov 2015
Vacuum technology trends can be seen over the period of innovation defined by Moore’s Law, particularly in the areas of increasing shaft speed, management of pumping power, and the use computer modeling.

Cambridge CMOS Sensors wins again at NMI awards

Tue, 11 Nov 2015
Cambridge CMOS Sensors (CCS), a semiconductor company with gas sensor solutions to monitor the local environment, today announced that it has been crowned winner of the Product of the Year category at this year's National Microelectronics Institute (NMI) Awards, held at the Grange Tower Bridge Hotel in London.

CEA-Leti and CEA-Inac pave the way for quantum information processing on SOI CMOS platform

Mon, 12 Dec 2015
CEA-Leti today announced preliminary steps for demonstrating a quantum bit, or qubit, the building block of quantum information, in a process utilizing a silicon-on-insulator (SOI) CMOS platform.

Leti develops local-strain techniques in FD-SOI fabrication to improve next-generation performance

Tue, 12 Dec 2015
CEA-Leti today announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed at the same, or lower, power consumption, and improve performance.

Imec improves performance and reliability of deeply-scaled CMOS logic devices

Wed, 12 Dec 2015
At this week’s IEEE International Electron Devices Meeting 2015, nano-electronics research center imec presented breakthrough results to increase performance and improve reliability of deeply scaled silicon CMOS logic devices.

When front-end-of-line and back-end-of-line reliability meet

Wed, 12 Dec 2015
Due to the further scaling and increasing complexity of transistors, the boundaries between back-end-of-line and front-end-of-line reliability research are gradually fading. Imec’s team leaders Kristof Croes and Dimitri Linten give their vision on the future of reliability research.

Applied Materials' Chorng-Ping Chang named 2016 IEEE Fellow

Tue, 12 Dec 2015
Applied Materials, Inc. today announced that Dr. Chorng-Ping Chang, who leads the company's strategic external research with universities and industry consortia, has been named a 2016 IEEE Fellow.

IEEE Photonics Society announces Call for Papers for fifth annual Optical Interconnects Conference

Fri, 1 Jan 2016
Paper submission deadline is January 24, 2016.

Wide Band Gap technologies: An opportunity to increase power devices performance

Fri, 1 Jan 2016
When people think about Wide Band Gap (WBG) materials for power electronics applications, they usually think of GaN or SiC. However, there are materials with an even larger band gap which can further increase power device performance.

Flash, STT-MRAM and resistive RAM: They all come with different challenges

Mon, 1 Jan 2016
Research in memory is really exciting these days: in parallel you have the scaling of classical memories (SRAM, DRAM, Flash) and the emergence of new memories capable of enabling new applications or even new system hierarchies. At imec, we mostly focus on three concepts which all come with different challenges.

Cypress supports wafer sales on leading F-RAM and nvSRAM Portfolio

Thu, 1 Jan 2016
Cypress Semiconductor Corp., today announced the addition of wafer products to its industry-leading nonvolatile random access memory (NVRAM) portfolio.

Cornell-led team creates gallium nitride power diode

Fri, 1 Jan 2016
Making tiny switches do enormous jobs in a more efficient way than current technology allows is one of the goals of a research team led by Cornell engineering professor Huili (Grace) Xing.

Wirelessly supplying power to brain

Mon, 2 Feb 2016
A research team at the Department of Electrical and Electronic Information Engineering at Toyohashi University of Technology has developed a wafer-level packaging technique to integrate a silicon large-scale integration (LSI) chip in a very thin film of a thickness 10 μm.

Call for Papers open for SEMICON Europa 2016 and 2016FLEX Europe

Wed, 2 Feb 2016
SEMI today announced the "Call for Papers" for technical sessions and presentations for SEMICON Europa 2016 which takes place 25-27 October in Grenoble, France.

Engineering material magic

Mon, 2 Feb 2016
University of Utah engineers have discovered a new kind of 2D semiconducting material for electronics that opens the door for much speedier computers and smartphones that also consume a lot less power.

Cadence Innovus Implementation System qualified on Samsung 10nm FinFET process

Tue, 2 Feb 2016
Cadence Design Systems, Inc. today announced that the Cadence Innovus Implementation System has been qualified for Samsung Foundry's latest 10-nanometer (10nm) process.

Mentor Graphics launches Veloce Apps

Fri, 2 Feb 2016
Mentor Graphics Corp. ushered in a new era of emulation by announcing new applications for the Veloce emulation platform.

Light helps the transistor laser switch faster

Wed, 3 Mar 2016
A new study by University of Illinois engineers found that in the transistor laser, a device for next-generation high-speed computing, the light and electrons spur one another on to faster switching speeds than any devices available.

GLOBALFOUNDRIES broadens SiGe power amplifier portfolio

Tue, 3 Mar 2016
GLOBALFOUNDRIES today announced new advanced radio-frequency (RF) silicon solutions, further expanding the portfolio of Silicon Germanium (SiGe) power amplifier (PA) technologies designed to enable performance-optimized cellular and Wi-Fi solutions in increasingly sophisticated mobile devices and hardware.

Making electronics safer with perovskites

Wed, 3 Mar 2016
Scientists in Japan are developing methods to manufacture safer ceramic capacitors.

Replacement for silicon devices looms big with ORNL discovery

Thu, 3 Mar 2016
Two-dimensional electronic devices could inch closer to their ultimate promise of low power, high efficiency and mechanical flexibility with a processing technique developed at the Department of Energy's Oak Ridge National Laboratory.

Rudolph adds high-speed 3D metrology to the NSX Series for advanced packaging process control

Thu, 4 Apr 2016
Rudolph Technologies, Inc. today announced the availability of new, high-speed 3D metrology on its flagship NSX Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects.

Leti extends collaboration with Qualcomm on CoolCube 3D integration technology

Tue, 4 Apr 2016
Leti, an institute of CEA Tech, today announced the continuation of its collaboration with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to develop CoolCube.

IEEE International Electron Devices Meeting announces 2016 Call for Papers

Fri, 4 Apr 2016
The 62nd annual IEEE International Electron Devices Meeting (IEDM), to be held at the San Francisco Union Square Hilton hotel December 3 - 7, 2016, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

UW-Madison engineers fabricate fastest flexible silicon transistor

Wed, 4 Apr 2016
Working in collaboration with colleagues around the country, University of Wisconsin-Madison engineers have pioneered a unique method that could allow manufacturers to easily and cheaply fabricate high-performance transistors with wireless capabilities on huge rolls of flexible plastic.

EV Group receives multiple orders for GEMINI FB XT fusion bonder for 3D chip stacking production applications

Wed, 5 May 2016
EV Group (EVG) announced that it has received multiple orders for its GEMINI FB XT automated fusion wafer bonders from multiple leading device manufacturers.

Synopsys' Custom Compiler enabled for Samsung Foundry's 14nm finFET process

Fri, 5 May 2016
Synopsys, Inc. today announced that the company's Custom Compiler tool has been enabled by Samsung for 14 nanometer (nm) LPP and LPC FinFET production.

GLOBALFOUNDRIES releases performance-enhanced 130nm SiGe RF technology

Mon, 5 May 2016
GLOBALFOUNDRIES today announced a next-generation radio-frequency (RF) silicon solution for its Silicon Germanium (SiGe) high-performance technology portfolio.

Imec and Holst Centre present multi-standard low-power wide-area radio chip

Tue, 5 May 2016
The nanoelectronics research centers imec and Holst Centre (set up by imec and TNO), presented a low-power wide-area (LPWA) multi-standard radio chip today at imec's annual technology forum in Brussels (ITF Brussels 2016).

MACOM launches new GaN power transistors

Thu, 5 May 2016
MACOM Technology Solutions reported the newest entries in its MAGb series of GaN on Silicon power transistors for use in macro wireless basestations.

Advanced Packaging Forum provides answers at SEMICON West 2016

Tue, 6 Jun 2016
Today, SEMI announced that the latest packaging solutions will be the topic of an in-depth session at the SEMICON West 2016 Advanced Packaging Forum - and on display on the exhibition floor.

Samsung introduces new line-up of LED components for automotive lighting, featuring chip-scale packaging

Tue, 6 Jun 2016
Samsung Electronics Co., Ltd. announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.

Imec demonstrates junction-less gate-all-around lateral and vertical nanowire FET devices

Thu, 6 Jun 2016
The new GAA-NWFET is a promising candidate for advanced logic & analog/RF applications, and scaled SRAM cells.

Building U.S. manufacturing ecosystems for emerging advanced packaging technologies

Wed, 6 Jun 2016
Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

AI Technology, Inc. introduces temporary bonding adhesive for thin wafer handling

Thu, 6 Jun 2016
For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.

SEMI Strategic Materials Conference delivers demand drivers for new device and packaging materials

Thu, 6 Jun 2016
The Strategic Materials Conference (SMC 2016), focusing on "Scaling Challenges: The Future of Materials and Packaging," will be held September 20-21, at the Computer History Museum in Mountain View, Calif.

Applied Materials' next-generation e-beam inspection system provides industry's highest resolution

Mon, 7 Jul 2016
Applied Materials, Inc. today announced its next-generation e-beam inspection system is delivering the highest resolution and image quality at the fastest throughput to leading foundry, logic, DRAM and 3D NAND customers as they move to advanced nodes.

Rudolph Technologies announces new Clearfind technology for advanced packaging inspection

Mon, 7 Jul 2016
Clearfind technology sees organic defects that often escape detection with conventional white-light inspection technologies.

Chemical etching method helps transistors stand tall

Tue, 7 Jul 2016
University of Illinois researchers have developed a way to etch very tall, narrow finFETs, a type of transistor that forms a tall semiconductor "fin" for the current to travel over. The etching technique addresses many problems in trying to create 3-D devices, typically done now by stacking layers or carving out structures from a thicker semiconductor wafer.

Microsemi announces production release of second generation high performance Flashtec NVMe controllers

Thu, 8 Aug 2016
Microsemi Corporation today announced the production release of its Flashtec NVM Express (NVMe)2032 and NVMe2016 controllers.

Utah and Minnesota engineers discover highly conductive materials for more efficient electronics

Wed, 7 Jul 2016
Engineers from the University of Utah and the University of Minnesota have discovered that interfacing two particular oxide-based materials makes them highly conductive, a boon for future electronics that could result in much more power-efficient laptops, electric cars and home appliances that also don't need cumbersome power supplies.

Samsung showcases flash technologies to address growing requirements of storage systems

Fri, 8 Aug 2016
Samsung Electronics Co., Ltd. this week introduced a blueprint for next-generation flash memory solutions that will meet the ever-increasing demands of big data networks, cloud computing and real-time analysis.

Mentor Graphics launches new Xpedition Enterprise Platform

Mon, 8 Aug 2016
Mentor Graphics Corporation today announced the first phase of the new Xpedition printed circuit design (PCB) flow to address the increasing complexity of today's advanced systems designs.

Memory for future wearable electronics

Fri, 9 Sep 2016
Stretchable, flexible, reliable memory device inspired by the brain.

Continuous roll-process technology for transferring and packaging flexible LSI

Mon, 8 Aug 2016
A research team led by Professor Keon Jae Lee from the Korea Advanced Institute of Science and Technology (KAIST) and by Dr. Jae-Hyun Kim from the Korea Institute of Machinery and Materials (KIMM) has jointly developed a continuous roll-processing technology that transfers and packages flexible large-scale integrated circuits.

Plastic crystals could improve fabrication of memory devices

Wed, 8 Aug 2016
A novel 'plastic crystal' developed by Hokkaido University researchers has switching properties suitable for memory-related applications.

GLOBALFOUNDRIES launches embedded MRAM on 22FDX platform

Thu, 9 Sep 2016
High-performance embedded non-volatile memory solution is ideally suited for emerging applications in advanced IoT and automotive.

GLOBALFOUNDRIES to deliver industry's leading-performance offering of 7nm FinFET technology

Thu, 9 Sep 2016
This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.

Applied Materials and A*STAR's Institute of Microelectronics to advance R&D in FOWLP

Mon, 9 Sep 2016
The organizations will expand the scope of their R&D collaboration to focus on advancing Fan-Out Wafer-Level Packaging (FOWLP), a key technology inflection expected to help make chips and end-user devices smaller, faster and more power efficient.

Toshiba expands 24nm SLC NAND flash lineup to address industrial applications

Tue, 9 Sep 2016
Toshiba America Electronic Components, Inc. has expanded its family of 24nm single-level cell (SLC) NAND flash memory solutions.

INVECAS and GlobalFoundries announces availability of advanced 14nm FinFET design IP library

Wed, 9 Sep 2016
Silicon-proven and optimized IP from INVECAS is now available for foundry customers on GLOBALFOUNDRIES' 14LPP process.

Researchers use novel materials to build smallest transistor

Thu, 10 Oct 2016
In the quest for faster and more powerful computers and consumer electronics, big advances come in small packages.

Peregrine Semiconductor wins 2016 ECN IMPACT Award

Fri, 10 Oct 2016
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator), announces that the UltraCMOS PE42723 high linearity RF switch has won an ECN IMPACT Award in the market disruptor category.

Samsung starts industry's first mass production of System-on-Chip with 10nm finFET technology

Mon, 10 Oct 2016
Samsung Electronics Co., Ltd. today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.

Exploring defects in nanoscale devices for possible quantum computing applications

Thu, 10 Oct 2016
Researchers at Tokyo Institute of Technology in collaboration with the University of Cambridge have studied the interaction between microwave fields and electronic defect states inside the oxide layer of field-effect transistors at cryogenic temperatures.

New perovskite solar cell design could outperform existing commercial technologies

Fri, 10 Oct 2016
Stanford, Oxford team creates high-efficiency tandem cells.

Ultralow power transistors could function for years without a battery

Fri, 10 Oct 2016
A new design for transistors which operate on 'scavenged' energy from their environment could form the basis for devices which function for months or years without a battery, and could be used for wearable or implantable electronics.

Next-gen low-noise imaging tech developed by Leti for French SME Pyxalis

Thu, 11 Nov 2016
Leti, an institute of CEA Tech, and PYXALIS, a French SME specializing in high-performance image sensors, today announced a new technology that lowers readout noise for image sensors down to 0.5 electron noise and dramatically improves low-light image sensing capabilities.

New record for silicon-based multi-junction solar cell

Wed, 11 Nov 2016
Researchers at the Fraunhofer Institute for Solar Energy Systems ISE together with the Austrian company EV Group (EVG) have successfully manufactured a silicon-based multi-junction solar cell with two contacts and an efficiency exceeding the theoretical limit of silicon solar cells.

Researchers surprised at the unexpected hardness of gallium nitride

Mon, 10 Oct 2016
A Lehigh University team discovers that the widely used semiconducting material is almost as wear-resistant as diamonds.

Synopsys advances test and yield analysis solution for 7nm process node

Tue, 11 Nov 2016
Synopsys, Inc. today announced it expanded its test and yield analysis solution targeting FinFET-specific defects to enable higher quality testing, repair, diagnostics and yield analysis of advanced 7nm SoCs.

Stanford engineers find that a new memory technology may be more energy efficient than previously thought

Wed, 12 Dec 2016
While exploring the atomic-level forces at play in a new type of computer chip, researchers found an energy-saving surprise that could translate into longer battery life for next-generation mobile devices.

Lab4MEMS project recognized with European Innovation Award

Mon, 11 Nov 2016
Project developed pilot line for next-generation MEMS devices.

Human-focused research and IoT promise profound, positive changes, say Leti CEO

Tue, 12 Dec 2016
Leti CEO Marie Semeria today delivered a sweeping, optimistic assessment of a rapidly evolving world where "hyperconnectivity" and the Internet of Things – guided by a "human-centered research approach and symbiotic development strategies" – herald profound changes in the way individuals relate to each other and to the physical world.

Amkor completes product qualification of SWIFT packaging

Wed, 12 Dec 2016
Amkor Technology, Inc. today announced completion of product qualification for its innovative new Silicon Wafer Integrated Fan-Out Technology (SWIFT).

Telecommunications light amplifier could strengthen integrity of transmitted data

Thu, 1 Jan 2017
Imagine a dim light which is insufficiently bright enough to illuminate a room. An amplifier for such a light would increase the brightness by increasing the number of photons emitted. Photonics researchers have created such a high gain optical amplifier that is compact enough to be placed on a chip. The developed amplifier would help to efficiently increase the power of the transmitted light before it is completely depleted through optical losses.

2017 Symposia on VLSI Technology & Circuits opens online submission for papers

Thu, 1 Jan 2017
Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits, to be held at the Rihga Royal Hotel in Kyoto, Japan from June 5 - 8, 2017.

Toshiba expands line-up of embedded NAND flash memory products for automotive applications

Tue, 12 Dec 2016
Sample shipments start from today with mass production scheduled for the second quarter (April to June) of 2017.

Researchers create practical and versatile microscopic optomechanical device

Mon, 1 Jan 2017
Trapping light and mechanical waves within a tiny bullseye, design could enable more sensitive motion detection.

AGC unveils innovative glass substrates for semiconductor packaging

Wed, 1 Jan 2017
AGC Asahi Glass (AGC), a manufacturer of glass, chemicals and high-tech materials, today announced it has developed a diverse line of glass substrates specifically designed for semiconductor packaging applications and semiconductor manufacturing process support.

Dow Corning expands LED packaging design options with launch of new silicone coatings

Tue, 1 Jan 2017
Dow Corning significantly expanded the design flexibilities for LED packaging manufacturers today with the addition of three new highly reflective silicone coatings to its fast-growing portfolio of advanced LED solutions.

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding

Fri, 1 Jan 2017
Breakthrough results pave the way to multi-layer 3D ICs with high density interconnects realized by automated wafer-to-wafer bonding technology.

STATS ChipPAC recognized for patent innovations for the seventh consecutive year by IEEE

Mon, 1 Jan 2017
STATS ChipPAC Pte. Ltd. announced today that it has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2016 Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers.

Imec introduces new snapshot multispectral image sensor that combines color and near-infrared imaging

Tue, 1 Jan 2017
At next week’s SPIE Photonics West in San Francisco, imec, a research and innovation hub in nano-electronics and digital technologies, will introduce a new image sensor with integrated color (Red Green Blue, RGB) and narrow-band near-infrared (NIR) filters.

Toward all-solid lithium batteries

Thu, 2 Feb 2017
Researchers investigate mechanics of lithium sulfides, which show promise as solid electrolytes.

New photorelay from Toshiba features industry's smallest package

Mon, 2 Feb 2017
Toshiba America Electronic Components, Inc. (TAEC) has added a new photorelay to its extensive lineup of photocouplers.

GlobalFoundries announces availability of 45nm RF SOI

Tue, 2 Feb 2017
Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations.

Ultratech receives large, repeat multiple system order for fan-out wafer-level packaging applications

Thu, 2 Feb 2017
Ultratech, Inc. today announced that it has received a repeat, multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems.

Huge growth in cloud memory changes semiconductor supply chain

Fri, 2 Feb 2017
The explosive growth in demand for internet bandwidth and cloud computing capacity brings a new set of technology challenges and opportunities for the semiconductor supply chain.

Dream Chip Technologies presents first 22nm FD-SOI silicon of new automotive driver assistance SoC

Mon, 2 Feb 2017
Dream Chip Technologies announced today the presentation of the industry`s first 22nm FD-SOI silicon for a new ADAS System-on-Chip (SoC) for automotive computer vision applications at the Mobile World Congress in Barcelona.

Imec presents InGaAs TFET with sub-60 mV/decade sub-threshold swing

Mon, 3 Mar 2017
Promising alternative for MOSFET in future ultralow power chips.

Leti announces backside shield that protects microchips from physical attacks

Wed, 3 Mar 2017
Leti, a research institute of CEA Tech, today announced it has developed a shield that can help protect electronic devices against physical attacks from the chips’ backside.

EVG breaks speed and accuracy barrier in mask alignment lithography for semiconductor packaging

Wed, 3 Mar 2017
New IQ Aligner NT achieves double throughput and alignment accuracy over previous-generation platform; opens up new applications for EVG lithography solutions.

NXP launches single-chip SoC with integrated microcontroller

Thu, 3 Mar 2017
NXP Semiconductors today announced the world's smallest single-chip SoC solution -- the MC9S08SUx microcontroller (MCU) family -- with an integrated 18V-to-5V LDO and MOSFET pre-driver that delivers ultra-high-voltage solution for drones, robots, power tools, DC fan, healthcare and other low-end brushless DC electric motor control (BLDC) applications.

Cadence expands capabilities of integrated design and analysis flow for TSMC InFO packaging technology

Mon, 3 Mar 2017
Cadence Design Systems, Inc. today announced new optimization capabilities within its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.

Cadence achieves certification for TSMC's 7nm process technology

Tue, 3 Mar 2017
Cadence Design Systems, Inc. today announced several new capabilities resulting from its close collaboration with TSMC to further 7nm FinFET design innovation for mobile and high-performance computing (HPC) platforms.

Electro-optical switch transmits data at record-low temperatures

Thu, 3 Mar 2017
A silicon optical switch newly developed at Sandia National Laboratories is the first to transmit up to 10 gigabits per second of data at temperatures just a few degrees above absolute zero.

Synopsys' IC Compiler II certified for TSMC's 12nm process technology

Thu, 3 Mar 2017
Synopsys, Inc. today announced that TSMC has certified the complete suite of products in the Synopsys Galaxy Design Platform for the most current version of 12nm FinFET process technology.

UC researchers use gold coating to control luminescence of nanowires

Fri, 3 Mar 2017
University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper.

Transphorm announces first automotive-qualified GaN FETs

Mon, 3 Mar 2017
Transphorm Inc. announced that its second generation, JEDEC-qualified high voltage gallium nitride (GaN) technology is now the industry's first GaN solution to earn automotive qualification -- having passed the Automotive Electronics Council’s AEC-Q101 stress tests for automotive-grade discrete semiconductors.

A novel method for the fabrication of active-matrix 3-D pressure sensors

Wed, 4 Apr 2017
A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

ON Semiconductor extends leading image sensor portfolio for sub-lux imaging applications

Mon, 4 Apr 2017
New IT-EMCCD image sensors combine improved low-light and NIR sensitivity with simplified integration for camera manufacturers.

NXP announces new 65 V LDMOS technology that speeds RF power design

Mon, 4 Apr 2017
NXP Semiconductors N.V. today announced a new laterally diffused metal oxide semiconductor (LDMOS) technology for RF power transistors designed for operation up to 65 volts (V).

Reducing down to 1/3 of thermal resistance by WOW technology for 3D DRAM application

Mon, 4 Apr 2017
Researchers at Tokyo institute of Technology presented a design guide for reducing 30% of thermal resistance for 3-dimensional (3D) stacked devices compared with the conventional ICs using solder bump joint structure.

MRAM lowers system power

Fri, 4 Apr 2017
ST-MRAM (spin-transfer magnetic RAM) is an extremely promising new technology with the potential to replace major segments of the market for flash, SRAM, and DRAM semiconductors in applications such as mobile products, automotive, IoT, and data storage.

Flexible, organic and biodegradable: Stanford researchers develop new wave of electronics

Tue, 5 May 2017
A new semiconductor developed by Stanford researchers is as flexible as skin and easily degradable. It could have diverse medical and environmental applications, without adding to the mounting pile of global electronic waste.

Discovery of new PVD chalcogenide materials for memory applications

Fri, 4 Apr 2017
A case study is presented based on the use of high throughput experimentation (HTE) for the discovery of new memory materials.

IEEE International Electron Devices Meeting announces 2017 Call for Papers

Tue, 5 May 2017
The 63rd annual IEEE International Electron Devices Meeting (IEDM), to be held at the Hilton San Francisco Union Square hotel December 2-6, 2017, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

Imec and Cascade Microtech develop first automatic probe system for advanced 3D chips

Wed, 5 May 2017
Imec and Cascade announced the successful development of a fully-automatic system for pre-bond testing of advanced 3D chips.

MagnaChip to offer 0.13 micron BCD process technology with high-density embedded flash

Mon, 6 Jun 2017
This BCD process offers 40V power LDMOS and delivers 64K Bytes flash memory, making it suitable for programmable PMIC, wireless power chargers and USB-C power-delivery IC products.

Synopsys, GlobalFoundries collaborate to deliver design platform and IP enablement for 7nm finFET process

Tue, 6 Jun 2017
Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare Embedded Memory IP on GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET process technology.

HPC, chiplets and interposers

Thu, 6 Jun 2017
The need for ever more computational power continues to grow and exaflop (1018 ) capabilities may soon become necessary.

Leti and Fraunhofer team up to strengthen microelectronics innovation in France and Germany

Thu, 6 Jun 2017
Two European research institutes today announced their new collaboration to develop innovative, next-generation microelectronics technologies to spur innovation in their countries and strengthen European strategic and economic sovereignty.

Micron and SEMI partner to host High Tech U in Silicon Valley

Wed, 6 Jun 2017
The SEMI Foundation and the Micron Technology Foundation announced their partnership this week to deliver the 213th SEMI High Tech U (HTU) program which kicks off in earnest today at Micron’s facilities in Milpitas.

ASM International launches Intrepid epitaxy tool

Thu, 7 Jul 2017
ASM International introduced the Intrepid ES 300mm epitaxy (epi) tool for advanced-node CMOS logic and memory high-volume production applications.

Hamburg researchers develop new transistor concept

Mon, 7 Jul 2017
Transistors, as used in billions on every computer chip, are nowadays based on semiconductor-type materials, usually silicon. As the demands for computer chips in laptops, tablets and smartphones continue to rise, new possibilities are being sought out to fabricate them inexpensively, energy-saving and flexibly.

Cadence full-flow digital, signoff and Verification Suite optimized to support Arm Cortex-A75, Cortex-A55 CPUs and Arm Mali-G72 GPU

Mon, 8 Aug 2017
Cadence delivered new 7nm-ready Rapid Adoption Kits (RAKs) for the Cortex-A75 and the Cortex-A55 CPUs, which include the DynamIQ Shared Unit (DSU) that provides a shared level 3 cache between the CPUs, and a 7nm-ready RAK for the Mali-G72 GPU.

IntelliProp announces Gen-Z persistent memory controller combining DRAM and NAND

Tue, 8 Aug 2017
This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.

GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory solution

Wed, 8 Aug 2017
GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

Samsung introduces far-reaching V-NAND memory solutions to tackle data processing and storage challenges

Wed, 8 Aug 2017
Samsung Electronics Co., Ltd. has announced new V-NAND (Vertical NAND) memory solutions and technology that will address the pressing requirements of next-generation data processing and storage systems.

MRSI Systems launches high speed die bonder for photonics high volume manufacturing

Tue, 8 Aug 2017
MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements.

Newly-discovered semiconductor dynamics may help improve energy efficiency

Wed, 9 Sep 2017
Researchers examining the flow of electricity through semiconductors have uncovered another reason these materials seem to lose their ability to carry a charge as they become more densely "doped." Their results, which may help engineers design faster semiconductors in the future, are published online in the journal ACS Nano.

DARPA's drive to keep the microelectronics revolution at full speed builds its own momentum

Fri, 9 Sep 2017
A dozen performer teams with DARPA’s CHIPS program convene to kick off an ambitious push for an era of versatile, plug-and-play "chiplets."

Scientists demonstrated 1.3 μm submilliamp threshold quantum dot micro-lasers on Si

Mon, 9 Sep 2017
Decades ago, the Moore's law predicted that the number of transistors in a dense integrated circuit doubles approximately every two years. This prediction was proved to be right in the past few decades, and the quest for ever smaller and more efficient semiconductor devices have been a driving force in breakthroughs in the technology.

GLOBALFOUNDRIES announces enhanced RF SOI process design kit

Mon, 9 Sep 2017
GLOBALFOUNDRIES today announced the availability of a new set of enhanced RF SOI process design kits (PDKs) to help designers improve their designs of RF switches and deliver differentiated RF front-end solutions for a wide range of markets including front-end modules for mobile devices, mmWave, 5G and other high-frequency applications.

GLOBALFOUNDRIES delivers custom 14nm FinFET technology for IBM Systems

Fri, 9 Sep 2017
Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI.

Team builds flexible new platform for high-performance electronics

Wed, 10 Oct 2017
A team of University of Wisconsin–Madison engineers has created the most functional flexible transistor in the world -- and with it, a fast, simple and inexpensive fabrication process that’s easily scalable to the commercial level.

Industry first precision p-channel zero threshold MOSFET array enables sub-threshold circuits for ultra-low power applications

Wed, 10 Oct 2017
The MOSFET currently has the industry’s lowest operating voltage of 0.2 Volt (V) and current of less than one nano amp (nA).

Columbia engineers invent breakthrough millimeter-wave circulator IC

Fri, 10 Oct 2017
Researchers are first to demonstrate a circulator on a silicon chip at mm-wave frequencies that enables nonreciprocal transmission of waves: device could enable two-way radios and transform 5g networks, self-driving cars, and virtual reality.

Seeing the next dimension of computer chips

Wed, 10 Oct 2017
Researchers image perfectly smooth side-surfaces of 3-D silicon crystals with a scanning tunneling microscope, paving the way for smaller and faster computing devices.

Leti to present update of CoolCube/3D VLSI tech developments at 2017 IEEE S3S

Fri, 10 Oct 2017
Leti, a research institute of CEA Tech, will hold a workshop on Oct. 17 to present updates on their progress developing CoolCube high-density 3D sequential, monolithic-integration technology, and their supporting design-and-manufacturing ecosystems.

Samsung completes qualification of 8nm LPP process

Wed, 10 Oct 2017
Samsung Electronics Co., Ltd. announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.

2017 sees advances in connected devices, memory

Tue, 11 Nov 2017
The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.

Enabling the A.I. era

Wed, 11 Nov 2017
There’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of rapidly growing applications, including artificial intelligence/deep learning, virtual and augmented reality, 5G, automotive, the IoT and many other uses, such as bioelectronics and drones. The key question for most semiconductor manufacturers is how can they benefit from these trends?

Alpha and Omega Semiconductor announces shield gate technology generation 2 100V 3.6mOhm MOSFET

Thu, 11 Nov 2017
Alpha and Omega Semiconductor Limited today announced the release of AONS66916 production utilizing the latest Alpha Shield Gate Technology Generation 2 (AlphaSGT2).

Leti demonstrates world's first 300mm wafer-to-wafer direct hybrid bonding with 1-micron pitch

Mon, 11 Nov 2017
New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications.

Semiconducting carbon nanotubes can reduce noise in carbon nanotube interconnects

Fri, 11 Nov 2017
Crosstalk and noise can become a major source of reliability problems of CNT based VLSI interconnects in the near future.

Advantest launches automated IC handler with thermal control for use in semiconductor engineering labs

Wed, 11 Nov 2017
Semiconductor test equipment supplier Advantest Corporation has developed the M4171 handler to meet the mobile electronics market's needs for cost-efficient thermal control testing of ICs with high power dissipation during device characterization and pre-production bring up.

Researchers quantify factors for reducing power semiconductor resistance by two-thirds

Tue, 12 Dec 2017
Discovery expected to lower energy consumption in electric power equipment.

Nambi Seshadri wins 2018 IEEE Alexander Graham Bell Medal

Tue, 12 Dec 2017
Awarded for exceptional contributions to communications and networking sciences and engineering.

How to tame the electromagnetic interference in the fabs and beyond

Thu, 12 Dec 2017
Electromagnetic interference (EMI) is an increasingly important topic across the global electronics manufacturing supply chain.

Leti memory breakthrough point way to significant improvements in SoC memories

Fri, 12 Dec 2017
Leti, a research institute of CEA Tech, demonstrated significant improvements in the field of memory systems at IEDM 2017 this week.

Leti develops world's first micro-coolers for CERN particle detectors

Mon, 12 Dec 2017
Leti, a research institute of CEA Tech, today announced it has created the world's first microfluidic circuit for cooling a particle detector, perhaps paving the way to a revolutionary, new detector technique at the Large Hadron Collider.

National Academy of Inventors announces SUNY Poly professor Dr. Bin Yu selected as 2017 NAI Fellow

Tue, 12 Dec 2017
Dr. Yu selected for significant contributions to semiconductor-based devices, nanotechnology research after being awarded more than 300 U.S. patents.

IXYS announces 200V power MOSFETs with fast body diodes and lowest on-resistances

Thu, 12 Dec 2017
Fabricated using a charge compensation principle and IXYS' own process technology, these new MOSFETs exhibit the lowest on-state resistances in the industry.

Intel unveils industry's first FPGA integrated with high bandwidth memory built for acceleration

Mon, 12 Dec 2017
Intel today announced the availability of the Intel Stratix 10 MX FPGA, the industry’s first field programmable gate array (FPGA) with integrated High Bandwidth Memory DRAM (HBM2).

Everspin begins 40nm STT-MRAM volume production

Wed, 1 Jan 2018
Everspin Technologies, Inc., a developer and manufacturer of discrete and embedded MRAM, today announced the Company recorded revenue for its first 40nm 256Mb STT-MRAM products in the fourth quarter of 2017 and is in the process of ramping its volume production in 2018

Micron launches industry's first enterprise SATA solid state drives built on 64-layer 3D NAND technology

Tue, 1 Jan 2018
Micron Technology, Inc. today launched the Micron 5200 series of SATA solid state drives.

GLOBALFOUNDRIES delivering 45nm RF SOI customer prototypes for 5G applications

Fri, 1 Jan 2018
Company's advanced 300mm RF SOI offering is ready for volume production.

Alpha and Omega Semiconductor announces the newest generation of XSPairFET

Tue, 1 Jan 2018
Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced AONE36132, a 25V N-Channel MOSFET in a dual DFN 3.3x3.3 package which is ideal for synchronous buck converters.

Nordson MARCH MesoSPHERE Plasma Systems enable very high throughput processing for 3D and wafer-level package assembly

Fri, 2 Feb 2018
Nordson MARCH, a Nordson company introduces the MesoSPHERE Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level – handling wafers up to 450mm and panels up to 480mm.

SK Hynix ramps up enterprise SSDs with its 72-layer 512Gb 3D NAND flash

Mon, 2 Feb 2018
With its 72-Layer 512Gb (Gigabits) 3D NAND Flash chips, the company is paving the way for its full-fledged entrance to the high value-added eSSD market.

Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs

Tue, 2 Feb 2018
Texas Instruments (TI) today introduced the industry's smallest operational amplifier (op amp) and low-power comparators at 0.64 mm2.

Samsung begins mass production of 256GB embedded Universal Flash Storage for automotive applications

Fri, 2 Feb 2018
Samsung Electronics Co., Ltd. today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.

Imec introduces CMOS chip with 16,384 micro-electrodes and 1,024 channels for multimodal cell interfacing

Mon, 2 Feb 2018
Breakthrough for high-throughput cell assays and characterization of complex cell behavior and interaction.

MagnaChip offers 2nd-generation 0.13 micron BCD process technology with high-density embedded flash memory

Mon, 2 Feb 2018
MagnaChip Semiconductor Corporation announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory.

3D depth sensing & VCSEL technology surges: Key takeaways from SEMI Member Forum

Fri, 2 Feb 2018
Since Apple unveiled iPhone X with face-recognition functionality in early November 2017, interest in 3D sensing technology has reached fever pitch and attracted huge investments across the related supply chains.

Synopsys collaborates with Samsung Foundry to develop DesignWare IP for Samsung 8nm finFET process

Thu, 3 Mar 2018
Synopsys, Inc. today announced a collaboration with Samsung Foundry to develop DesignWare Foundation IP for Samsung's 8nm Low Power Plus (8LPP) FinFET process technology.

Breakthrough in circuit design makes electronics more resistant to damage and defects

Mon, 3 Mar 2018
A newly published paper in Nature Electronics details how researchers at the Advanced Science Research Center, GC/CUNY, used an array of nonlinear resonators to overcome signal disruption when electronic circuits are broken or damaged.

Materials 'sandwich' breaks barrier for solar cell efficiency

Mon, 3 Mar 2018
NYU Tandon Professor André D. Taylor's research team combines materials and borrows lessons from nature to build a better organic solar cell.

Testing: The key to AI-enabled autonomous driving

Wed, 2 Feb 2018
Since 2010, 474 companies have poured $51 billion into developing products enabled by artificial intelligence (AI), with the bulk of these investments targeting autonomous driving and in-vehicle experiences, according to the McKinsey reports.

New insights from failures

Mon, 3 Mar 2018
To be able to guarantee the reliability of transistors, we have been conducting research for some years now at imec to see what happens when transistors operate properly and when they fail.

Engineers turn plastic insulator into heat conductor

Mon, 4 Apr 2018
Technique could prevent overheating of laptops, mobile phones, and other electronics.

The 2018 Symposia on VLSI Technology & Circuits covers converging trends in machine learning, artificial intelligence & the IoT

Mon, 4 Apr 2018
The 2018 Symposia on VLSI Technology & Circuits will deliver a unique perspective into the technological ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing – the emerging technologies needed for 'smart living.'

Diamond-based circuits can take the heat for advanced applications

Tue, 4 Apr 2018
Researchers at Japan's National Institute for Materials Science developed a hydrogenated diamond circuit operational at 300 degrees Celsius.

ON Semiconductor introduces digital image sensor with low light sensitivity and signal-noise ratio

Tue, 4 Apr 2018
ON Semiconductor introduced the industry’s first 1/1.7-inch 2.1 megapixel CMOS image sensor featuring ON Semiconductor’s newly developed 4.2μm Back Side Illuminated (BSI) pixels.

Toshiba releases automotive 40V N-channel power MOSFETs in new package

Wed, 4 Apr 2018
Reduced on-resistance from use of a small low-resistance package.

Psst! A whispering gallery for light boosts solar cells

Fri, 4 Apr 2018
Trapping light with an optical version of a whispering gallery, researchers at the National Institute of Standards and Technology (NIST) have developed a nanoscale coating for solar cells that enables them to absorb about 20 percent more sunlight than uncoated devices.

Mobile Semiconductor's 22nm ULL memory compiler joins the GlobalFoundries FDXcelerator Partner Program

Fri, 4 Apr 2018
This new embedded SRAM technology on 22nm FDX offers the best in class memory solution using the GLOBALFOUNDRIES low leakage FDSOI bit cells and ultra-low leakage devices.

Spin Transfer Technologies announces breakthrough MRAM technology for SRAM and DRAM applications

Mon, 4 Apr 2018
Spin Transfer Technologies, Inc. announced results of its unique Precessional Spin Current (PSC) structure.

Valleytronics discovery could extend limits of Moore's Law

Tue, 5 May 2018
Study finds that light polarization properties of candidate material offer additional computing degrees of freedom.

TowerJazz announces release of advanced 300mm 65nm BCD power management platform

Wed, 5 May 2018
TowerJazz today announced the release of its 300mm 65nm BCD (Bipolar-CMOS-DMOS) process, the most advanced power management platform for up to 16V operation and 24V maximum voltage.

TowerJazz and Newsight Imaging announce advanced CMOS image sensor chips for LiDAR

Wed, 5 May 2018
TowerJazz, the global specialty foundry leader, and Newsight Imaging, today announced production of Newsight's advanced CMOS image sensor (CIS) chips and camera modules, customized for very high volume LiDAR and machine vision markets, combining sensors, digital algorithms and pixel array on the same chip.

Researchers control the properties of graphene transistors using pressure

Wed, 5 May 2018
A Columbia University-led international team of researchers has developed a technique to manipulate the electrical conductivity of graphene with compression, bringing the material one step closer to being a viable semiconductor for use in today's electronic devices.

IEEE International Electron Devices Meeting announces 2018 Call for Papers

Tue, 5 May 2018
The 64th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union Square hotel December 1-5, 2018, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

TowerJazz & Gpixel announce world's smallest global shutter pixel

Tue, 5 May 2018
TowerJazz, the global specialty foundry leader, and Gpixel, Inc., a fast-growing CMOS image sensor (CIS) provider focusing on professional applications, announced today that Gpixel's GMAX0505.

NXP brings standard packages to RF power

Tue, 6 Jun 2018
New RF power transistors simplify design and manufacturing.

Winbond extends performance of Serial NAND Flash memory with 1Gbit device with maximum data-transfer rate of 83MB/s

Fri, 6 Jun 2018
Winbond’s new high-performance Serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s.

Synopsys IC Validator certified by Samsung Foundry for 7nm signoff physical verification

Thu, 6 Jun 2018
Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys' IC Validator has been certified by Samsung Foundry for signoff of all designs using its 7-nanometer (nm) Low Power Plus (LPP) process with Extreme Ultraviolet (EUV) lithography technology.

pSemi GaN FET driver delivers fast switching to solid-state LiDAR systems

Thu, 6 Jun 2018
pSemi Corporation (formerly known as Peregrine Semiconductor), a Murata company focused on semiconductor integration, announces the availability of the PE29101 gallium nitride (GaN) field-effect transistor (FET) driver for solid-state light detection and ranging (LiDAR) systems.

FormFactor announces breakthrough improvements in productivity for RF probe systems

Fri, 6 Jun 2018
FormFactor, Inc., a electrical test and measurement supplier to the semiconductor industry, has extended its Contact Intelligence technology.

Imec furthers high-mobility nanowire FETs for nodes beyond 5nm

Tue, 6 Jun 2018
At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology presented considerable progress in enabling germanium nanowire pFET devices as a practical solution to extend scaling beyond the 5nm node.

imec presents complementary FET as scaling contender for nodes beyond N3

Wed, 6 Jun 2018
At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology, will present a process flow for a complementary FET (CFET) device for nodes beyond N3.

Synospsys Custom Design Platform accelerates robust custom design for Samsung Foundry's 7LPP process technology

Fri, 6 Jun 2018
Samsung and Synopsys release 7LPP Custom Design reference flow.

EV Group accelerates 3D-IC packaging roadmap with breakthrough wafer bonding technology

Tue, 7 Jul 2018
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView NT3 aligner.

ROHM's new CMOS op-amp delivers leading-class low noise

Thu, 7 Jul 2018
Ideal for industrial applications that demand high-accuracy sensing, including sonar and optical sensors.

Toshiba announces new analog output IC photocoupler for automotive applications

Thu, 7 Jul 2018
Toshiba Electronic Devices & Storage Corporation announces the launch of a new analog output IC photocoupler that enables high-speed communications in automotive applications – especially electric vehicles (EV) and hybrid electric vehicles (HEV).

Overlay performance of through silicon via last lithography for 3D packaging

Tue, 7 Jul 2018
A lithographic method for TSV alignment to embedded targets was evaluated using in-line stepper self metrology, with TIS correction.

FET fabrication from fins to nano-sheets

Wed, 7 Jul 2018
As the commercial IC fabrication industry continues to shrink field-effect transistor (FET) sizes, 2D planar structures evolved into 3D fins which are now evolving into 3D stacks of 2D nano-sheets.

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits

Mon, 7 Jul 2018
A team of researchers from the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) at UNSW Sydney have successfully implemented an atomic engineering strategy for individually addressing closely spaced spin qubits in silicon.

Amkor delivers package assembly design kit to support Mentor’s high-density advanced packaging tools

Wed, 7 Jul 2018
Amkor Technology, Inc., a provider of outsourced semiconductor packaging and test (OSAT) services, today announced it has partnered with Mentor to release Amkor’s SmartPackage Package Assembly Design Kit (PADK), the first in the industry to support Mentor’s High-Density Advanced Packaging (HDAP) design process and tools.

Toshiba Memory Corporation develops 96-layer BiCS FLASH with QLC technology

Mon, 7 Jul 2018
Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.

Toshiba develops 40V N-channel power MOSFETs with improved thermal performance

Tue, 7 Jul 2018
New packaging provides double-sided cooling for improved heat dissipation.

Multilayer chip beads with high rated currents

Wed, 8 Aug 2018
TDK Corporation has developed the new MPZ0603-H series of multilayer chip beads for power lines in an IEC 0603 package that feature twice the rated current and about half the DC resistance of the existing MPZ0603-C series.

pSemi announces world's first monolithic, SOI Wi-Fi front-end module

Wed, 8 Aug 2018
pSemi Corporation (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, introduces the world’s first monolithic, silicon-on-insulator (SOI) Wi-Fi front-end module.

Toshiba announces next-generation superjunction power MOSFETs

Mon, 8 Aug 2018
New devices increase power supply efficiency even further.

MRSI Systems launches MRSI-HVM3P for new applications extending the MRSI-HVM3 die bonder family

Tue, 8 Aug 2018
MRSI Systems (Mycronic Group), is expanding its high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC).

Rudolph Technologies launches second-gen Dragonfly inspection and metrology system

Wed, 8 Aug 2018
Rudolph Technologies, Inc. today announced its new Dragonfly G2 platform, which incorporates many of the benefits of the Firefly system onto the Dragonfly platform, including higher sensitivity and throughput and the proprietary Clearfind Technology.

KLA-Tencor expands IC packaging portfolio

Fri, 8 Aug 2018
KLA-Tencor Corporation announced two new defect inspection products designed to address a wide variety of integrated circuit (IC) packaging challenges.

SUNY Poly professor awarded $500,000 National Science Foundation grant to develop next-gen memory

Thu, 9 Sep 2018
NSF grant supports SUNY Poly research for scalable computing infrastructure that mimics the synaptic functionality of the human brain.

GOWIN Semiconductor unveils the latest embedded memory products

Mon, 9 Sep 2018
The 2 new embedded FPGA devices were designed with low power, small package size, and low cost in mind. 

Keysight Technologies' 3D planar electromagnetic simulator certified for GLOBALFOUNDRIES 22FDX process technology

Tue, 9 Sep 2018
Keysight Technologies, Inc. (NYSE: KEYS), a technology company that helps enterprises, service providers, and governments accelerate innovation to connect and secure the world, today announced that the company's 3D planar electromagnetic (EM) simulator, Momentum, has been certified for GLOBALFOUNDRIES (GF) 22FDX, 22nm Fully-Depleted Silicon-On-Insulator (FD-SOI) technology.

GLOBALFOUNDRIES extends FinFET offering with new features to enable tomorrow's intelligent systems

Tue, 9 Sep 2018
Feature-rich semiconductor platform delivers competitive performance and scalability for next-generation compute applications.

GLOBALFOUNDRIES delivering 8SW RF SOI client chips on 300mm platform for next-generation mobile applications

Wed, 9 Sep 2018
RF SOI technology builds on manufacturing legacy that reaches new milestone with more than 40 billion chips shipped.

WIN Semiconductors Corp integrated GaAs technologies support 5G user equipment and network infrastructure

Wed, 9 Sep 2018
WIN Semiconductors Corp., the world’'s largest pure-play compound semiconductor foundry, is driving the development and deployment of 5G user equipment and network infrastructure in the sub-6GHz and mmWave frequency bands.

Synopsys Design Platform enabled for TSMC's multi-die 3D-IC advanced packaging technologies

Fri, 10 Oct 2018
Synopsys, Inc. today announced the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) advanced packaging technologies.

Mentor releases optimized flow, new fill automation for GLOBALFOUNDRIES' 22FDX IC manufacturing process

Tue, 10 Oct 2018
Mentor, a Siemens business, announced it has qualified complete solutions from its Calibre nmPlatform, Analog FastSPICE (AFS) Platform, Eldo Platform and Nitro-SoC place and route system for GLOBALFOUNDRIES' 22FDX Fully-Depleted Silicon-On-Insulator (FD-SOI) integrated circuit (IC) manufacturing processes.

MagnaChip introduces high-voltage super junction MOSFET

Mon, 10 Oct 2018
MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the introduction of a new High-Voltage Super Junction MOSFET with a 900V breakdown voltage and low total gate charge.

Samsung debuts semiconductor innovations at Samsung Tech Day

Fri, 10 Oct 2018
Technologies introduced at the event include 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM.

Micron Foundation announces $1M grant to advance curiosity in artificial intelligence

Thu, 10 Oct 2018
The grant was announced at the inaugural Micron Insight 2018 conference where the technology industry's top minds gathered in San Francisco to discuss the future of AI, machine learning and data science, and how memory technology is essential in bringing intelligence to life.

Innodisk bringing the next-generation NAND flash to the industrial embedded market

Wed, 10 Oct 2018
Innodisk is launching its industrial-grade 3D NAND SSD series, making the newest NAND flash technology available for the challenging requirements of embedded and industrial applications.

Unlocking the secrets of metal-insulator transitions

Fri, 11 Nov 2018
X-ray photon correlation spectroscopy at NSLS-II's CSX beamline used to understand electrical conductivity transitions in magnetite.

GLOBALFOUNDRIES, indie Semiconductor deliver performance-enhanced microcontrollers for automotive applications

Mon, 11 Nov 2018
GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF's 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash) technology.

IHP cooperates with EV Group on low-temperature covalent wafer bonding

Mon, 11 Nov 2018
EVG ComBond enables wafer-level packaging and heterogeneous integration for advanced MEMS, high-performance logic, power and "Beyond CMOS" devices with micron-level alignment accuracy.

MIRPHAB offering design, production and business planning for companies developing mid-infrared devices for chemical sensing and spectroscopic applications

Wed, 11 Nov 2018
MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

Micron and Achronix deliver next-generation FPGAs powered by high-performance GDDR6 memory for machine learning applications

Tue, 11 Nov 2018
Micron Technology, Inc., (Nasdaq: MU) today announced that its GDDR6 memory, Micron's fastest and most powerful graphics memory, will be the high-performance memory of choice supporting Achronix's next-generation stand-alone FPGA products built on TSMC 7nm process technology.

MRSI announces HVM3 die bonding demonstration capability in Shenzhen China

Fri, 11 Nov 2018
MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China.

CEA-Leti and Silvaco to develop gate-all-around SPICE compact models for circuit design and tech co-optimization

Mon, 12 Dec 2018
Leti and Silvaco Inc. today announced during the IEDM 2018 conference a project to create innovative and unified SPICE compact models for the design of advanced circuits using nanowire and nanosheet technologies.

New quantum materials could take computing devices beyond the semiconductor era

Mon, 12 Dec 2018
Mutliferroics are promising candidates for new type of memory and logic circuits.

CEA-Leti moves 3D sequential integration closer to commercialization

Tue, 12 Dec 2018
Leti, a research institute at CEA Tech, has reported breakthroughs in six 3D-sequential-integration process steps that previously were considered showstoppers in terms of manufacturability, reliability, performance or cost.

CEA-Leti develops circuits for neuromorphic processors that replace CMOS transistor-based TCAM memory with RRAM-based TCAM memory

Wed, 12 Dec 2018
Leti, a research institute at CEA Tech, has proven that RRAM-based ternary-content addressable memory (TCAM) circuits, featuring the most compact structure developed to date, can meet the performance and reliability requirements of multicore neuromorphic processors.

Synopsys and imec demonstrate accelerated modeling of complementary FET (CFET) technology

Mon, 12 Dec 2018
Synopsys, Inc. announced today another milestone in its longstanding partnership with imec.

New Intel architectures and technologies target expanded market opportunities

Wed, 12 Dec 2018
At Intel “Architecture Day,” top executives, architects and fellows revealed next-generation technologies and discussed progress on a strategy to power an expanding universe of data-intensive workloads for PCs and other smart consumer devices, high-speed networks, ubiquitous artificial intelligence (AI), specialized cloud data centers and autonomous vehicles.

Micron delivers industry's highest-capacity monolithic mobile memory for MediaTek's newest Helio smartphone platform

Thu, 12 Dec 2018
Micron Technology, Inc., a developer of memory and storage solutions, today announced that its monolithic 12Gb low-power double data rate 4X (LPDDR4X) DRAM has been validated for use in MediaTek's new Helio P90 smartphone platform reference design.

Rudolph Technologies announces rapid adoption of the Dragonfly G2 system for advanced packaging inspection

Tue, 1 Jan 2019
One quarter after release, the new Dragonfly platform achieves market recognition in advanced macro inspection with multiple deliveries to world’s largest OSAT.

Advanced testing paradigm shifting in era of heterogeneous integration

Mon, 1 Jan 2019
SEMI Taiwan Testing Committee founded to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications.

Corning Precision Glass Solutions introduces advanced packaging carriers optimized for fan-out processes

Tue, 1 Jan 2019
Corning Incorporated today introduced its latest breakthrough in glass substrates for the semiconductor industry – Advanced Packaging Carriers.

Agile manufacturing of glass carriers for advanced packaging

Tue, 1 Jan 2019
SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus.

ZEISS launches new high-resolution 3D X-ray imaging solutions

Wed, 1 Jan 2019
ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages.

LPKF offers glass foundry service for advanced IC and MEMS packaging solutions

Fri, 1 Jan 2019
Laser systems specialist LPKF Laser & Electronics, based in Hannover, Germany has added a foundry service for thin glass substrates to its product portfolio.

Fan-out system-in-board technology: Enabling RF and processor module and system-level integration

Wed, 1 Jan 2019
SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summitin Dresden, Germany.

SEMI 3D & Systems Summit showcases heterogeneous 3D integration

Wed, 1 Jan 2019
Inaugural summit offers latest insights in semiconductor manufacturing and applications.

GlobalFoundries and Dolphin Integration to deliver differentiated FD-SOI adaptive body bias solutions

Tue, 2 Feb 2019
IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration.

CEA-Leti and Stanford target edge-AI apps with breakthrough NVM memory cell

Wed, 2 Feb 2019
Researchers at CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

Synopsys and GLOBALFOUNDRIES collaborate to develop industry's first automotive grade 1 IP for 22FDX process

Thu, 2 Feb 2019
Synopsys, Inc. and GLOBALFOUNDRIES today announced a collaboration to develop a portfolio of automotive Grade 1 temperature DesignWare Foundation, Analog, and Interface IP for the GF 22-nm Fully-Depleted Silicon-On-Insulator process.

GOWIN Semiconductor announces release of the new GOWIN EDA tools for improved performance on new FPGA product families

Fri, 2 Feb 2019
GOWIN Semiconductor Corp. announces the release of GOWIN's new EDA tool, YunYuan 1.9.

Micron accelerates the mobile computing experience with introduction of new client SSD

Wed, 2 Feb 2019
Micron Technology, Inc. today added a new cost-efficient solid-state drive (SSD) to its client computing portfolio.