prepared-by-editor
Monolithic 3D chip fabricated without TSVs
Fri, 10 Oct 2013
Researchers from Taiwan’s National Nano Device Laboratories avoided the use of TSVs by fabricating a monolithic sub-50nm 3D using a novel CMP technique.
Mobility now driving the industry
Wed, 9 Sep 2013
It’s apparent that the world’s appetite for electronics has never been greater. That has increasingly taken the form of mobile electronics, including smartphones, tablets and tablets and the new “phablets.” People want to watch movies and live sports on their phones.
IBM develops sub-20nm nanofluidic channels for lab-on-chip
Tue, 10 Oct 2013
At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.
Introducing Semiconductor Digest
Tue, 4 Apr 2019
Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry