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TOUCH TECHNOLOGIES ARTICLES



Global demand and supply for automotive display systems expected to maintain healthy growth in 2018

06/18/2018  The global demand for automotive display systems is expected to continue a strong growth path in 2018, according to recent analysis from business information provider IHS Markit.

Memory device packaging: From leadframe to TSV

05/22/2018  Memory devices employ a wide range of packaging technology from wire-bond leadframe and BGA to TSV.

AMOLED panel demand in smartphone market expected to grow much slower than expected

04/16/2018  After showing triple-digit growth in 2017, flexible AMOLED panel is only expected to grow 34 percent in 2018 compared to the previous year.

ABI Research's Teardowns service finds first hidden under-display fingerprint sensor bites into Apple's face recognition technology

04/11/2018  What makes the Vivo X20 Plus UD smartphone so important is that it is the first smartphone to use Synaptics' under-display fingerprint sensor, and it has the potential to bite into Apple's face recognition technology, announced the Teardowns service of ABI Research.

Samsung Electronics diversifies its 8-inch foundry offerings with new RF/IoT and fingerprint technology solutions

03/21/2018  Samsung Electronics Co., Ltd. today announced more value added 8-inch (200mm) technology solutions for its foundry customers.

Immersion files lawsuits against Samsung in U.S. and China

03/09/2018  The complaint seeks to stop further infringement by Samsung and to recover damages.

Driven by size migration and high-end products, large TFT display market continued to grow in 2017

02/16/2018  Despite slower demand from end market and panel price erosion, the large thin-film transistor (TFT) display market expanded in 2017 in all three aspects -- unit shipments, area shipments and revenue.

Rutgers-led innovation could spur faster, cheaper, nano-based manufacturing

02/14/2018  Scalable and cost-effective manufacturing of thin film devices.

Chinese panel makers catching up fast in LTPS LCD panel shipments for mobile phones

02/12/2018  Total shipments of mobile phone displays, including thin-film transistor liquid crystal display (TFT LCD) and active matrix organic light-emitting diode (AMOLED) panels, reached 2.01 billion units in 2017, up 3 percent from 2016.

NXP unveils breakthrough tech for payment cards

10/27/2017  NXP Semiconductors N.V. (NASDAQ:NXPI) today debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas.

Global AMOLED panel production capacity set to more than quadruple over next five years

10/27/2017  Samsung Display and LG Display to remain as market leaders.

NVIDIA, Taiwan's Ministry of Science and Technology to accelerate Taiwan AI revolution with NVIDIA AI computing platform

10/26/2017  NVIDIA today announced that it is collaborating with Taiwan's Ministry of Science and Technology (MOST) to accelerate the development of artificial intelligence across Taiwan's commercial sector in support of its recently announced AI Grand Plan to help foster domestic AI-related industries.

Sussex physicists have breakthrough on brittle smart phone screens

10/25/2017  New 'potato stamp' technique combining silver and graphene may create cheaper, more flexible and eco-friendly screens.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018


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VIDEOS