RECOMMENDED TECHNOLOGY PAPERS
Potting Compounds Protect Electronic Circuits
Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. Factors such as handling and processing, open time, viscosity and cure schedules must be considered when determining which formulation to go with. Learn more about the performance properties of epoxies, silicones, UV curables, and B-staged epoxies, plus the packaging options available, to see which is best for the manufacturing and assembly of your electronic device. Shortened version: Potting and encapsulation compounds are designed to completely enclose a component, module or PCB, which effectively shields the unit while providing structural support. There are a variety of potting formulations on the market today that suit the needs of diverse applications. Learn about the performance properties of each, plus the packaging options available, to see which is best suited for the manufacturing and assembly of your electronic device.October 15, 2015
Sponsored by Master Bond, Inc.,
Success in the Electronic and High Tech Industry
View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor
Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing ApplicationsMore Technology Papers
Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.
September 2015 (Date and time TBD)
Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.
November 2015 (Date and time TBD)
As the industry moves to 10nm and 7nm nodes, advances in wafer processing â€“ etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others â€“ will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D SRAMs, high mobility transistors and 450mm wafer processing.
3D NAND Challenges and Opportunities
December 2015 (Date and time TBD)
Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography. Imecâ€™s Jan Van Houdt, director flash memory program / manager memory device design group, will discuss trends, challenges and opportunities.