NEWS ANALYSIS & FEATURES


Siborg Systems introduces educational version of MicroTec semiconductor process and device simulator

10/19/2015  Siborg has recently made a new MicroTec version available particularly targeting educational use of the software.

Microsemi announces proposal to acquire PMC-Sierra, Inc.

10/19/2015  Microsemi Corporation announced that it submitted an offer to acquire PMC-Sierra, Inc in a cash and stock transaction.

Evonik and SCREEN FT enter strategic partnership to promote iXsenic technology

10/19/2015  German chemical company Evonik Industries AG and Japanese FPD production equipment manufacturer SCREEN Finetech Solutions Co., Ltd. have signed a contract for a strategic partnership.

Next-generation perovskite solar cells made stable by metal oxide “sandwich”

10/19/2015  New solar cell construction extends the cell’s effective life in air by more than 10 times, with only a marginal loss of efficiency converting sunlight to electricity.

Applied Materials and A*STAR announce new R&D joint lab in Singapore for advanced semiconductor technology

10/19/2015  Applied Materials, Inc. announced it plans to establish a new R&D laboratory in Singapore in collaboration with the Agency for Science, Technology and Research (A*STAR).

Silver: The promising electrode winner for low-cost perovskite solar cells

10/16/2015  A study published in Advanced Materials Interfaces by the Energy Materials and Surface Sciences Unit at the Okinawa Institute of Science and Technology Graduate University (OIST) reveals a cause for the short lifetime of perovskite solar cells with silver electrodes.

SEMICON Japan 2015: Lineup of speakers

10/16/2015  SEMI announced the lineup of speakers for SEMICON Japan’s keynote stage, which focuses on key market and technology challenges and developments, and their impact on the semiconductor supply chain.

Automotive MEMS sensors market to grow 6% from 2015-2020, P&S Market Research

10/15/2015  The global automotive MEMS sensor market was valued at $2,600.5 million in 2014, and it is expected to grow at a CAGR of 6.0%, during the period 2015-2020.

FlexEnable spearheads breakthrough in flexible electronics

10/14/2015  FlexEnable has successfully validated a new class of high performance organic semiconductors in a million pound project funded by Innovate UK.

VeriSilicon to acquire Vivante Corporation

10/13/2015  VeriSilicon Holdings Co., Ltd. and Vivante Corporation announced a definitive merger agreement.

Japan well positioned to support IoT and the industry

10/13/2015  Japan has long played a critical role in semiconductor manufacturing and accounts for the largest portion of the global total installed fab capacity in 2015 according to the SEMI Fab database.

UK collaboration seeks to develop new ultra-barrier materials based on Graphene interlayers

10/12/2015  The Centre of Process Innovation (CPI) has announced that it is part of a UK based collaboration to develop the next generation of ultra-barrier materials using graphene for the production of flexible transparent plastic electronic based displays.

Scientists paint quantum electronics with beams of light

10/12/2015  Scientists from the University of Chicago and Penn State University accidentally discovered a new way of using light to draw and erase quantum-mechanical circuits in a unique class of materials called topological insulators.

Chemical mechanical planarization market worth $4.94 Billion by 2020

10/12/2015  According to a new market research report published by MarketsandMarkets, the market is expected to grow at a CAGR of 6.83% between 2015 and 2020, and reach $4.94 Billion by 2020.

Applied Materials advances OLED display manufacturing for flexible mobile products and curved TVs

10/12/2015  Applied Materials, Inc. unveiled two new systems that enable the volume production of high-resolution, thin and lightweight flexible OLED displays for mobile products and TVs.

Vanadium dioxide leads to a better transistor

10/12/2015  Penn State materials scientists have discovered a way to give the transistor a boost by incorporating vanadium oxide.

Infineon CEO Says Robot Cars Will Drive Semiconductor Demand

10/12/2015  Infineon’s CEO, Reinhard Ploss, says that the autonomously driven cars of the future will create a large demand for a variety of new semiconductors and sensors.

mCube introduces smallest and most power-efficient accelerometer for wearables and Internet of Moving Things

10/08/2015  mCube announced the sampling of its new MC3635 3-axis accelerometer featuring the industry’s lowest power consumption and a microscopic 1.6×1.6 mm Land Grid Array package.

Two polymer-blend could boost efficiency of LEDs

10/08/2015  A blend of two polymers can be used to boost the efficiency of LEDs, according to a research study published in the journal Applied Materials Today.

Organic semiconductors get weird at the edge: University of British Columbia research

10/08/2015  As the push for tinier and faster electronics continues, a new finding by University of British Columbia scientists could help inform the design of the next generation of cheaper, more efficient devices.





VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. Factors such as handling and processing, open time, viscosity and cure schedules must be considered when determining which formulation to go with. Learn more about the performance properties of epoxies, silicones, UV curables, and B-staged epoxies, plus the packaging options available, to see which is best for the manufacturing and assembly of your electronic device. Shortened version: Potting and encapsulation compounds are designed to completely enclose a component, module or PCB, which effectively shields the unit while providing structural support. There are a variety of potting formulations on the market today that suit the needs of diverse applications. Learn about the performance properties of each, plus the packaging options available, to see which is best suited for the manufacturing and assembly of your electronic device.October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

More Technology Papers

WEBCASTS

Metrology

 

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Wafer Processing

  November 2015 (Date and time TBD)

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D SRAMs, high mobility transistors and 450mm wafer processing.

Sponsored By:

3D NAND Challenges and Opportunities

  December 2015 (Date and time TBD)

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography. Imec’s Jan Van Houdt, director flash memory program / manager memory device design group, will discuss trends, challenges and opportunities.

Sponsored By:
More Webcasts

EVENTS

International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 – December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 – December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
http://www.semiconjapan.org/en/
December 16, 2015 – December 18, 2015

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