Wafer Processing

MAGAZINE



WAFER PROCESSING ARTICLES



U.S. announces trade talks with Japan, the EU, and UK; Action will benefit semiconductor industry

10/22/2018  Last week, the Office of the U.S. Trade Representative (USTR), on instruction from President Trump, notified Congress that the administration intends to begin bilateral trade negotiations with Japan, the European Union (EU), and the United Kingdom.

Samsung debuts semiconductor innovations at Samsung Tech Day

10/19/2018  Technologies introduced at the event include 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM.

Communications rise to represent largest portion of foundry sales

10/17/2018  Communications apps expected to account for 3x more than computer in 2018 pure-play foundry sales.

SEMI reaffirms support for industry cooperation on RoHS review

10/16/2018  SEMI today confirmed its support for a Joint-Industry Cooperation on an RoHS Review aimed at urging the European Commission to, at a minimum, consider dedicating more resources to a targeted outreach programme with third countries.

Wafer shipments forecast to set new highs through 2021

10/16/2018  Total wafer shipments in 2018 year are expected to eclipse the all-time market high set in 2017 and continue to reach record levels through 2021.

Dynamic Fault Detection: Utilizing AI and IoT to revolutionize manufacturing

10/15/2018  A new approach in Fault Detection and Classification (FDC) allows engineers to uncover issues more thoroughly and accurately by taking advantage of full sensor traces.

Advanced technology key to strong foundry revenue per wafer

10/15/2018  Analysis shows more than a 16x difference between the average revenue generated by 0.5µ 200mm wafers ($370) and ≤20nm 300mm wafers ($6,050).

Hidden gapless states on the path to semiconductor nanocrystals

10/12/2018  When chemists from the Institute of Physical Chemistry of the Polish Academy of Sciences in Warsaw were starting work on yet another material designed for the efficient production of nanocrystalline zinc oxide, they didn't expect any surprises. They were greatly astonished when the electrical properties of the changing material turned out to be extremely exotic.

Researchers quickly harvest 2-D materials, bringing them closer to commercialization

10/12/2018  Efficient method for making single-atom-thick, wafer-scale materials opens up opportunities in flexible electronics.

The global compound semiconductor market grows on increasing demand for optoelectronic devices

10/11/2018  The global compound semiconductor market was valued at USD 66,623 million in 2016 and is expected to reach USD 142,586 million in 2023 while growing at a CAGR of 11.3% from 2017 to 2023.

Toshiba Memory Corporation appoints Stacy J. Smith as Executive Chairman

10/11/2018  Toshiba Memory Corporation (TMC) today announced the appointment of Stacy J. Smith as Executive Chairman, effective on October 1, 2018.

Cadence recognized with four 2018 TSMC Partner of the Year awards

10/10/2018  Cadence Design Systems, Inc. today announced that it has received four TSMC Partner of the Year awards at this year’s TSMC Open Innovation Platform (OIP) Ecosystem Forum.

Presto Engineering upgrades Europe's largest independent semiconductor testing facility to ISO 9001:2015 standard

10/10/2018  Semiconductors play increasingly important control roles in automotive, industrial and safety critical applications. Quality and reliability are therefore of vital importance and so Presto Engineering has completed certification to the ISO 9001:2015 quality standard at its facility in Caen, France, which is Europe’s largest independent semiconductor test facility.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018


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VIDEOS