Wafer Processing

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WAFER PROCESSING ARTICLES



WFE semiconductor equipment billings to drop 24% in second half of 2018

08/16/2018  On the heels of a 37.3% growth in wafer front end (WFE) semiconductor equipment growth in 2017, the market will grow only 10% in 2018 to $62.3 billion.

IBM and Synopsys accelerate 3nm process development with DTCO innovations

08/15/2018  Synopsys, Inc. today announced a collaboration with IBM to apply design technology co-optimization (DTCO) to the pathfinding of new semiconductor process technologies for the 3-nanometer (nm) process node and beyond.

Cabot Microelectronics to acquire KMG Chemicals

08/15/2018  Cabot Microelectronics Corporation and KMG Chemicals, Inc. have entered into a definitive agreement under which Cabot Microelectronics will acquire KMG in a cash and stock transaction with a total enterprise value of approximately $1.6 billion.

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

Size of semiconductor acquisitions may have hit limit

08/14/2018  Mega-mergers become less likely because of the high-dollar value of major acquisitions, increasing scrutiny from regulators, rising protectionism among more countries, and growing global trade frictions.

Strong 2Q'18 global supply chain growth but second half slowing

08/14/2018  Semiconductor capital equipment sales are historically very volatile, with their growth fluctuating MUCH MORE than electronic equipment.

Terahertz technology creates new insight into how semiconductor lasers work

08/13/2018  Pioneering engineers working with terahertz frequency technology have been researching how individual frequencies are selected when a laser is turned on, and how quickly the selection is made.

CyberOptics demonstrates Airborne Particle and Ultra High-Resolution MRS sensors at SEMICON Taiwan

08/09/2018  Significantly improving yields and tool uptime in semiconductor fabs worldwide.

Rudolph Technologies appoints David B. Miller as Chairman of the Board

08/09/2018  Mr. Miller’s appointment is subsequent to the Company’s receipt of Thomas G. Greig’s resignation from the position.

ClassOne places Solstice CopperMax electroplating tool with defense industry supplier i3 Microsystems

08/09/2018  ClassOne, a supplier of new electroplating and wet process tools to the 200mm and smaller semiconductor manufacturing industry, today announced the sale its flagship Solstice S8 CopperMax electroplating tool to i3 of Binghamton, NY.

SEMI China, CASPA promote China-Silicon Valley innovation partnership

08/08/2018  Aiming to forge stronger ties between the two technology heavyweights as partners in semiconductor industry innovation, SEMI and CASPA (Chinese American Semiconductor Professional Association) in mid July signed a strategic cooperation agreement to promote industry innovation between Silicon Valley and China.

Process Watch: Automotive defect sensitivity requirements

08/07/2018  Semiconductors continue to grow in importance in the automotive supply chain, requiring IC manufacturers to adapt their processes to produce chips that meet automotive quality standards.

Mid-year global semiconductor sales up 20.4% compared to 2017

08/06/2018  Q2 sales are highest on record, 6.0 percent more than previous quarter, 20.5 percent higher than Q2 of last year.

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WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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