Wafer Processing

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WAFER PROCESSING ARTICLES



FormFactor to collaborate with Keysight Technologies and GlobalFoundries

06/18/2018  FormFactor, Inc. (NASDAQ:FORM), an electrical test and measurement supplier to the semiconductor industry, announced today the company has deployed an integrated CM300xi probing solution for wafer-level testing of silicon photonics (SiPh) devices.

Qualcomm extends cash tender offer for all outstanding shares of NXP

06/15/2018  Qualcomm Incorporated has extended the offering period of its previously announced cash tender offer to purchase all of the outstanding common shares of NXP Semiconductors N.V.

FormFactor announces breakthrough improvements in productivity for RF probe systems

06/15/2018  FormFactor, Inc., a electrical test and measurement supplier to the semiconductor industry, has extended its Contact Intelligence technology.

Cautious optimism

06/15/2018  The World Bank just updated its multiyear forecast for GDP growth both globally and by country.

Synopsys IC Validator certified by Samsung Foundry for 7nm signoff physical verification

06/14/2018  Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys' IC Validator has been certified by Samsung Foundry for signoff of all designs using its 7-nanometer (nm) Low Power Plus (LPP) process with Extreme Ultraviolet (EUV) lithography technology.

Semiconductor equipment record spending streak to continue through 2019

06/12/2018  The semiconductor industry is nearing a third consecutive year of record equipment spending with projected growth of 14 percent (YOY) in 2018 and 9 percent in 2019, a mark that would extend the streak to a historic fourth consecutive growth year, according to the latest update of the World Fab Forecast report published by SEMI.

Sales increase 20% year-to-year in April; double-digit annual growth projected for 2018

06/06/2018  Industry forecast projects sales will increase 12.4 percent in 2018 and 4.4 percent in 2019.

Led by Texas Instruments, the industrial semiconductor market grew nearly 12% in 2017

06/06/2018  Analog Devices jumped to second in the market share ranking, after its acquisition of Linear Technology.

Applied Materials breakthrough accelerates chip performance in the big data and AI era

06/05/2018  Applied Materials, Inc. today announced a breakthrough in materials engineering that accelerates chip performance in the big data and AI era.

MIT researchers devise new way to make light interact with matter

06/04/2018  Reducing the wavelength of light could allow it to be absorbed or emitted by a semiconductor, study suggests.

Dow unveils two new silicone adhesives formulated to deliver processing options for device and displays assembly

06/04/2018  Dow Performance Silicones further enhanced design flexibilities and processing options for consumer device and display OEMs today with the addition of DOWSIL™ SE 9100 and DOWSIL™ SE 9160 Adhesives to its portfolio of one-part, room-temperature cure (RTV) silicone solutions.

Worldwide semiconductor equipment billings in first quarter 2018 reach record $17B

06/04/2018  SEMI reported that worldwide semiconductor manufacturing equipment billings reached a historic quarterly high of US$17.0 billion for the first quarter of 2018, surging 59 percent in March to end the quarter with an all-time monthly high of $7.8 billion.

BISTel announces intelligent chamber matching application to help semiconductor manufacturers guard against events impacting yield

06/01/2018  BISTel, a provider of intelligent, real-time data management, advanced analytics and predictive solutions for smart manufacturing announced today an innovative new Chamber Matching (CM) application that enables semiconductor manufacturers to better guard against events that negatively impact yield.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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