Upcoming Webcasts

JOIN US FOR OUR PROGRAM OF LIVE AND INTERACTIVE SOLID STATE TECHNOLOGY WEBCASTS

Register today for these upcoming webcasts. The dates and times for some webcasts have not yet been set, please select the webcasts that you would like to pre-register for and complete your information at the bottom of this page and you will be notified via email when the webcast has been scheduled. After the live event each Webcast is archived, and can be viewed on demand.

Solid State Technology is looking for more speakers to present during our upcoming webcasts! Submit your abstract here.

Browse On-Demand Webcasts here
Advanced Packaging


Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Lithography


Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Environment, Safety & Health


Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Wafer Processing


Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.



For more information on Solid State Technology's webcast program and sponsorship opportunities, please contact:

Jenna Johnson
Sales Manager
P: 612.598.3446
E: jjohnson@extensionmedia.com


Webcast Archives