SEMI testifies against third round of U.S. tariffs citing damage to semiconductor supply chain
08/27/2018In testimony last week before a U.S. government interagency panel considering tariffs on $200 billion wort…
Worldwide semiconductor revenue hit record $120.8B in Q2 2018
08/22/2018Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018….
TSMC WannaCry infection forces shutdowns, financial losses
08/24/2018On August 3, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), the largest chip fabricator globally introduced a WannaCry Ransomware cryptow…
New material could improve efficiency of computer processing and memory
08/22/2018Discovery could have major impact on semiconductor industry….
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Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and…
Date and time TBDEUV lithography has been under intense development for years and appears to be close to…





Cymer announces customer installation of latest light source for chip production at advanced nodes

08/27/2018  Cymer, a manufacturer of excimer lasers used in semiconductor manufacturing, today announced the first customer installation of its XLR 860ix light source, which is expected to be used in the production of chips at advanced logic and memory nodes.

GOWIN Semiconductor Corp. announces RISC-V microprocessor implementation for GOWIN FPGA solutions

08/27/2018  GOWIN Semiconductor Corp., an innovator of programmable logic devices, announces their development of RISC-V Microprocessor IP implemented in their current ARORA Family GW-2A FPGA products.

TowerJazz addressing emerging markets of 5G and mmWave with new leading edge SiGe and RF SOI technologies

08/27/2018  Showcasing new offerings at EuMW 2018 and participating in panel discussion on RF semiconductor options for 5G systems.

Nano-imaging of intersubband transitions in few-layer 2-D materials

08/27/2018  A study in Nature Nanotechnology reports on the first observation of intersubband transitions in 2-D materials via scattering scanning near-field optical microscopy.

A human enzyme can biodegrade graphene

08/24/2018  Graphene Flagship partners discovered that a natural human enzyme can biodegrade graphene. These findings could have great implications in the development of graphene-based biomedical devices.

Watlow acquires Yarbrough Solutions Worldwide

08/24/2018  Watlow, a designer and manufacturer of complete thermal systems, announced that it has acquired Yarbrough Solutions Worldwide of Austin, Texas.

North American semiconductor equipment industry posts July 2018 billings

08/24/2018  Global billings declined for the second month in a row, indicative of customer push-outs.

Gartner identifies five emerging technology trends that will blur the lines between human and machine

08/23/2018  The 35 must-watch technologies represented on the Gartner Inc. Hype Cycle for Emerging Technologies, 2018 revealed five distinct emerging technology trends that will blur the lines between humans and machines.

Samsung's Exynos i S111 delivers efficiency and reliability for NB-IoT devices

08/23/2018  New IoT solution includes modem, processor, memory and GNSS functions in one chip.

Immersion announces appointment of Tom Lacey as interim CEO and board member

08/23/2018  Lacey succeeds Carl Schlachte, the company’s prior Interim CEO, who is resigning as a director of Immersion.

Helping the microchip industry go (very low) with the flow

08/23/2018  A new NIST analysis reveals a heated source of potentially expensive errors.

The largest compound semiconductor device maker in China selects ClassOne Solstice CopperMax electroplating system

08/23/2018  ClassOne Technology today announced a multi-tool sale of its flagship Solstice CopperMax electroplating system to China’s premier compound semiconductor manufacturer.

IDT and Steradian Semiconductors announce strategic partnership

08/22/2018  Integrated Device Technology, Inc. announced today a strategic partnership with Steradian Semiconductor Pvt. Ltd. to deliver ultra-high resolution 4D mmWave imaging RADAR for emerging industrial, security, medical, and autonomous vehicle markets.

Semtech’s LoRa technology creates IoT metering solutions to improve facility management in China

08/22/2018  EasyLinkin’s LoRa-based IoT solutions gather data and analytics on utility usage.

Sanan IC goes global, emerges as a world-class III-V technology platform company

08/22/2018  Sanan Integrated Circuit Co., a pure-play compound semiconductor foundry, today announces its entry into the North American, European, and Asia Pacific (APAC) markets with their advanced III-V technology platform.

ASIC Design Services adds Core Deep Learning IP to SiFive DesignShare program

08/21/2018  SiFive, a provider of commercial RISC-V processor IP, today announced that ASIC Design Services, a design house, IP provider, and a distributor for FPGA and EDA software, has joined the DesignShare ecosystem.

MRSI Systems launches MRSI-HVM3P for new applications extending the MRSI-HVM3 die bonder family

08/21/2018  MRSI Systems (Mycronic Group), is expanding its high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC).

Murata invests in MEMS sensor manufacturing in Finland

08/21/2018  Murata Manufacturing Co., Ltd. expands its MEMS sensor manufacturing by building a new factory in Vantaa, Finland to increase the sensor production capacity.

TowerJazz to showcase SiGe and silicon photonic process solutions for 100 to 400Gb/s optical data links at ECOC

08/21/2018  The Company will showcase its advanced SiGe (Silicon Germanium) process, with speeds in excess of 300GHz, and its newest production SiPho (Silicon Photonics) process built into data center high-speed optical data links.



Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.


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Materion Advanced Materials:



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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Advanced Packaging

  Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:


  Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

  Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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Munich, Germany
November 13, 2018 - November 16, 2018

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Leak check semiconductor process chambers quickly and reliably
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